EN13C7D2F-100.000M [ECLIPTEK]
CRYSTAL OSCILLATOR, CLOCK, 100MHz, CMOS OUTPUT, ROHS COMPLIANT, CERAMIC, SMD, 6 PIN;型号: | EN13C7D2F-100.000M |
厂家: | Ecliptek |
描述: | CRYSTAL OSCILLATOR, CLOCK, 100MHz, CMOS OUTPUT, ROHS COMPLIANT, CERAMIC, SMD, 6 PIN 机械 输出元件 振荡器 |
文件: | 总5页 (文件大小:212K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
RoHS
Pb
EN13C7D2F-100.000M
EN13C7 D 2 F -100.000M
Series
Nominal Frequency
RoHS Compliant (Pb-free) 3.3V 6 Pad 5mm x 7mm
Ceramic SMD HCSL Oscillator
100.000MHz
Logic Control / Additional Output
Tri-State (Pad 1) and Complementary Output
Frequency Tolerance/Stability
±50ppm Maximum over 0°C to +70°C
Duty Cycle
50 ±5(%)
ELECTRICAL SPECIFICATIONS
Nominal Frequency
100.000MHz
Frequency Tolerance/Stability
±50ppm Maximum over 0°C to +70°C (Inclusive of all conditions: Calibration Tolerance (at 25°C),
Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change,
First Year Aging at 25°C, Shock, and Vibration)
Supply Voltage
+3.3Vdc ±5%
Input Current
35mA Typical, 60mA Maximum (Without Load)
700mVdc Typical, 600mVdc Minimum
20mVdc Typical, 50mVdc Maximum
300pSec Typical, 700pSec Maximum (Measured at 0.175Vdc to 0.525Vdc of waveform)
50 ±5(%) (Measured at the crossing point)
50 Ohms (Between Output and Ground)
HCSL
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Rise/Fall Time
Duty Cycle
Load Drive Capability
Output Logic Type
Phase Noise
-78dBc/Hz at 10Hz Offset, -113dBc/Hz at 100Hz Offset, -126dBc/Hz at 1kHz Offset, -134dBc/Hz at 10kHz
Offset, -140dBc/Hz at 100kHz Offset, -146dBc/Hz at 1MHz Offset, -148dBc/Hz at 10MHz Offset, -
152dBc/Hz at 20MHz Offset (All Values are Typical, Fo=100.000MHz)
Logic Control / Additional Output
Tri-State Input Voltage (Vih and Vil)
Tri-State (Pad 1) and Complementary Output
Vih of 70% of Vdd Minimum or No Connect to Enable Output and Complementary Output, Vil of 30% of
Vdd Maximum to Disable (High Impedance) Output and Complementary Output
Standby Current
RMS Phase Jitter
10µA Maximum (Without Load)
0.5pSec Typical, 0.6pSec Maximum at 100MHz; 0.4pSec Typical, 0.5pSec Maximum at 125MHz (Fj=12kHz
to 20MHz)
Period Jitter (Deterministic)
Period Jitter (Random)
Period Jitter (One Sigma)
Period Jitter (Cycle to Cycle)
Period Jitter (tp-p)
0.2pSec Typical
1.0pSec Typical
1.5pSec Typical
10pSec Typical
12pSec Typical
5mSec Maximum
-55°C to +125°C
Start Up Time
Storage Temperature Range
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
MIL-STD-883, Method 1014, Condition A
UL94-V0
Fine Leak Test
Flammability
Gross Leak Test
Mechanical Shock
Moisture Resistance
Moisture Sensitivity
Resistance to Soldering Heat
Resistance to Solvents
Solderability
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
Temperature Cycling
Vibration
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/12/2010 | Page 1 of 5
EN13C7D2F-100.000M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN CONNECTION
1
2
3
4
5
6
Tri-State
No Connect
5.00
±0.15
2.60 ±0.15
Case/Ground
Output
2.00
MAX
1.2 ±0.2
Complementary Output
Supply Voltage
1
2
6
5
4
2.54
TYP
7.00
±0.15
LINE MARKING
5.08
±0.15
1
2
3
ECLIPTEK
100.00M
3
XXYZZ
XX=Ecliptek Manufacturing
Code
Y=Last Digit of the Year
ZZ=Week of the Year
1.4
±0.1
Suggested Solder Pad Layout
All Dimensions in Millimeters
1.80 (X6)
1.80 (X6)
0.54 (X4)
Solder Land
2.39 (X3)
(X6)
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/12/2010 | Page 2 of 5
EN13C7D2F-100.000M
OUTPUT WAVEFORM & TIMING DIAGRAM
VIH
VIL
VOH
0.525VDC
Q
Q
OUTPUT DISABLE
(HIGH IMPEDANCE
STATE)
Crossover
0.175VDC
VOL
tPLZ
tPZL
Fall
Time
Rise
Time
TW
T
Duty Cycle (%) = TW/T x 100
Test Circuit for Tri-State and Complementary Output
Oscilloscope
Frequency
Counter
Probe 2
(Note 2)
Probe 1
(Note 2)
50 Ohms
RS
(Note 4)
Supply
Voltage
(VDD
)
Output
Current
Meter
Complementary
Output
RS
(Note 4)
Power
Supply
Voltage
Meter
Ground
Tri-State
0.1µF
(Note 1)
0.01µF
(Note 1)
No
Connect
50
Ohms
Switch
Power
Supply
Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency
ceramic bypass capacitor close (less than 2mm) to the package ground and supply voltage
pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high
bandwidth (>500MHz) passive probe is recommended.
Note 3: Test circuit PCB traces need to be designed for a characteristic line impedance of 50 ohms.
Note 4: A 10 ohm to 33 ohm series resistor is required to limit overshoot. Rs value is circuit layout dependant.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/12/2010 | Page 3 of 5
EN13C7D2F-100.000M
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate)
3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
150°C
175°C
200°C
60 - 180 Seconds
Ramp-up Rate (TL to TP)
3°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
217°C
60 - 150 Seconds
Peak Temperature (TP)
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/12/2010 | Page 4 of 5
EN13C7D2F-100.000M
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
Low Temperature Infrared/Convection 240°C
TS MAX to TL (Ramp-up Rate)
5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
N/A
150°C
N/A
60 - 120 Seconds
Ramp-up Rate (TL to TP)
5°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
150°C
200 Seconds Maximum
Peak Temperature (TP)
240°C Maximum
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
240°C Maximum 1 Time / 230°C Maximum 2 Times
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/12/2010 | Page 5 of 5
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