ESCP-BMS1-G-00100KD-01

Datasheet ESCP-BMS1

MEMS Capacitive Pressure & Temperature Sensor for gases.

•

State of the art performance due to MEMS capacitive technology

Outstanding overpressure tolerance (up to 100x)

Absolute, differential, gauge operation

Full scale pressure sensor options from 10 mbar to 11000 mbar

Temperature sensor: -20^oC to +85^oC

Calibrated & temperature compensated output

I²C, SPI or analog interface

Excellent accuracy, resolution, long term stability

Low power consumption

No external components required

Product Summary

ES Systems has developed a series of board mountable pressure sensors targeting a variety of

markets requiring high resolution and accuracy for absolute, gauge or differential pressure

measurements. The ESCP-BMS1 is a MEMS capacitive pressure sensor with state-of-the-art

performance. The MEMS pressure sensor die is underpinned by ES’ innovative SOI-surface

micromachining technology.

ESCP-BMS1 is an absolute, gauge or differential pressure sensor of ultra high resolution with

analog, SPI or I²C interface. The output is fully calibrated, and temperature compensated

based on the internal temperature sensor and the factory calibration coefficients which are

stored in the embedded memory. The sensor is ready to be installed directly to the end system

without further processing. The total error including repeatability, hysteresis, non-linearity,

thermal offset and calibration error between 0^oC and 60^oC is better than 0.25% FS.

Different power modes are available enabling low power operation. The sensor can be

configured to provide both high accuracy 32-bit pressure and temperature outputs.

ESCP-BMS1 is a silicon capacitive pressure sensor with excellent long-term stability. The sensor

is incorporated in a standard 8-pin DIP package with a single or two pneumatic ports. The top

port is the high side and the bottom port is the low side.

Typical Applications

Industrial

Air Flow Measurement • Air Compressors • Air Movement Control • Actuators • Analytical Instruments • Automated

Pneumatic Assembly Equipment • Chemical Analysis Controllers • Factory Automation • Fire Suppression System • Flow

Calibrators Gas Chromatography • Gas Flow Instrumentation • Gaseous Leak Detection • Industrial Controls •

Industrial Gas Supply • Industrial Pneumatic Devices • Leak Detection • Modulated Furnace Controls • Oxygen

Concentrators • Panel Meters • Pressure Switching • Pressure Valves • Process Control Pumps • Remote Monitoring

Devices • Robotics • Valves • Vacuum Pump Monitoring • Variable Air Volume (VAV) Control

Medical

Anesthesia Equipment • Breathalyzers • CPAP Equipment • Drug Dosing Equipment • Hospital Beds • Hospital Gas

Supply • Hospital Room Air Pressure • Massage Machines • Medical Instrumentation • Nebulizers • Patient Monitoring

Equipment • Respiratory Equipment • Sleep Apnea Equipment • Spirometers • Ventilators • Wound Therapy

HVAC

Airflow Monitoring • Clogged Filter Detection • Duct Air Flow • Environmental Control Systems • Filter Monitoring •

Blocked Filter Detection • Indoor Air Quality

v1.7

Datasheet ESCP-BMS1

1. Total Error Band

Total Error Band (TEB) is a single specification that includes all possible sources of error in a pressure measurement.

TEB should not be confused with accuracy, which is actually a component of TEB. TEB is the worst error that the sensor

could experience. The TEB specification on a datasheet may be confusing. ES Systems uses the TEB specification in its

datasheet because it is the most comprehensive measurement of a sensor’s true accuracy. ES Systems also provides

the accuracy specification in order to provide a common comparison with competitors’ literature that does not use the

TEB specification.

All Possible Errors

Offset

Full Scale Span

Pressure Non-Linearity

Pressure Hysteresis

Accuracy

TEB

Noise

Pressure Non-Repeatability

Thermal Effect on Offset

Thermal Effect on Span

Thermal Hysteresis

The figure below, illustrates the accuracy as well as the total error of the pressure measurement of ESCP-BMS1

sensors.

Accuracy Performance

Total Error Band Performance

FS range absolute: 0.5 to 10 bar

FS range gauge: 60 to 11000 mbar

FS range differential: ±50 to ±1000 mbar

0% FS to 100% FS = ±0.25%FS

FS range absolute: 0.5 to 10 bar

FS range gauge: 60 to 11000 mbar

FS range differential: ±50 to ±1000 mbar

0% FS to 100%FS = ±0.15%FS

2/23

Datasheet ESCP-BMS1

2. Absolute Maximum Ratings¹

Characteristic

Min.

