B32914A3155K000 [EPCOS]
Film Capacitors EMI Suppression Capacitors (MKP); 薄膜电容器EMI抑制电容器（ MKP ）
| 型号： | B32914A3155K000 |
| 厂家： | 
EPCOS |
| 描述： | Film Capacitors EMI Suppression Capacitors (MKP) |
| 文件： | 总16页 (文件大小：305K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Film Capacitors
EMI Suppression Capacitors (MKP)
Series/Type:
B32911 ... B32916
Date:
May 2009
© EPCOS AG 2009. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
EMI suppression capacitors (MKP)
X1 / 330 V AC
B32911 ... B32916
Typical applications
Dimensional drawing
X1 class for interference suppression
"Across the line" applications
For apparatus permanently connected to
mains and isolated from direct contact with
humidity
Climatic
Max. operating temperature: 110 °C
Climatic category (IEC 60068-1):
40/110/56
Construction
Dimensions in mm
Dielectric: polypropylene (MKP)
Plastic case (UL 94 V-0)
Epoxy resin sealing (UL 94 V-0)
Lead
spacing
±0.4
Lead
diameter
d1
Type
Features
Very small dimensions
Good self-healing properties
High voltage capability
10
0.6
0.8
1.0
B32911
15 ... 27.5
37.5
B32912 ... B32914
B32916
Terminals
Parallel wire leads, lead-free tinned
Standard lead lengths: 6 ꢀ1 mm
Special lead lengths available on request
Marking examples
=10 mm
15 ≤
≤ 27.5 mm
Marking
(CR ≤ 1 µF)
Manufacturer's logo, lot number,
date code, rated capacitance (coded),
capacitance tolerance (code letter),
rated AC voltage (IEC),
series number, sub-class (X1),
dielectric code (MKP), climatic category,
passive flammability category, approvals.
22.5 ≤
≤ 37.5 mm
Delivery mode
(CR > 1 µF)
Bulk (untaped)
Taped (Ammo pack or reel)
For taping details, refer to chapter
"Taping and packing".
Please read Cautions and warnings and
Important notes at the end of this document.
Page 2 of 16
B32911 ... B32916
X1 / 330 V AC
Approvals
Approval marks
Standards
Certificate
EN 60384-14 / IEC 60384-14 (330 V AC) 40018909 & 40010694
UL1414 (250 V AC)
UL1283 (330 V AC)
E97863
E157153
1)
CSA C22.2 No. 1 (250 V AC)
CSA C22.2 No. 8 (330 V AC)
E97863
E157153
1) approved by UL
Overview of available types
Lead spacing 10 mm
15 mm
22.5 mm
B32913
27.5 mm
B32914
37.5 mm
B32916
Type
CR (µF)
0.010
0.022
0.033
0.047
0.068
0.10
0.15
0.22
0.33
0.47
0.68
1.0
B32911
B32912
1.5
2.2
3.3
4.7
6.8
Please read Cautions and warnings and
Important notes at the end of this document.
