PP6N-1LXX [ELITE]
1W Power LED;
| 型号： | PP6N-1LXX |
| 厂家： | 
Elite Enterprises (H.K.) Co., Ltd. |
| 描述： | 1W Power LED |
| 文件： | 总23页 (文件大小：634K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ProLight PP6N-1Lxx
1W Power LED
Technical Datasheet
Version: 1.8
Features
● High flux per LED
● Various colors
● Good color uniformity
● Industry best moisture senstivity level - JEDEC 2a
4 week floor life without reconditioning
● Low-temp. & lead free reflow soldering
● RoHS compliant
● More energy efficient than incandescent and
most halogen lamps
● Low Voltage DC operated
● Instant light (less than 100ns)
● No UV
Typical Applications
● Reading lights (car, bus, aircraft)
● Portable (flashlight, bicycle)
● Uplighters/Downlighters
● Decorative/Entertainment
● Bollards/Security/Garden
● Cove/Undershelf/Task
● Indoor/Outdoor Commercial and
Residential Architectural
● Automotive Ext (Stop-Tail-Turn,
CHMSL, Mirror Side Repeat)
● LCD backlights
2009/08
1
Emitter Mechanical Dimensions
Notes:
1. The cathode side of the device is denoted by the chamfer on the part body.
2. Electrical insulation between the case and the board is required --- slug of device is not
electrically neutral. Do not electrically connect either the anode or cathode to the slug.
3. Drawing not to scale.
4. All dimensions are in millimeters.
5. All dimendions without tolerances are for reference only.
6. Please do not solder the emitter by manual hand soldering, otherwise it will damage the emitter.
7. Please do not use a force of over 3kgf impact or pressure on the lens of the LED, otherwise
it will cause a catastrophic failure.
*The appearance and specifications of the product may be modified for improvement without notice.
2
Star Mechanical Dimensions
Notes:
1. Slots in aluminum-core PCB for M3 or #4 mounting screw.
2. Electrical interconnection pads labeled on the aluminum-core PCB with "+" and "-" to denote
positive and negative, respectively. All positive pads are interconnected, as are all negative pads,
allowing for flexibility in array interconnection.
3. Drawing not to scale.
4. All dimensions are in millimeters.
5. All dimendions without tolerances are for reference only.
6. Please do not use a force of over 3kgf impact or pressure on the lens of the LED, otherwise
it will cause a catastrophic failure.
*The appearance and specifications of the product may be modified for improvement without notice.
3
Flux Characteristics at 350mA, TJ = 25°C
Lumious Flux ΦV (lm)
Part Number
Emitter
Radiation
Pattern
Color
Star
Minimum
Typical
White
Warm White
Green
PP6N-1LWE
PP6N-1LVE
PP6N-1LGE
PP6N-1LBE
PP6N-1LAE
PP6N-1LRE
PP6N-1LWS
PP6N-1LVS
PP6N-1LGS
PP6N-1LBS
PP6N-1LAS
PP6N-1LRS
67.2
67.2
58.9
10.7
30.6
30.6
86
77
66
14
42
40
Lambertian
Blue
Amber
Red
● ProLight maintains a tolerance of ± 10% on flux and power measurements.
● Please do not drive at rated current more than 1 second without proper heat sink.
Electrical Characteristics at 350mA, TJ = 25°C
Temperature
Thermal
Coefficient of
VF (mV/ °C)
ΔVF/ ΔTJ
Resistance
Junction to
Slug (°C/ W)
Forward Voltage VF (V)
Dynamic
Resistance (Ω)
Color
Min.
Typ.
Max.
White
Warm White
Green
2.8
2.8
2.8
2.8
1.9
1.9
3.5
3.5
3.5
3.5
2.2
2.2
4.3
4.3
4.3
4.3
3.1
3.1
1.0
1.0
1.0
1.0
2.4
2.4
-2.0
-2.0
-2.0
-2.0
-2.0
-2.0
10
10
10
10
10
10
Blue
Amber
Red
Optical Characteristics at 350mA, TJ = 25°C
Temperature
Coefficient of
Dominant
Half-width Wavelength
Total
included Viewing
Angle Angle
(degrees) (degrees)
Dominant Wavelength λD,
Spectral
or Color Temperature CCT
(nm)
(nm/ °C)
Radiation
Pattern
Color
Δλ1/2
ΔλD/ ΔTJ
θ0.90V
2 θ1/2
Min.
Typ.
Max.
