PG1C-1NWS [ELITE]
1W White Power LED;
| 型号： | PG1C-1NWS |
| 厂家： | 
Elite Enterprises (H.K.) Co., Ltd. |
| 描述： | 1W White Power LED |
| 文件： | 总17页 (文件大小：549K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Technology Corporation
ProLight PG1C-1NWx
1W White Power LED
Technical Datasheet
Version: 1.4
Features
●High flux per LED
●Very long operating life(up to 100k hours)
●Good color uniformity
●Industry best moisture senstivity level - JEDEC 2a
4 week floor life without reconditioning
●Low-temp. & lead free reflow soldering
●RoHS compliant
●More energy efficient than incandescent and
most halogen lamps
●Low Voltage DC operated
●Instant light (less than 100ns)
●No UV
●Superior ESD protection
Typical Applications
● Excellent Design for Mining Lamp
● Reading lights (car, bus, aircraft)
●Portable (flashlight, bicycle)
●Uplighters/Downlighters
● Decorative/Entertainment
● Bollards/Security/Garden
● Cove/Undershelf/Task
● Indoor/Outdoor Commercial and
Residential Architectural
● Automotive Ext (Stop-Tail-Turn,
CHMSL, Mirror Side Repeat)
2010/04
1
Emitter Mechanical Dimensions
TOP VIEW
BOTTOM VIEW
Notes:
1. The cathode side of the device is denoted by a hole in the lead frame.
2. Electrical insulation between the case and the board is required --- slug of device is not
electrically neutral. Do not electrically connect either the anode or cathode to the slug.
3. Drawing not to scale.
4. All dimensions are in millimeters.
5. All dimendions without tolerances are for reference only.
6. Please do not bend the leads of LED, otherwise it will damage the LED.
7. Please do not use a force of over 3kgf impact or pressure on the lens of the LED, otherwise
it will cause a catastrophic failure.
*The appearance and specifications of the product may be modified for improvement without notice.
2
Star Mechanical Dimensions
Notes:
1. Slots in aluminum-core PCB for M3 or #4 mounting screw.
2. Electrical interconnection pads labeled on the aluminum-core PCB with "+" and "-" to denote
positive and negative, respectively. All positive pads are interconnected, as are all negative pads,
allowing for flexibility in array interconnection.
3. Drawing not to scale.
4. All dimensions are in millimeters.
5. All dimendions without tolerances are for reference only.
6. Please do not use a force of over 3kgf impact or pressure on the lens of the LED, otherwise
it will cause a catastrophic failure.
*The appearance and specifications of the product may be modified for improvement without notice.
3
Part Number
Emitter
Star
Beam Pattern
Lambertian
Color
PG1C-1NWE
PG1C-1NWS
White
Related Illumination (Lux) at Distance 1.0meter / 250mA
Minimum Illumination (Lux) guarantee while using ProLight's mine reflector Beam Pattern
Color
1800
Spot
White
LED Light
Distance
( test board to LED light)
** Please refer to the reflector datasheet for the detail.
Optical Characteristics at 250mA, Junction Temperature, Tj=25℃
Dominant Wavelength λD
Temperature
Peak Wavelength λp
Spectral
Half-width (nm)
Δλ1/2
Coefficient or
Color Temperature(CCT)
Dominant Wavelength
ΔλD/ΔTj (nm/℃)
Min.
Typ.
Max.
Color
White
4100 K
5000 K
10000 K
--
--
Optical Characteristics at 250mA, Junction Temperature, Tj=25℃
( Continued)
Total included Angle
Viewing Angle
Typical Candela
on Axis (cd)
2θ1/2 (degrees)
θ0.9V (degrees)
Beam Pattern
Lambertian
Color
White
160
140
--
Electrical Characteristics at 250mA, Junction Temperature, Tj=25℃
Temperature
Coefficient of
Vf (mV/℃)
ΔVf/ΔTj
Thermal
Resistance
Junction to
Slug (℃/W)
Forward Voltage Vf(V)
Dynamic
Min.
2.79
Typ.
3.45
Max.
3.65
Resistance (Ω)
Color
White
1.0
-2
10
4
Absolute Maximum Ratings
White
350
Parameter
DC Forward Current (mA)
500
Peak Pulsed Forward Current (mA)
Average Forward Current (mA)
ESD Sensitivity
350
±4000V (Class III)
(HBM per MIL-STD-883E Method 3015.7)
LED Junction Temperature (℃)
Aluminum-core PCB Temperature (℃)
Storage & Operating Temperature (℃)
Soldering Temperature (℃)
120
105
-40 to +105
235°C
Photometric Luminous Flux Bin Structure
Minimum Illumination (Lux)
Typical Illumination (Lux)
Bin Code
1800
2700
S
● Measurement @1.0m / 250mA by Lutron LX103 Light Meter without Glass Lens.