Page 3 of 16
B32911 ... B32916
X1 / 330 V AC
Ordering codes and packing units
Lead spacing CR
Max. dimensions Ordering code
Reel
Untaped
Ammo
pack
pcs./MOQ
w × h × l
mm
(composition see
below)
mm
10
µF
pcs./MOQ pcs./MOQ
0.010
0.022
0.033
0.022
0.033
0.047
0.068
0.10
0.15
0.15
0.22
0.22
0.33
0.15
0.22
0.33
0.47
0.47
0.68
1.0
4.0 × 9.0 × 13.0 B32911A3103+*** 4000
5.0 × 11.0 × 13.0 B32911B3223+*** 3320
6.0 × 12.0 × 13.0 B32911A3333M*** 2720
5.0 × 10.5 × 18.0 B32912A3223+*** 4680
5.0 × 10.5 × 18.0 B32912A3333+*** 4680
5.0 × 10.5 × 18.0 B32912A3473+*** 4680
6.0 × 11.0 × 18.0 B32912A3683+*** 3840
7.0 × 12.5 × 18.0 B32912A3104+*** 3320
7.0 × 12.5 × 18.0 B32912B3154M*** 3320
8.5 × 14.5 × 18.0 B32912A3154+*** 2720
8.5 × 14.5 × 18.0 B32912B3224M*** 2720
9.0 × 17.5 × 18.0 B32912A3224+*** 2560
9.0 × 17.5 × 18.0 B32912B3334M*** 2560
6.0 × 15.0 × 26.5 B32913A3154+*** 2720
7.0 × 16.0 × 26.5 B32913A3224+*** 2320
8.5 × 16.5 × 26.5 B32913A3334M*** 1920
10.5 × 18.5 × 26.5 B32913A3474M*** 1560
11.0 × 21.0 × 31.5 B32914A3474+***
11.0 × 21.0 × 31.5 B32914B3684+***
13.5 × 23.0 × 31.5 B32914A3105+***
18.0 × 27.5 × 31.5 B32914A3155+***
19.0 × 30.0 × 31.5 B32914A3225M***
18.0 × 32.5 × 41.5 B32916A3335+***
20.0 × 39.5 × 41.5 B32916A3475M***
28.0 × 42.5 × 41.5 B32916A3685M***
6800
5200
4400
5200
5200
5200
4400
3600
3600
2800
2800
2800
2800
2800
2400
2000
1600
1400
1400
1000
ꢀ
4000
4000
4000
4000
4000
4000
4000
4000
4000
2000
2000
2000
2000
2880
2520
2040
2160
1280
1280
1040
800
15
22.5
27.5
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
1.5
2.2
ꢀ
720
720
640
440
37.5
3.3
ꢀ
ꢀ
4.7
6.8
ꢀ
MOQ = Minimum Order Quantity, consisting of 4 packing units.
Further intermediate capacitance values on request.
Composition of ordering code
+ = Capacitance tolerance code:
*** = Packaging code:
M = ±20%
K = ±10%
289 = Ammo pack
189 = Reel
000 = Untaped (lead length 6 ꢀ1 mm)
Please read Cautions and warnings and
Important notes at the end of this document.
Page 4 of 16
B32911 ... B32916
X1 / 330 V AC
Technical data
Rated AC voltage ( IEC 60384-14 )
Maximum continuous DC voltage VDC
Max. operating temperature Top,max
DC test voltage
330 V (50/60 Hz)
760 V
+110 °C
2500 V, 2 s
Dissipation factor tan δ (in 10-3)
CR ≤ 2.2 µF CR > 2.2 µF
at 20 °C (upper limit values)
at
1 kHz
1
2
Insulation resistance Rins
or time constant τ = CR ꢁ Rins
at 100 V DC, 20 °C,
C
R ≤ 0.33 µF
CR > 0.33 µF
30 000 s
100 000 MΩ
rel. humidity ≤ 65% and for 60 s
(minimum as-delivered values)
Passive flammability category
to IEC 40 (CO) 752
B
Capacitance tolerances
(measured at 1 kHz)
±10% (K), ±20% (M)
Pulse handling capability
"dV/dt" represents the maximum permissible voltage change per unit of time for non-sinusoidal
voltages, expressed in V/µs.
"k0" represents the maximum permissible pulse characteristic of the waveform applied to the
capacitor, expressed in V2/µs.
Note:
The values of dV/dt and k0 provided below must not be exceeded in order to avoid damaging the
capacitor.
dV/dt and k0 values
Lead spacing
dV/dt in V/µs
k0 in V2/µs
10 mm
550
473 000
15 mm
400
344 000
22.5 mm
200
27.5 mm
150
37.5 mm
100
172 000
129 000
86 000
Please read Cautions and warnings and
Important notes at the end of this document.
