PC8N-5LTX [ELITE]
5W Power LED;型号: | PC8N-5LTX |
厂家: | Elite Enterprises (H.K.) Co., Ltd. |
描述: | 5W Power LED |
文件: | 总19页 (文件大小:1371K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
PC8N-5LTx
5W Power LED
Technical Datasheet
Version: 1.2
Typical Applications
Features
•Various colors
•Good color uniformity
•Low-temp. & lead free reflow soldering
•Industry’s first lighting-class LED
•Low Voltage DC operated
•Instant light (less than 100ns)
•No UV
•Reading lights (car, bus, aircraft)
•Portable (flashlight, bicycle)
•Uplighters/Downlighters
•High flux per LED
•Decorative/Entertainment
•Bollards/Security/Garden
•Cove/Undershelf/Task
•Indoor/Outdoor Commercial and
Residential Architectural
•Automotive Ext (Stop-Tail-Turn,
CHMSL, Mirror Side Repeat)
•LCD backlights/Stage/Studio lighting
•Superior ESD protection
•Multi - Color In One Package
Introduction
‧ ProLight Hornet Colorful series is a color changeable LED with maximum 4 color
chips in one package. Compared to prior RGB in one package, Hornet-series is
especial able to provide the “White” color independently. It’s creating a small
optical source for excellent optical control and efficient color mixing.
ProLight Hornet Colorful series is much suitable for the application of color-
changing lighting, indoor cove lighting, and entertainment lighting.
2010/04
3F No.12, Kung-Yeh 10th Rd., Ping Chen Industrial
Zone, Ping Chen, 324, Taoyuan Hsien, Taiwan,
R.O.C.
Tel :886-3-419-2099
Fax :886-3-419-2377
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Emitter Mechanical Dimensions
Notes:
1. The cathode side of the device is denoted by the chamfer on the part body.
2. Electrical insulation between the case and the board is required --- slug of device is not
electrically neutral. Do not electrically connect either the anode or cathode to the slug.
3. Drawing not to scale.
4. All dimensions are in millimeters.
5. All dimensions without tolerances are for reference only.
6. Please do not solder the emitter by manual hand soldering, otherwise it will damage the emitter.
7. Please do not use a force of over 3kgf impact or pressure on the lens of the LED, otherwise
it will cause a catastrophic failure.
*The appearance and specifications of the product may be modified for improvement without notice.
2
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R.O.C.
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Star Mechanical Dimensions
Notes:
1. Slots in aluminum-core PCB for M3 or #4 mounting screw.
2. Electrical interconnection pads labeled on the aluminum-core PCB with "+" and "-" to denote
positive and negative, respectively. All positive pads are interconnected, as are all negative pads,
allowing for flexibility in array interconnection.
3. Drawing not to scale.
4. All dimensions are in millimeters.
5. All dimendions without tolerances are for reference only.
6. Please do not use a force of over 3kgf impact or pressure on the lens of the LED, otherwise
it will cause a catastrophic failure.
*The appearance and specifications of the product may be modified for improvement without notice.
3
3F No.12, Kung-Yeh 10th Rd., Ping Chen Industrial
Zone, Ping Chen, 324, Taoyuan Hsien, Taiwan,
R.O.C.
Tel :886-3-419-2099
Fax :886-3-419-2377
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Flux Characteristics at 350mA, TJ = 25°C
Radiation
Pattern
Part Number
Emitter
Lumious Flux ΦV (lm)
Color
Star
Minimum
Typical
63
46
11.5
24.5
82
60
15
32
White
Green
Blue
Lambertian
PC8N-5LTE
PC8N-5LTS
Red
●
●
±
ProLight maintains a tolerance of 10% on flux and power measurements.
Please do not drive at rated current more than 1 second without proper heat sink.
