B37933K5010C260 [EPCOS]
CAPACITOR, CERAMIC, MULTILAYER, 50V, CH, 0.0000012uF, SURFACE MOUNT, 0603, CHIP;
| 型号： | B37933K5010C260 |
| 厂家： | 
EPCOS |
| 描述： | CAPACITOR, CERAMIC, MULTILAYER, 50V, CH, 0.0000012uF, SURFACE MOUNT, 0603, CHIP PC 电容器 |
| 文件： | 总17页 (文件大小：131K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Multilayer ceramic capacitors
Chip capacitors, HQF
Date:
October 2006
Data Sheet
ꢀꢁ EPCOS AG 2006. Reproduction, publication and dissemination of this data sheet and the
information contained therein without EPCOS’ prior express consent is prohibited.
Multilayer ceramic capacitors
HQF
Chip
Ordering code system
B37923
K
5
100
J
0
60
Packaging
^
60 cardboard tape, 180-mm reel
^
70 cardboard tape, 330-mm reel
Decimal place for cap. values <10 pF, otherwise not used
Capacitance tolerance
^
^
^
C
< 10 pF:
B
C
D
0.1 pF (standard for capacitance values ≤3.9 pF)
0.25 pF (standard for capacitance values ≤8.2 pF)
M0.5 pF
R
^
^
^
^
C
O 10 pF:
F
G
J
M 1%
M 2%
5% (standard)
M10%
R
K
0
^
Capacitance, coded 100 10 · 10 pF = 10 pF
(example)
Rated voltage
Rated voltage [VDC] 50
Code
5
^
Termination
Standard:
K
nickel barrier for all case sizes
Type and size
Chip size
(inch / mm)
Temperature characteristic
HQF
0402 / 1005
0603 / 1608
B37923
B37933
Please read Cautions and warnings and
Important notes at the end of this document.
2
10/06
Multilayer ceramic capacitors
HQF
Chip
Features
■ Ultra-low ESR and high Q factor
■ Tight capacitance tolerances
■ High stability with respect to time,
temperature (TCC: 0 M 60 ppm/LC), frequency and voltage
■ Class 1 characteristic with copper inner electrodes
■ Excellent attenuation
■ High self-resonant frequency
■ Lower power dissipation / Less energy absorption
■ To AEC-Q200
Applications
■ High-frequency applications
■ Matching circuits
■ Cellular communication, Bluetooth, DECT
■ Cable TV, satellite TV (LNB), GPS, satellite radio
■ Filters, RF amplifiers, VCOs
Termination
■ For soldering: Nickel barrier terminations (Ni)
Options
■ Alternative capacitance tolerances available on request
Delivery mode
■ Cardboard tape, 180-mm and 330-mm reel available
Electrical data
Temperature characteristic
Climatic category (IEC 60068-1)
Standard
C0H
55/125/56
EIA
Dielectric
Rated voltage
Class 1
50
VR
VDC
Test voltage
Capacitance range
Vtest
CR
2.5 · VR/5 s
0.3 pF … 82 pF
0 M 60 · 10–6/K
<1.0 · 10–3
>105
VDC
Temperature coefficient
Dissipation factor (limit value)
Insulation resistance1) at + 25 LC
Insulation resistance1) at +125 LC
Time constant1) at + 25 LC
Time constant1) at +125 LC
Operating temperature range
Ageing
tan ꢂ
Rins
Rins
ꢄ
Mꢃ
Mꢃ
s
s
LC
>104
>1000
>100
–55 … +125
none
ꢄ
Top
1) For C >10 nF the time constant ꢀ = C · R is given.
R
ins
Please read Cautions and warnings and
Important notes at the end of this document.
3
10/06
Multilayer ceramic capacitors
HQF
HQF
Capacitance tolerances
C
C ? 3.9 pF
4.7 pF ? C ? 8.2 pF
R
R
R
Code letter
B
C
B
C
D
(standard)
(standard)
Tolerance
M0.1 pF
M0.25 pF
M0.1 pF
M0.25 pF
M0.5 pF
C
C O 10 pF
R
R
Code letter
F
G
J
K
(standard)
Tolerance
M1%
M2%
M5%
M10%
Dimensional drawing
b
k
k
KKE0329-N
Dimensions (mm)
Case size (inch)
(mm)
0402
1005
0603
1608
l
1.0 M0.10
0.5 M0.05
0.5 M0.05
0.1 –0.40
1.6 M0.15
b
s
k
0.8 M0.10
0.8 M0.10
0.1 –0.40
Tolerances to CECC 32101-801
Please read Cautions and warnings and
Important notes at the end of this document.
