B82477R4302M100 [EPCOS]
SMT power inductors; SMT功率电感型号: | B82477R4302M100 |
厂家: | EPCOS |
描述: | SMT power inductors |
文件: | 总8页 (文件大小:219K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SMT power inductors
Size 12.5 x 12.5 x 8.5 (mm)
Series/Type:
B82477R4
Ordering code:
Date:
June 2012
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Identification/Classification 1
(header 1 + top left bar):
SMT power inductors
Identification/Classification 2
Size 12.5 x 12.5 x 8.5 (mm)
(header 2 + bottom left header bar):
Ordering code: (top right header bar)
Series/Type: (bottom right header bar)
B82477R4
June 2012
Preliminary data (optional):
(if necessary)
Department:
Date:
EPCOS AG 2012. Reproduction, publication and dissemination of this publication, enclosures hereto and the information
contained therein without EPCOS' prior express consent is prohibited.
SMT power inductors
Size 12.5 x 12.5 x 8.5 (mm)
B82477R4
Rated inductance 0.82 ... 1000 µH
Construction
Ferrite core
Magnetically shielded
Winding: enamel copper wire
Winding soldered to terminals
Injection molded base
Features
High mechanical stability
Temperature range up to +150 °C
High rated current
Increased current handling capability compared to B82477P4 series (Isat +30%)
Suitable for lead-free reflow soldering
as referenced in JEDEC J-STD 020D
RoHS-compatible
Halogen Free in the meaning of Cl 900ppm, Br 900pm, Cl+Br 1500ppm
Applications
Filtering of supply voltages
Coupling, decoupling
DC/DC converters
Automotive electronics
Terminals
Base material
Cu (L ≤10 µH), CuSn6P (L >15 µH)
Layer composition Ni, Sn (lead-free)
Electro-plated
Marking
Marking on component:
Manufacturer, L value (µH, coded),
manufacturing date (YWWD)
Minimum data on reel:
Manufacturer, ordering code, L value,
quantity, date of packing
Delivery mode and packing unit
24-mm blister tape, wound on 330-mm reel
Packing unit: 350 pcs./reel
June 2012
Please read Cautions and warnings and
Page 2 of 8
Important notes at the end of this document.
SMT power inductors
Size 12.5 x 12.5 x 8.5 (mm)
B82477R4
Dimensional drawing and layout recommendation
Dimensions in mm
Taping and packing
Blister tape
Dimensions in mm
June 2012
Please read Cautions and warnings and
Page 3 of 8
Important notes at the end of this document.
SMT power inductors
Size 12.5 x 12.5 x 8.5 (mm)
B82477R4
Technical data and measuring conditions
Measured with LCR meter Agilent 4284A at frequency fL,
0.1 V, +20 °C
Rated inductance LR
Rated temperature TR
Rated current IR
+85 °C
Max. permissible DC with temperature increase of ≤40 K
measured at +85°C
Max. permissible DC with inductance decrease ∆L/L0 of
approx. 10%
Saturation current ISat
DC resistance Rmax
Measured at +20 °C
Dip and look method Sn95.5Ag3.8Cu0.7:
+(245 5) °C, (3 0.3) s
Wetting of soldering area 90%
(based on IEC 60068-2-58)
Solderability (lead-free)
Resistance to soldering heat
Climatic category
+260 °C, 40 s (as referenced in JEDEC J-STD 020D)
55/150/56 (to IEC 60068-1)
Mounted: –55 °C … +150 °C
Packaged: –25 °C … +40 °C, ≤75% RH
Storage conditions
Weight
Approx. 4 g
June 2012
Please read Cautions and warnings and
Page 4 of 8
Important notes at the end of this document.
SMT power inductors
Size 12.5 x 12.5 x 8.5 (mm)
B82477R4
Characteristics and ordering codes
LR
Tolerance fL
MHz
0.82 20% = M 0.1
IR
Isat
Rmax
Ordering code
µH
A
A (min)
27.0
20.0
18.0
15.5
13.0
12.2
11.0
10.5
8.75
7.25
6.10
5.20
4.30
3.55
2.90
2.40
2.00
1.70
1.35
1.10
0.95
A (typ) mΩ
38.0
11.5
5.0 B82477R4821M100
6.5 B82477R4152M100
8.0 B82477R4202M100
9.0 B82477R4302M100
1.50
2.00
3.00
3.60
4.70
5.60
6.80
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
9.75
27.0
8.90
8.25
8.05
7.50
7.25
6.60
5.90
5.00
4.20
3.38
3.20
2.65
2.25
1.80
1.35
1.12
1.02
0.80
0.65
24.0
18.0
16.0
14.25
12.75
12.0
10.25
8.75
7.25
6.00
4.90
3.90
3.25
2.80
2.20
1.80
1.50
1.25
1.05
10.0 B82477R4362M100
11.0 B82477R4472M100
11.5 B82477R4562M100
15.0 B82477R4682M100
18.5 B82477R4103M100
25.0 B82477R4153M100
32.0 B82477R4223M100
50.0 B82477R4333M100
60.0 B82477R4473M100
85.0 B82477R4683M100
10
15
22
33
47
68
100
150
220
330
470
680
1000
120
B82477R4104M100
B82477R4154M100
B82477R4224M100
B82477R4334M100
B82477R4474M100
B82477R4684M100
B82477R4105M100
175
290
425
605
860
1350
Current derating Iop/IR versus ambient temperature TA (rated temperature TR = +85°C)
June 2012
Please read Cautions and warnings and
Page 5 of 8
Important notes at the end of this document.
