EN13C7D2F-100.000M [ECLIPTEK]

CRYSTAL OSCILLATOR, CLOCK, 100MHz, CMOS OUTPUT, ROHS COMPLIANT, CERAMIC, SMD, 6 PIN;
EN13C7D2F-100.000M
型号: EN13C7D2F-100.000M
厂家: Ecliptek    Ecliptek
描述:

CRYSTAL OSCILLATOR, CLOCK, 100MHz, CMOS OUTPUT, ROHS COMPLIANT, CERAMIC, SMD, 6 PIN

机械 输出元件 振荡器
文件: 总5页 (文件大小:212K)
中文:  中文翻译
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RoHS  
Pb  
EN13C7D2F-100.000M  
EN13C7 D 2 F -100.000M  
Series  
Nominal Frequency  
RoHS Compliant (Pb-free) 3.3V 6 Pad 5mm x 7mm  
Ceramic SMD HCSL Oscillator  
100.000MHz  
Logic Control / Additional Output  
Tri-State (Pad 1) and Complementary Output  
Frequency Tolerance/Stability  
±50ppm Maximum over 0°C to +70°C  
Duty Cycle  
50 ±5(%)  
ELECTRICAL SPECIFICATIONS  
Nominal Frequency  
100.000MHz  
Frequency Tolerance/Stability  
±50ppm Maximum over 0°C to +70°C (Inclusive of all conditions: Calibration Tolerance (at 25°C),  
Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change,  
First Year Aging at 25°C, Shock, and Vibration)  
Supply Voltage  
+3.3Vdc ±5%  
Input Current  
35mA Typical, 60mA Maximum (Without Load)  
700mVdc Typical, 600mVdc Minimum  
20mVdc Typical, 50mVdc Maximum  
300pSec Typical, 700pSec Maximum (Measured at 0.175Vdc to 0.525Vdc of waveform)  
50 ±5(%) (Measured at the crossing point)  
50 Ohms (Between Output and Ground)  
HCSL  
Output Voltage Logic High (Voh)  
Output Voltage Logic Low (Vol)  
Rise/Fall Time  
Duty Cycle  
Load Drive Capability  
Output Logic Type  
Phase Noise  
-78dBc/Hz at 10Hz Offset, -113dBc/Hz at 100Hz Offset, -126dBc/Hz at 1kHz Offset, -134dBc/Hz at 10kHz  
Offset, -140dBc/Hz at 100kHz Offset, -146dBc/Hz at 1MHz Offset, -148dBc/Hz at 10MHz Offset, -  
152dBc/Hz at 20MHz Offset (All Values are Typical, Fo=100.000MHz)  
Logic Control / Additional Output  
Tri-State Input Voltage (Vih and Vil)  
Tri-State (Pad 1) and Complementary Output  
Vih of 70% of Vdd Minimum or No Connect to Enable Output and Complementary Output, Vil of 30% of  
Vdd Maximum to Disable (High Impedance) Output and Complementary Output  
Standby Current  
RMS Phase Jitter  
10µA Maximum (Without Load)  
0.5pSec Typical, 0.6pSec Maximum at 100MHz; 0.4pSec Typical, 0.5pSec Maximum at 125MHz (Fj=12kHz  
to 20MHz)  
Period Jitter (Deterministic)  
Period Jitter (Random)  
Period Jitter (One Sigma)  
Period Jitter (Cycle to Cycle)  
Period Jitter (tp-p)  
0.2pSec Typical  
1.0pSec Typical  
1.5pSec Typical  
10pSec Typical  
12pSec Typical  
5mSec Maximum  
-55°C to +125°C  
Start Up Time  
Storage Temperature Range  
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS  
ESD Susceptibility  
MIL-STD-883, Method 3015, Class 1, HBM: 1500V  
MIL-STD-883, Method 1014, Condition A  
UL94-V0  
Fine Leak Test  
Flammability  
Gross Leak Test  
Mechanical Shock  
Moisture Resistance  
Moisture Sensitivity  
Resistance to Soldering Heat  
Resistance to Solvents  
Solderability  
MIL-STD-883, Method 1014, Condition C  
MIL-STD-883, Method 2002, Condition B  
MIL-STD-883, Method 1004  
J-STD-020, MSL 1  
MIL-STD-202, Method 210, Condition K  
MIL-STD-202, Method 215  
MIL-STD-883, Method 2003  
Temperature Cycling  
Vibration  
MIL-STD-883, Method 1010, Condition B  
MIL-STD-883, Method 2007, Condition A  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/12/2010 | Page 1 of 5  
EN13C7D2F-100.000M  
MECHANICAL DIMENSIONS (all dimensions in millimeters)  
PIN CONNECTION  
1
2
3
4
5
6
Tri-State  
No Connect  
5.00  
±0.15  
2.60 ±0.15  
Case/Ground  
Output  
2.00  
MAX  
1.2 ±0.2  
Complementary Output  
Supply Voltage  
1
2
6
5
4
2.54  
TYP  
7.00  
±0.15  
LINE MARKING  
5.08  
±0.15  
1
2
3
ECLIPTEK  
100.00M  
3
XXYZZ  
XX=Ecliptek Manufacturing  
Code  