Optical Characteristics at 350mA, TJ = 25°C
Total
included
Angle
Dominant Wavelength λD,
Viewing
Angle
or Color Temperature CCT
Radiation
Color
(degrees)
θ0.90V
(degrees)
2 θ1/2
Pattern
Min.
Typ.
Max.
3710 K
6020 K
3985 K
6535 K
4260 K
7050 K
530 nm
465 nm
631 nm
160
160
160
160
160
140
140
140
140
140
White
Lambertian
Green
Blue
520 nm
460 nm
620.5 nm
525 nm
462.5 nm
623 nm
Red
●
●
±
ProLight maintains a tolerance of 1nm for dominant wavelength measurements.
±
ProLight maintains a tolerance of 5% for CCT measurements.
Electrical Characteristics at 350mA, TJ = 25°C
Thermal
Resistance
Forward Voltage VF (V)
Typ.
Junction to
Slug (°C/ W)
Color
Min.
Max.
White
Green
Blue
2.8
2.8
2.8
1.9
3.5
3.5
3.5
2.2
4.0
4.0
4.0
3.1
3
Red
4
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Zone, Ping Chen, 324, Taoyuan Hsien, Taiwan,
R.O.C.
Tel :886-3-419-2099
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Absolute Maximum Ratings
Parameter
White/Green/Blue/Red
DC Forward Current (mA)
350
500
350
Peak Pulsed Forward Current (mA)
Average Forward Current (mA)
ESD Sensitivity
(HBM per MIL-STD-883E Method 3015.7)
LED Junction Temperature (°C)
Aluminum-core PCB Temperature (°C)
Storage & Operating Temperature (°C)
Soldering Temperature(°C)
> ±500V
120
90
-40 to +90
260°C
5
3F No.12, Kung-Yeh 10th Rd., Ping Chen Industrial
Zone, Ping Chen, 324, Taoyuan Hsien, Taiwan,
R.O.C.
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Color Bin
White Binning Structure Graphical Representation
0.48
0.46
0.44
0.42
0.40
2580 K
2870 K
3220 K
3710 K
Planckian
(BBL)
4260 K
4745 K
S0
0.38
0.36
0.34
0.32
0.30
0.28
0.26
5310 K
6020 K
7050 K
X0
0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50
x
White Bin Structure
Typ. CCT
(K)
Typ. CCT
(K)
Bin Code
S0
x
y
Bin Code
X0
x
y
0.401
0.374
0.367
0.390
0.404
0.387
0.358
0.372
0.321
0.303
0.307
0.322
0.348
0.330
0.311
0.326
4000
6500
●
±
Tolerance on each color bin (x , y) is 0.01
6
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Zone, Ping Chen, 324, Taoyuan Hsien, Taiwan,
R.O.C.
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Color Spectrum, TJ = 25°C
1. White
1.0
Standard Eye Response Cruve
0.8
White
0.6
0.4
0.2
0.0
350 400 450 500 550 600 650 700 750 800 850
Wavelength(nm)
2. Blue、Green、Red
1.0
Blue
Green
Red
0.8
0.6
0.4
0.2
0.0
400
450
500
550
600
650
700
Wavelength(nm)
7
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R.O.C.
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Light Output Characteristics
Relative Light Output vs. Junction Temperature at 350mA
160
140
120
100
80
White
Green
Blue
60
40
20
0
80
0
20
40
60
100
120
-20
Junction Temperature, TJ (℃)
160
140
120
100
80
Red
60
40
20
0
80
0
20
40
60
100
120
-20
Junction Temperature, TJ (℃)
8
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R.O.C.