5
Color Bins
White Binning Structure Graphical Representation
0.48
0.46
0.44
0.42
4100 K
4500 K
0.40
TM
TN
5000 K
UM
0.38
0.36
0.34
0.32
0.30
0.28
0.26
5650 K
UN
U0
VM
Planckian
(BBL)
T0
TP
6300 K
VN
V0
VP
WM
WN
W0
7000 K XM
UP
XN
X0
WP
WQ
10000 K
Y0
YA
XP
White
0.26
0.28
0.30
0.32
0.34
0.36
0.38
0.40
x
6
Color Bins
White Bin Structure
Typ. CCT
(K)
Typ. CCT
(K)
Bin Code
x
y
Bin Code
W0
x
y
0.378
0.374
0.360
0.362
0.382
0.378
0.362
0.365
0.374
0.370
0.357
0.360
0.386
0.382
0.365
0.367
0.362
0.360
0.344
0.346
0.365
0.362
0.346
0.347
0.360
0.357
0.343
0.344
0.365
0.367
0.348
0.347
0.329
0.329
0.346
0.344
0.329
0.329
0.347
0.346
0.329
0.344
0.343
0.329
0.329
0.329
0.348
0.347
0.382
0.366
0.357
0.372
0.397
0.382
0.372
0.386
0.366
0.351
0.342
0.357
0.413
0.397
0.386
0.400
0.372
0.357
0.344
0.359
0.386
0.372
0.359
0.372
0.357
0.342
0.331
0.344
0.386
0.400
0.385
0.372
0.331
0.345
0.359
0.344
0.345
0.357
0.372
0.359
0.331
0.344
0.331
0.320
0.357
0.369
0.385
0.372
0.329
0.329
0.317
0.316
0.329
0.316
0.315
0.329
0.329
0.329
0.318
0.317
0.329
0.329
0.319
0.318
0.329
0.329
0.315
0.314
0.308
0.305
0.316
0.317
0.305
0.303
0.315
0.316
0.308
0.317
0.319
0.311
0.301
0.314
0.315
0.303
0.308
0.283
0.274
0.303
0.308
0.311
0.290
0.283
0.345
0.331
0.320
0.333
0.345
0.333
0.344
0.357
0.331
0.320
0.310
0.320
0.320
0.310
0.300
0.310
0.369
0.357
0.344
0.355
0.311
0.322
0.333
0.320
0.322
0.333
0.344
0.333
0.311
0.320
0.300
0.293
0.342
0.355
0.344
0.333
0.311
0.284
0.301
0.333
0.311
0.293
0.270
0.284
T0
4300
4300
4300
4300
4750
4750
4750
4750
5320
5320
5320
5320
5970
5970
5970
5970
5970
6650
6650
6650
6650
8000
8000
TN
TP
TM
U0
UN
UP
UM
V0
WN
WP
WQ
WM
X0
XN
XP
XM
Y0
VN
VP
VM
YA
● Tolerance on each color bin (x , y) is ± 0.01
Note: Although several bins are outlined, product availability in a particular bin varies by production run
and by product performance. Not all bins are available in all colors.
7
Color Spectrum, TJ = 25°C
1.0
0.8
Standard Eye Response Cruve
White
0.6
0.4
0.2
0.0
350 400 450 500 550 600 650 700 750 800 850
Wavelength(nm)
Light Output Characteristics
Relative Light Output vs. Junction Temperature at 350mA
160
140
120
100
80
White
60
40
20
0
-20
0
20
40
60
80
100
120
Junction Temperature, TJ (℃)
8
Forward Current Characteristics, TJ = 25°C
1.2
1.0
0.8
0.6
0.4
0.2
0.0
400
350
300
250
200
150
100
50
0
0 0.5 1 1.5 2 2.5 3 3.5 4
Forward Voltage(V)
0
100
200
300
400
Forward Current(mA)
Fig 1. Forward Current vs. Forward
Voltage for White.
Fig 2. Relative Luminous Flux vs.
Forward Current for White at
Tj=25℃ maintained.
Ambient Temperature vs. Maximum Forward Current
White (TJMAX = 120°C)
400
350
300
250
RθJ-A = 60°C/W
200
RθJ-A = 50°C/W
150
RθJ-A = 40°C/W
100
RθJ-A = 30°C/W
50
0
0
25
50
75
100
125
150
Ambient Temperature (℃)
9
Typical Representative Spatial Radiation Pattern
Lambertian Radiation Pattern
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10
20
30
40
50
60
70
80
90
Angular Displacement (Degrees)
10
Moisture Sensitivity Level - JEDEC 2a
Soak Requirements
Accelerated Environment
Conditions Time (hours) Conditions Time (hours) Conditions
Level
Floor Life
Standard
Time
≤30°C /
30°C /
60°C /
2a
4 weeks
696 +5/-0
120 +1/-0
60% RH
60% RH
60% RH
● The standard soak time includes a default value of 24 hours for semiconductor manufature's
exposure time (MET) between bake and bag and includes the maximum time allowed out of
the bag at the distributor's facility.