Page 5 of 16
B32911 ... B32916
X1 / 330 V AC
Mounting guidelines
1
Soldering
Solderability of leads
1.1
The solderability of terminal leads is tested to IEC 60068-2-20, test Ta, method 1.
Before a solderability test is carried out, terminals are subjected to accelerated ageing (to
IEC 60068-2-2, test Ba: 4 h exposure to dry heat at 155 °C). Since the ageing temperature is far
higher than the upper category temperature of the capacitors, the terminal wires should be cut off
from the capacitor before the ageing procedure to prevent the solderability being impaired by the
products of any capacitor decomposition that might occur.
Solder bath temperature
Soldering time
235 ±5 °C
2.0 ±0.5 s
Immersion depth
Evaluation criteria:
Visual inspection
2.0 +0/ꢀ0.5 mm from capacitor body or seating plane
Wetting of wire surface by new solder ≥90%, free-flowing solder
1.2
Resistance to soldering heat
Resistance to soldering heat is tested to IEC 60068-2-20, test Tb, method 1A.
Conditions:
Series
Solder bath temperature Soldering time
MKT boxed (except 2.5 × 6.5 × 7.2 mm) 260 ±5 °C
coated
10 ±1 s
uncoated (lead spacing > 10 mm)
MFP
MKP (lead spacing > 7.5 mm)
MKT boxed (case 2.5 × 6.5 × 7.2 mm)
5 ±1 s
(lead spacing ≤ 7.5 mm)
uncoated (lead spacing ≤ 10 mm)
insulated (B32559)
MKP
MKT
< 4 s
recommended soldering
profile for MKT uncoated
(lead spacing ≤ 10 mm) and
insulated (B32559)
Please read Cautions and warnings and
Important notes at the end of this document.
Page 6 of 16
B32911 ... B32916
X1 / 330 V AC
Immersion depth
Shield
2.0 +0/ꢀ0.5 mm from capacitor body or seating plane
Heat-absorbing board, (1.5 ±0.5) mm thick, between capacitor
body and liquid solder
Evaluation criteria:
Visual inspection
No visible damage
2% for MKT/MKP/MFP
5% for EMI suppression capacitors
As specified in sectional specification
∆C/C0
tan δ
Please read Cautions and warnings and
Important notes at the end of this document.
Page 7 of 16
B32911 ... B32916
X1 / 330 V AC
1.3
General notes on soldering
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature Tmax. Long exposure to temperatures above this type-related temperature limit
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Pre-heating with a maximum temperature of 110 °C
Temperature inside the capacitor should not exceed the following limits:
ꢀ MKP/MFP 110 °C
ꢀ MKT 160 °C
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
Uncoated capacitors
For uncoated MKT capacitors with lead spacings ≤10 mm (B32560/B32561) the following mea-
sures are recommended:
pre-heating to not more than 110 °C in the preheater phase
rapid cooling after soldering
Please read Cautions and warnings and
Important notes at the end of this document.
Page 8 of 16
B32911 ... B32916
X1 / 330 V AC
2
Cleaning
To determine whether the following solvents, often used to remove flux residues and other sub-
stances, are suitable for the capacitors described, refer to the table below:
Type
Ethanol,
isopropanol,
n-propanol
n-propanol-water
mixtures,
water with surface
tension-reducing
tensides (neutral)
Solvent from
table A (see
next page)
Solvent from
table B (see
next page)
MKT
(uncoated)
Suitable
Unsuitable
In part suitable Unsuitable
Suitable
MKT, MKP, MFP
(coated/boxed)
Suitable
Even when suitable solvents are used, a reversible change of the electrical characteristics may
occur in uncoated capacitors immediately after they are washed. Thus it is always recommended
to dry the components (e.g. 4 h at 70 °C) before they are subjected to subsequent electrical test-
ing.