White
4100 K
5500 K
3300 K
525 nm
465 nm
592 nm
10000 K
4100 K
535 nm
475 nm
597 nm
631 nm
---
---
35
25
20
20
---
160
160
160
160
160
160
140
140
140
140
140
140
Warm White 2700 K
---
Green
Blue
515 nm
455 nm
587 nm
0.04
0.04
0.05
0.05
Lambertian
Amber
Red
613.5 nm 623 nm
● ProLight maintains a tolerance of ± 1nm for dominant wavelength measurements.
● ProLight maintains a tolerance of ± 5% for CCT measurements.
4
Absolute Maximum Ratings
White/Warm White/
Parameter
Green/Blue/Amber/Red
DC Forward Current (mA)
350
500
350
Peak Pulsed Forward Current (mA)
Average Forward Current (mA)
ESD Sensitivity
> ±500V
(HBM per MIL-STD-883E Method 3015.7)
LED Junction Temperature (°C)
Aluminum-core PCB Temperature (°C)
Storage & Operating Temperature (°C)
Soldering Temperature(°C)
120
105
-40 to +105
235°C
Photometric Luminous Flux Bin Structure
Color
Bin Code
Minimum Photometric Flux (lm)
Maximum Photometric Flux (lm)
T1
T2
67.2
76.6
76.6
87.4
White
T1
T2
67.2
76.6
76.6
87.4
Warm White
*When CCT is less than 3050K, T2 bin is not available.
S2
T1
58.9
67.2
67.2
76.6
Green
Blue
L
10.7
13.9
13.9
18.1
M
Q
R
30.6
39.8
39.8
51.7
Amber
Red
Q
R
30.6
39.8
39.8
51.7
● ProLight maintains a tolerance of ± 10% on flux and power measurements.
● The flux bin of the product may be modified for improvement without notice.
5
Color Bin
White and Warm White Binning Structure Graphical Representation
0.48
2700 K
2850 K
0.46
0.44
3050 K
3250 K
3500 K
3800 K
M1
4100 K
N1
0.42
0.40
0.38
0.36
0.34
0.32
0.30
0.28
0.26
P1
N0
Q1
4500 K
M0
Planckian
(BBL)
R1
P0
Q0
S1
S0
5000 K
R0
TN
T0
5650 K
UN
U0
6300 K
VN
V0
Warm White
7000 K
WN
XN
X0
W0
WP
10000 K
Y0
White
XP
YA
0.26
0.28
0.30
0.32
0.34
0.36
0.38
0.40
0.42
0.44
0.46
0.48
0.50
x
6
Color Bins
White Bin Structure
Typ. CCT
(K)
Typ. CCT
(K)
Bin Code
x
y
Bin Code
WN
x
y
0.378
0.374
0.360
0.362
0.382
0.378
0.362
0.365
0.362
0.360
0.344
0.346
0.365
0.362
0.346
0.347
0.329
0.329
0.346
0.344
0.329
0.329
0.347
0.346
0.329
0.329
0.317
0.316
0.382
0.366
0.357
0.372
0.397
0.382
0.372
0.386
0.372
0.357
0.344
0.359
0.386
0.372
0.359
0.372
0.331
0.345
0.359
0.344
0.345
0.357
0.372
0.359
0.345
0.331
0.320
0.333
0.329
0.316
0.315
0.329
0.329
0.329
0.318
0.317
0.308
0.305
0.316
0.317
0.305
0.303
0.315
0.316
0.308
0.317
0.319
0.311
0.308
0.283
0.274
0.303
0.308
0.311
0.290
0.283
0.345
0.333
0.344
0.357
0.331
0.320
0.310
0.320
0.311
0.322
0.333
0.320
0.322
0.333
0.344
0.333
0.311
0.320
0.300
0.293
0.311
0.284
0.301
0.333
0.311
0.293
0.270
0.284
T0
4300
4300
4750
4750
5320
5320
5970
5970
5970
6650
6650
6650
8000
8000
TN
U0
UN
V0
WP
X0
XN
XP
Y0
VN
W0
YA
● Tolerance on each color bin (x , y) is ± 0.01
Note: Although several bins are outlined, product availability in a particular bin varies by production run
and by product performance. Not all bins are available in all colors.
