PKR5611SI [ERICSSON]
DC-DC Regulated Power Supply Module, 1 Output, 6W, Hybrid, ROHS COMPLIANT, SMD-18;
| 型号： | PKR5611SI |
| 厂家： | 
ERICSSON |
| 描述： | DC-DC Regulated Power Supply Module, 1 Output, 6W, Hybrid, ROHS COMPLIANT, SMD-18 |
| 文件： | 总24页 (文件大小：754K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Technical Specification
EN/LZT 146 303 R5E November 2007
PKR 5000 series
DC/DC converters, Input 18-75 V, Output up to 1.5 A/11 W
© Ericsson Power Modules AB
Key Features
•
Industry standard MacroDensTM footprint
47.8 x 28.1 x max height 8.0 mm (1.88 x 1.11 x max
height 0.32 in.)
•
•
•
Typ. 79 % efficiency at 3.3 Vout full load
1500 Vdc input to output isolation.
Meets isolation requirements equivalent to basic
insulation according to IEC/EN/UL 60950
More than 5.1 million hours predicted MTBF at 40oC
ambient temperature
•
General Characteristics
•
•
•
•
•
•
Over current protection
Soft start
Remote control
Output voltage adjust function
Input voltage adjust function
Highly automated manufacturing to ensure highest
quality
Safety Approvals
Design for Environment
•
ISO 9001/14001 certified supplier
Meets requirements in high-
temperature lead-free soldering
processes.
Contents
General Information
Safety Specification
Absolute Maximum Ratings
............................................................. 2
............................................................. 3
............................................................. 4
Product Program
Ordering No.
3.3V, 1.5A / 5W Electrical Specification PKR 5510 SI
5.0V, 1.2A / 6W Electrical Specification PKR 5611 SI
12.0V, 0.92A / 11W Electrical Specification PKR 5113 SI
............................................................. 5
............................................................. 8
........................................................... 11
EMC Specification
........................................................... 14
........................................................... 15
........................................................... 16
........................................................... 17
........................................................... 18
........................................................... 21
........................................................... 23
........................................................... 24
Operating Information
Thermal Consideration
Connections
Mechanical Information
Soldering Information
Delivery Information
Product Qualification Specification
2
Technical Specification
EN/LZT 146 303 R5E November 2007
PKR 5000 series
DC/DC converters, Input 18-75 V, Output up to 1.5 A/11 W
© Ericsson Power Modules AB
Compatibility with RoHS requirements
General Information
The products are compatible with the relevant clauses and
requirements of the RoHS directive 2002/95/EC and have a
maximum concentration value of 0.1% by weight in
homogeneous materials for lead, mercury, hexavalent
chromium, PBB and PBDE and of 0.01% by weight in
homogeneous materials for cadmium.
Ordering Information
See Contents for individual product ordering numbers.
Option
Suffix
S
SPB
P
Ordering No.
PKR 5510 SI
PKR 5510 SPBI
PKR 5510 PI
SMD, lead-free surface finish
SMD, leaded surface finish
Through hole pin
Reliability
Exemptions in the RoHS directive utilized in Ericsson
Power Modules products include:
The Mean Time Between Failure (MTBF) is calculated at full
output power and an operating ambient temperature (TA) of
+40°C, which is a typical condition in Information and
Communication Technology (ICT) equipment. Different
methods could be used to calculate the predicted MTBF
and failure rate which may give different results. Ericsson
Power Modules currently uses one method, Telcordia
SR332.
-
Lead in high melting temperature type solder (used to
solder the die in semiconductor packages)
Lead in glass of electronics components and in
electronic ceramic parts (e.g. fill material in chip
resistors)
-
-
Lead as an alloying element in copper alloy containing
up to 4% lead by weight (used in connection pins
made of Brass)
Predicted MTBF for the series is:
-
5.1 million hours according to Telcordia SR332, issue
1, Black box technique.
The exemption for lead in solder for servers, storage and
storage array systems, network infrastructure equipment
for switching, signaling, transmission as well as network
management for telecommunication is only utilized in
surface mount products intended for end-users’ leaded
SnPb Eutectic soldering processes. (See ordering
information table).
Telcordia SR332 is a commonly used standard method
intended for reliability calculations in ICT equipment. The
parts count procedure used in this method was originally
modelled on the methods from MIL-HDBK-217F, Reliability
Predictions of Electronic Equipment. It assumes that no
reliability data is available on the actual units and devices
for which the predictions are to be made, i.e. all predictions
are based on generic reliability parameters.
Quality Statement
The products are designed and manufactured in an
industrial environment where quality systems and methods
like ISO 9000, 6σ (sigma), and SPC are intensively in use to
boost the continuous improvements strategy. Infant
mortality or early failures in the products are screened out
and they are subjected to an ATE-based final test.
Conservative design rules, design reviews and product
qualifications, plus the high competence of an engaged
work force, contribute to the high quality of our products.
Warranty
Warranty period and conditions are defined in Ericsson
Power Modules General Terms and Conditions of Sale.
Limitation of Liability
Ericsson Power Modules does not make any other
warranties, expressed or implied including any warranty of
merchantability or fitness for a particular purpose
(including, but not limited to, use in life support
applications, where malfunctions of product can cause
injury to a person’s health or life).
3
Technical Specification
EN/LZT 146 303 R5E November 2007
PKR 5000 series
DC/DC converters, Input 18-75 V, Output up to 1.5 A/11 W
© Ericsson Power Modules AB
Safety Specification
Isolated DC/DC converters
It is recommended that a slow blow fuse with a rating
twice the maximum input current per selected product be
used at the input of each DC/DC converter. If an input filter
is used in the circuit the fuse should be placed in front of
the input filter.
General information
Ericsson Power Modules DC/DC converters and DC/DC
regulators are designed in accordance with safety
standards IEC/EN/UL60950, Safety of Information
Technology Equipment.
In the rare event of a component problem in the input filter
or in the DC/DC converter that imposes a short circuit on
the input source, this fuse will provide the following
functions:
IEC/EN/UL60950 contains requirements to prevent injury
or damage due to the following hazards:
•
•
•
•
•
•
Electrical shock
Energy hazards
Fire
Mechanical and heat hazards
Radiation hazards
Chemical hazards
•
•
Isolate the faulty DC/DC converter from the input
power source so as not to affect the operation of
other parts of the system.
