B57411-V2101-M62 [EPCOS]
RESISTOR, TEMPERATURE DEPENDENT, NTC, 100ohm, SURFACE MOUNT, CHIP;
| 型号： | B57411-V2101-M62 |
| 厂家： | 
EPCOS |
| 描述： | RESISTOR, TEMPERATURE DEPENDENT, NTC, 100ohm, SURFACE MOUNT, CHIP |
| 文件： | 总13页 (文件大小：347K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Multilayer NTC Thermistor
V - Series
SMD NTC Thermistor Series with Ni-Barrier
B57xxx-V2xxx-xxx
DATA SHEET
General Description
EPCOS offers a new series of surface mountable NTC thermistors with the smallest chip sizes
available on the market today. These high quality SMD thermistors in multilayer technology with inner
electrodes with almost no change (<1%) of resistance value after soldering offer a superior resistance
stability. They were developed for a variety of applications for the specific demands of our customers
in the telecom and automotive industry.
Features
-
Multilayer SMD NTC with inner electrodes
-
-
-
-
-
Ni - Barrier termination (Ag/Ni/Sn)
Standard EIA chip sizes 0402, 0603, 0805
High accuracy: ±5% in resistance, B-value tolerance down to ±1,5% available
Excellent long term ageing stability in high temperature and high humidity environment
Superior resistance stability during soldering, therefore almost no change (<1%) during soldering
Applications
-
Temperature measurement and compensation for telecom, automotive and data systems
Ni - Barrier Series
B
25/50 / K
B
25/85 / K
B25/100 /K (specified)
R25 / 0402 0603 0805
R25 / 0402 0603 0805
R25 / 0402 0603 0805
Ω
Ω
Ω
47
47
47
100
150
220
330
470
680
1k
100
150
220
330
470
680
1k
100
150
220
330
470
680
1k
1,5k
2,2k
3,3k
4,7k
6,8k
10k
15k
22k
33k
47k
68k
100k
1,5k
2,2k
3,3k
4,7k
6,8k
10k
15k
22k
33k
47k
68k
100k
1,5k
2,2k
3,3k
4,7k
6,8k
10k
15k
22k
33k
47k
68k
100k
The B-value is calculated between two specified ambient temperatures. This B-characteristic is indicated by the slope of the
linear plot. Therefore the given B-values in the three tables above represent one and the same part measured at different
temperature references (25/50°C; 25/85°C; 25/100°C).
KB VS PM
Revision 2001/d
Page 1 of 13
12.10.2001
Multilayer NTC Thermistor
V - Series
SMD NTC Thermistor Series with Ni-Barrier
B57xxx-V2xxx-xxx
DATA SHEET
How to order
e.g. case size 0603, R25=10kΩ ± 5%, B25/100=4500 K ± 3%, paper taped, Ø180 mm reel
Í ordering code: B57331- V2103-J60
-
-
B57 3 31 V 2 103 J
60
NTC thermistor
2 = EIA Chip Size 0402
3 = EIA Chip Size 0603
4 = EIA Chip Size 0805
B25/100- value / tolerance code:
B – tolerance
3%
2% 1.5%
B-value
3550 K 11 12
4000 K 21 22
4500 K 31 32
13
23
33
Multilayer SMD NTC