Table A
Manufacturers' designations for trifluoro-trichloro-ethane-based cleaning solvents (selection)
Trifluoro-trichloro-
ethane
Mixtures of trifluoro-trichloro-ethane with ethanol and
isopropanol
Manufacturer
Freon TF
Freon TE 35; Freon TP 35; Freon TES
Frigen 113 TR-E; Frigen 113 TR-P; Frigen TR-E 35
Arklone A; Arklone L; Arklone K
Du Pont
Hoechst
ICI
Frigen 113 TR
Arklone P
Kaltron 113 MDR
Flugene 113
Kaltron 113 MDA; Kaltron 113 MDI; Kaltron 113 MDI 35 Kali-Chemie
Flugene 113 E; Flugene 113 IPA Rhone-Progil
Table B (worldwide banned substances)
Manufacturers' designations for unsuitable cleaning solvents (selection)
Mixtures of chlorinated hydrocarbons and ketones with fluorated hydrocarbons Manufacturer
Freon TMC; Freon TA; Freon TC
Arklone E
Du Pont
ICI
Kaltron 113 MDD; Kaltron 113 MDK
Flugene 113 CM
Kali-Chemie
Rhone-Progil
Please read Cautions and warnings and
Important notes at the end of this document.
Page 9 of 16
B32911 ... B32916
X1 / 330 V AC
3
Embedding of capacitors in finished assemblies
In many applications, finished circuit assemblies are embedded in plastic resins. In this case,
both chemical and thermal influences of the embedding ("potting") and curing processes must be
taken into account.
Our experience has shown that the following potting materials can be recommended: non-flexible
epoxy resins with acid-anhydride hardeners; chemically inert, non-conducting fillers; maximum
curing temperature of 100 °C.
Caution:
Consult us first if you wish to embed uncoated types!
Please read Cautions and warnings and
Important notes at the end of this document.
Page 10 of 16
B32911 ... B32916
X1 / 330 V AC
Cautions and warnings
Do not exceed the upper category temperature (UCT).
Do not apply any mechanical stress to the capacitor terminals.
Avoid any compressive, tensile or flexural stress.
Do not move the capacitor after it has been soldered to the PC board.
Do not pick up the PC board by the soldered capacitor.
Do not place the capacitor on a PC board whose PTH hole spacing differs from the specified
lead spacing.
Do not exceed the specified time or temperature limits during soldering.
Avoid external energy inputs, such as fire or electricity.
Avoid overload of the capacitors.
The table below summarizes the safety instructions that must always be observed. A detailed de-
scription can be found in the relevant sections of the chapters "General technical information" and
"Mounting guidelines".
Topic
Safety information
Reference chapter
"General technical
information"
Storage conditions Make sure that capacitors are stored within the
4.5
specified range of time, temperature and humidity "Storage conditions"
conditions.
Flammability
Avoid external energy, such as fire or electricity
(passive flammability), avoid overload of the
capacitors (active flammability) and consider the
flammability of materials.
5.3
"Flammability"
Resistance to
vibration
Do not exceed the tested ability to withstand
vibration. The capacitors are tested to
IEC 60068-2-6.
5.2
"Resistance to vibration"
EPCOS offers film capacitors specially designed
for operation under more severe vibration regimes
such as those found in automotive applications.
Consult our catalog "Film Capacitors for
Automotive Electronics".
Please read Cautions and warnings and
Important notes at the end of this document.
Page 11 of 16
B32911 ... B32916
X1 / 330 V AC
Topic
Safety information
Reference chapter
"Mounting guidelines"
Soldering
Cleaning
Do not exceed the specified time or temperature 1 "Soldering"
limits during soldering.
Use only suitable solvents for cleaning capacitors. 2 "Cleaning"
Embedding of
capacitors in
When embedding finished circuit assemblies in
plastic resins, chemical and thermal influences
3 "Embedding of
capacitors in finished
assemblies"
finished assemblies must be taken into account.