Protect the distribution wiring from excessive
current and power loss thus preventing
hazardous overheating.
On-board DC-DC converters are defined as component
power supplies. As components they cannot fully comply
with the provisions of any Safety requirements without
“Conditions of Acceptability”. It is the responsibility of the
installer to ensure that the final product housing these
components complies with the requirements of all
applicable Safety standards and Directives for the final
product.
The galvanic isolation is verified in an electric strength test.
The test voltage (Viso) between input and output is
1500 Vdc or 2250 Vdc for 60 seconds (refer to product
specification).
Leakage current is less than 1 μA at nominal input voltage.
24 V DC systems
The input voltage to the DC/DC converter is SELV (Safety
Extra Low Voltage) and the output remains SELV under
normal and abnormal operating conditions.
Component power supplies for general use should comply
with the requirements in IEC60950, EN60950 and
UL60950 “Safety of information technology equipment”.
48 and 60 V DC systems
There are other more product related standards, e.g.
IEEE802.3af “Ethernet LAN/MAN Data terminal equipment
power”, and ETS300132-2 “Power supply interface at the
input to telecommunications equipment; part 2: DC”, but
all of these standards are based on IEC/EN/UL60950 with
regards to safety.
If the input voltage to Ericsson Power Modules DC/DC
converter is 75 Vdc or less, then the output remains SELV
(Safety Extra Low Voltage) under normal and abnormal
operating conditions.
Single fault testing in the input power supply circuit should
be performed with the DC/DC converter connected to
demonstrate that the input voltage does not exceed
75 Vdc.
Ericsson Power Modules DC/DC converters and DC/DC
regulators are UL60950 recognized and certified in
accordance with EN60950.
If the input power source circuit is a DC power system, the
source may be treated as a TNV2 circuit and testing has
demonstrated compliance with SELV limits and isolation
requirements equivalent to Basic Insulation in accordance
with IEC/EN/UL60950.
The flammability rating for all construction parts of the
products meets requirements for V-0 class material
according to IEC 60695-11-10.
The products should be installed in the end-use
equipment, in accordance with the requirements of the
ultimate application. Normally the output of the DC/DC
converter is considered as SELV (Safety Extra Low
Voltage) and the input source must be isolated by
minimum Double or Reinforced Insulation from the primary
circuit (AC mains) in accordance with IEC/EN/UL60950.
Non-isolated DC/DC regulators
The input voltage to the DC/DC regulator is SELV (Safety
Extra Low Voltage) and the output remains SELV under
normal and abnormal operating conditions.
4
ENovember2007
Absolute Maximum Ratings
Characteristics
min
-45
typ
max
+110
+125
+75
Unit
°C
°C
V
Tref
TS
Operating Temperature (see Thermal Consideration section)
Storage temperature
-55
VI
Input voltage
-0.5
Viso
Vtr
Isolation voltage (input to output test voltage)
Input voltage transient (tp 100 ms)
1500
100
Vdc
V
Positive logic option
-5
-5
16
V
Remote Control pin voltage
(see Operating Information section)
VRC
Vadj
Adjust pin voltage (see Operating Information section)
+40
V
Stress in excess of Absolute Maximum Ratings may cause permanent damage. Absolute Maximum Ratings, sometimes referred to as no destruction limits, are
normally tested with one parameter at a time exceeding the limits of Output data or Electrical Characteristics. If exposed to stress above these limits, function and
performance may degrade in an unspecified manner.
Fundamental Circuit Diagram
Out1
Rtn
1
2
2
3
1
4
+In
1
2
TOA
RC
Vadj
NOR
-In
Sync
5
ENovember2007
3.3V, 1.5A / 5W Electrical Specification
PKR 5510 SI
Tref = -30 to +95ºC, VI = 18 to 75 V, pin 8 connected to pin 9 unless otherwise specified under Conditions.
Typical values given at: Tref = +25°C, VI= 53 VI max IO, unless otherwise specified under Conditions.
Characteristics
Conditions
min
18
typ
max
75
Unit
V
VI
Input voltage range
VIoff
VIon
CI
Turn-off input voltage
Turn-on input voltage
Internal input capacitance
Output power
Decreasing input voltage
Increasing input voltage
15
16
17.2
2
V
17.9
5
V
μF
W
dB
PO
Output voltage initial setting
f = 100 Hz sinewave, 1 Vp-p
50 % of max IO
0
SVR
Supply voltage rejection (ac)
71
73.0
79.0
79.0
81.0
1.4
max IO
η
Efficiency
%
50 % of max IO, VI = 27 V
max IO, VI = 27 V
Pd
Pli
Power Dissipation
Input idling power
Input standby power
Switching frequency
max IO
2
W
IO = 0 A, VI = 53 V
VI = 53 V (turned off with RC)
0-100 % of max IO
210
74
mW
mW
kHz
PRC
fs
477
510
533
Output voltage initial setting and
accuracy
VOi
Tref = +25°C, VI = 53 V, max IO
3.27
3.30
3.33
V
Output adjust range
Output voltage tolerance band
Idling voltage
10 —100% of max IO
10-100 % of max IO
2.8
3.8
3.46
4.1
V
V
3.15
3.34
VO
IO = 0 A
3.55
43
V
Line regulation
max IO
70
mV
mV
Load regulation
VI = 53 V, 0-100 % of max IO
54
200
Load transient
voltage deviation
Vtr
ttr
tr
±165
60
mV
μs
VI = 53 V, Load step 25-75-25 % of
max IO, di/dt = 1 A/μs
Load transient recovery time
Ramp-up time
(from 10−90 % of VOi)
0.1
0.8
2.4
6
ms
10-100 % of max IO
Start-up time
(from VI connection to 90 % of VOi)
ts
4.5
12
ms
IO
Output current
0
1.5
2.8
A
A
Ilim
Current limit threshold
VO = 3V, Tref < max Tref
1.7
2.6
3.0
Tref = 25ºC, See Operating
Information section
See ripple & noise section,
max IO, VOi
Isc
Short circuit current
Output ripple & noise
3.4
50
A
VOac
9
mVp-p
6
ENovember2007
3.3V, 1.5A / 5W Typical Characteristics
PKR 5510 SI
Efficiency
Power Dissipation
[%]
85
[W]
2.0
80
75
70
65
1.5
1.0
0.5
0.0
18 V
27 V
53 V
75 V
18 V
27 V
53 V
75 V
60
0.0
0.3
0.6
0.9
1.2
1.5
[A]
0.0
0.3
0.6
0.9
1.2
1.5 [A]
Dissipated power vs. load current and input voltage at
ref = +25°C
Efficiency vs. load current and input voltage at Tref = +25°C
T
Output Current Derating
Thermal Resistance
[A]
1.6
[°C/W]
14
1.5 m/s
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
12
10
8
1.0 m/s
0.5 m/s
6
4
Nat. Conv.