SMT power inductors
Size 12.5 x 12.5 x 8.5 (mm)
B82477R4
Typical curves:
Inductance vs. DC superposition measured with LCR meter Agilent 4284A at Ta=+20 °C
820nH
3µH
1.2
1.0
0.8
0.6
0.4
0.2
0.0
5.0
4.0
3.0
2.0
1.0
0.0
0
2000 4000 6000 8000 10000 12000 14000 16000 18000 20000
0
5000
10000
15000
20000
25000
30000
35000
40000
Idc [mA]
Idc [mA]
10µH
33µH
15.0
12.5
10.0
7.5
50
40
30
20
10
0
5.0
2.5
0.0
0
2000
4000
6000
8000
Idc [mA]
10000
12000
14000
0
1000 2000 3000 4000 5000 6000 7000 8000 9000 10000
Idc [mA]
100µH
330µH
150
500
400
300
200
100
0
125
100
75
50
25
0
0
500
1000 1500 2000 2500 3000 3500 4000 4500 5000
0
500
1000
1500
2000
2500
3000
Idc [mA]
Idc [mA]
1000µH
1500
1250
1000
750
500
250
0
0
200
400
600
800
1000
1200
1400
1600
Idc [mA]
June 2012
Please read Cautions and warnings and
Important notes at the end of this document.
Page 6 of 8
SMT power inductors
Size 12.5 x 12.5 x 8.5 (mm)
B82477R4
Cautions and warnings
■ Please note the recommendations in our Inductors data book (latest edition) and in the data
sheets.
– Particular attention should be paid to the derating curves given there.
– The soldering conditions should also be observed. Temperatures quoted in relation to wave
soldering refer to the pin, not the housing.
■ If the components are to be washed varnished it is necessary to check whether the washing
varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,
or on glued joints. In particular, it is possible for washing varnish agent residues to have a
negative effect in the long-term on wire insulation
Washing processes may damage the product due to the possible static or cyclic mechanical
loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,
which might lead to reduced reliability or lifetime.
■ The following points must be observed if the components are potted in customer applications:
– Many potting materials shrink as they harden. They therefore exert a pressure on the plastic
housing or core. This pressure can have a deleterious effect on electrical properties, and in
extreme cases can damage the core or plastic housing mechanically.
– It is necessary to check whether the potting material used attacks or destroys the wire
insulation, plastics or glue.
– The effect of the potting material can change the high-frequency behaviour of the components.
■ Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to
breakage of the core.
■ Even for customer-specific products, conclusive validation of the component in the circuit can
only be carried out by the customer.
June 2012
Please read Cautions and warnings and
Page 7 of 8
Important notes at the end of this document.
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical
requirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application. As a
rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them
than the customers themselves. For these reasons, it is always ultimately incumbent on the
customer to check and decide whether an EPCOS product with the properties described in the
product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or failure
before the end of their usual service life cannot be completely ruled out in the current state
of the art, even if they are operated as specified. In customer applications requiring a very high
level of operational safety and especially in customer applications in which the malfunction or
failure of an electronic component could endanger human life or health (e.g. in accident
prevention or life-saving systems), it must therefore be ensured by means of suitable design of the
customer application or other action taken by the customer (e.g. installation of protective circuitry
or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or
failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our Material
Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed
questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products. Consequently,
we cannot guarantee that all products named in this publication will always be available.
The aforementioned does not apply in the case of individual agreements deviating from the
foregoing for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of
the “General Terms of Delivery for Products and Services in the Electrical Industry”
published by the German Electrical and Electronics Industry Association (ZVEI).
7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CeraLink, CSMP, CSSP, CTVS, DeltaCap,
DigiSiMic, DSSP, FilterCap, FormFit, MiniBlue, MiniCell, MKD, MKK, MLSC, MotorCap, PCC,
PhaseCap, PhaseCube, PhaseMod, PhiCap, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD,
SiMic, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse, WindCap are trademarks
registered or pending in Europe and in other countries. Further information will be found on the
Internet at www.epcos.com/trademarks.
Page 8 of 8
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