EP3645TTS-27.100M [ECLIPTEK]

CMOS, Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 3.3Vdc 4 Pad 3.2mm x 5.0mm Ceramic Surface Mount (SMD) Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 3.3Vdc 4 Pad 3.2mm x 5.0mm Ceramic Surface Mount (SMD);
EP3645TTS-27.100M
型号: EP3645TTS-27.100M
厂家: Ecliptek    Ecliptek
描述:

CMOS, Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 3.3Vdc 4 Pad 3.2mm x 5.0mm Ceramic Surface Mount (SMD) Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 3.3Vdc 4 Pad 3.2mm x 5.0mm Ceramic Surface Mount (SMD)

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Ecliptek | EP36 Series Oscillator  
http://www.ecliptek.com/oscillators/EP36/  
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EP36 Series Oscillator  
Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 3.3Vdc 4 Pad 3.2mm x 5.0mm Ceramic Surface Mount (SMD)  
2011/65 +  
168 SVHC  
2015/863  
Revision G 02/27/2015  
ectrical Specifications  
Nominal Frequency  
1.000MHz to 106.250MHz  
Some frequencies within this range may not be available.  
requency Tolerance/Stability  
(Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency  
Stability over the Operating Temperature Range, Supply Voltage  
Change, Output Load Change, First Year Aging @25°C, Shock, and  
Vibration)  
±100ppm Maximum  
±50ppm Maximum  
Operating Temperature Range  
-20°C to +70°C  
-40°C to +85°C  
upply Voltage (V  
nput Current  
)
DD  
3.3V  
±0.3V  
DC DC  
28mA Maximum (Unloaded)  
Output Voltage Logic High (V  
)
OH  
V
-0.4V Minimum (I = -8mA)  
DC OH  
DD  
Output Voltage Logic Low (V  
Duty Cycle  
)
0.4V  
Maximum (I = +8mA)  
DC OL  
OL  
Measured at 50% of waveform  
50 ±10(%)  
50 ±5(%)(Only available over Nominal Frequency of 1M to 50M)  
ise Time/Fall Time  
oad Drive Capability  
Measured at 20% to 80% of Waveform  
4nSec Maximum  
30pF Maximum over Nominal Frequency of 1MHz to 50MHz  
15pF Maximum over Nominal Frequency of 50.000001MHz to  
106.25MHz  
Output Logic Type  
in 1 Connection  
CMOS  
Power Down (Disable Output: Logic Low)  
Tri-State (Disabled Output: High Impedance)  
ri-State Input Voltage (Vih and Vil)  
70% of V  
Minimum to enable output, 20% of V  
Maximum to  
DD  
DD  
disable output, No Connect to enable output.  
tandby Current  
Disable Current  
20µA Maximum (Pin 1 = Ground)  
16mA Maximum (Pin 1 = Ground)  
bsolute Clock Jitter  
±250pSec Maximum, ±100pSec Typical over Nominal Frequency of  
1MHz to 33MHz  
±125pSec Maximum, ±75pSec Typical over Nominal Frequency of  
33.000001MHz to 106.25MHz  
One Sigma Clock Period Jitter  
±50pSec Maximum over Nominal Frequency of 1MHz to 33MHz  
±40pSec Maximum over Nominal Frequency of 33.000001MHz to  
106.25MHz  
1 of 10  
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ging (at 25°C)  
±5ppm/year Maximum  
-55°C to +125°C  
torage Temperature Range  
tart Up Time  
10mSec Maximum  
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http://www.ecliptek.com/oscillators/EP36/  
echanical Dimensions  
Dimensions in Millimeters  
1: Power Down (Logic Low) or Tri-State (High Impedance)  
2: Ground/Case Ground  
3: Output  
4: Supply Voltage  
arking Specifications  
e 1:  
E XXXXXX  
E = Ecliptek Designator  
XXXXXX = Nominal Frequency in MHz (5 Digits + Decimal)  
e 2:  
XXXXX  
XXXXX = Ecliptek Manufacturing Identifier  
3 of 10  
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http://www.ecliptek.com/oscillators/EP36/  
vironmental and Mechanical Specifications  
e Leak Test  
MIL-STD-883, Method 1014, Condition A  
MIL-STD-883, Method 1014, Condition C  
MIL-STD-202, Method 213, Condition C  
MIL-STD-202, Method 210  
oss Leak Test  
chanical Shock  