Termination type:
2 = Ag/Ni/Sn
(1 = AgPt)
(0 = AgPd)
Resistance at rated temp. (25°C): 103 = 10 x 103 Ω = 10 kΩ
Resistance Tolerance:
J = ± 5 %
K = ± 10 %
M = ± 20 %
Option
Packaging codes:
60 = cardboard tape, 180mm reel
70 = cardboard tape, 330mm reel
62 = blister tape, 180mm reel
72 = blister tape, 330mm reel
KB VS PM
Revision 2001/d
Page 2 of 13
12.10.2001
Multilayer NTC Thermistor
V - Series
SMD NTC Thermistor Series with Ni-Barrier
B57xxx-V2xxx-xxx
DATA SHEET
Case Size Resistance
B25/50
B25/85
B25/100
Part Number
0402
3470 K
3450 K
3550 K
B57211-V2101-*60
150 Ω
220 Ω
330 Ω
470 Ω
1 kΩ
1,5 kΩ
2,2 kΩ
3,3 kΩ
4,7 kΩ
10 kΩ
15 kΩ
22 kΩ
33 kΩ
47 kΩ
B57211-V2151-*60
B57211-V2221-*60
B57211-V2331-*60
B57211-V2471-*60
B57221-V2102-*60
B57221-V2152-*60
B57221-V2222-*60
B57221-V2332-*60
B57221-V2472-*60
B57231-V2103-*60
B57231-V2153-*60
B57231-V2223-*60
B57231-V2333-*60
B57231-V2473-*60
3940 K
4390 K
3980 K
4470 K
4000 K
4500 K
0603
3470 K
3450 K
3550 K
B57311-V2470-*60
B57311-V2101-*60
100 Ω
B57311-V2151-*60
B57311-V2221-*60
B57311-V2331-*60
B57321-V2471-*60
B57321-V2681-*60
B57321-V2102-*60
B57321-V2152-*60
B57331-V2222-*60
B57331-V2332-*60
B57331-V2472-*60
B57331-V2682-*60
B57331-V2103-*60
B57331-V2153-*60
B57331-V2223-*60
B57331-V2333-*60
B57331-V2473-*60
B57331-V2683-*60
B57331-V2104-*60
150 Ω
220 Ω
330 Ω
470 Ω
680 Ω
1 kΩ
1,5 kΩ
2,2 kΩ
3,3 kΩ
4,7 kΩ
6,8 kΩ
10 kΩ
15 kΩ
22 kΩ
33 kΩ
47 kΩ
68 kΩ
100 kΩ
3940 K
4390 K
3980 K
4470 K
4000 K
4500 K
* = Resistance Tolerance: J for ∆R/R25 = ± 5%
for ∆R/R25 = ± 10%
M
for ∆R/R25 = ± 20%
K
Alternative resistance ratings, resistance tolerance < 5% and B-value tolerance < 3% on request.
KB VS PM
Revision 2001/d
Page 3 of 13
12.10.2001
Multilayer NTC Thermistor
V - Series
SMD NTC Thermistor Series with Ni-Barrier
B57xxx-V2xxx-xxx
DATA SHEET
Case Size Resistance
B25/50
B25/85
B25/100
Part Number
0805
3470 K
3540 K
3550 K
B57411-V2470-*62
B57411-V2101-*62
B57411-V2151-*62
B57411-V2221-*62
B57411-V2331-*62
B57421-V2471-*62
B57421-V2681-*62
B57421-V2102-*62
B57421-V2152-*62
B57431-V2222-*62
B57431-V2332-*62
B57431-V2472-*60
B57431-V2682-*62
B57431-V2103-*62
B57431-V2153-*62
B57431-V2223-*62
B57431-V2333-*62
B57431-V2473-*62
B57431-V2683-*62
B57431-V2104-*62
100 Ω
150 Ω
220 Ω
330 Ω
470 Ω
680 Ω
1 kΩ
1,5 kΩ
2,2 kΩ
3,3 kΩ
4,7 kΩ
6,8 kΩ
10 kΩ
15 kΩ
22 kΩ
33 kΩ
47 kΩ
68 kΩ
100 kΩ
3940K
4390 K
3980 K
4470K
4000 K
4500 K
* = Resistance Tolerance: J for ∆R/R25 = ± 5%
for ∆R/R25 = ± 10%
M
for ∆R/R25 = ± 20%
K
Alternative resistance ratings, resistance tolerance < 5% and B-value tolerance < 3% on request.
