EPS13D2C1HE-27.000MTR [ECLIPTEK]
CRYSTAL OSCILLATOR, CLOCK, 27 MHz, LVCMOS OUTPUT, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN;型号: | EPS13D2C1HE-27.000MTR |
厂家: | Ecliptek |
描述: | CRYSTAL OSCILLATOR, CLOCK, 27 MHz, LVCMOS OUTPUT, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN 机械 输出元件 振荡器 |
文件: | 总6页 (文件大小:185K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
RoHS
Pb
EPS13D2C1HE-27.000M TR
EPS13D2 C 1 H E -27.000M TR
Series
Packaging Options
RoHS Compliant (Pb-free) 3.3V 4 Pad 5mm x 7mm
Ceramic SMD LVCMOS Programmable Spread
Spectrum Oscillator
Tape & Reel
Nominal Frequency
27.000MHz
Frequency Stability
±100ppm Maximum over Operating Temperature of
-20°C to +70°C
Spread Spectrum
±1.50% Center Spread
Output Control Function
Tri-State
Duty Cycle
50 ±10%
ELECTRICAL SPECIFICATIONS
Nominal Frequency
27.000MHz
Frequency Stability
±100ppm Maximum over Operating Temperature of -20°C to +70°C (Inclusive of all conditions: Frequency
Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year
Aging at 25°C, Shock, and Vibration.)
Aging at 25°C
±5ppm First Year Maximum
3.3Vdc ±0.3Vdc
Supply Voltage
Maximum Supply Voltage
Input Current
-0.5Vdc to +7.0Vdc
30mA Maximum (Unloaded; Vdd=3.3Vdc)
Vdd-0.4Vdc Minimum (IOH=-8mA)
0.4Vdc Maximum (IOL=+8mA)
2.7nSec Maximum (Measured at 20% to 80% of Waveform)
50 ±10% (Measured at 50% of Waveform)
15pF Maximum
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Rise/Fall Time
Duty Cycle
Load Drive Capability
Output Logic Type
Output Control Function
CMOS
Tri-State (High Impedance Internal Pull Down Resistor of 100kOhms Typical on Pad 3, Internal Pull Up
Resistor of 100kOhms Typical on Pad 1)
Tri-State Input Voltage (Vih and Vil)
Tri-State Output Disable Time
Tri-State Output Enable Time
Disable Current
70% of Vdd Minimum or No Connection to Enable Output, 30% of Vdd Maximum to Disable Output
350nSec Maximum
350nSec Maximum
20mA Maximum (Unloaded; Pad 1=Ground; Vdd=3.3Vdc)
±1.50% Center Spread
Spread Spectrum
Modulation Frequency
Period Jitter
30kHz Minimum, 31.5kHz Typical, 33kHz Maximum
400pSec Maximum (Cycle to Cycle; Spread Spectrum-On; Vdd=3.3Vdc)
10mSec Maximum
Start Up Time
Storage Temperature Range
-55°C to +125°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
MIL-STD-883, Method 1014, Condition A
MIL-STD-883, Method 1014, Condition C
MIL-STD-202, Method 213, Condition C
MIL-STD-202, Method 210
Gross Leak Test
Mechanical Shock
Resistance to Soldering Heat
Resistance to Solvents
Solderability
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
Temperature Cycling
Vibration
MIL-STD-883, Method 1010
MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/12/2010 | Page 1 of 6
EPS13D2C1HE-27.000M TR
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN CONNECTION
1
2
3
4
Tri-State
2.20
±0.15
Case/Ground
Output
5.00
±0.15
1.4 ±0.2
Supply Voltage
1
4
3
LINE MARKING
1
2
3
ECLIPTEK
27.000M
7.00
5.08
3.68
±0.15
±0.15
±0.15
SXXYZZ
S=Configuration Designator
XX=Ecliptek Manufacturing
Code
2
Y=Last Digit of the Year
ZZ=Week of the Year
1.60 ±0.20
1.4 ±0.1
Suggested Solder Pad Layout
All Dimensions in Millimeters
2.0 (X4)
2.0 (X4)
Solder Land
(X4)
3.1
1.6
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/12/2010 | Page 2 of 6
EPS13D2C1HE-27.000M TR
OUTPUT WAVEFORM & TIMING DIAGRAM
VIH
VIL
VOH
80% of Waveform
OUTPUT DISABLE
(HIGH IMPEDANCE
STATE)
50% of Waveform
20% of Waveform
VOL
tPLZ
tPZL
Fall
Time
Rise
Time
TW
T
Duty Cycle (%) = TW/T x 100
Test Circuit for CMOS Output
Frequency
Counter
Oscilloscope
Probe
(Note 2)
Supply
Voltage
(VDD
)
Output
_
+
Current
Meter
+
+
Power
Supply
0.01µF
(Note 1)
Voltage
Meter
0.1µF
(Note 1)
CL
(Note 3)
Ground
_
_
Tri-State or
Power Down
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and VDD pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/12/2010 | Page 3 of 6
EPS13D2C1HE-27.000M TR
Tape & Reel Dimensions
Quantity Per Reel: 1,000 units
4.0 ±0.1
2.0 ±0.1
DIA 1.5 +0.1/-0.0
0.3 ±0.05
7.5 ±0.1
16.0
A0*
+0.3/-0.1
6.75 ±0.1
8.0 ±0.1
B0*
K0*
*Compliant to EIA 481A
1.5 MIN
22.4 MAX
DIA 40 MIN
Access Hole at
Slot Location
360 MAX
DIA 50 MIN
2.5 MIN Width
10.0 MIN Depth
Tape slot in Core
for Tape Start
DIA 20.2 MIN
DIA 13.0 ±0.2
16.4 +2.0/-0.0
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/12/2010 | Page 4 of 6
EPS13D2C1HE-27.000M TR
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate)
3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
150°C
175°C
200°C
60 - 180 Seconds
Ramp-up Rate (TL to TP)
3°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
217°C
60 - 150 Seconds
Peak Temperature (TP)
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/12/2010 | Page 5 of 6
EPS13D2C1HE-27.000M TR
Recommended Solder Reflow Methods
Critical Zone
TL to TP
TP
Ramp-up
Ramp-down
TL
TS Max
TS Min
tL
tP
tSPreheat
t 25°C to Peak
Time (t)
Low Temperature Infrared/Convection 240°C
TS MAX to TL (Ramp-up Rate)
5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
N/A
150°C
N/A
60 - 120 Seconds
Ramp-up Rate (TL to TP)
5°C/second Maximum
Time Maintained Above:
- Temperature (TL)
- Time (tL)
150°C
200 Seconds Maximum
Peak Temperature (TP)
240°C Maximum
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
240°C Maximum 1 Time / 230°C Maximum 2 Times
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 8/12/2010 | Page 6 of 6
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