EMSL13L2J-187.5093MTR [ECLIPTEK]

CRYSTAL OSCILLATOR, CLOCK, 187.5093 MHz, HSCL OUTPUT, ROHS COMPLIANT, PLASTIC, SMD, 6 PIN;


型号：	EMSL13L2J-187.5093MTR
厂家：	Ecliptek
描述：	CRYSTAL OSCILLATOR, CLOCK, 187.5093 MHz, HSCL OUTPUT, ROHS COMPLIANT, PLASTIC, SMD, 6 PIN 机械输出元件振荡器
文件：	总6页 (文件大小：237K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

RoHS

EMSL13L2J-187.5093M TR

EMSL13 L 2 J -187.5093M TR

Series

Packaging Options

RoHS Compliant (Pb-free) 3.3V 6 Pad 5mm x 7mm

Plastic SMD HCSL MEMS Oscillator

Tape & Reel

Nominal Frequency

Frequency Tolerance/Stability

±100ppm Maximum over -20°C to +70°C

187.5093MHz

Logic Control / Additional Output

Duty Cycle

50 ±5(%)

Standby (ST) and Complementary Output

ELECTRICAL SPECIFICATIONS

Nominal Frequency

187.5093MHz

Frequency Tolerance/Stability

±100ppm Maximum over -20°C to +70°C (Inclusive of all conditions: Calibration Tolerance at 25°C,

Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change,

1st Year Aging at 25°C, Reflow, Shock, and Vibration)

Aging at 25°C

±1ppm First Year Maximum

Supply Voltage

+3.3Vdc ±0.3Vdc

Input Current

70mA Maximum (Excluding Load Termination Current)

750mVdc Typical, 600mVdc Minimum

25mVdc Typical, 50mVdc Maximum

Output Voltage Logic High (Voh)

Output Voltage Logic Low (Vol)

Rise/Fall Time

300pSec Typical, 350pSec Maximum (Measured over 20% to 80% of waveform)

50 ±5(%) (Measured at 50% of waveform)

50 Ohms to ground (Output and Complementary Output)

HCSL

Duty Cycle

Load Drive Capability

Output Logic Type

Logic Control / Additional Output

Output Control Input Voltage

Standby (ST) and Complementary Output

Vih of 70% of Vcc Minimum or No Connect to Enable Output and Complementary Output, Vil of 30% of Vcc

Maximum to Disable Output and Complementary Output (High Impedance)

Standby Current

30µA Maximum (ST) Without Load

0.2pSec Typical

Period Jitter (Deterministic)

Period Jitter (Random)

Period Jitter (RMS)

2.0pSec Typical

1.5pSec Typical, 3.0pSec Maximum

20pSec Typical, 25pSec Maximum

10pSec Typical

Period Jitter (pk-pk)

Period Jitter (Cycle to Cycle)

RMS Phase Jitter (Fj = 637kHz to

10MHz; Random)

1.6pSec Typical

RMS Phase Jitter (Fj = 1.5MHz to

22MHz; Random)

0.4pSec Typical

RMS Phase Jitter (Fj = 1.875MHz to

20MHz; Random)

Start Up Time

10mSec Maximum

-55°C to +125°C

Storage Temperature Range

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS

ESD Susceptibility

MIL-STD-883, Method 3015, Class 2, HBM 2000V

Flammability

UL94-V0

Mechanical Shock

Moisture Resistance

Moisture Sensitivity Level

Resistance to Soldering Heat

Resistance to Solvents

Solderability

MIL-STD-883, Method 2002, Condition G, 30,000G

MIL-STD-883, Method 1004

J-STD-020, MSL 1

MIL-STD-202, Method 210, Condition K

MIL-STD-202, Method 215

MIL-STD-883, Method 2003 (Six I/O Pads on bottom of package only)

MIL-STD-883, Method 1010, Condition B

MIL-STD-883, Method 1011, Condition B

MIL-STD-883, Method 2007, Condition A, 20G

Temperature Cycling

Thermal Shock

Vibration

www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/12/2010 | Page 1 of 6

EMSL13L2J-187.5093M TR

MECHANICAL DIMENSIONS (all dimensions in millimeters)

PIN CONNECTION

0.85

±0.15

1.20 ±0.10 (x4)

1.47

Standby (ST)

No Connect

5.00

±0.15

0.08

MAX

Case Ground

Output

Complementary Output

Supply Voltage

7.00

±0.15

5.08

±0.10

2.30

LINE MARKING

XXXX or XXXXX

XXXX or XXXXX=Ecliptek

Manufacturing Lot Code

2.54 TYP

2.60

±0.15

1.40

±0.10 (x4)

Note A: Center paddle is connected

internally to oscillator ground (Pad 3).