KB VS PM
Revision 2001/d
Page 4 of 13
12.10.2001
Multilayer NTC Thermistor
V - Series
SMD NTC Thermistor Series with Ni-Barrier
B57xxx-V2xxx-xxx
DATA SHEET
Series in 0402
W
T
• Part Dimensions
L
Dimensions in mm
k
7\SH
/
:
7
N
ꢀꢁꢀꢂ
ꢀꢄꢆꢇPD[ꢄ
ꢃꢄꢀ±ꢀꢄꢃ ꢀꢄꢅ±ꢀꢄꢀꢅ
ꢀꢄꢂꢅ±ꢀꢄꢃꢅ
Dimensions in [mm]
Termination Ag/Ni/Sn
Climatic Category (IEC 60068-1, JIS C 0010)
Lower category temperature (LCT)
Upper category temperature (UCT)
Power rating at 25°C
Dissipation factor (on PCB)
Thermal cooling time constant (on PCB)
Heat capacity
55/125/56
-55°C
125°C
P25
Gth
Tth
150mW 1)
approx. 2.5mW/K 1)
approx. 3.0s 1)
approx. 7.5mJ/K 1)
approx. 4.5mg
Cth
Weight of component
1) Depends on mounting situation
Series in 0603
W
T
• Part Dimensions
L
Dimensions in mm
k
7\SH
/
:
7
N
ꢀꢆꢀꢈ
ꢀꢄꢊꢇPD[ꢄ
ꢃꢄꢆ±ꢀꢄꢃꢅ ꢀꢄꢉ±ꢀꢄꢃꢅ
ꢀꢄꢈꢅ±ꢀꢄꢃꢅ
Dimensions in [mm]
Termination Ag/Ni/Sn
Climatic Category (IEC 60068-1, JIS C 0010)
Lower category temperature (LCT)
Upper category temperature (UCT)
Power rating at 25°C
Dissipation factor (on PCB)
Thermal cooling time constant (on PCB)
Heat capacity
55/125/56
-55°C
125°C
P25
Gth
Tth
180mW 1)
approx. 3.0 mW/K 1)
approx. 4.0 s 1)
approx. 12 mJ/K 1)
approx. 6 mg
Cth
Weight of component
1) Depends on mounting situation
KB VS PM
Revision 2001/d
Page 5 of 13
12.10.2001
Multilayer NTC Thermistor
V - Series
SMD NTC Thermistor Series with Ni-Barrier
B57xxx-V2xxx-xxx
DATA SHEET
Series in 0805
W
T
• Part Dimensions
L
Dimensions in mm
k
7\SH
/
:
7
N
ꢀꢉꢀꢅ
ꢃꢄꢂꢅꢇPD[ꢄ
ꢀꢄꢊꢇPD[ꢄ
ꢂꢄꢀ±ꢀꢄꢂ ꢃꢄꢂꢅ±ꢀꢄꢃꢅ
ꢂꢄꢀ±ꢀꢄꢂ ꢃꢄꢂꢅ±ꢀꢄꢃꢅ
ꢀꢄꢅ±ꢀꢄꢂꢅ
ꢀꢄꢅ±ꢀꢄꢂꢅ
ꢀꢉꢀꢅꢇ6/
*) slimline version optionally available on request
Dimensions in [mm]
Termination Ag/Ni/Sn
Climatic Category (IEC 60068-1, JIS C 0010)
Lower category temperature (LCT)
Upper category temperature (UCT)
Power rating at 25°C
Dissipation factor (on PCB)
Thermal cooling time constant (on PCB)
Heat capacity
55/125/56
-55°C
125°C
P25
Gth
Tth
210 mW 1)
approx. 3.5 mW/K 1)
approx. 10 s 1)
Cth
approx. 35 mJ/K 1)
approx. 13 mg
Weight of component
1) Depends on mounting situation
KB VS PM
Revision 2001/d
Page 6 of 13
12.10.2001
Multilayer NTC Thermistor
V - Series
SMD NTC Thermistor Series with Ni-Barrier
B57xxx-V2xxx-xxx
DATA SHEET
MOUNTING INSTRUCTIONS
1. Termination
Ni-barrier termination (Ag/Ni/Sn)
Optional: AgPd or AgPt - termination
available on request
Inner electrode
Base layer - silver
Diffusion barrier - nickel
Outer layer - tin
2. Recommended geometry of solder pads
Size
A
B
C
D
[mm]
[mm]
[mm]
[mm]
0402
0603
0805
0,6
1,0
1,3
0,6
1,0
1,2
0,5
1,0
1,0
1,7
3,0
3,4
B
C
B
A
A
D
3. Recommended soldering profiles
- Wettability test in accordance with IEC 60068-2-58 (= JIS C 0054) :
Preconditioning: Immersion into flux F-SW 32.