Tel :886-3-419-2099
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Forward Current Characteristics, TJ = 25°C
1. Forward Voltage vs. Forward Current
400
350
300
250
200
150
100
50
400
350
300
250
200
150
100
50
White, Green, Blue
Red
0
0
0
0.5
1
1.5
2
2.5
3
3.5
4
0
0.5
1
1.5
2
2.5
3
Forward Voltage (V)
Forward Voltage (V)
2. Forward Current vs. Normalized Relative Luminous Flux
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Red
White, Green, Blue
0
100
200
300
400
0
100
200
300
400
Forward Current (mA)
Forward Current (mA)
9
3F No.12, Kung-Yeh 10th Rd., Ping Chen Industrial
Zone, Ping Chen, 324, Taoyuan Hsien, Taiwan,
R.O.C.
Tel :886-3-419-2099
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Typical Representative Spatial Radiation Pattern
Lambertian Radiation Pattern
100
90
80
70
60
50
40
30
20
10
0
-100
-80
-60
-40
-20
0
20
40
60
80
100
Angular Displacement (Degrees)
10
3F No.12, Kung-Yeh 10th Rd., Ping Chen Industrial
Zone, Ping Chen, 324, Taoyuan Hsien, Taiwan,
R.O.C.
Tel :886-3-419-2099
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Moisture Sensitivity Level - JEDEC 1
Soak Requirements
Accelerated Environment
Level
Floor Life
Conditions
Standard
Time (hours) Conditions
Time
Time (hours)
Conditions
≤30°C /
85% RH
85°C /
85% RH
1
Unlimited
168 +5/-0
NA
NA
●
●
The standard soak time includes a default value of 24 hours for semiconductor manufature's
exposure time (MET) between bake and bag and includes the maximum time allowed out of
the bag at the distributor's facility.
Table below presents the moisture sensitivity level definitions per IPC/JEDEC's J-STD-020C.
Soak Requirements
Level
Floor Life
Conditions
Standard
Accelerated Environment
Time
Time (hours)
Conditions
Time (hours)
Conditions
≤30°C /
85% RH
≤30°C /
60% RH
≤30°C /
60% RH
≤30°C /
60% RH
≤30°C /
60% RH
≤30°C /
60% RH
≤30°C /
60% RH
≤30°C /
60% RH
85°C /
85% RH
85°C /
60% RH
30°C /
60% RH
30°C /
60% RH
30°C /
60% RH
30°C /
60% RH
30°C /
60% RH
30°C /
60% RH
1
2
Unlimited
168 +5/-0
NA
NA
1 year
4 weeks
168 hours
72 hours
48 hours
24 hours
168 +5/-0
696 +5/-0
192 +5/-0
96 +2/-0
72 +2/-0
48 +2/-0
NA
NA
60°C /
60% RH
60°C /
60% RH
60°C /
60% RH
60°C /
60% RH
60°C /
2a
3
120 +1/-0
40 +1/-0
20 +0.5/-0
15 +0.5/-0
10 +0.5/-0
NA
4
5
5a
6
60% RH
Time on Label
(TOL)
Time on Label
(TOL)
NA
11
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R.O.C.
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Qualification Reliability Testing
Stress
Duration
Stress Test
Stress Conditions
25°C, IF = max DC (Note 1)
85°C/60%RH, IF = max DC (Note 1)
85°C/85%RH, non-operating
110°C, non-operating
Failure Criteria
Note 2
Room Temperature
Operating Life (RTOL)
Wet High Temperature
Operating Life (WHTOL)
Wet High Temperature
Storage Life (WHTSL)
High Temperature
Storage Life (HTSL)
Low Temperature
Storage Life (LTSL)
Non-operating
1000 hours
1000 hours
1000 hours
1000 hours
1000 hours
200 cycles
200 cycles
Note 2
Note 2
Note 2
-40°C, non-operating
Note 2
-40°C to 120°C, 30 min. dwell,
<5 min. transfer
-40°C to 120°C, 20 min. dwell,
<20 sec. transfer
Note 2
Temperature Cycle (TMCL)
Non-operating
Thermal Shock (TMSK)
Note 2
1500 G, 0.5 msec. pulse,
5 shocks each 6 axis
Mechanical Shock
Natural Drop
Note 3
On concrete from 1.2 m, 3X
Note 3
Variable Vibration
Frequency
10-2000-10 Hz, log or linear sweep rate,
20 G about 1 min., 1.5 mm, 3X/axis
Note 3
Solder Heat Resistance
(SHR)
260°C ± 5°C, 10 sec.
