ES52C1A10N-20.000M TR [ECLIPTEK]

OSCILLATORS 1.0PPM 0+50 3.3V 20.000MHZ CLIPPED SINEWAVE 5X7MM 10PAD SMD;


型号：	ES52C1A10N-20.000M TR
厂家：	Ecliptek
描述：	OSCILLATORS 1.0PPM 0+50 3.3V 20.000MHZ CLIPPED SINEWAVE 5X7MM 10PAD SMD
文件：	总4页 (文件大小：124K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

RoHS

ES52C1A10N-20.000M

ES52C1 A 10 N -20.000M

Series

Nominal Frequency

RoHS Compliant (Pb-free) 5mm x 7mm Ceramic SMD

3.3Vdc Clipped Sinewave TC(VC)XO

20.000MHz

Control Voltage

None (No Connect on Pin 1)

Operating Temperature Range

0°C to +50°C

Frequency Stability

±1.0ppm Maximum

ELECTRICAL SPECIFICATIONS

Nominal Frequency

20.000MHz

Frequency Stability vs. Frequency

Tolerance

±1.0ppm Maximum (Measured at 25°C ±2°C, Vdd=3.3Vdc, Vc=1.5Vdc)

Frequency Stability

±1.0ppm Maximum

Frequency Stability vs. Input Voltage ±0.2ppm Maximum (Vdd ±5%)

Frequency Stability vs. Aging

Frequency Stability vs. Load

Operating Temperature Range

Supply Voltage

±1ppm/Year Maximum (at 25°C)

±0.2ppm Maximum (±1kOhm//±1pF)

0°C to +50°C

3.3Vdc ±5%

Input Current

2.0mA Maximum

Output Voltage

0.8Vp-p Clipped Sinewave Minimum

10kOhms//10pF

Load Drive Capability

Output Logic Type

Control Voltage

Clipped Sinewave

None (No Connect on Pin 1)

Phase Noise

-80dBc/Hz at 10Hz offset, -115dBc/Hz at 100Hz offset, -135dBc/Hz at 1kHz offset, -145dBc/Hz at 10kHz

offset, -145dBc/Hz at 100kHz offset (Typical Values, at 12.800MHz)

Start Up Time

5mSec Maximum

-55°C to +125°C

Storage Temperature Range

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS

Fine Leak Test

MIL-STD-883, Method 1014 Condition A

MIL-STD-883, Method 1014 Condition C

MIL-STD-202, Method 213 Condition C

MIL-STD-202, Method 210

Gross Leak Test

Mechanical Shock

Resistance to Soldering Heat

Resistance to Solvents

Solderability

MIL-STD-202, Method 215

MIL-STD-883, Method 2003

Temperature Cycling

Vibration

MIL-STD-883, Method 1010

MIL-STD-883, Method 2007 Condition A

www.ecliptek.com | Specification Subject to Change Without Notice | Rev J 2/16/2010 | Page 1 of 4

ES52C1A10N-20.000M

MECHANICAL DIMENSIONS (all dimensions in millimeters)

PIN CONNECTION

No Connect

Do Not Connect

Case/Ground

Output

5.0

±0.2

0.8 ±0.1

(x4)

2.0

1.4 ±0.1

(x4)

MAX

0.3

±0.1

(x10)

7.0

±0.2

Do Not Connect

Supply Voltage

2.7 ±0.1

(x4)

2.0 ±0.1

(x4)

LINE MARKING

E20.000

E=Ecliptek

XXYZZ

XX=Ecliptek Manufacturing

Code

Y=Last Digit of the Year

ZZ=Week of the Year

Suggested Solder Pad Layout

All Dimensions in Millimeters

1.2 (X4)

1.8 (X4)

Solder Land

(X4)

3.9

3.0

All Tolerances are ±0.1

www.ecliptek.com | Specification Subject to Change Without Notice | Rev J 2/16/2010 | Page 2 of 4

ES52C1A10N-20.000M

OUTPUT WAVEFORM

0VDC

VP-P

Test Circuit for No Connect Option

Frequency

Counter

Oscilloscope

Probe

(Note 2)

Supply

Voltage

(V_DD

)

Output

Current

Meter

0.01µF

(Note 1)

0.1µF

(Note 1)

Power

Supply

Voltage

Meter

Ground

C_L= 10pF

(Note 3)

R_L= 10kOhms

No Connect

Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency

ceramic bypass capacitor close to the package ground and V_DDpin is required.

Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth

(>300MHz) passive probe is recommended.

Note 3: Capacitance value C_Lincludes sum of all probe and fixture capacitance.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev J 2/16/2010 | Page 3 of 4

ES52C1A10N-20.000M

Recommended Solder Reflow Methods

Critical Zone

T_Lto T_P

T_P

Ramp-up

Ramp-down

T_L

T_SMax

T_SMin

t_L

t_P

t_SPreheat

t 25°C to Peak

Time (t)

Low Temperature Infrared/Convection 220°C

TS MAX to TL (Ramp-up Rate)

5°C/second Maximum

Preheat

- Temperature Minimum (TS MIN)

- Temperature Typical (TS TYP)

- Temperature Maximum (TS MAX)

- Time (tS MIN)

N/A

150°C

N/A

60 - 120 Seconds

Ramp-up Rate (TL to TP)

5°C/second Maximum

Time Maintained Above:

- Temperature (TL)

- Time (tL)

150°C

200 Seconds Maximum

Peak Temperature (TP)

220°C Maximum

Target Peak Temperature (TP Target)

Time within 5°C of actual peak (tp)

Ramp-down Rate

220°C Maximum 1 Time / 215°C Maximum 1 Time

15 seconds Maximum 1 Time / 80 seconds Maximum 1 Time

5°C/second Maximum

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

N/A

Level 1

Low Temperature Manual Soldering

185°C Maximum for 10 seconds Maximum, 2 times Maximum.

High Temperature Manual Soldering

260°C Maximum for 5 seconds Maximum, 2 times Maximum.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev J 2/16/2010 | Page 4 of 4

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