B69842N5257A200 [EPCOS]

Ceramic BPF, 5250MHz, CERAMIC, SMD, 5 PIN;


型号：	B69842N5257A200
厂家：	EPCOS
描述：	Ceramic BPF, 5250MHz, CERAMIC, SMD, 5 PIN PC
文件：	总4页 (文件大小：167K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Microwave Ceramics and Modules

2 Pole Filter for W-LAN 5GHz / [5.15–5.35] Band

Filter

B69842N5257A200

Data Sheet

Features

z SMD filter consisting of coupled resonators with stepped impedances

z MgTiO - CaTiO (ε = 21 / TC =0±10 ppm/K) with a coating of copper (10µm) and tin (>5µm)

3 r

z Excellent reflow solderability, no migration effect due to copper/tin metallization

Index

Page 2

z Component drawing

z Recommended footprint

Page 3

z Characteristics

z Maximum ratings

z Typical passband characteristic

Page 4

z Processing information

z Soldering requirements

z Delivery mode

ISSUE DATE

19.03.04

ISSUE

PUBLISHER

SAW MWC PD

PAGE

1/4

Microwave Ceramics and Modules

2 Pole Filter for W-LAN 5GHz / [5.15–5.35] Band

Filter

B69842N5257A200

Data Sheet

Component drawing

View from below onto the solder terminals and view from beside

Recommended footprint

I/O

ISSUE DATE

19.03.04

ISSUE

PUBLISHER

SAW MWC PD

PAGE

2/4

Microwave Ceramics and Modules

2 Pole Filter for W-LAN 5GHz / [5.15–5.35] Band

Filter

B69842N5257A200

Data Sheet

Characteristics

min.

typ.

5250

1.4

max.

Center frequency

Insertion loss

Passband

MHz

1.8

B 200

MHz

Standing wave ratio

Impedance

SWR

1.5

2.0

1.0

Ω

Power

Attenuation

at DC to 1990 MHz

at 1990 to 2170 MHz

at 2400 to 2500 MHz

at 4500 MHz

at 5000 MHz

at 5500 MHz

at 6.5 to 10 GHz

Maximum ratings

IEC climatic category (IEC 68-1)

- 40/+ 90/56

-40 / + 85

Operating temperature

°C

Typical passband characteristic

-5

-10

-15

-20

-25

-30

-35

-40

-45

-50

S11 [dB]

S21 [dB]

freq [GHz]

ISSUE DATE

19.03.04

ISSUE

PUBLISHER

SAW MWC PD

PAGE

3/4

Microwave Ceramics and Modules

2 Pole Filter for W-LAN 5GHz / [5.15–5.35] Band

Filter

B69842N5257A200

Data Sheet

Processing information

z Wettability acc. to IEC 68-2-58: ≥ 75% (after aging)

Soldering Requirements

Profile for eutectic

Profile for leadfree

solder paste

SnPb solder paste

Soldering type

reflow

235 (max. 2 sec.)

reflow

Maximum soldering temperature

260 (max. 2 sec.)

°C

(measuring point on top surface of the component) 225 (max. 10 sec.)

250 (max. 10 sec.) °C

Recommended soldering conditions (infrared):

within 10 sec.

245°C±5°C

Temp. [°C]

within 10 sec.

215°C±10°C

Temp. [°C]

30 sec.

Time [sec.]

> - 5 °C/s

20-40 sec.

Time [sec.]

2.5 °C/s

40-80 sec.

2-3 min.

Delivery mode

z Blister tape acc. to IEC 286-3, PS, grey

z Pieces/tape: 4000

information contained therein without EPCOS' prior express consent is prohibited.

The information contained in this data sheet describes the type of component and shall not be considered as guaranteed characteristics.

Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and Electronics Industry

recommended by the ZVEI (German Electrical and Electronic Manufacturers' Association), unless otherwise agreed.

ISSUE DATE

19.03.04

ISSUE

PUBLISHER

SAW MWC PD

PAGE

4/4

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