7
Color Bins
Warm White Bin Structure
Typ. CCT
(K)
Typ. CCT
(K)
Bin Code
x
y
Bin Code
Q0
x
y
0.453
0.444
0.459
0.467
0.460
0.453
0.467
0.473
0.438
0.429
0.444
0.453
0.444
0.438
0.453
0.460
0.424
0.416
0.429
0.438
0.430
0.424
0.438
0.444
0.416
0.399
0.403
0.419
0.430
0.416
0.419
0.432
0.412
0.394
0.399
0.416
0.426
0.412
0.416
0.430
0.407
0.389
0.394
0.412
0.421
0.407
0.412
0.426
0.409
0.402
0.416
0.424
0.414
0.409
0.424
0.430
0.392
0.387
0.402
0.409
0.414
0.409
0.392
0.397
0.392
0.387
0.374
0.378
0.397
0.392
0.378
0.382
0.400
0.382
0.389
0.407
0.414
0.400
0.407
0.421
0.391
0.374
0.382
0.400
0.414
0.400
0.391
0.406
0.391
0.374
0.366
0.382
0.406
0.391
0.382
0.397
M0
2770
2770
2950
2950
3150
3150
3370
3370
3650
3650
3950
3950
M1
N0
N1
P0
P1
Q1
R0
R1
S0
S1
● Tolerance on each color bin (x , y) is ± 0.01
Note: Although several bins are outlined, product availability in a particular bin varies by production run
and by product performance. Not all bins are available in all colors.
8
Dominant Wavelength Bin Structure
Minimum Dominant
Wavelength (nm)
Maximum Dominant
Wavelength (nm)
Color
Bin Code
A
1
2
3
515
520
525
530
520
525
530
535
Green
A
1
2
3
455
460
465
470
460
465
470
475
Blue
2
4
6
7
587.0
589.5
592.0
594.5
589.5
592.0
594.5
597.0
Amber
Red
2
4
613.5
620.5
620.5
631.0
● ProLight maintains a tolerance of ± 1nm for dominant wavelength measurements.
Note: Although several bins are outlined, product availability in a particular bin varies by production run
and by product performance. Not all bins are available in all colors.
9
Color Spectrum, TJ = 25°C
1. White
1.0
0.8
Standard Eye Response Cruve
White
0.6
0.4
0.2
0.0
350 400 450 500 550 600 650 700 750 800 850
Wavelength(nm)
2. Warm White
1.0
Standard Eye Response Cruve
Warm White
0.8
0.6
0.4
0.2
0.0
350 400 450 500 550 600 650 700 750 800 850
Wavelength(nm)
3. Blue、Green、Amber、Red
1.0
0.8
0.6
0.4
0.2
0.0
Blue
Green
Amber
Red
400
450
500
550
600
650
700
Wavelength(nm)
10
Light Output Characteristics
Relative Light Output vs. Junction Temperature at 350mA
160
White, Warm White
Green
Blue
140
120
100
80
60
40
20
0
-20
0
20
40
60
80
100
120
Junction Temperature, TJ (℃)
160
140
120
100
80
Red
Amber
60
40
20
0
-20
0
20
40
60
80
100
120
Junction Temperature, TJ (℃)
11
Forward Current Characteristics, TJ = 25°C
1. Forward Voltage vs. Forward Current
400
350
300
250
200
150
100
50
400
350
300
250
200
150
100
50
Red, Amber
White, Warm White,
Green, Blue
0
0
0 0.5 1 1.5 2 2.5 3 3.5 4
Forward Voltage (V)
0
0.5
1
1.5
2
2.5
3
Forward Voltage (V)
2. Forward Current vs. Normalized Relative Luminous Flux
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Red, Amber
White, Warm White,
Green, Blue
0
100
200
300
400
0
100
200
300
400
Forward Current (mA)
Forward Current (mA)
12
Ambient Temperature vs. Maximum Forward Current
1. White, Warm White, Green, Blue (TJMAX = 120°C)
400
350
300
250
RθJ-A = 60°C/W
200
RθJ-A = 50°C/W
150
RθJ-A = 40°C/W
100
RθJ-A = 30°C/W
50
0
0
25
50
75
100
125
150
Ambient Temperature (℃)
2. Red, Amber (TJMAX = 120°C)
400
350
300
250
RθJ-A = 60°C/W
RθJ-A = 50°C/W
200
150
100
50
RθJ-A = 40°C/W
RθJ-A = 30°C/W
0
0
25
50
75
100
125
150
Ambient Temperature (℃)
13
Typical Representative Spatial Radiation Pattern
Lambertian Radiation Pattern
100
90
80
70
60
50
40
30
20
10
0
-100
-80
-60
-40
-20
0
20
40
60
80
100
Angular Displacement (Degrees)
14
Moisture Sensitivity Level - JEDEC 2a
Soak Requirements
Accelerated Environment
Conditions Time (hours) Conditions Time (hours) Conditions
Level
Floor Life
Standard
Time
≤30°C /
30°C /
60°C /
2a
4 weeks
696 +5/-0
120 +1/-0
60% RH
60% RH
60% RH
● The standard soak time includes a default value of 24 hours for semiconductor manufature's
exposure time (MET) between bake and bag and includes the maximum time allowed out of
the bag at the distributor's facility.