● Table below presents the moisture sensitivity level definitions per IPC/JEDEC's J-STD-020C.
Soak Requirements
Level
Floor Life
Standard
Accelerated Environment
Time
Conditions Time (hours) Conditions Time (hours) Conditions
≤30°C /
85% RH
≤30°C /
60% RH
≤30°C /
60% RH
≤30°C /
60% RH
≤30°C /
60% RH
≤30°C /
60% RH
≤30°C /
60% RH
≤30°C /
60% RH
85°C /
85% RH
85°C /
1
2
Unlimited
168 +5/-0
168 +5/-0
696 +5/-0
192 +5/-0
96 +2/-0
72 +2/-0
48 +2/-0
NA
NA
NA
1 year
4 weeks
168 hours
72 hours
48 hours
24 hours
NA
60% RH
30°C /
60°C /
60% RH
60°C /
2a
3
120 +1/-0
40 +1/-0
20 +0.5/-0
15 +0.5/-0
10 +0.5/-0
NA
60% RH
30°C /
60% RH
30°C /
60% RH
60°C /
4
60% RH
30°C /
60% RH
60°C /
5
60% RH
30°C /
60% RH
60°C /
5a
6
60% RH
30°C /
60% RH
Time on Label
(TOL)
Time on Label
(TOL)
NA
60% RH
11
Qualification Reliability Testing
Stress Test
Room Temperature
Operating Life (RTOL)
Wet High Temperature
Operating Life (WHTOL)
Wet High Temperature
Storage Life (WHTSL)
High Temperature
Stress Conditions
Stress Duration Failure Criteria
25°C, IF = max DC (Note 1)
85°C/60%RH, IF = max DC (Note 1)
85°C/85%RH, non-operating
110°C, non-operating
1000 hours
1000 hours
1000 hours
1000 hours
1000 hours
200 cycles
200 cycles
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 3
Note 3
Note 3
Note 3
Storage Life (HTSL)
Low Temperature
-40°C, non-operating
Storage Life (LTSL)
Non-operating
-40°C to 120°C, 30 min. dwell,
<5 min. transfer
Temperature Cycle (TMCL)
Non-operating
-40°C to 120°C, 20 min. dwell,
<20 sec. transfer
Thermal Shock (TMSK)
1500 G, 0.5 msec. pulse,
5 shocks each 6 axis
Mechanical Shock
Natural Drop
On concrete from 1.2 m, 3X
Variable Vibration
Frequency
10-2000-10 Hz, log or linear sweep rate,
20 G about 1 min., 1.5 mm, 3X/axis
Solder Heat Resistance
(SHR)
260°C ± 5°C, 10 sec.
Steam age for 16 hrs., then solder dip
at 260°C for 5 sec.
Solder coverage
on lead
Solderability
Notes:
1. Depending on the maximum derating curve.
2. Criteria for judging failure
Criteria for Judgement
Item
Test Condition
Min.
-
Max.
Forward Voltage (VF)
IF = max DC
IF = max DC
Initial Level x 1.1
Luminous Flux or
Radiometric Power (ΦV)
Reverse Current (IR)
Initial Level x 0.7
-
VR = 5V
-
50 μA
* The test is performed after the LED is cooled down to the room temperature.
3. A failure is an LED that is open or shorted.
12
Recommended Solder Pad Design
● All dimensions are in millimeters.
● Electrical isolation is required between Slug and Solder Pad.
13
Reflow Soldering Condition
Low-Temp. & Pb-Free Assembly
(58Bi-42Sn Eutectic Alloy)
Profile Feature
Preheat & Soak
Sn-Pb Eutectic Assembly
Temperature min (Tsmin
Temperature max (Tsmax
Time (Tsmin to Tsmax
)
100 °C
150 °C
90 °C
120 °C
)
)
60-120 seconds
3 °C / second max.
183°C
60-120 seconds
2 °C / second max.
138°C
Average Ramp-Up Rate (Tsmax to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
60-150 seconds
235°C
20-50 seconds
185°C
Peak package body temperature (TP)
Time (tP) within 5°C of the specified
classification temperature (TC)
20 seconds
20 seconds
Average ramp-down rate (TP to Tsmax
)
6 °C/second max.
6 minutes max.
3 °C/second max.
4 minutes max.
Time 25°C to Peak Temperature
● All temperatures refer to topside of the package, measured on the package body surface.
● Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
a heat plate should be used. It should be confirmed beforehand whether the characteristics of
LEDs will or will not be damaged by repairing.