2
0
0
20
40
60
80
100 [°C]
0.0
0.5
1.0
1.5
2.0
2.5
3.0 [m/s]
Available load current vs. ambient air temperature and airflow at
VI = 53 V. See Thermal Consideration section.
Thermal resistance vs. airspeed measured at the converter.
Tested in wind tunnel with airflow and test conditions as per
the Thermal consideration section.
Output Characteristics
Current Limit Characteristics
[V]
[V]
3.50
3.80
3.60
3.40
3.20
3.00
2.80
2.80
2.10
1.40
0.70
0.00
18 V
27 V
53 V
75 V
18 V
27 V
53 V
75 V
0.0
0.3
0.5
0.8
1.0
1.3
1.5
[A]
0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2
[A]
Output voltage vs. load current at Tref = +25°C
Output voltage vs. load current at IO > max IO , Tref = +25°C
7
ENovember2007
3.3V, 1.5A / 5W Typical Characteristics
PKR 5510 SI
Start-up
Shut-down
Start-up enabled by connecting VI at:
Tref = +25°C, VI = 53 V,
Top trace: output voltage (1.0 V/div.).
Bottom trace: input voltage (20 V/div.).
Time scale: (2 ms/div.).
Shut-down enabled by disconnecting VI at:
Tref = +25°C, VI = 53 V,
IO = 1.5 A resistive load.
Top trace: output voltage (1.0 V/div.).
Bottom trace: input voltage (20 V/div.).
Time scale: (0.5 ms/div.).
I
O = 1.5 A resistive load.
Output Ripple & Noise
Output Load Transient Response
Output voltage ripple at:
Tref = +25°C, VI = 53 V,
IO = 1.5 A resistive load.
Trace: output voltage (20 mV/div.).
Time scale: (2 μs/div.).
Output voltage response to load current step- Top trace: output voltage (200 mV/div.).
change (0.38-1.1-0.38 A) at:
Bottom trace: load current (0.5 A/div.).
Time scale: (0.1 ms/div.).
Tref =+25°C, VI = 53 V.
Output Voltage Adjust (see operating information)
Passive adjust
The resistor value for an adjusted output voltage is calculated by
using the following equations:
Output Voltage Adjust Upwards, Increase:
Rou= 3.18 x (3.89 — Voi) / (Vo — Voi) kΩ, Voi = initial output voltage, Vo =
desired output voltage
E.g. Increase 4% =>Vo =3.43 Vdc
3.18 x (3.89 — 3.43) / (3.43 —3.3) = 11.2 kΩ
Output Voltage Adjust Downwards, Decrease:
Rod= 13 x (Voi — Vo) / (Vo —2.72) kΩ, Voi = initial output voltage, Vo =
desired output voltage
E.g. Decrease 2% =>Vo = 3.23 Vdc
13 x (3.3 — 3.23) / (3.23 —2.72)= 1.8 kΩ
8
ENovember2007
5.0V, 1.2A / 6W Electrical Specification
PKR 5611 SI
Tref = -30 to +95ºC, VI = 18 to 75 V, pin 8 connected to pin 9 unless otherwise specified under Conditions.
Typical values given at: Tref = +25°C, VI= 53 VI max IO, unless otherwise specified under Conditions.
Characteristics
Conditions
min
18
typ
max
75
Unit
V
VI
Input voltage range
VIoff
VIon
CI
Turn-off input voltage
Turn-on input voltage
Internal input capacitance
Output power
Decreasing input voltage
Increasing input voltage
15
16
17.1
2
V
17.9
6
V
μF
W
dB
PO
Output voltage initial setting
f = 100 Hz sinewave, 1 Vp-p
50 % of max IO
0
SVR
Supply voltage rejection (ac)
70
77.0
82.0
83.0
84.0
1.3
max IO
η
Efficiency
%
50 % of max IO, VI = 27 V
max IO, VI = 27 V
Pd
Pli
Power Dissipation
Input idling power
Input standby power
Switching frequency
max IO
1.8
W
IO = 0 A, VI = 53 V
VI = 53 V (turned off with RC)
0-100 % of max IO
270
85
mW
mW
kHz
PRC
fs
477
510
533
Output voltage initial setting and
accuracy
VOi
5.02
5.05
5.08
V
Tref = +25°C, VI = 53 V, IO = 0.2A
Output adjust range
Output voltage tolerance band
Idling voltage
4.3
4.85
5.2
5.8
5.25
6.0
V
V
10-100 % of max IO
O = 0 A
VO
I
5.4
17
90
V
Line regulation
max IO
40
mV
mV
Load regulation
VI = 53 V, 0-100 % of max IO
160
Load transient
voltage deviation
Vtr
ttr
tr
±185
100
1.5
mV
μs
VI = 53 V, Load step 25-75-25 % of
max IO, di/dt = 1 A/μs
Load transient recovery time
Ramp-up time
(from 10−90 % of VOi)
0.1
1.3
4.3
11
ms
10-100 % of max IO
Start-up time
(from VI connection to 90 % of VOi)
ts
4.7
ms
IO
Output current
0
1.2
2.0
A
A
Ilim
Current limit threshold
VO = 4V, Tref < max Tref
1.4
1.9
2.4
Tref = 25ºC, See Operating
Information section
See ripple & noise section,
max IO, VOi
Isc
Short circuit current
Output ripple & noise
3.5
60
A
VOac
8
mVp-p
9
ENovember2007
5.0V, 1.2A / 6W Typical Characteristics
PKR 5611 SI
Efficiency
Power Dissipation
[%]
90
[W]
2.0
85
80
75
70
65
1.5
1.0
0.5
0.0
18 V
27 V
53 V
75 V
18 V
27 V
53 V
75 V
0.0
0.2
0.4
0.6
0.8
1.0
1.2
[A]
0.0
0.2
0.4
0.6
0.8
1.0
1.2 [A]
Dissipated power vs. load current and input voltage at
ref = +25°C
Efficiency vs. load current and input voltage at Tref = +25°C
T
Output Current Derating
Thermal Resistance
[A]
[癈/W]
1.4
14
1.5 m/s
1.2
1.0
0.8
0.6
0.4
0.2
0.0
12
10
8
1.0 m/s
0.5 m/s
6
4
Nat. Conv.