Caution: Consult us first, if you also wish to
embed other uncoated component types!
Please read Cautions and warnings and
Important notes at the end of this document.
Page 12 of 16
B32911 ... B32916
X1 / 330 V AC
Symbols and terms
Symbol
α
English
German
Wärmeübergangszahl
Heat transfer coefficient
αC
Temperature coefficient of capacitance Temperaturkoeffizient der Kapazität
A
Capacitor surface area
Kondensatoroberfläche
Feuchtekoeffizient der Kapazität
Kapazität
βC
Humidity coefficient of capacitance
Capacitance
C
CR
Rated capacitance
Nennkapazität
∆C
∆C/C
Absolute capacitance change
Relative capacitance change (relative
deviation of actual value)
Absolute Kapazitätsänderung
Relative Kapazitätsänderung (relative
Abweichung vom Ist-Wert)
∆C/CR
Capacitance tolerance (relative deviation Kapazitätstoleranz (relative Abweichung
from rated capacitance)
Time differential
vom Nennwert)
dt
Differentielle Zeit
∆t
Time interval
Zeitintervall
∆T
Absolute temperature change
(self-heating)
Absolute Temperaturänderung
(Selbsterwärmung)
∆tan δ
∆V
Absolute change of dissipation factor
Absolute voltage change
Absolute Änderung des Verlustfaktors
Absolute Spannungsänderung
dV/dt
Time differential of voltage function (rate Differentielle Spannungsänderung
of voltage rise)
(Spannungsflankensteilheit)
Spannungsänderung pro Zeitintervall
Aktivierungsenergie zur Diffusion
Eigeninduktivität
∆V/∆t
E
Voltage change per time interval
Activation energy for diffusion
Self-inductance
ESL
ESR
f
Equivalent series resistance
Frequency
Ersatz-Serienwiderstand
Frequenz
f1
Frequency limit for reducing permissible Grenzfrequenz für thermisch bedingte
AC voltage due to thermal limits
Reduzierung der zulässigen
Wechselspannung
f2
Frequency limit for reducing permissible Grenzfrequenz für strombedingte
AC voltage due to current limit
Reduzierung der zulässigen
Wechselspannung
fr
Resonant frequency
Resonanzfrequenz
FD
Thermal acceleration factor for diffusion Therm. Beschleunigungsfaktor zur
Diffusion
FT
i
Derating factor
Deratingfaktor
Current (peak)
Stromspitze
IC
Category current (max. continuous
current)
Kategoriestrom (max. Dauerstrom)
Please read Cautions and warnings and
Important notes at the end of this document.
Page 13 of 16
B32911 ... B32916
X1 / 330 V AC
Symbol
IRMS
English
German
(Sinusoidal) alternating current,
root-mean-square value
Capacitance drift
(Sinusförmiger) Wechselstrom
iz
Inkonstanz der Kapazität
Impulskennwert
k0
LS
λ
Pulse characteristic
Series inductance
Serieninduktivität
Failure rate
Ausfallrate
λ0
Constant failure rate during useful
service life
Konstante Ausfallrate in der
Nutzungsphase
λtest
Pdiss
Pgen
Q
Failure rate, determined by tests
Dissipated power
Experimentell ermittelte Ausfallrate
Abgegebene Verlustleistung
Erzeugte Verlustleistung
Wärmeenergie
Generated power
Heat energy
ρ
Density of water vapor in air
Universal molar constant for gases
Ohmic resistance of discharge circuit
Dichte von Wasserdampf in Luft
Allg. Molarkonstante für Gas
Ohmscher Widerstand des
Entladekreises
R
R
Ri
Internal resistance
Insulation resistance
Parallel resistance
Series resistance
severity (humidity test)
Time
Innenwiderstand
Rins
RP
RS
S
Isolationswiderstand
Parallelwiderstand
Serienwiderstand
Schärfegrad (Feuchtetest)
Zeit
t
T
Temperature
Temperatur
τ
Time constant
Zeitkonstante
tan δ
tan δD
Dissipation factor
Dielectric component of dissipation
factor
Verlustfaktor
Dielektrischer Anteil des Verlustfaktors
tan δP
tan δS
TA
Parallel component of dissipation factor Parallelanteil des Verlfustfaktors
Series component of dissipation factor
Ambient temperature
Serienanteil des Verlustfaktors
Umgebungstemperatur
Tmax
Tmin
Upper category temperature
Lower category temperature
Obere Kategorietemperatur
Untere Kategorietemperatur
tOL
Operating life at operating temperature Betriebszeit bei Betriebstemperatur und
and voltage
-spannung
Top
TR
Operating temperature
Rated temperature
Reference temperature
Reference service life
AC voltage
Beriebstemperatur
Nenntemperatur
Referenztemperatur
Referenz-Lebensdauer
Wechselspannung
Tref
tSL
VAC
Please read Cautions and warnings and
Important notes at the end of this document.