4
10/06
Multilayer ceramic capacitors
HQF
HQF
Recommended solder pad
D
KKE0308-1
Recommended dimensions (mm) for reflow soldering
Case size
(inch/mm)
Type
A
C
D
0402/1005
0603/1608
single chip
single chip
0.35 … 0.45 1.0 … 1.4
0.60 … 0.70 1.8 … 2.2
0.4 … 0.6
0.6 … 0.8
Recommended dimensions (mm) for wave soldering
Case size
(inch/mm)
0603/1608
Type
A
C
D
single chip
0.8 … 0.9
2.2 … 2.8
0.6 … 0.8
Termination
Ceramic body
Termination
(nickel barrier)
Inner electrode
Cu
Substrate electrode
Intermediate electrode
External electrode
Cu
Ni
Sn
KKE0486-D
Please read Cautions and warnings and
Important notes at the end of this document.
5
10/06
Multilayer ceramic capacitors
HQF
HQF
Product range for HQF chip capacitors
1)
Size
inch
0402
0603
mm
1005
1608
Type
B37923
B37933
V (VDC)
R
50
50
C
R
0.3 pF
0.4 pF
0.5 pF
0.6 pF
0.7 pF
0.8 pF
0.9 pF
1.0 pF
1.2 pF
1.5 pF
1.8 pF
2.2 pF
2.7 pF
3.3 pF
3.9 pF
4.7 pF
5.6 pF
6.8 pF
8.2 pF
10. pF
12. pF
15. pF
18. pF
22. pF
27. pF
82. pF
1) l P b (inch) / l P b (mm)
Please read Cautions and warnings and
Important notes at the end of this document.
6
10/06
Multilayer ceramic capacitors
HQF; 0402
HQF
Ordering codes and packing for HQF capacitors, 50 VDC, nickel barrier terminations
Case size 0402, 50 VDC
Chip thickness
Cardboard tape, Cardboard tape,
b 180-mm reel
b 330-mm reel
^
^
** 60
** 70
1)
C
Ordering code
mm
pcs/reel
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
10000
pcs/reel
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
50000
R
0.3 pF
0.4 pF
0.5 pF
0.6 pF
0.7 pF
0.8 pF
0.9 pF
1.0 pF
1.2 pF
1.5 pF
1.8 pF
2.2 pF
2.7 pF
3.3 pF
3.9 pF
4.7 pF
5.6 pF
6.8 pF
8.2 pF
10. pF
12. pF
15. pF
18. pF
22. pF
B37923K5000B3**
B37923K5000B4**
B37923K5000B5**
B37923K5000B6**
B37923K5000B7**
B37923K5000B8**
B37923K5000B9**
B37923K5010B0**
B37923K5010B2**
B37923K5010B5**
B37923K5010B8**
B37923K5020B2**
B37923K5020B7**
B37923K5030B3**
B37923K5030B9**
B37923K5040C7**
B37923K5050C6**
B37923K5060C8**
B37923K5080C2**
B37923K5100J0**
B37923K5120J0**
B37923K5150J0**
B37923K5180J0**
B37923K5220J0**
0.5 M0.05
0.5 M0.05
0.5 M0.05
0.5 M0.05
0.5 M0.05
0.5 M0.05
0.5 M0.05
0.5 M0.05
0.5 M0.05
0.5 M0.05
0.5 M0.05
0.5 M0.05
0.5 M0.05
0.5 M0.05
0.5 M0.05
0.5 M0.05
0.5 M0.05
0.5 M0.05
0.5 M0.05
0.5 M0.05
0.5 M0.05
0.5 M0.05
0.5 M0.05
0.5 M0.05
1) The table contains the ordering codes for the standard capacitance tolerance.
For other available capacitance tolerances see page 154.
Please read Cautions and warnings and
Important notes at the end of this document.