2
0
0
20
40
60
80
100
[°C]
0.0
0.5
1.0
1.5
2.0
2.5
3.0 [m/s]
Available load current vs. ambient air temperature and airflow at
VI = 53 V. See Thermal Consideration section.
Thermal resistance vs. airspeed measured at the converter.
Tested in wind tunnel with airflow and test conditions as per
the Thermal consideration section.
Output Characteristics
Current Limit Characteristics
[V]
[V]
5.45
5.0
4.0
3.0
2.0
1.0
0.0
5.25
5.05
4.85
18 V
27 V
53 V
75 V
18 V
27 V
53 V
75 V
0.0
0.2
0.4
0.6
0.8
1.0
1.2
[A]
0.0
0.5
1.0
1.5
2.0
2.5
3.0
[A]
Output voltage vs. load current at Tref = +25°C
Output voltage vs. load current at IO > max IO , Tref = +25°C
10
ENovember2007
5.0V, 1.2A / 6W Typical Characteristics
PKR 5611 SI
Start-up
Shut-down
Start-up enabled by connecting VI at:
Tref = +25°C, VI = 53 V,
Top trace: output voltage (2.0 V/div.).
Bottom trace: input voltage (20 V/div.).
Time scale: (2 ms/div.).
Shut-down enabled by disconnecting VI at:
Tref = +25°C, VI = 53 V,
IO = 1.2 A resistive load.
Top trace: output voltage (2.0 V/div.).
Bottom trace: input voltage (20 V/div.).
Time scale: (0.5 ms/div.).
I
O = 1.2 A resistive load.
Output Ripple & Noise
Output Load Transient Response
Output voltage ripple at:
Tref = +25°C, VI = 53 V,
IO = 1.2 A resistive load.
Trace: output voltage (10 mV/div.).
Time scale: (5 μs/div.).
Output voltage response to load current step- Top trace: output voltage (100 mV/div.).
change (0.3-0.9-0.3 A) at:
Bottom trace: load current (0.5 A/div.).
Time scale: (0.1 ms/div.).
Tref =+25°C, VI = 53 V.
Output Voltage Adjust (see operating information)
Passive adjust
The resistor value for an adjusted output voltage is calculated by
using the following equations:
Output Voltage Adjust Upwards, Increase:
Rou= 3.18 x (5.93 — Voi) / (Vo — Voi) kΩ, Voi = initial output voltage, Vo =
desired output voltage
E.g. Increase 4% =>Vo =5.25 Vdc
3.18 x (5.93 — 5.05) / (5.25 —5.05) = 14.0 kΩ
Output Voltage Adjust Downwards, Decrease:
Rod= 12.6 x (Voi — Vo) / (Vo —4.28) kΩ, Voi = initial output voltage, Vo =
desired output voltage
E.g. Decrease 2% =>Vo = 4.95 Vdc
12.6 x (5.05 — 4.95) / (5.05 —4.28)= 1.6 kΩ13 x (3.3 — 3.23) / (3.23
—2.72)= 1.8 kΩ
11
ENovember2007
12V, 0.92A / 11W Electrical Specification
PKR 5113 SI
Tref = -30 to +95ºC, VI = 18 to 75 V, pin 8 connected to pin 9 unless otherwise specified under Conditions.
Typical values given at: Tref = +25°C, VI= 53 VI max IO, unless otherwise specified under Conditions.
Characteristics
Conditions
min
18
typ
max
75
Unit
V
VI
Input voltage range
VIoff
VIon
CI
Turn-off input voltage
Turn-on input voltage
Internal input capacitance
Output power
Decreasing input voltage
Increasing input voltage
15
16
17.0
2
V
17.9
11
V
μF
W
dB
PO
Output voltage initial setting
f = 100 Hz sinewave, 1 Vp-p
50 % of max IO
0
SVR
Supply voltage rejection (ac)
62
83.5
84.5
86.0
85.0
2.0
max IO
η
Efficiency
%
50 % of max IO, VI = 27 V
max IO, VI = 27 V
Pd
Pli
Power Dissipation
Input idling power
Input standby power
Switching frequency
max IO
2.7
W
IO = 0 A, VI = 53 V
VI = 53 V (turned off with RC)
0-100 % of max IO
260
86
mW
mW
kHz
PRC
fs
477
510
533
Output voltage initial setting and
accuracy
VOi
11.94
12.0
12.06
V
Tref = +25°C, VI = 53 V, max IO
Output adjust range
Output voltage tolerance band
Idling voltage
6.7
15
12.6
15.6
86
V
V
10-100 % of max IO
O = 0 A
11.45
12.15
VO
I
V
Line regulation
max IO
30
mV
mV
Load regulation
VI = 53 V, 0-100 % of max IO
300
346
Load transient
voltage deviation
Vtr
ttr
tr
±460
62
mV
μs
VI = 53 V, Load step 25-75-25 % of
max IO, di/dt = 1 A/μs
Load transient recovery time
Ramp-up time
(from 10−90 % of VOi)
0.1
0.8
2.4
6
ms
10-100 % of max IO
Start-up time
(from VI connection to 90 % of VOi)
ts
4.5
12
ms
IO
Output current
0
0.92
2.1
A
A
Ilim
Current limit threshold
VO = 10V, Tref < max Tref
1.1
1.7
2.2
Tref = 25ºC, See Operating
Information section
See ripple & noise section,
max IO, VOi
Isc
Short circuit current
Output ripple & noise
2.6
50
A
VOac
9
mVp-p
12
ENovember2007
12V, 0.92A / 11W Typical Characteristics
PKR 5113 SI
Efficiency
Power Dissipation
[%]
90
[W]
3.0
2.5
2.0
1.5
1.0
0.5
0.0
85
80
75
70
18 V
27 V
53 V
75 V
18 V
27 V
53 V
75 V
65
0.0
0.2
0.4
0.6
0.8
1.0 [A]
0.0
0.2
0.4
0.6
0.8
1.0 [A]
Dissipated power vs. load current and input voltage at
ref = +25°C
Efficiency vs. load current and input voltage at Tref = +25°C
T
Output Current Derating
Thermal Resistance
[A]
1.2
[°C/W]
14
1.0
0.8
0.6
0.4
0.2
0.0
12
10
8
3.0 m/s
2.0 m/s
1.5 m/s
1.0 m/s
0.5 m/s
Nat. Conv.