● Table below presents the moisture sensitivity level definitions per IPC/JEDEC's J-STD-020C.
Soak Requirements
Level
Floor Life
Standard
Accelerated Environment
Time
Conditions Time (hours) Conditions Time (hours) Conditions
≤30°C /
85% RH
≤30°C /
60% RH
≤30°C /
60% RH
≤30°C /
60% RH
≤30°C /
60% RH
≤30°C /
60% RH
≤30°C /
60% RH
≤30°C /
60% RH
85°C /
85% RH
85°C /
1
2
Unlimited
168 +5/-0
168 +5/-0
696 +5/-0
192 +5/-0
96 +2/-0
72 +2/-0
48 +2/-0
NA
NA
NA
1 year
4 weeks
168 hours
72 hours
48 hours
24 hours
NA
60% RH
30°C /
60°C /
60% RH
60°C /
2a
3
120 +1/-0
40 +1/-0
20 +0.5/-0
15 +0.5/-0
10 +0.5/-0
NA
60% RH
30°C /
60% RH
30°C /
60% RH
60°C /
4
60% RH
30°C /
60% RH
60°C /
5
60% RH
30°C /
60% RH
60°C /
5a
6
60% RH
30°C /
60% RH
Time on Label
(TOL)
Time on Label
(TOL)
NA
60% RH
15
Qualification Reliability Testing
Stress Test
Room Temperature
Operating Life (RTOL)
Wet High Temperature
Operating Life (WHTOL)
Wet High Temperature
Storage Life (WHTSL)
High Temperature
Stress Conditions
Stress Duration Failure Criteria
25°C, IF = max DC (Note 1)
85°C/60%RH, IF = max DC (Note 1)
85°C/85%RH, non-operating
110°C, non-operating
1000 hours
1000 hours
1000 hours
1000 hours
1000 hours
200 cycles
200 cycles
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 2
Note 3
Note 3
Note 3
Note 3
Storage Life (HTSL)
Low Temperature
-40°C, non-operating
Storage Life (LTSL)
Non-operating
-40°C to 120°C, 30 min. dwell,
<5 min. transfer
Temperature Cycle (TMCL)
Non-operating
-40°C to 120°C, 20 min. dwell,
<20 sec. transfer
Thermal Shock (TMSK)
1500 G, 0.5 msec. pulse,
5 shocks each 6 axis
Mechanical Shock
Natural Drop
On concrete from 1.2 m, 3X
Variable Vibration
Frequency
10-2000-10 Hz, log or linear sweep rate,
20 G about 1 min., 1.5 mm, 3X/axis
Solder Heat Resistance
(SHR)
260°C ± 5°C, 10 sec.
Steam age for 16 hrs., then solder dip
at 260°C for 5 sec.
Solder coverage
on lead
Solderability
Notes:
1. Depending on the maximum derating curve.
2. Criteria for judging failure
Criteria for Judgement
Item
Test Condition
Min.
-
Max.
Forward Voltage (VF)
IF = max DC
IF = max DC
Initial Level x 1.1
Luminous Flux or
Radiometric Power (ΦV)
Reverse Current (IR)
Initial Level x 0.7
-
VR = 5V
-
50 μA
* The test is performed after the LED is cooled down to the room temperature.
3. A failure is an LED that is open or shorted.
16
Recommended Solder Pad Design
● All dimensions are in millimeters.
● Electrical isolation is required between Slug and Solder Pad.
17
Reflow Soldering Condition
Low-Temp. & Pb-Free Assembly
(58Bi-42Sn Eutectic Alloy)
Profile Feature
Preheat & Soak
Sn-Pb Eutectic Assembly
Temperature min (Tsmin
Temperature max (Tsmax
Time (Tsmin to Tsmax
)
100 °C
150 °C
90 °C
120 °C
)
)
60-120 seconds
3 °C / second max.
183°C
60-120 seconds
2 °C / second max.
138°C
Average Ramp-Up Rate (Tsmax to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
60-150 seconds
235°C
20-50 seconds
185°C
Peak package body temperature (TP)
Time (tP) within 5°C of the specified
classification temperature (TC)
20 seconds
20 seconds
Average ramp-down rate (TP to Tsmax
)
6 °C/second max.