Evaluation criteria: Wetting of soldering areas ≥ 95%.
Solder: SnPb 60/40.
Bath temperature (°C): 215 ± 3.
Dwell time (s): 4
- Soldering heat resistance test in accordance with IEC 60068-2-58 (= JIS C 0054) :
Preconditioning: Immersion into flux F-SW 32.
Evaluation criteria: Leaching of side edges ≤ 1/3.
Solder: SnPb 60/40.
Bath temperature (°C): 260 ± 5.
Dwell time (s): 10
KB VS PM
Revision 2001/d
Page 7 of 13
12.10.2001
Multilayer NTC Thermistor
V - Series
SMD NTC Thermistor Series with Ni-Barrier
B57xxx-V2xxx-xxx
DATA SHEET
Infrared reflow soldering profile: (according to CECC 00802)
Temperature characteristics at component terminals during infrared reflow soldering
(two cycles are permitted).
Wave soldering profile: (for case sizes 0603 and 0805 only)
Temperature characteristics at component terminals during wave soldering can be
recommended once in general.
4. Storage conditions
Solderability is guaranteed for 12 months from date of delivery for types with Ni-barrier
termination, provided that the components are stored in the original packages.
Storage temperature: -25 ... +45°C
Relative humidity: < 75% annual average, < 95% on max. 30 days in a year, dew
precipitation and wetness are inadmissible.
For more detailed information please refer to the MLCC databook 2001.
KB VS PM
Revision 2001/d
Page 8 of 13
12.10.2001
Multilayer NTC Thermistor
V - Series
SMD NTC Thermistor Series with Ni-Barrier
B57xxx-V2xxx-xxx
DATA SHEET
RELIABILITY
Tests of SMD NTC thermistors are made according to IEC 60068. The parts are mounted on
standardized PCB in accordance with IEC 60539-1.
Test
Standard
Test conditions
∆R25 / R25
(typical)
Remarks
Resistance
drift after
soldering
reflow soldering profile
(all sizes)
wave soldering profile
(for sizes 0603 and 0805 only)
Excellent resistance
stability during
soldering due to
unique inner electrode
design
-
< 1%
< 2%
Cold test
IEC 60068-2-1
(=JIS C 0020)
Storage at lower category
temperature T= -55°C
Duration: 1000h
Storage in IEC 60068-2-2
dry heat (=JIS C 0021)
Storage at upper category
temperature T=125°C
Duration: 1000h
< 2%
< 2%
Storage in IEC 60068-2-3
damp heat, (=JIS C 0022)
steady state
Temperature of air: 40°C
relative humidity of air: 93%
Duration: 56days
Rapid
IEC 60068-2-14 Lower test temperature: -55°C
temperature (=JIS C 0025) Upper test temperature: 125°C
< 2%
< 2%
cycling
Number of cycles: 100
Endurance
at Pmax
-
Pmax=150mW ( for size 0402 )
Pmax=180mW ( for size 0603 )
Pmax=210mW ( for size 0805 )
Duration: 1000h
Solderability IEC 60068-2-58 Solderability: 215°C ± 3°C / 3s
(=JIS C 0054)
95% of terminations
wetted
Resistance to soldering heat:
260°C± 5°C / 10s
< 1%
KB VS PM
Revision 2001/d
Page 9 of 13
12.10.2001
Multilayer NTC Thermistor