6
4
2
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0[m/s]
0
20
40
60
80
100 [°C]
Available load current vs. ambient air temperature and airflow at
VI = 53 V. See Thermal Consideration section.
Thermal resistance vs. airspeed measured at the converter.
Tested in wind tunnel with airflow and test conditions as per
the Thermal consideration section.
Output Characteristics
Current Limit Characteristics
[V]
[V]
13.0
12.0
10.0
8.0
12.8
18 V
27 V
53 V
75 V
18 V
12.6
12.4
12.2
12.0
11.8
27 V
53 V
75 V
6.0
4.0
2.0
0.0
0.0
0.5
1.0
1.5
2.0
2.5 [A]
0.0
0.2
0.4
0.6
0.8
1.0 [A]
Output voltage vs. load current at Tref = +25°C
Output voltage vs. load current at IO > max IO , Tref = +25°C
13
ENovember2007
12V, 0.92A / 11W Typical Characteristics
PKR 5113 SI
Start-up
Shut-down
Start-up enabled by connecting VI at:
Tref = +25°C, VI = 53 V,
Top trace: output voltage (5.0 V/div.).
Bottom trace: input voltage (20 V/div.).
Time scale: (2 ms/div.).
Shut-down enabled by disconnecting VI at:
Tref = +25°C, VI = 53 V,
IO = 0.92 A resistive load.
Top trace: output voltage (5.0 V/div.).
Bottom trace: input voltage (50 V/div.).
Time scale: (2 ms/div.).
I
O = 0.92 A resistive load.
Output Ripple & Noise
Output Load Transient Response
Output voltage ripple at:
Tref = +25°C, VI = 53 V,
IO = 0.92 A resistive load.
Trace: output voltage (20 mV/div.).
Time scale: (2 μs/div.).
Output voltage response to load current step- Top trace: output voltage (200 mV/div.).
change (0.69-0.23-0.69 A) at:
Bottom trace: load current (0.5 A/div.).
Time scale: (0.2 ms/div.).
Tref =+25°C, VI = 53 V.
Output Voltage Adjust (see operating information)
Passive adjust
The resistor value for an adjusted output voltage is calculated by
using the following equations:
Output Voltage Adjust Upwards, Increase:
Rou= 4.20 x (15 — Vo) / (Vo - Voi) kΩ
E.g. Increase 4% =>Vo =12.48 Vdc
4.20 x (15 — 12.48) / (12.48 — 12) = 22.05 kΩ
Output Voltage Adjust Downwards, Decrease:
Rod= 18 x (Voi — Vo) / (Vo —6.7) kΩ
E.g. Decrease 2% =>Vo = 11.74 Vdc
18 x (12 — 11.74) / (11.74 —6.7)= 0.908 kΩ12.6 x (5.05 — 4.95) /
(5.05 —4.28)= 1.6 kΩ13 x (3.3 — 3.23) / (3.23 —2.72)= 1.8 kΩ
14
ENovember2007
EMC Specification
Conducted EMI measured according to EN55022, CISPR 22
and FCC part 15J (see test set-up). See Design Note 009 for
further information. The fundamental switching frequency is
510 kHz for PKR 5113 SI @ VI = 53 V, max IO.
Conducted EMI Input terminal value (typ)
Test set-up
Layout recommendation
The radiated EMI performance of the DC/DC converter will
depend on the PCB layout and ground layer design.
It is also important to consider the stand-off of the DC/DC
converter.
EMI without filter
A ground layer will increase the stray capacitance in the PCB
and improve the high frequency EMC performance.
External filter (class B)
Required external input filter in order to meet class B in
EN 55022, CISPR 22 and FCC part 15J.
Output ripple and noise
Output ripple and noise measured according to figure below.
Filter components:
C1= 1μF 100V
C2= 10μF 100V
C3,C4= 2.2nF
1500Vdc
L1= Pulse PO354
1.17mH
Output ripple and noise test setup
EMI with filter
15
ENovember2007
converter from an input source with an inductance below 10
μH.
Operating information
Input Voltage
External Decoupling Capacitors
The input voltage range 18…75Vdc.
When powering loads with significant dynamic current
requirements, the voltage regulation at the point of load can
be improved by addition of decoupling capacitors at the load.
The most effective technique is to locate low ESR ceramic
and electrolytic capacitors as close to the load as possible by
using several parallel capacitors to lower the effective ESR.
The ceramic capacitors will handle high-frequency dynamic
load changes while the electrolytic capacitors are used to
handle low frequency dynamic load changes. Ceramic
capacitors will also reduce any high frequency noise at the
load.
At input voltages exceeding 75 V, the power loss will be
higher than at normal input voltage and Tref must be limited to
absolute max +95°C. The absolute maximum continuous
input voltage is 75 Vdc.