● Reflow soldering should not be done more than two times.
● When soldering, do not put stress on the LEDs during heating.
● After soldering, do not warp the circuit board.
14
Heat Plate Soldering Condition
(1) Soldering Process for Solder Paste
(2) Soldering Process for Solder Wire
Solder Paste
MCPCB
Heat Plate
MCPCB
Put MCPCB on Heat Plate.
Use Solder Mask to print Solder Paste on MCPCB.
Solder Wire
Emitter
Heat Plate
Place Solder Wire to the solder pad of MCPCB.
Place Emitter on MCPCB.
Emitter
Heat Plate
Heat Plate
Put MCPCB on Heat Plate until Solder Paste melt.
The Solder Paste sould be melted within 10 seconds.
Take out MCPCB out from Heat Plate within 15 seconds.
Put Emitter on MCPCB. Take the MCPCB out
from Heat Plate within 10 seconds.
● Heat plate temperature: 230°C max for Lead Solder and 230°C max for Lead-Free Solder.
● We recommend using the 58Bi-42Sn eutectic alloy for low-temp. and lead free soldering (melting point = 138 °C).
● When soldering, do not put stress on the LEDs during heating.
● After soldering, do not warp the circuit board.
Manual Hand Soldering
Solder Wire
Thermal Conductive Glue
Soldering Iron
MCPCB
Emitter
Use Soldering Iron to solder the
leads of Emtter within 5 seconds.
Place Emitter on the MCPCB.
Place Thermal Comductive Glue
on the MCPCB.
● For prototype builds or small series production runs it possible to place and solder the emitters by hand.
● Solder tip temperature: 230°C max for Lead Solder and 260°C max for Lead-Free Solder.
● Avoiding damage to the emitter or to the MCPCB dielectric layer. Damage to the epoxy layer can cause
a short circuit in the array.
● Do not let the solder contact from solder pad to back-side of MCPCB. This one will cause a short circuit
and damage emitter.
15
Emitter Tube Packaging
Star Tube Packaging
Notes:
1. Emitter 50 pieces per tube and Star 20 pieces per tube.
2. Drawing not to scale.
3. All dimensions are in millimeters.
4. All dimendions without tolerances are for reference only.
**Please do not open the moisture barrier bag (MBB) more than one week. This may cause the leads
of LED discoloration. We recommend storing ProLight’s LEDs in a dry box after opening the MBB.
The recommended storage conditions are temperature 5 to 30°C and humidity less than 40% RH.
16
Precaution for Use
● Storage
Please do not open the moisture barrier bag (MBB) more than one week. This may cause the
leads of LED discoloration. We recommend storing ProLight’s LEDs in a dry box after opening
the MBB. The recommended storage conditions are temperature 5 to 30°C and humidity less
than 40% RH. It is also recommended to return the LEDs to the MBB and to reseal the MBB.
● The slug is is not electrically neutral. Therefore, we recommend to isolate the heat sink.
● The slug is to be soldered. If not, please use the heat conductive adhesive.
● Any mechanical force or any excess vibration shall not be accepted to apply during cooling
process to normal temperature after soldering.
● Please avoid rapid cooling after soldering.
● Components should not be mounted on warped direction of PCB.
● Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
a heat plate should be used. It should be confirmed beforehand whether the characteristics of
the LEDs will or will not be damaged by repairing.
● This device should not be used in any type of fluid such as water, oil, organic solvent and etc.
When cleaning is required, isopropyl alcohol should be used.
● When the LEDs are illuminating, operating current should be decide after considering the
package maximum temperature.
● The appearance, specifications and flux bin of the product may be modified for improvement
without notice. Please refer to the below website for the latest datasheets.
http://www.prolightopto.com/
Handling of Silicone Lens LEDs
Notes for handling of silicone lens LEDs
● Please do not use a force of over 3kgf impact or pressure on the silicone lens,
otherwise it will cause a catastrophic failure.
● The LEDs should only be picked up by making contact with the sides of the LED body.
● Avoid touching the silicone lens especially by sharp tools such as Tweezers.
● Avoid leaving fingerprints on the silicone lens.
● Please store the LEDs away from dusty areas or seal the product against dust.
● When populating boards in SMT production, there are basically no restrictions
regarding the form of the pick and place nozzle, except that mechanical pressure
on the silicone lens must be prevented.
● Please do not mold over the silicone lens with another resin. (epoxy, urethane, etc)
╳
○
17
相关型号：
SI9130DB
5- and 3.3-V Step-Down Synchronous ConvertersWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135LG-T1
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135LG-T1-E3
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135_11
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9136_11
Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130CG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130LG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130_11
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137DB
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137LG
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9122E
500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification DriversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
©2020 ICPDF网 联系我们和版权申明