B37933K5010C860 [EPCOS]

CAPACITOR, CERAMIC, MULTILAYER, 50V, CH, 0.0000018uF, SURFACE MOUNT, 0603, CHIP;


型号：	B37933K5010C860
厂家：	EPCOS
描述：	CAPACITOR, CERAMIC, MULTILAYER, 50V, CH, 0.0000018uF, SURFACE MOUNT, 0603, CHIP
文件：	总11页 (文件大小：277K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Multilayer Ceramic Capacitor

HQM - Chip / Size 0603

HQM / 0603 / 50V

B37933K5******

Hi-Q Capacitors 0603

Description

The “High-Q-series” was designed for wireless communications and high frequency applications.

The “High-Q-Capacitors” have a class 1 dielectric ceramic and copper inner electrode. The class 1

dielectric ceramic used, HQM, is a very stable dielectric offering a temperature coefficient of

capacitance (TCC) of 0± 60ppm/°C. The higher conductivity of copper give a lower ESR. These

advantages mean a improved performance of matching circuits, lower power dissipation and less

energy absorption.

Features

n Ultra low ESR and high Q-factor

n Tight capacitance tolerances

n Class 1 capacitor with Cu-inner-electrodes

n High stability with respect of time, temperature, frequency and voltage

n Excellent attenuation

n High self resonance frequency

n Lead free component

n CuNiSn (Nickel Barrier) Termination

Applications

n Cellular Communication

n Bluetooth

n DECT

n Cable TV

n Satellite TV (LNB)

n GPS

n Vehicle Location Systems

n Paging

n Test and Measurement

n Filters

n RF Amplifiers

n VCO´s

n HIPERLAN

ISSUE DATE

28.03.02

ISSUE

PUBLISHER

EPCOS AG

PAGE

1/11

Multilayer Ceramic Capacitor

HQM - Chip / Size 0603

HQM / 0603 / 50V

B37933K5******

Ordering Code System

Chip

B37933

K 5 100 J 5 60

Type and Size:

HQM / 0603

Termination Type:

K = Cu/Ni/Sn

Rated Voltage:

5 = 50V

Rated Capacitance:

100 = 10 x 10⁰pF = 10pF

Capacitance Tolerance:

C<10pF: B = ±0.1pF C = ±0.25pF

C>10pF: J = ±5%

K = ±10%

Decimal place:

for cap. values <10pF, otherwise not used

Packaging code:

01 = bulk case

60 = card board, 180mm reel

ISSUE DATE

28.03.02

ISSUE

PUBLISHER

EPCOS AG

PAGE

2/11

Multilayer Ceramic Capacitor

HQM - Chip / Size 0603

HQM / 0603 / 50V

B37933K5******

Sample Kit

B37933

K 5 999 J 0 99

Cap values:

0.4, 0.5, 0.7, 0.8, 0.9, 1.0, 1.2, 1.5, 1.8, 2.2,

3.3, 3.9, 4.7, 5.6, 6.8, 8.2, 10, 12, 15, 18

Capacitance Tolerance:

C<3.9pF: B = ±0.1pF

4.7pF<C10pF C = ±0.25pF

C>10pF: J = ±5%

Internal Code

Packaging code:

99 = Sample Kit

Part Dimensions

Symbol Min

Max

1.75

0.90

Unit

1.45

0.70

0.25

0.90

0.40

Dimensions and tolerances in accordance with

CECC 32101-801

ISSUE DATE

28.03.02

ISSUE

PUBLISHER

EPCOS AG

PAGE

3/11

Multilayer Ceramic Capacitor

HQM - Chip / Size 0603

HQM / 0603 / 50V

B37933K5******

Electrical Data

Capacitance Test Conditions

Test frequency:

1.0 MHz ± 0,2 MHz

1.0 V ± 0.2 V

25°C ± 1°C (EIA)

< 1.0 x 10^-3

Test voltage:

Reference Temperature

Dissipation factor tan δ (limit value):

Insulation Resistance:

Ageing:

> 10⁵MΩ

none

Temperature coefficient (tolerance) 0 ± 60*10^-61/K

Operating Temperature Range:

Climatic category (IEC 68-1):

Capacitance Range:

-55°C ... +125°C

55/125/56

0.4 ... 82pF (up from 1pF Series E12)

RF Measuring Systems Performance

S-Parameter Measuring Configuration:

n HP 8753D (30kHz – 6GHz)

n HP 8722D (1MHz – 40GHz)

n samples soldered on microstrip PCB’s

n Measuring Direction: Shunt

Impedance Measuring Configuration:

n Agilent E 4991A (1MHz – 3GHz)

n Test fixture 16197A

n parts not soldered

ISSUE DATE

28.03.02

ISSUE

PUBLISHER

EPCOS AG

PAGE

4/11

Multilayer Ceramic Capacitor

HQM - Chip / Size 0603

HQM / 0603 / 50V

B37933K5******

Typical RF Performance

Capacitance

[pF]

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.2

1.5

1.8

2.2

2.7

3.3

3.9

4.7

5.6

6.8

8.2

f_res

ESR@ 1GHz ²Q@ 1GHz ²

ESR@ f_res

[mΩ]

595

540

510

440

410

390

365

335

300

285

250

235

210

200

185

170

155

140

130

118

108

100

[MHz]

17800

17100

13600

12200

11400

10600

9600

8800

7900

6900

5750

5100

4700

4150

3550

3130

2850

2730

2580

2400

2150

2050

1870

1780

[mΩ]

445

400

385

345

325

315

300

275

250

240

215

200

185

175

165

150

140

130

120

110

102

860

805

755

635

595

560

525

455

395

360

305

270

235

210

185

160

135

115

ESR@ 300MHz ²

Q@ 300MHz ²ESR@ f_res

Capacitance

f_res

[pF]

[MHz]

[mΩ]

930

105

¹Impedance Analyser E 4991A, parts not soldered

²Network Analyser HP 8753D, parts soldered

ISSUE DATE

28.03.02

ISSUE

PUBLISHER

EPCOS AG

PAGE

5/11

Multilayer Ceramic Capacitor

HQM - Chip / Size 0603

HQM / 0603 / 50V

B37933K5******

Fig. 1: Typical ESR for different Frequencies vs.

Capacitance ³

Fig. 2: Typical Q Factor for different Frequencies vs.

Capacitance ³

Fig. 3: Typical Self Resonant Frequencies vs.

Capacitance ³

Fig. 4: Typical ESR at Resonant Frequencies for

soldered parts vs. Capacitance ⁴

Fig. 5: Typical ESR for different Capacitances vs.

Frequency ³

Fig. 6: Typical Q Factor for different Capacitances vs.

Frequency ³

³Impedance Analyser E 4991A, parts not soldered

⁴Network Analyser HP 8753D, parts soldered

ISSUE DATE

28.03.02

ISSUE

PUBLISHER

EPCOS AG

PAGE

6/11

Multilayer Ceramic Capacitor

HQM - Chip / Size 0603

HQM / 0603 / 50V

B37933K5******

RF Experiences

The proporties of Hi-Q capacitors depend on soldering conditions and pad sizes. In general soldered

parts show a better RF behaveour then not soldered parts. The resonant frequency decreases with

bigger pad sizes.

Measurand

ESR@1GHz

Q@1GHz

ESR@fres

fres

Parts not soldered

see figure 1 and 5

see figure 2 and 6

higher

Parts soldered

lower

higher

see figure 4

lower

see figure 3

Mounting Instructions

Copper/Nickel/Tin terminations

Class 1 Ceramic

Copper Inner electrodes

Substrate electrode - copper

Intermediate electrode- nickel

External electrode - tin

Geometry of solder pads

Recommended dimensions:

Unit

1.0

3.0

ISSUE DATE

28.03.02

ISSUE

PUBLISHER

EPCOS AG

PAGE

7/11

Multilayer Ceramic Capacitor

HQM - Chip / Size 0603

HQM / 0603 / 50V

B37933K5******

Recommended soldering profile

Test according IEC 60068-2-58:

Wettability Test: 215°C ± 3°C / 3 sec ± 0,3sec (wetting of soldering area > 95%)

Leaching Test: 260°C ± 5°C / 10sec ± 1sec (no leaching of contacts)

Soldering conditions:

n Reflow soldering conditions according to CECC 00802, temperature characteristics at terminals

during infrared-reflow soldering

n Two reflow cycles and Pb free solder process admitted

Storage conditions:

Solderability is guaranteed for 12 months from date of delivery, provided that the components are

stored in the original packages.