Turn-off Input Voltage
The converters monitor the input voltage and will turn on and
turn off at predetermined levels. The minimum hysteresis
between turn on and turn off input voltage is 0.6V.
To increase VIon a resistor should be connected between pin
11 and 17. The resistance is given by the following equation:
Rset(up) = (X - Von)/(Von - VIon) kΩ
It is equally important to use low resistance and low
inductance PCB layouts and cabling.
External decoupling capacitors will become part of the
control loop of the DC/DC converter and may affect the
stability margins. As a “rule of thumb”, 100 μF/A of output
current can be added without any additional analysis.
The recommended absolute maximum value of output
capacitance is 10 000 μF. For further information please
contact your local Ericsson Power Modules representative.
To decrease VIon a resistor should be connected between pin
10 and 11. The resistance is given by the following equation:
Rset(down) = 51(Von - Y)/(VIon - Von) kΩ
Variants/Parameters
PKR5510
X
Vion
Y
17.2
17.1
17.0
857
857
857
12.7
12.7
12.7
PKR5611
PKR5113
Output Voltage Adjust (Vadj
)
Voff is the adjusted turn-off input voltage and is determined by
Von - Voff = 0.8V (Typical value).
All converters have an Output Voltage Adjust pin (Vadj). This
pin can be used to adjust the output voltage above or below
Output voltage initial setting.
At increased output voltages the maximum power rating of
the converter remains the same, and the max output current
must be decreased correspondingly.
To increase the voltage the resistor should be connected
between the Vadj pin and -IN. The resistor value of the Output
voltage adjust function is according to information given
under the Output section for the respective product.
To decrease the output voltage, the resistor should be
connected between the Vadj pin and NOR pin.
Remote Control (RC)
The products are fitted with a
remote control function referenced
to the primary negative input
connection (- In), and have positive
logic. The RC function allows the
converter to be turned on/off by an
external device like a
semiconductor or mechanical
switch.
The maximum required sink current is 1 mA. When the RC pin
is left open, the voltage generated on the RC pin is
<16 V. To ensure that the converter stays off the voltage must
be below 1.0 V.
Input and Output Impedance
The impedance of both the input source and the load will
interact with the impedance of the DC/DC converter. It is
important that the input source has low characteristic
impedance. The converters are designed for stable operation
without external capacitors connected to the input or output.
The performance in some applications can be enhanced by
addition of external capacitance as described under External
Decoupling Capacitors. If the input voltage source contains
significant inductance, the addition of a 10 μF capacitor
across the input of the converter will ensure stable operation.
The capacitor is not required when powering the DC/DC
16
ENovember2007
Operating information continued
Thermal Consideration
Parallel Operation
General
Paralleling of several converters is easily accomplished by
direct connection of the output voltage terminal pins. The
load regulation characteristic is specifically designed for
optimal paralleling performance. Load sharing between
converters will be within ±10%. It is recommended not to
exceed
PO = n x 0.9 x POmax, where POmax is the maximum
converter output power and n is the number of paralleled
converters, to prevent overloading any of the converters and
thereby decreasing the reliability performance.
The converters are designed to operate in different thermal
environments and sufficient cooling must be provided to
ensure reliable operation.
Cooling is achieved mainly by conduction, from the pins to
the PCB board, and convection, which is dependant on the
airflow across the converter. Increased airflow enhances the
cooling of the converter.
The Output Current Derating graph found in the Output
section for each model provides the available output current
vs. ambient air temperature and air velocity at Vin = 53 V.
Over Temperature Protection (OTP)
The converter is tested on a 254 x 254 mm,
35 μm (1 oz), 8-layer test board mounted vertically in a wind
tunnel with a cross-section of 305 x 305 mm.
The PKR 5000 Series DC/DC converters include an internal
over temperature shutdown circuit.
When the temperature exceeds 130°C - 150°C on the control
circuit the converter will shut down. The DC/DC converter will
make continuous attempts to start up (non-latching mode)
and resume normal operation automatically when the
temperature has dropped >15°C below the temperature
threshold.
Proper cooling of the converter can be verified by measuring
the temperature at position P1. The temperature at these
positions should not exceed the max values provided in the
table below.
Note that the max value is the absolute maximum rating
(non destruction) and that the electrical Output data is
guaranteed up to Tref +95°C.
Over Current Protection (OCP)
The converters include current limiting circuitry for protection
at continuous overload.
The output voltage will decrease towards zero for output
currents in excess of max output current (max IO). The
converter will resume normal operation after removal of the
overload. The load distribution should be designed for the
maximum output short circuit current specified.
See Design Note 019 for further information.
Position
P1
Device
Transformer
Designation
Tref
max value
110º C
P2
P3
Mosfet
PCB
Synchronization
It is possible to synchronize the switching frequency to an
external symmetrical clock signal. The input can be driven by
a TTL-compatible output and reference to the -input pin 17.
P1
Characteristic
Min
2.2
1.2
0
Typ
1.7
Max
6.5
2.2
0.4
Unit
V
High level
Threshold level*)
V
V
Low level
Air Flow
1.5
mA
Sink current
Sync. Frequency
520
668
kHz
*) Rise time < 10ns
17
ENovember2007
Thermal Consideration continued
Connections
Definition of reference temperature (Tref
)
The reference temperature is used to monitor the temperature
limits of the product. Temperatures above maximum Tref are
not allowed and may cause degradation or permanent
damage to the product. Tref is also used to define the
temperature range for normal operating conditions.
18 17 16 15 14 13 12 11 10
Tref is defined by the design and used to guarantee safety
margins, proper operation and high reliability of the module.
1
2
3
4
5
6
7
8
9
Ambient Temperature Calculation
By using the thermal resistance the maximum allowed
ambient temperature can be calculated.
1. The power loss is calculated by using the formula
((1/η) - 1) × output power = power losses (Pd).
η = efficiency of converter. E.g. 84 % = 0.84
Pin
Designation
Out 1
Function
Output 1
1
2
3
4
5
6
7
8
9
Rtn
Output return
2. Find the thermal resistance (Rth) in the Thermal Resistance
graph found in the Output section for each model.