6 minutes max.
3 °C/second max.
4 minutes max.
Time 25°C to Peak Temperature
● All temperatures refer to topside of the package, measured on the package body surface.
● Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
a heat plate should be used. It should be confirmed beforehand whether the characteristics of
LEDs will or will not be damaged by repairing.
● Reflow soldering should not be done more than two times.
● When soldering, do not put stress on the LEDs during heating.
● After soldering, do not warp the circuit board.
18
Heat Plate Soldering Condition
(1) Soldering Process for Solder Paste
(2) Soldering Process for Solder Wire
Solder Paste
MCPCB
Heat Plate
MCPCB
Put MCPCB on Heat Plate.
Use Solder Mask to print Solder Paste on MCPCB.
Solder Wire
Emitter
Heat Plate
Place Solder Wire to the solder pad of MCPCB.
Place Emitter on MCPCB.
Emitter
Heat Plate
Heat Plate
Put MCPCB on Heat Plate until Solder Paste melt.
The Solder Paste sould be melted within 10 seconds.
Take out MCPCB out from Heat Plate within 15 seconds.
Put Emitter on MCPCB. Take the MCPCB out
from Heat Plate within 10 seconds.
● Heat plate temperature: 230°C max for Lead Solder and 230°C max for Lead-Free Solder.
● We recommend using the 58Bi-42Sn eutectic alloy for low-temp. and lead free soldering (melting point = 138 °C).
● When soldering, do not put stress on the LEDs during heating.
● After soldering, do not warp the circuit board.
19
Emitter Reel Packaging
Notes:
1. Drawing not to scale.
2. All dimensions are in millimeters.
3. General tolerance is ± 0.10 mm.
20
Emitter Reel Packaging
13.2 ± 0.5
16.2 ± 0.5
Φ 21 ± 0.5
Φ 13.1 ± 0.5
3 ± 0.5
60 ± 0.5
178 ± 1
4 ± 0.5
5 ± 0.5
Notes:
1. Empty component pockets sealed with top cover tape.
2. 250 or 500 pieces per reel.
3. Drawing not to scale.
4. All dimensions are in millimeters.
21
Emitter Tube Packaging
Notes:
1. 20 pieces per tube.
2. Drawing not to scale.
3. All dimensions are in millimeters.
4. All dimendions without tolerances are for reference only.
**Please do not open the moisture barrier bag (MBB) more than one week. This may cause the leads
of LED discoloration. We recommend storing ProLight’s LEDs in a dry box after opening the MBB.
The recommended storage conditions are temperature 5 to 30°C and humidity less than 40% RH.
22
Precaution for Use
● Storage
Please do not open the moisture barrier bag (MBB) more than one week. This may cause the
leads of LED discoloration. We recommend storing ProLight’s LEDs in a dry box after opening
the MBB. The recommended storage conditions are temperature 5 to 30°C and humidity less
than 40% RH. It is also recommended to return the LEDs to the MBB and to reseal the MBB.
● The slug is is not electrically neutral. Therefore, we recommend to isolate the heat sink.
● The slug is to be soldered. If not, please use the heat conductive adhesive.
● Any mechanical force or any excess vibration shall not be accepted to apply during cooling
process to normal temperature after soldering.
● Please avoid rapid cooling after soldering.
● Components should not be mounted on warped direction of PCB.
● Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
a heat plate should be used. It should be confirmed beforehand whether the characteristics of
the LEDs will or will not be damaged by repairing.
● This device should not be used in any type of fluid such as water, oil, organic solvent and etc.
When cleaning is required, isopropyl alcohol should be used.
● When the LEDs are illuminating, operating current should be decide after considering the
package maximum temperature.
● The appearance, specifications and flux bin of the product may be modified for improvement
without notice. Please refer to the below website for the latest datasheets.
http://www.prolightopto.com/
Handling of Silicone Lens LEDs
Notes for handling of silicone lens LEDs
● Please do not use a force of over 3kgf impact or pressure on the silicone lens,
otherwise it will cause a catastrophic failure.
● The LEDs should only be picked up by making contact with the sides of the LED body.
● Avoid touching the silicone lens especially by sharp tools such as Tweezers.
● Avoid leaving fingerprints on the silicone lens.
● Please store the LEDs away from dusty areas or seal the product against dust.
● When populating boards in SMT production, there are basically no restrictions
regarding the form of the pick and place nozzle, except that mechanical pressure
on the silicone lens must be prevented.
● Please do not mold over the silicone lens with another resin. (epoxy, urethane, etc)
╳
○
23
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