7
10/06
Multilayer ceramic capacitors
HQF; 0603
HQF
Ordering codes and packing for HQF capacitors, 50 VDC, nickel barrier terminations
Case size 0603, 50 VDC
Chip thickness
Cardboard tape, Cardboard tape,
b 180-mm reel
b 330-mm reel
^
^
** 60
** 70
1)
C
Ordering code
mm
pcs/reel
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
4000
pcs/reel
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
16000
R
0.4 pF
0.5 pF
0.6 pF
0.7 pF
0.8 pF
0.9 pF
1.0 pF
1.2 pF
1.5 pF
1.8 pF
2.2 pF
2.7 pF
3.3 pF
3.9 pF
4.7 pF
5.6 pF
6.8 pF
8.2 pF
10. pF
12. pF
15. pF
18. pF
22. pF
27. pF
82. pF
B37933K5000B4**
B37933K5000B5**
B37933K5000B6**
B37933K5000B7**
B37933K5000B8**
B37933K5000B9**
B37933K5010B0**
B37933K5010B2**
B37933K5010B5**
B37933K5010B8**
B37933K5020B2**
B37933K5020B7**
B37933K5030B3**
B37933K5030B9**
B37933K5040C7**
B37933K5050C6**
B37933K5060C8**
B37933K5080C2**
B37933K5100J0**
B37933K5120J0**
B37933K5150J0**
B37933K5180J0**
B37933K5220J0**
B37933K5270J0**
B37933K5820J0**
0.8 M0.1
0.8 M0.1
0.8 M0.1
0.8 M0.1
0.8 M0.1
0.8 M0.1
0.8 M0.1
0.8 M0.1
0.8 M0.1
0.8 M0.1
0.8 M0.1
0.8 M0.1
0.8 M0.1
0.8 M0.1
0.8 M0.1
0.8 M0.1
0.8 M0.1
0.8 M0.1
0.8 M0.1
0.8 M0.1
0.8 M0.1
0.8 M0.1
0.8 M0.1
0.8 M0.1
0.8 M0.1
1) The table contains the ordering codes for the standard capacitance tolerance.
For other available capacitance tolerances see page 154.
Please read Cautions and warnings and
Important notes at the end of this document.
8
10/06
Multilayer ceramic capacitors
HQF; 0402
HQF
Typical RF performance for HQF capacitors, case size 0402, 50 VDC
1)
res
MHz
2)
2)
2)
Capacitance
pF
f
ESR @ 1 GHz
mꢃ
Q @ 1 GHz
ESR @ f
mꢃ
res
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
23400
20350
19700
17400
15100
14450
12600
12000
10600
8900
7100
6400
6000
5500
5350
4650
3950
4100
3650
3350
3350
2600
2300
2200
560
490
440
405
375
355
335
320
295
265
245
225
205
185
170
155
145
130
120
110
102
92
920
805
720
650
600
560
520
490
440
390
350
310
275
245
225
200
175
155
140
120
104
88
710
605
535
485
445
415
385
365
330
290
265
235
210
190
175
155
140
125
115
105
94
12
15
82
18
84
70
74
22
78
56
66
1) Measured with impedance analyser E 4991A, parts not soldered.
2) Measured with network analyser HP 8753D, parts soldered.
Please read Cautions and warnings and
Important notes at the end of this document.
9
10/06
Multilayer ceramic capacitors
HQF; 0603
HQF
Typical RF performance for HQF capacitors, case size 0603, 50 VDC
1)
res
MHz
2)
2)
2)
res
Capacitance
pF
f
ESR @ 1 GHz
mꢃ
Q @ 1 GHz
ESR @ f
mꢃ
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
17800
17100
13600
12200
11400
10600
9600
8800
7900
6900
5750
5100
4700
4150
3550
3130
2850
2730
2580
2400
2150
2050
1870
1780
445
400
385
345
325
315
300
275
250
240
215
200
185
175
165
150
140
130
120
110
102
96
860
805
755
635
595
560
525
455
395
360
305
270
235
210
185
160
135
115
96
595
540
510
440
410
390
365
335
300
285
250
235
210
200
185
170
155
140
130
118
108
100
90
12
76
15
62
18
50
22
88
34
27
80
26
82
1)
2)
2)
res
Capacitance
pF
f
ESR @ 300 MHz
mꢃ
Q @
300 MHz
ESR @ f
mꢃ
res
2)
MHz
82
930
52
105
52
1) Measured with impedance analyser E 4991A, parts not soldered.