Calculate the temperature increase (ΔT).
ΔT = Rth x Pd
NC
Not connected
NC
Not connected
NC
Not connected
NC
Not connected
3. Max allowed ambient temperature is:
Max Tref - ΔT.
Sync
Vadj
NOR
Synchronization input
Output voltage adjust
Connection of Nominal Output
voltage Resistor1)
Turn-on/off input voltage adjust
E.g. PKR 5113 SI at 1m/s:
1
10
11
TOA
RC
1. ((
) - 1) × 11 W = 2.1 W
Remote control. Used to turn-
on/off output
0.84
2. 2.1 W × 7.6°C/W =16.0°C
12
13
14
15
16
17
18
NC
NC
NC
NC
NC
- In
+ In
Not connected
Not connected
Not connected
Not connected
Not connected
Negative Input
Positive input
3. 110 °C — 16.0°C = max ambient temperature is 94.0°C
The actual temperature will be dependent on several factors
such as the PCB size, number of layers and direction of
airflow.
1) Nominal voltage when pin 8 & 9 are connected together.
18
ENovember2007
Mechanical Information — Surface Mount Version
19
ENovember2007
Assembly Information — Surface Mount Version
20
ENovember2007
Mechanical Information — Hole Mount Version
21
ENovember2007
Mixed Solder Process Recommendations
Soldering Information - Surface Mounting
The surface mount version of the product is intended for
convection reflow or vapor phase reflow in SnPb or Pb-free
reflow processes.
When using products with Pb-free solder bumps and thereby
mixing Pb-free solder with SnPb paste on the host board and
reflowing at SnPb process temperatures (backwards
compatibility), special recommendations apply.
Mounting Options
The surface mount version is available in two options, SnPb
based or SnAgCu based (Pb-free) solder bumps.
An extended preheat time between +170°C and +180°C for
60 to 90s and a pin reflow temperature (TPIN) between +220°C
and +225°C for 30 to 60 s is recommended.
The SnPb solder bumps are intended for SnPb solder paste
on the host board and to be reflowed in SnPb reflow process
temperatures, typically +210 to +220°C.
The extended preheat and soak at reflow temperature will
minimize temperature gradients and maximize the wetting
and solder mixing in the final solder joints. The use of nitrogen
reflow atmosphere will further improve the solder joint quality.
The Pb-free solder bumps are intended for Pb-free solder
paste on the host board and to be reflowed in Pb-free reflow
process temperatures, typically +235 to +250°C.
Temperature
Note that recommendations for minimum and maximum pin
temperature — and maximum peak product temperature — are
different depending on mounting option, reflow process type
and if the dry packing of the products has been kept intact.
Solder bump
Profile
60-90 s
170°C to 180°C
30-60 s
221°C to 225°C
General Reflow Profile Recommendations
Time
The reflow profile should be optimised to avoid excessive
heating of the product. It is recommended to have a
sufficiently extended preheat time to ensure an even
temperature across the host PCB and to minimize the time in
reflow.
Dry Pack Information
Products intended for Pb-free reflow processes are delivered
in standard moisture barrier bags according to IPC/JEDEC
standard J-STD-033 (Handling, packing, shipping and use of
moisture/reflow sensitivity surface mount devices). The SnPb
option of this product is also delivered in dry packing.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between the
product and the host board, since cleaning residues may
affect long time reliability and isolation voltage.
Using products in high temperature Pb-free soldering
processes requires dry pack storage and handling. In case
the products have been stored in an uncontrolled
environment and no longer can be considered dry, the
modules must be baked according to J-STD-033.
Reflow process specifications1
Average ramp-up rate
SnPb eutectic
Pb-free
3°C/s max
+183°C
3°C/s max
+221°C
Typical solder melting (liquidus) TL
temperature
Minimum reflow time above TL
30 s
30 s
Thermocoupler Attachment
Minimum pin temperature
Peak product temperature
Average ramp-down rate
Maximum time 25°C to peak
TPIN
TPRODUCT
+210°C
+225°C
6°C/s max
6 minutes
+235°C
+260°C
6°C/s max
8 minutes
1 Note: for mixed SnPb / Pb-free soldering, special recommendations apply
Top of PCB near pin
9 or pin 10 for
Temperature
measurement of
maximum product
temperature, TPRODUCT
TPRODUCT maximum
TPIN minimum
Pin
profile
TL
Product
profile
Time in
reflow
Pin 5 of pin 14 for measurement of minimum
pin (solder joint) temperature, TPIN
Time in preheat
/ soak zone
Time 25°C to peak
Time
22
ENovember2007
Pin Temperature Recommendations
Surface Mount Assembly and Repair
Pin number 5 and 14 are chosen as reference locations for
the minimum pin (solder joint) temperature recommendations
since these will likely be the coolest solder joints during
reflow
The solder bumps of the product require particular care
during assembly since the solder bumps are hidden between
the host board and the product’s PCB. Special procedures
are required for successful rework of these products.
SnPb Solder Processes
Assembly
Minimum pin temperature: for SnPb solder processes, a pin
Automatic pick and place equipment should be used to
temperature (TPIN) in excess of the solder melting temperature, mount the product on the host board. The use of a vision
(TL, +183°C for Sn63Pb37) for more than 30 seconds, and a
peak temperature of +210°C is recommended to ensure a
reliable solder joint.
system, utilizing the fiducials on the bottom side of the
product, will ensure adequate accuracy. Manual mounting of
solder bump products is not recommended.
A maximum pin temperature of +225°C should be sufficient
for most applications but depending on type of solder paste
and flux system used on the host board, up to a
recommended maximum temperature of +245°C could be
used, provided that the products are kept in a controlled
environment (dry pack handling and storage) prior to
assembly.
Note that the actual position of the pick up surface may vary
between variants within the product program and is not
necessarily in the center of the product outline.
If necessary, it is recommended to fine tune the solder print
aperture size to optimize the amount of deposited solder with
consideration to screen thickness and solder print capability.