Page 14 of 16
B32911 ... B32916
X1 / 330 V AC
Symbol
VC
English
German
Category voltage
Category AC voltage
Kategoriespannung
(Sinusförmige)
VC,RMS
Kategorie-Wechselspannung
Teilentlade-Einsatzspannung
Ladespannung
VCD
Vch
VDC
VFB
Vi
Corona-discharge onset voltage
Charging voltage
DC voltage
Gleichspannung
Fly-back capacitor voltage
Input voltage
Spannung (Flyback)
Eingangsspannung
Ausgangssspannung
Betriebsspannung
Vo
Output voltage
Vop
Vp
Operating voltage
Peak pulse voltage
Peak-to-peak voltage Impedance
Rated voltage
Impuls-Spitzenspannung
Spannungshub
Vpp
VR
Nennspannung
Amplitude of rated AC voltage
Amplitude der Nenn-Wechselspannung
R
VRMS
(Sinusoidal) alternating voltage,
root-mean-square value
S-correction voltage
(Sinusförmige) Wechselspannung
VSC
Vsn
Spannung bei Anwendung "S-correction"
Spannung bei Anwendung
"Beschaltung"
Snubber capacitor voltage
Z
Impedance
Scheinwiderstand
Lead spacing
Rastermaß
Please read Cautions and warnings and
Important notes at the end of this document.
Page 15 of 16
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical re-
quirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application.
As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar
with them than the customers themselves. For these reasons, it is always ultimately incum-
bent on the customer to check and decide whether an EPCOS product with the properties de-
scribed in the product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or
failure before the end of their usual service life cannot be completely ruled out in the
current state of the art, even if they are operated as specified. In customer applications
requiring a very high level of operational safety and especially in customer applications in
which the malfunction or failure of an electronic component could endanger human life or
health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by
means of suitable design of the customer application or other action taken by the customer
(e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by
third parties in the event of malfunction or failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our Ma-
terial Data Sheets on the Internet (www.epcos.com/material). Should you have any more de-
tailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order. We also
reserve the right to discontinue production and delivery of products. Consequently, we
cannot guarantee that all products named in this publication will always be available. The
aforementioned does not apply in the case of individual agreements deviating from the fore-
going for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to the current ver-
sion of the "General Terms of Delivery for Products and Services in the Electrical In-
dustry" published by the German Electrical and Electronics Industry Association
(ZVEI).
7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CSMP, CSSP, CTVS, DSSP,
MiniBlue, MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, SIFERRIT,
SIFI, SIKOREL, SilverCap, SIMDAD, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse,
WindCap are trademarks registered or pending in Europe and in other countries. Further
information will be found on the Internet at www.epcos.com/trademarks.
Page 16 of 16
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SI9130LG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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SI9130_11
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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SI9137
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SI9137DB
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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SI9122E
500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification DriversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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