Max.

Unit

Vdc

V

Supply voltage (V_supply

Voltage on any pin

Current on any pin

Burst pressure

)

2.7

3.6

-0.3

-

2

mA

-

20²

bara

^oC[^oF]

Storage temperature

-20[-4]

+85[+185]

1

Absolute maximum ratings are the extreme limits the device will withstand without damage. The electrical and

performance characteristics are not guaranteed as the maximum limits are approached, nor will the device necessarily

operate as specified at absolute maximum ratings. Prolonged operation at absolute maximum ratings will degrade

the device performance

²For sensors with FS pressure output < 1bara Burst pressure is 5bara

CAUTION

IMPROPER HANDLE

PRODUCT DAMAGE

Do not apply mechanical stress to the sensor.

Failure to comply with the instructions may

result in product damage.

Do not disassemble these products.

Failure to comply with the instructions may

result in product damage.

3. Operating Specifications

Characteristic

Min.

Typ.

Max.

Unit

1

Supply voltage (V_supply

)

2.7

3.3

3.6

V

Supply current

Continuous mode

Sleep mode

-

0.5

0.1

mA

Output

Calibrated Pressure & Temperature

I²C, SPI, Analog

-

Output Interface

Digital bus frequency

I²C

10

-

100

kHz

SPI

50

1000

Analog Output Resistance

Start-up time²

220k

-

30

-

Ohm

msec

^oC[^oF]

% RH

-

Operating temp. range

Relative humidity (non-condensing)

-20[-4]

+85[+185]

95

-

I²C/SPI voltage Level

Low

-

20

%V_supply

High

80

-

Pull up on SDA / MISO / SCL / SCLK / SS

Media Compatibility

4.7

-

kOhm

Gases

-

¹The sensor is not reverse polarity protected. Incorrect application of supply voltage or ground to the wrong pin may

cause electrical failure.

²After 95% of V_supplyreached.

3/23

Datasheet ESCP-BMS1

4. Sensor Pressure Types

Pressure Type

Description

Absolute

Gauge

Output is proportional to the difference between applied pressure and vacuum pressure

Output is proportional to the difference between applied pressure and ambient pressure

Output is proportional to the difference between the pressures applied to each port (P1 - P2)

Differential

5. Pressure Sensor Specifications

Absolute

Gauge

Typ.

Differential

Characteristic

Unit

Min.

Typ.

Max.

Min.

Max.

Min.

Typ.

Max.

1000

Pressure Range

200

-

10000

0

-

11000

-1000

-

mbar

Comp. temp range¹

Option 01

0[32]

-

+60[+140]

0[32]

-

+60[+140]

0[32]

-

+60[+140] ^oC[^oF]

+85[+185]

Option 02

-20[-4]

+85[+185] -20[-4]

Effective Resolution

Response Time (15Hz)

Response Time (1KHz)

-

15

11

-

15

11

-

15²

11²

-

bits

Total Error Band³

0 to +60^oC

-20 to +85^oC

%

FSS⁵

-

±0.25

±0.35

-

±0.25

±0.35

-

±0.25⁴

±0.35⁴

Accuracy⁶

-

±0.15

±0.25

-

±0.15

±0.25

-

±0.15⁷

±0.25

%FSS

Long term stability⁸

1

The temperature range over which the sensor will produce an output proportional to pressure within the specified

performance limits. Note that for valid datasheet values, ambient and medium temperatures must be the same

²For the 10mbar differential sensor only, effective resolution is 11 bits at 15Hz and 10 bits at 1KHz

³The maximum deviation from ideal transfer function over the entire compensated temperature and pressure range.

Includes all errors due to offset, full scale span, accuracy, thermal effect on offset, thermal effect on span and thermal

hysteresis

⁴For the 10mbar differential sensor only, TEB is ±2.0 % FSS for 0^oC to +60^oC and ±2.5 % FSS for –20^oC to +85^oC

⁵The algebraic difference between the output signal measured at the maximum (P_max) and the minimum (P_min) limits of

the pressure range

6

The maximum deviation in output from a Best Fit Straight Line (BFSL) fitted to the output measured over the

pressure range at 21^oC [69.8^oF]. Includes all errors due to pressure non-linearity, pressure hysteresis, non-repeatability

and noise

⁷For the 10mbar differential sensor only, accuracy is ±1.5 % FSS

⁸Accelerated Life Test Profile: 100hours at 90^oC

6. Temperature Sensor Operating Specifications

Characteristic

Min.