Pb-free Solder Processes
Repair
For Pb-free solder processes, a pin temperature (TPIN) in
For a successful repair (removal and replacement) of a solder
excess of the solder melting temperature (TL, +217 to +221 °C bump product, a dedicated rework system should be used.
for SnAgCu solder alloys) for more than 30 seconds, and a
peak temperature of +235°C on all solder joints is
recommended to ensure a reliable solder joint.
The rework system should preferably utilize a bottom side
heater and a dedicated hot air nozzle to heat the solder
bumps to reflow temperature.
The product is an open frame design with a pick up surface
on a large central component. This pick up surface can not be
used for removal with a vacuum nozzle since the component
solder joints may have melted during the removal reflow.
Maximum Product Temperature Requirements
Top of the product PCB near pin 9 or 10 are chosen as
reference locations for the maximum (peak) allowed product
temperature (TPRODUCT), since these will likely be the warmest
parts of the product during the reflow process.
In order not to damage the product and nearby components
during removal and replacement with a new product, it is
recommended to use a double wall design of the hot air
nozzle to direct the air flow only to the edges of the product,
see ‘Assembly Information’ in the mechanical drawing.
SnPb Solder Processes
For conventional SnPb solder processes, the product is
qualified for MSL 1 according to IPC/JEDEC standard
J-STD-020C (no dry pack handling or controlled environment
required)
Soldering Information — Hole Mounting
The hole mount version of the product is intended for manual
or wave soldering in plated through holes on the host board.
When wave soldering is used, the temperature on the pins is
specified to maximum +270 °C for maximum 10 seconds.
A maximum preheat rate of 4°C/s and a preheat temperature
of max of +150°C is suggested.
During reflow, TPRODUCT must not exceed +225 °C at any time.
If the products are handled as MSL 3 products, they can
withstand up to +260°C as in Pb-free solder processes.
Pb-free Solder Processes
For Pb-free solder processes, the product is qualified for
MSL 3 according to IPC/JEDEC standard J-STD-020C.
When soldering by hand, care should be taken to avoid direct
contact between the hot soldering iron tip and the pins for
more than a few seconds in order to prevent overheating.
During reflow, TPRODUCT must not exceed +260 °C at any time.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between the
product and the host board. The cleaning residues may affect
long time reliability and isolation voltage.
23
ENovember2007
Delivery Package Information
The surface mount version of the product is delivered in
antistatic injection molded trays (Jedec design guide 4.10D
standard) or in antistatic carrier tape (EIA 481 standard)
Tray Specifications
Material
PPE, antistatic
105 < Ohm/square < 1012
Surface resistance
The trays can be baked at maximum
125 °C for maximum 48 hours
The hole mount version is delivered in antistatic tubes.
Bakability
Tray capacity
Box capacity
Tray weight
15 products / tray
Carrier Tape Specifications
150 products (10 full trays / box)
140 g empty, 320 g full tray maximum
Material
Polystyrene (PS), antistatic
< 107 Ohm/square
Surface resistivity
Bakability
The tape is not bakable
72 mm [2.835 inch]
JEDEC standard tray
Tape width
Note: all tray dimensions refer to pocket center. Exact position
of pickup point depends on the position of the pickup surface
(top of main transformer) of the individual product variant
Pocket pitch
Pocket depth
Reel diameter
Reel capacity
Reel weight
36 mm [1.417 inch]
9.2 mm [0.362 inch]
330 mm [13 inch]
150 products / reel
Approximately 2.5 kg / full reel
Tape feed direction
Pin 1
Round holes
Elongated holes
Tube Specifications
Material
PVC, transparent with antistatic coating
< 1011 Ohm/square
Surface resistance
Bakability
The tubes are not bakable
10 products / tube
Tube capacity
Box capacity
Tube weight
100 products (10 full tubes / box)
Typical 160 g full tube
24
ENovember2007
Product Qualification Specification
Characteristics
External visual inspection
Operational life test
IPC-A-610
MIL-STD-202G method 108A
With power cycling
Tref
Load
Duration
According to Absolute
maximum ratings
Maximum output power
500 h
Vibration, broad band random
Vibration, sinusoidal
IEC 60068-2-64 Fh
IEC 68-2-64 Fc
Frequency
Acceleration spectral density
Duration and directions
10 to 500 Hz
0.5 g2/Hz
10 min in each 3 perpendicular
directions
Frequency
Amplitude
Acceleration
Sweep rate
Duration
10 to 500 Hz
0.75 mm
10 g
1 octave/min
2 h in each 3 perpendicular
directions
Mechanical shock
IEC 68-2-27 Ea
Peak acceleration
Duration
100 g
6 ms
Pulse shape
Directions
Half sine
6
Number of pulses
18 (3 + 3 in each perpendicular
direction)
Change of temperature
(Temperature cycling)
IEC 60068-2-14 Na
IEC 68-2-21 Ue1
Temperature range
Number of cycles
Dwell time
-40 to +100°C
300
30 min
Robustness of terminations
Surface mount products
All leads
IEC 68-2-21 Ua1
Through hole mount products
All leads
IEC 68-2-21 Ub (5.2b)
Solderability
Surface mount version
IEC 68-2-58 Td
Temperature, SnPb Eutectic
Temperature, Pb free
Preconditioning
215 ±5°C
245 ±5°C
240 h in 85°C/85%RH
Solderability
Hole mount version
IEC 68-2-58 Ta
Temperature, Pb free
Solder immersion time
Preconditioning
260 ±5°C
5 ±0.5 s
Steam ageing 8 h±15 minutes
Damp heat
IEC 60068-2-67 Cy
with bias
Temperature
Humidity
+85 °C
85 % RH
Duration
Preconditioning
500 hours
Reflowed 3X according to
IPC/JEDEC J-STD-020C MSL3
at 260°C
Moisture reflow sensitivity
classification
J-STD-020C
SnPb Eutectic
Pb free
MSL 1, peak reflow at 225°C
MSL 3, peak reflow at 260°C
Immersion in cleaning solvents
IEC 68-2-45 XA
Method 2
Water
Isopropyl alcohol
Glycol ether
+55 ±5°C
+35 ±5°C
+35 ±5°C
Cold (in operation)
IEC 68-2-1 Ad
Temperature TA
Duration
-40°C
72 h
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