Storage temperature: -25 ... +45°C

Relative humidity: < 75% annual average, < 95% on max. 30 days in a year, dew precipitation and

wetness are inadmissible.

ISSUE DATE

28.03.02

ISSUE

PUBLISHER

EPCOS AG

PAGE

8/11

Multilayer Ceramic Capacitor

HQM - Chip / Size 0603

HQM / 0603 / 50V

B37933K5******

Taping, Packing

Cardboard Taping

(in accordance with DIN IEC 60286-3)

Direction of unreeling

Dimensions and Tolerances:

Definition

Symbol

Dimension (mm)

Tol. (mm)

Compartment width x Compartments length

Compartment height

A₀x B₀

0.95 x 1.8

0.9

± 0.2

max.

± 0.1

± 0.1¹⁾

± 0.05

± 0.1

± 0.3

± 0.1

± 0.05

Overall thickness

T₂

1.1

Sprocket hole diameter

D₀

P₀

P₂

P₁

1.5

Sprocket hole pitch

4.0

Distance center hole to center compartment

Pitch of the component compartments

Tape width

2.0

4.0

8.0

Distance edge to center of hole

Distance center hole to center compartment

¹⁾≤ +0.2 mm over 10 sprocket holes.

1.75

3.5

Part orientation in tape pocket :

equivalent terminations

because of unipolar component

ISSUE DATE

28.03.02

ISSUE

PUBLISHER

EPCOS AG

PAGE

9/11

Multilayer Ceramic Capacitor

HQM - Chip / Size 0603

HQM / 0603 / 50V

B37933K5******

Reel Packaging

+0,15

12,75

-0

Ø62

±1,5

Package 8-mm Tape

Definition

Symbol Dim.

Tol.

Dim.

(mm)

330

Tol.

(mm)

180

(mm)

-2/+0

(mm)

± 2.0

+1.5/-0

Reel diameter A

Reel width

(inside)

8.4

+1.5/-0 8.4

Reel width

(outside)

14.4

max.

14.4

max.

Packing units

Size

Chip

thickness

Cardboard

tape

Units /reel

Ø 180mm

4000 pcs

Units /bulk

case

inch / mm

0603/1608

0.8 mm

8 mm

15000 pcs

Leader, Trailer

Tape end (trailer)

40 min.

Vacant positions

Leader

25 min.

Vacant positions

300 mm

Top cover tape

ISSUE DATE

28.03.02

ISSUE

PUBLISHER

EPCOS AG

PAGE 10/11

Multilayer Ceramic Capacitor

HQM - Chip / Size 0603

HQM / 0603 / 50V

B37933K5******

Additional Taping Information

Reel material:

PS.

Tape material:

Tape break force:

Cardboard

min 10 N

Top cover tape strength: min 10 N

Top cover tape peel force: 0.1-0.65 N at a peel speed of 300 mm/min

Tape peel angle:

Angle between top cover tape and the direction of feed during peel

off: 165 -180°

Cavity play:

Each part rests in the cavity so that the angle between the part and

cavity centreline is no more than 20°

Weight of component:

Weight of loaded reel:

4.6 mg

max. 1500 g

Label Example

EPCOS AG 2002. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information

contained therein without EPCOS' prior express consent is prohibited.

Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and

Electronics Industry recommended by the ZVEI (German Electrical and Electronic Manufacturers' Association), unless

otherwise agreed.

ISSUE DATE

28.03.02

ISSUE

PUBLISHER

EPCOS AG

PAGE 11/11

相关型号：