Note 3
Steam age for 16 hrs., then solder dip
Solder coverage
on lead
Solderability
at 260°C for 5 sec.
Notes:
1. Depending on the maximum derating curve.
2. Criteria for judging failure
Criteria for Judgement
Item
Test Condition
IF = max DC
IF = max DC
VR = 5V
Min.
--
Max.
Initial Level x 1.1
Forward Voltage (VF)
Luminous Flux or
Radiometric Power (ΦV)
Reverse Current (IR)
Initial Level x 0.7
--
--
50 μA
* The test is performed after the LED is cooled down to the room temperature.
3. A failure is an LED that is open or shorted.
12
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Recommended Solder Pad Design
Standard Emitter
TYPE A.
TYPE B.
All dimensions are in millimeters.
Electrical isolation is required between Slug and Solder Pad.
●
●
13
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R.O.C.
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Reflow Soldering Condition
Sn-Pb
Eutectic Assembly
Low-Temp. & Pb-Free Assembly
(58Bi-42Sn Eutectic Alloy)
Profile Feature
Preheat & Soak
Temperature min (Tsmin
Temperature max (Tsmax
)
)
100 °C
150 °C
90 °C
120 °C
Time (Tsmin to Tsmax
)
60-120 seconds
60-120 seconds
Average Ramp-Up Rate (Tsmax to TP)
3 °C / second max.
2 °C / second max.
Liquidous temperature (TL)
Time at liquidous (tL)
183°C
60-150 seconds
138°C
20-50 seconds
Peak package body temperature (TP)
235°C
185°C
Time (tP) within 5°C of the specified
classification temperature (TC)
20 seconds
20 seconds
Average ramp-down rate (TP to Tsmax
)
6 °C/second max.
6 minutes max.
3 °C/second max.
4 minutes max.
Time 25°C to Peak Temperature
All temperatures refer to topside of the package, measured on the package body surface.
Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
a heat plate should be used. It should be confirmed beforehand whether the characteristics of
LEDs will or will not be damaged by repairing.
●
●
Reflow soldering should not be done more than two times.
When soldering, do not put stress on the LEDs during heating.
After soldering, do not warp the circuit board.
●
●
●
14
3F No.12, Kung-Yeh 10th Rd., Ping Chen Industrial
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R.O.C.
Tel :886-3-419-2099
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Heat Plate Soldering Condition
(1) Soldering Process for Solder Paste
(2) Soldering Process for Solder Wire
Solder Paste
MCPCB
Heat Plate
MCPCB
Use Solder Mask to print Solder Paste on MCPCB.
Put MCPCB on Heat Plate.
Solder Wire
Emitter
Heat Plate
Place Emitter on MCPCB.
Place Solder Wire to the solder pad of MCPCB.
Emitter
Heat Plate
Heat Plate
Put MCPCB on Heat Plate until Solder Paste melt.
The Solder Paste sould be melted within 10 seconds.
Take out MCPCB out from Heat Plate within 15 seconds.
Put Emitter on MCPCB. Take the MCPCB out
From Heat Plate within 10 seconds.
Heat plate temperature: 260 C max for Lead Solder and 260 C max for Lead-Free Solder.
°
°
●
When soldering, do not put stress on the LEDs during heating.
After soldering, do not warp the circuit board.
●
●
15
3F No.12, Kung-Yeh 10th Rd., Ping Chen Industrial
Zone, Ping Chen, 324, Taoyuan Hsien, Taiwan,
R.O.C.