V - Series
SMD NTC Thermistor Series with Ni-Barrier
B57xxx-V2xxx-xxx
DATA SHEET
Standardized R/T Characteristics
No / B25/100
1 / 3550 K
2 / 4000 K
3 / 4500 K
Temp. (°C)
RT/R25 (Ω) α (%/K) RT/R25 (Ω) α (%/K) RT/R25 (Ω) α (%/K)
-55,00
-50,00
-45,00
-40,00
-35,00
-30,00
-25,00
-20,00
-15,00
-10,00
-5,00
56,633
41,134
30,209
22,420
16,807
12,721
9,7156
7,4854
5,8152
4,5537
3,5931
2,8558
2,2857
1,8416
1,4934
1,2184
1,0000
0,82537
0,68495
0,57139
0,47905
0,40358
0,34158
0,29040
0,24795
0,21259
0,18300
0,15813
0,13715
0,11938
0,10427
0,091375
0,080333
0,070846
0,062666
0,055592
0,049454
6,5
6,3
6,1
5,9
5,7
5,5
5,3
5,1
5,0
4,8
4,7
4,5
4,4
4,3
4,1
4,0
3,9
3,8
3,7
3,6
3,5
3,4
3,3
3,2
3,1
3,0
3,0
2,9
2,8
2,7
2,7
2,6
2,5
2,5
2,4
2,4
2,3
96,158
66,892
47,127
33,606
24,243
17,681
13,032
9,7020
7,2923
5,5314
4,2325
3,2657
2,5400
1,9907
1,5716
1,2494
1,0000
0,80552
0,65288
0,53229
0,43645
0,35981
0,29819
0,24837
0,20787
0,17479
0,14763
0,12523
0,10667
0,09123
0,07832
0,06749
0,05836
0,05065
0,044098
0,038520
0,033752
7,4
7,1
6,9
6,6
6,4
6,2
6,0
5,8
5,6
5,4
5,3
5,1
4,9
4,8
4,7
4,5
4,4
4,3
4,1
4,0
3,9
3,8
3,7
3,6
3,5
3,4
3,3
3,2
3,2
3,1
3,0
2,9
2,9
2,8
2,7
2,7
2,6
132,52
90,523
62,637
43,867
31,071
22,244
16,087
11,746
8,6553
6,4337
4,8223
3,6435
2,7739
2,1274
1,6431
1,2777
1,0000
0,78759
0,62406
0,49737
0,39863
0,32123
0,26022
0,21186
0,17334
0,14249
0,11767
0,097598
0,081300
0,068004
0,057111
0,048150
0,040747
0,034609
0,029500
0,025231
0,021651
7,8
7,5
7,2
7,0
6,8
6,6
6,4
6,2
6,0
5,8
5,7
5,5
5,4
5,2
5,1
5,0
4,8
4,7
4,6
4,5
4,4
4,3
4,2
4,1
4,0
3,9
3,8
3,7
3,6
3,5
3,5
3,4
3,3
3,2
3,2
3,1
3,0
0,00
5,00
10,00
15,00
20,00
25,00
30,00
35,00
40,00
45,00
50,00
55,00
60,00
65,00
70,00
75,00
80,00
85,00
90,00
95,00
100,00
105,00
110,00
115,00
120,00
125,00
The tabulated resistance characteristics have been standardized for the resistance value at 25°C. The
actual resistance values of a particular NTC thermistor are obtained by multiplying the ratio RT/R25
(tabulated values) by the resistance value at 25°C (specified in the data sheets).
KB VS PM
Revision 2001/d
Page 10 of 13
12.10.2001
Multilayer NTC Thermistor
V - Series
SMD NTC Thermistor Series with Ni-Barrier
B57xxx-V2xxx-xxx
DATA SHEET
TAPING AND PACKING
Taping: Tape and reel packing comply with specifications of IEC 60286-3
Cardboard tape
(for sizes 0402 and 0603):
P
0
T
P
D
0
2
T
A
1
0
T
1
P
1
T
2
Direction of unreeling
Blister tape
(for size 0805)
A
P
0
Section A-A
P
D
2
0
E
F
W
B
0
G
D
A
1
K
0
0
A
P
T
1
2
Direction of unreeling
Dimensions and tolerances:
Definition
Symbol Dimension (mm)
Size 0402
Dimension (mm)
Dimension (mm)
Tol. (mm)
Size 0603
Size 0805
1.6 x 2.4
1.3
Compartment width x Compartments length A0 x B0
0.6 x 1,15
-
0.95 x 1.8
-
± 0.2
max.