Suggested Solder Pad Layout

All Dimensions in Millimeters

1.80 (X6)

2.00 (X6)

0.54 (X4)

Solder Land

2.39 (X3)

(X6)

All Tolerances are ±0.1

www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/12/2010 | Page 2 of 6

EMSL13L2J-187.5093M TR

OUTPUT WAVEFORM & TIMING DIAGRAM

VIH

VIL

VOH

80%

OUTPUT STANDBY

(HIGH IMPEDANCE

STATE)

50%

20%

VOL

tPLZ

tPZL

Fall

Time

Rise

Time

Duty Cycle (%) = TW/T x 100

Test Circuit for Tri-State and Complementary Output

Oscilloscope

Frequency

Counter

Probe 2

(Note 2)

Probe 1

(Note 2)

50 Ohms

(Note 4)

Supply

Voltage

(V_DD

)

Output

Current

Meter

Complementary

Output

(Note 4)

Power

Supply

Voltage

Meter

Ground

Tri-State

0.1µF

(Note 1)

0.01µF

(Note 1)

Connect

Ohms

Switch

Power

Supply

Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency

ceramic bypass capacitor close (less than 2mm) to the package ground and supply voltage

pin is required.

Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high

bandwidth (>500MHz) passive probe is recommended.

Note 3: Test circuit PCB traces need to be designed for a characteristic line impedance of 50 ohms.

Note 4: A 10 ohm to 33 ohm series resistor is required to limit overshoot. Rs value is circuit layout dependant.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/12/2010 | Page 3 of 6

EMSL13L2J-187.5093M TR

Tape & Reel Dimensions

Quantity Per Reel: 1,000 units

4.0 ±0.2

2.0 ±0.2

DIA 1.5 ±0.1

0.30 ±0.05

7.5 ±0.2

16.0 ±0.3

A0*

6.75 ±0.20

8.0 ±0.2

B0*

K0*

*Compliant to EIA 481A

1.5 MIN

22.4 MAX

DIA 40 MIN

Access Hole at

Slot Location

180 MAX

DIA 50 MIN

2.5 MIN Width

10.0 MIN Depth

Tape slot in Core

for Tape Start

DIA 20.2 MIN

DIA 13.0 ±0.2

16.4 +2.0/-0

www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/12/2010 | Page 4 of 6

EMSL13L2J-187.5093M TR

Recommended Solder Reflow Methods

Critical Zone

T_Lto T_P

T_P

Ramp-up

Ramp-down

T_L

T_SMax

T_SMin

t_L

t_P

t_SPreheat

t 25°C to Peak

Time (t)

High Temperature Infrared/Convection

TS MAX to TL (Ramp-up Rate)

3°C/second Maximum

Preheat

- Temperature Minimum (TS MIN)

- Temperature Typical (TS TYP)

- Temperature Maximum (TS MAX)

- Time (tS MIN)

150°C

175°C

200°C

60 - 180 Seconds

Ramp-up Rate (TL to TP)

3°C/second Maximum

Time Maintained Above:

- Temperature (TL)

- Time (tL)

217°C

60 - 150 Seconds

Peak Temperature (TP)

260°C Maximum for 10 Seconds Maximum

250°C +0/-5°C

Target Peak Temperature (TP Target)

Time within 5°C of actual peak (tp)

Ramp-down Rate

20 - 40 seconds

6°C/second Maximum

8 minutes Maximum

Level 1

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/12/2010 | Page 5 of 6

EMSL13L2J-187.5093M TR

Recommended Solder Reflow Methods

Critical Zone

T_Lto T_P

T_P

Ramp-up

Ramp-down

T_L

T_SMax

T_SMin

t_L

t_P

t_SPreheat

t 25°C to Peak

Time (t)

Low Temperature Infrared/Convection 240°C

TS MAX to TL (Ramp-up Rate)

5°C/second Maximum

Preheat

- Temperature Minimum (TS MIN)

- Temperature Typical (TS TYP)

- Temperature Maximum (TS MAX)

- Time (tS MIN)

N/A

150°C

N/A

60 - 120 Seconds

Ramp-up Rate (TL to TP)

5°C/second Maximum

Time Maintained Above:

- Temperature (TL)

- Time (tL)

150°C

200 Seconds Maximum

Peak Temperature (TP)

240°C Maximum

Target Peak Temperature (TP Target)

Time within 5°C of actual peak (tp)

Ramp-down Rate

240°C Maximum 1 Time / 230°C Maximum 2 Times

10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time

5°C/second Maximum

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

N/A

Level 1

Low Temperature Manual Soldering

185°C Maximum for 10 seconds Maximum, 2 times Maximum.

High Temperature Manual Soldering

260°C Maximum for 5 seconds Maximum, 2 times Maximum.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/12/2010 | Page 6 of 6

相关型号：