Y=Last Digit of the Year  
ZZ=Week of the Year  
1.4  
±0.1  
Suggested Solder Pad Layout  
All Dimensions in Millimeters  
1.80 (X6)  
1.80 (X6)  
0.54 (X4)  
Solder Land  
2.39 (X3)  
(X6)  
All Tolerances are ±0.1  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/12/2010 | Page 2 of 5  
EN13C7D2F-100.000M  
OUTPUT WAVEFORM & TIMING DIAGRAM  
VIH  
VIL  
VOH  
0.525VDC  
Q
Q
OUTPUT DISABLE  
(HIGH IMPEDANCE  
STATE)  
Crossover  
0.175VDC  
VOL  
tPLZ  
tPZL  
Fall  
Time  
Rise  
Time  
TW  
T
Duty Cycle (%) = TW/T x 100  
Test Circuit for Tri-State and Complementary Output  
Oscilloscope  
Frequency  
Counter  
Probe 2  
(Note 2)  
Probe 1  
(Note 2)  
50 Ohms  
RS  
(Note 4)  
Supply  
Voltage  
(VDD  
)
Output  
Current  
Meter  
Complementary  
Output  
RS  
(Note 4)  
Power  
Supply  
Voltage  
Meter  
Ground  
Tri-State  
0.1µF  
(Note 1)  
0.01µF  
(Note 1)  
No  
Connect  
50  
Ohms  
Switch  
Power  
Supply  
Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency  
ceramic bypass capacitor close (less than 2mm) to the package ground and supply voltage  
pin is required.  
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high  
bandwidth (>500MHz) passive probe is recommended.  
Note 3: Test circuit PCB traces need to be designed for a characteristic line impedance of 50 ohms.  
Note 4: A 10 ohm to 33 ohm series resistor is required to limit overshoot. Rs value is circuit layout dependant.  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/12/2010 | Page 3 of 5  
EN13C7D2F-100.000M  
Recommended Solder Reflow Methods  
Critical Zone  
TL to TP  
TP  
Ramp-up  
Ramp-down  
TL  
TS Max  
TS Min  
tL  
tP  
tSPreheat  
t 25°C to Peak  
Time (t)  
High Temperature Infrared/Convection  
TS MAX to TL (Ramp-up Rate)  
3°C/second Maximum  
Preheat  
- Temperature Minimum (TS MIN)  
- Temperature Typical (TS TYP)  
- Temperature Maximum (TS MAX)  
- Time (tS MIN)  
150°C  
175°C  
200°C  
60 - 180 Seconds  
Ramp-up Rate (TL to TP)  
3°C/second Maximum  
Time Maintained Above:  
- Temperature (TL)  
- Time (tL)  
217°C  
60 - 150 Seconds  
Peak Temperature (TP)  
260°C Maximum for 10 Seconds Maximum  
250°C +0/-5°C  
Target Peak Temperature (TP Target)  
Time within 5°C of actual peak (tp)  
Ramp-down Rate  
20 - 40 seconds  
6°C/second Maximum  
8 minutes Maximum  
Level 1  
Time 25°C to Peak Temperature (t)  
Moisture Sensitivity Level  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/12/2010 | Page 4 of 5  
EN13C7D2F-100.000M  
Recommended Solder Reflow Methods  
Critical Zone  
TL to TP  
TP  
Ramp-up  
Ramp-down  
TL  
TS Max  
TS Min  
tL  
tP  
tSPreheat  
t 25°C to Peak  
Time (t)  
Low Temperature Infrared/Convection 240°C  
TS MAX to TL (Ramp-up Rate)  
5°C/second Maximum  
Preheat  
- Temperature Minimum (TS MIN)  
- Temperature Typical (TS TYP)  
- Temperature Maximum (TS MAX)  
- Time (tS MIN)  
N/A  
150°C  
N/A  
60 - 120 Seconds  
Ramp-up Rate (TL to TP)  
5°C/second Maximum  
Time Maintained Above:  
- Temperature (TL)  
- Time (tL)  
150°C  
200 Seconds Maximum  
Peak Temperature (TP)  
240°C Maximum  
Target Peak Temperature (TP Target)  
Time within 5°C of actual peak (tp)  
Ramp-down Rate  
240°C Maximum 1 Time / 230°C Maximum 2 Times  
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time  
5°C/second Maximum  
Time 25°C to Peak Temperature (t)  
Moisture Sensitivity Level  
N/A  
Level 1  
Low Temperature Manual Soldering  
185°C Maximum for 10 seconds Maximum, 2 times Maximum.  
High Temperature Manual Soldering  
260°C Maximum for 5 seconds Maximum, 2 times Maximum.  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/12/2010 | Page 5 of 5  

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