Compartment height
Overall thickness
K0
T2
T
0.7
1.1
2.5
max.
0.6
0.9
0.3
max.
Sprocket hole diameter
D0
D1
P0
P2
P1
W
E
1.5
1.5
1.5
+0.1/-0
Compartment hole diameter
-
-
1.0
min.
Sprocket hole pitch
4.0
4.0
4.0
± 0.11)
± 0.05
± 0.1
± 0.3
± 0.1
± 0.05
min.
Distance centre hole to centre compartment
Pitch of the component compartments
Tape width
2.0
2.0
2.0
4.0
4.0
4.0
8.0
8.0
8.0
Distance edge to centre of hole
Distance centre hole to centre compartment
Distance edge to centre compartment
1) ≤ 0.2 mm over 10 sprocket holes.
1.75
3.5
1.75
3.5
1.75
3.5
F
G
0.75
0.75
0.75
Part orientation in tape pocket
equivalent terminations
because of unipolar component
KB VS PM
Revision 2001/d
Page 11 of 13
12.10.2001
Multilayer NTC Thermistor
V - Series
SMD NTC Thermistor Series with Ni-Barrier
B57xxx-V2xxx-xxx
DATA SHEET
W
2
Reel Packing:
+0,15
-0
12,75
Reel material:
PS.
Ø62 ±1,5
Tape material:
Tape break force:
Blister / Cardboard
W
1
min. 10N
Top cover tape peel force: 0.1 - 0.65N at a peel speed of 300 mm/min, angle between top cover
tape and the direction of feed during peel off: 165 -180°.
Top cover tape strength: min. 10N
Length of tape:
Leader section:
(including carrier tape with empty cavities, length min. 150 mm or min. 20 pcs. of empty cavities).
Trailer section: length min. 40 mm.
additional top cover tape, length min 400 mm, before component section
Empty part cavities at leader and trailer section on tape is sealed with top cover tape.
Cavity play:
Each part rests in the cavity so that the angle between the part centreline and the cavity centreline is
no more than 20°.
Weight of loaded reel: max. 1500 g
Package 8 mm tape
Definition
Symbo
l
Dim.
(mm)
180
8.4
14.4
330
Tol.
(mm)
-2/+0
+1.5/-0
max.
Reel diameter
A
Reel width (inside)
Reel width (outside)
Reel diameter
W1
W2
A
±2.0
Reel width (inside)
Reel width (outside)
W1
W2
12.4
18.4
+1.5/-0
max.
Packing units
Units /reel
Size
Chip thickness Cardboard tape Blister tape
Reel
Ø 180mm
10000
4000
Reel
Ø 330mm
-
16000
16000
12000
inch / mm
0402/1005
0603/1608
0805/2012
0.5 mm
0.8 mm
0.8 mm
1.2 mm
8 mm
8 mm
-
-
-
-
8 mm
8 mm
4000
3000
KB VS PM
Revision 2001/d
Page 12 of 13
12.10.2001
Multilayer NTC Thermistor
V - Series
SMD NTC Thermistor Series with Ni-Barrier
B57xxx-V2xxx-xxx
DATA SHEET
EPCOS AG 2001. All Rights Reserved. Reproduction, publication and dissemination of this data sheet, enclosures hereto
and the information contained therein without EPCOS’ prior express consent is prohibited.
The information contained in this data sheet describes the type of component and shall not be considered as guaranteed
characteristics. Purchase orders are subject to the General Conditions for the Supply of Products and Services of the
Electrical and Electronics Industry recommended by the ZVEI (German Electrical and Electronic Manufacturers’
Association), unless otherwise agreed.
KB VS PM
Revision 2001/d
Page 13 of 13
12.10.2001
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