2) Measured with network analyser HP 8753D, parts soldered.
Please read Cautions and warnings and
Important notes at the end of this document.
10 10/06
Multilayer ceramic capacitors
HQF; 0402
HQF
1)
Typical characteristics for case size 0402
ESR versus capacitance C
ESR versus capacitance C
(for not soldered parts)
at self-resonant frequency (for soldered parts)
KKE0477-E
KKE0480-Y
100
100
Ω
Ω
ESR
ESR
3 GHz
1 GHz
_1
_1
10
10
100 MHz
_2
10
_2
10
_1
_1
100
101
pF 102
C
10
100
101
pF 102
C
10
Self-resonant frequency f versus
res
ESR versus frequency f
capacitance C
KKE0479-V
KKE0481-7
105
MHz
fres
101
Ω
ESR
104
100
0.4 pF
3.3 pF
_1
103
10
12 pF
22 pF
_2
102
102
10
_1
103
MHz 104
10
100
101
pF 102
C
f
1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.
Please read Cautions and warnings and
Important notes at the end of this document.
11 10/06
Multilayer ceramic capacitors
HQF; 0402
HQF
1)
Typical characteristics for case size 0402
Q factor versus
Q factor versus
frequency f
capacitance C
KKE0478-M
KKE0482-F
104
104
Q
Q
103
100 MHz
103
0.4 pF
102
101
100
3.3 pF
12 pF
102
1 GHz
3 GHz
22 pF
_1
102
101
10
_1
10
100
101
pF 102
C
103
MHz 104
f
1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.
Please read Cautions and warnings and
Important notes at the end of this document.
12 10/06
Multilayer ceramic capacitors
HQF; 0603
HQF
1)
Typical characteristics for case size 0603
ESR versus capacitance C
(for not soldered parts)
ESR versus capacitance C
at self-resonant frequency (for soldered parts)
KKE0474-P
KKE0471-Z
100
100
Ω
Ω
ESR
ESR
3 GHz
1 GHz
_1
_1
10
10
300 MHz
100 MHz
_2
10
_2
10
_1
_1
100
101
pF 102
C
10
100
101
pF 102
C
10
Self-resonant frequency f versus
res
ESR versus frequency f
capacitance C
KKE0475-X
KKE0473-G
101
Ω
105
MHz
fres
ESR
0.4 pF
100
104
3.3 pF
_1
10
103
12 pF
27 pF
_2
102
102
10
_1
103
MHz 104
f
10
100
101
102
103
pF
C
1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.
Please read Cautions and warnings and
Important notes at the end of this document.
13 10/06
Multilayer ceramic capacitors
HQF; 0603
HQF
1)
Typical characteristics for case size 0603
Q factor versus
capacitance C
Q factor versus
frequency f
KKE0472-8
KKE0476-6
104
104
Q
Q
103
100 MHz
103
0.4 pF
102
101
100
1 GHz
3.3 pF
12 pF
27 pF
300 MHz
3 GHz
102
_1
102
101
10
_1
10
100
101
pF 102
C
103
104
MHz
f
1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.
Please read Cautions and warnings and
Important notes at the end of this document.
14 10/06
Multilayer ceramic capacitors
Cautions and warnings
Notes on the selection of ceramic capacitors
In the selection of ceramic capacitors, the following criteria must be considered:
1. Depending on the application, ceramic capacitors used to meet high quality requirements should
at least satisfy the specifications to AEC-Q200. They must meet quality requirements going
beyond this level in terms of ruggedness (e.g. mechanical, thermal or electrical) in the case of
critical circuit configurations and applications (e.g. in safety-relevant applications such as ABS
and airbag equipment or durable industrial goods).
2. At the connection to the battery or power supply (e.g. clamp 15 or 30 in the automobile) and at
positions with stranding potential, to reduce the probability of short circuits following a fracture,
two ceramic capacitors must be connected in series and/or a ceramic capacitor with integrated
series circuit should be used. The MLSC from EPCOS contains such a series circuit in a single
component.