Tel :886-3-419-2099
Fax :886-3-419-2377
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Emitter Reel Packaging
Notes:
1. Drawing not to scale.
2. All dimensions are in millimeters.
3. General tolerance is ± 0.10 mm.
16
3F No.12, Kung-Yeh 10th Rd., Ping Chen Industrial
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R.O.C.
Tel :886-3-419-2099
Fax :886-3-419-2377
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Emitter Reel Packaging
17.0 ± 0.5
19.5 ± 1.0
Φ 21 ± 0.5
Φ 13.1 ± 0.5
3 ± 0.5
60 ± 0.5
178 ± 1
4 ± 0.5
5 ± 0.5
Notes:
1. Empty component pockets sealed with top cover tape.
2. 250 or 500 pieces per reel.
3. Drawing not to scale.
4. All dimensions are in millimeters.
17
3F No.12, Kung-Yeh 10th Rd., Ping Chen Industrial
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R.O.C.
Tel :886-3-419-2099
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Star Tube Packaging
Notes:
1. 20 pieces per tube.
2. Drawing not to scale.
3. All dimensions are in millimeters.
4. All dimendions without tolerances are for reference only.
**Please do not open the moisture barrier bag (MBB) more than one week. This may cause the leads
of LED discoloration. We recommend storing ProLight’s LEDs in a dry box after opening the MBB.
The recommended storage conditions are temperature 5 to 30°C and humidity less than 40% RH.
18
3F No.12, Kung-Yeh 10th Rd., Ping Chen Industrial
Zone, Ping Chen, 324, Taoyuan Hsien, Taiwan,
R.O.C.
Tel :886-3-419-2099
Fax :886-3-419-2377
www.prolightopto.com
We Provide the Light to the world
Precaution for Use
● Storage
Please do not open the moisture barrier bag (MBB) more than one week. This may cause the
leads of LED discoloration. We recommend storing ProLight’s LEDs in a dry box after opening
the MBB. The recommended storage conditions are temperature 5 to 30°C and humidity less
than 40% RH. It is also recommended to return the LEDs to the MBB and to reseal the MBB.
● The slug is is not electrically neutral. Therefore, we recommend to isolate the heat sink.
● The slug is to be soldered. If not, please use the heat conductive adhesive.
● Any mechanical force or any excess vibration shall not be accepted to apply during cooling
process to normal temperature after soldering.
● Please avoid rapid cooling after soldering.
● Components should not be mounted on warped direction of PCB.
● Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
a heat plate should be used. It should be confirmed beforehand whether the characteristics of
the LEDs will or will not be damaged by repairing.
● This device should not be used in any type of fluid such as water, oil, organic solvent and etc.
When cleaning is required, isopropyl alcohol should be used.
● When the LEDs are illuminating, operating current should be decide after considering the
package maximum temperature.
● The appearance, specifications and flux bin of the product may be modified for improvement
without notice. Please refer to the below website for the latest datasheets.
http://www.prolightopto.com/
Handling of Silicone Lens LEDs
Notes for handling of silicone lens LEDs
● Please do not use a force of over 3kgf impact or pressure on the silicone lens,
otherwise it will cause a catastrophic failure.
● The LEDs should only be picked up by making contact with the sides of the LED body.
● Avoid touching the silicone lens especially by sharp tools such as Tweezers.
● Avoid leaving fingerprints on the silicone lens.
● Please store the LEDs away from dusty areas or seal the product against dust.
● When populating boards in SMT production, there are basically no restrictions
regarding the form of the pick and place nozzle, except that mechanical pressure
on the silicone lens must be prevented.
● Please do not mold over the silicone lens with another resin. (epoxy, urethane, etc)
19
3F No.12, Kung-Yeh 10th Rd., Ping Chen Industrial
Zone, Ping Chen, 324, Taoyuan Hsien, Taiwan,
R.O.C.
Tel :886-3-419-2099
Fax :886-3-419-2377
www.prolightopto.com
We Provide the Light to the world
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