sistance to Soldering Heat  
sistance to Solvents  
lderability  
MIL-STD-202, Method 215  
MIL-STD-883, Method 2003  
mperature Cycling  
bration  
MIL-STD-883, Method 1010  
MIL-STD-883, Method 2007, Condition A  
40°C/W (degrees Celsius per Watt)  
14°C/W (degrees Celsius per Watt)  
ermal Resistance (θ  
ermal Resistance (θ  
)
)
JA  
JC  
4 of 10  
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pe & Reel Dimensions  
00 pieces per reel  
mpliant to EIA-481  
Dimensions in Millimeters  
5 of 10  
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MOS Test Circuit  
te 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency ceramic bypass capacitor close  
ss than 2mm) to the package ground and supply voltage pin is required.  
te 2: A low input capacitance (<12pF), 10X Attentuation Factor, High Impedance (>10Mohms), and High bandwidth  
300MHz) passive probe is recommended.  
te 3: Capacitance value (C ) includes sum of all probe and fixture capacitance. See applicable specification sheet for  
L
ad Drive Capability’.  
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commended Solder Pad Dimensions  
erances = ±0.1  
Dimensions in Millimeters  
7 of 10  
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lder Reflow Profile  
h Temperature Infrared/Convection  
te: Temperatures shown are applied to body of  
vice.  
MAX to T (Ramp-up Rate)  
3°C/second Maximum  
L
eheat  
Temperature Minimum (T MIN)  
150°C  
S
Temperature Typical (T TYP)  
175°C  
S
Temperature Maximum (T MAX)  
200°C  
S
Time (t )  
60 - 180 Seconds  
3°C/second Maximum  
S
mp-up Rate (T to T )  
L
P
me Maintained Above:  
Temperature (T )  
217°C  
L
Time (t )  
60 - 150 Seconds  
260°C Maximum for 10 Seconds Maximum  
250°C +0/-5°C  
L
ak Temperature (T )  
P
rget Peak Temperature (T Target)  
P
me within 5°C of actual peak (t )  
P
20 - 40 seconds  
mp-down Rate  
6°C/second Maximum  
8 minutes Maximum  
Level 1  
me 25°C to Peak Temperature (t)  
oisture Sensitivity Level  
8 of 10  
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w Temperature Infrared/Convection  
te: Temperatures shown are applied to body of  
vice.  
MAX to T (Ramp-up Rate)  
5°C/second Maximum  
L
eheat  
Temperature Minimum (T MIN)  
N/A  
S
Temperature Typical (T TYP)  
150°C  
S
Temperature Maximum (T MAX)  
N/A  
S
Time (t )  
60 - 120 Seconds  
5°C/second Maximum  
S
mp-up Rate (T to T )  
L
P
me Maintained Above:  
Temperature (T )  
150°C  
L
Time (t )  
200 Seconds Maximum  
L
ak Temperature (T )  
240°C Maximum  
P
rget Peak Temperature (T Target)  
240°C Maximum 2 Times / 230°C Maximum 1 Time  
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time  
P
me within 5°C of actual peak (t )  
P
mp-down Rate  
5°C/second Maximum  
me 25°C to Peak Temperature (t)  
oisture Sensitivity Level  
N/A  
Level 1  
h Temperature Manual Soldering  
te: Temperatures listed are applied to body of device.  
0°C Maximum for 5 seconds Maximum, 2 times Maximum.  
w Temperature Manual Soldering  
te: Temperatures listed are applied to body of device.  
5°C Maximum for 10 seconds Maximum, 2 times Maximum.  
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- Build A Part Number  
2 - Next Page  
Select the parameters that meet your requirements and then click  
Next  
Access these Part Number specific  
resources and tools  
Frequency in  
Megahertz (1 to  
106.25):  
me frequencies within this  
ange may not be available  
Frequency  
Tolerance/Stability:  
Operating  
Temperature Range:  
Duty Cycle:  
Pin 1 Connection:  
Packaging Options:  
rt Numbering Guide  
TOOLS  
PRODUCT  
ECLIPTEK  
TERMS  
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