3. Ceramic capacitors with the temperature characteristics Z5U and Y5V do not satisfy the require-
ments to AEC-Q200 and are mechanically and electrically less rugged than C0G or X7R/X8R
ceramic capacitors. In applications that must satisfy high quality requirements, therefore, these
capacitors should not be used as discrete components (see the chapter “Effects on mechanical,
thermal and electrical stress”, point 1.4).
4. For ESD protection, preference should be given to the use of multilayer varistors (MLV) (see the
chapter “Effects on mechanical, thermal and electrical stress”, point 1.4).
5. An application-specific derating or continuous operating voltage must be considered in order to
cushion (unexpected) additional stresses (see the chapter “Reliability”).
The following should be considered in circuit board design
1. If technically feasible in the application, preference should be given to components having an
optimal geometrical design.
2. At least FR4 circuit board material should be used.
3. Geometrically optimal circuit boards should be used, ideally those that cannot be deformed.
4. Ceramic capacitors must always be placed a sufficient minimum distance from the edge of the
circuit board. High bending forces may be exerted there when the panels are separated and dur-
ing further processing of the board (such as when incorporating it into a housing).
5. Ceramic capacitors should always be placed parallel to the possible bending axis of the circuit
board.
6. No screw connections should be used to fix the board or to connect several boards. Compo-
nents should not be placed near screw holes. If screw connections are unavoidable, they must
be cushioned (for instance by rubber pads).
15 10/06
Multilayer ceramic capacitors
Cautions and warnings
The following should be considered in the placement process
1. Ensure correct positioning of the ceramic capacitor on the solder pad.
2. Caution when using casting, injection-molded and molding compounds and cleaning agents,
as these may damage the capacitor.
3. Support the circuit board and reduce the placement forces.
4. A board should not be straightened (manually) if it has been distorted by soldering.
5. Separate panels with a peripheral saw, or better with a milling head (no dicing or breaking).
6. Caution in the subsequent placement of heavy or leaded components (e.g. transformers or
snap-in components): danger of bending and fracture.
7. When testing, transporting, packing or incorporating the board, avoid any deformation of the
board not to damage the components.
8. Avoid the use of excessive force when plugging a connector into a device soldered onto the
board.
9. Ceramic capacitors must be soldered only by the mode (reflow or wave soldering) permissible
for them (see the chapter “Soldering directions”).
10. When soldering the most gentle solder profile feasible should be selected (heating time, peak
temperature, cooling time) in order to avoid thermal stresses and damage.
11. Ensure the correct solder meniscus height and solder quantity.
12. Ensure correct dosing of the cement quantity.
13. Ceramic capacitors with an AgPd external termination are not suited for the lead-free solder
process: they were developed only for conductive adhesion technology.
This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.
16 10/06
Multilayer ceramic capacitors
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical
requirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application. As
a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them
than the customers themselves. For these reasons, it is always ultimately incumbent on the
customer to check and decide whether an EPCOS product with the properties described in the
product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of passive electronic components
or failure before the end of their usual service life cannot be completely ruled out in the
current state of the art, even if they are operated as specified. In customer applications
requiring a very high level of operational safety and especially in customer applications in which
the malfunction or failure of a passive electronic component could endanger human life or health
(e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of
suitable design of the customer application or other action taken by the customer (e.g.
installation of protective circuitry or redundancy) that no injury or damage is sustained by third
parties in the event of malfunction or failure of a passive electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as “hazardous”). Useful information on this will be found in our
Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more
detailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products.
Consequently, we cannot guarantee that all products named in this publication will always be
available.
6. Unless otherwise agreed in individual contracts, all orders are subject to the current version
of the “General Terms of Delivery for Products and Services in the Electrical Industry”
published by the German Electrical and Electronics Industry Association (ZVEI).
7. The trade names EPCOS, EPCOS-JONES, Baoke, CeraDiode, CSSP, MLSC, PhaseCap,
PhaseMod, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMID, SIOV, SIP5D, SIP5K, UltraCap,
WindCap are trademarks registered or pending in Europe and in other countries. Further
information will be found on the Internet at www.epcos.com/trademarks.
17 10/06
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