Typ.

Max.

Unit

^oC[^oF]

Full Scale range

-

-20[-4]

+85[+185]

Accuracy

-

14

-

0.5

-

^oC

-

bits

Resolution

Output Rate

250

-

msec

4/23

Datasheet ESCP-BMS1

7. Pressure Range Specifications (mbar)

Pressure Range

Over Pressure¹

Burst Pressure²

Port1 (P1) Port 2 (P2) Port1 (P1) Port 2 (P2)

Absolute

Common Mode

Pressure³

Pressure Range

Unit

P_min

P_max

200

500

1000

1250

2000

5000

10000

mbara

4000

-

4000

-

00500MA

01000MA

01250MA

02000MA

05000MA

10000MA

4000

20000

Gauge

0

60

100

mbarg

1000

5000

4000

21000

-

5000

-

00060MG

00100MG

00160MG

00250MG

00400MG

00600MG

01500MG

05500MG

07000MG

11000MG

160

5000

250

5000

400

5000

600

21000

1500

5500

7000

11000

Differential

1000

-10

-50

10

50

mbarg

1000

5000

4000

5000

21000

2500

4000

10000

00010MD

00050MD

00100MD

00150MD

00200MD

00250MD

00500MD

00750MD

01000MD

1000

-100

-150

-200

-250

-500

-750

-1000

100

150

200

250

500

750

1000

2500

¹The maximum pressure which may safely be applied to the product for it to remain in specification once pressure is

returned to the operating pressure range. Exposure to higher pressures may cause permanent damage to the

product. Unless otherwise specified this applies to all available pressure ports at any temperature with the operating

temperature range

5/23

Datasheet ESCP-BMS1

7. Pressure Range Specifications (kPa)

Pressure Range

Over Pressure¹

Burst Pressure²

Common Mode

Pressure³

Pressure Range

Unit

P_min

P_max

Port1 (P1) Port 2 (P2) Port1 (P1) Port 2 (P2)

Absolute

20

50

100

125

200

500

1000

kPaA

400

-

400

-

00050KA

00100KA

00125KA

00200KA

00500KA

01000KA

400

2000

Gauge

0

6

10

kPaG

100

-

500

-

00006KG

00010KG

00016KG

00025KG

00040KG

00060KG

00150KG

00550KG

00700KG

01100KG

16

500

25

500

40

500

60

400

2100

150

550

700

1100

400

2100

Differential

100

-1

-5

1

5

kPaG

100

500

400

500

2100

250

400

1000

00001KD

00005KD

00010KD

00015KD

00020KD

00025KD

00050KD

00075KD

00100KD

100

-10

-15

-20

-25

-50

-75

-100

10

15

20

25

50

75

100

250

²The maximum pressure that may be applied to the specified port (P1 or P2) of the product without causing escape of

pressure media. Product should not be expected to function after exposure to any pressure beyond the burst

pressure

6/23

Datasheet ESCP-BMS1

7. Pressure Range Specifications (psi)

Pressure Range

Over Pressure¹

Burst Pressure²

Common Mode

Pressure³

Pressure Range

Unit

P_min

P_max

Port1 (P1) Port 2 (P2) Port1 (P1) Port 2 (P2)

Absolute

2.9

10

15

psia

58

-

58

-

00010PA

00015PA

00020PA

00030PA

00075PA

00145PA

20

58

30

58

75

290

145

Gauge

0

1

2

psig

14.5

72.5

58

-

14.5

72.5

58

-

00001PG

00002PG

00003PG

00004PG

00005PG

00010PG

00020PG

00080PG

00100PG

00160PG

3

4

5

10

20

80

100

160

58

304.6

Differential

14.5

-1

-2

1

2

psig

14.5

72.5

58

72.5

304.6

36.3

58

00001PD

00002PD

00003PD

00004PD

00005PD

00006PD

00007PD

00010PD

14.5

-3

3

14.5

58

-4

4

36.3

58

-5

5

36.3

58

-6

6

36.3

58

-7

7

36.3

58

-10

-15

10

15

36.3

145

58

36.3

00015PD

3

Common mode pressure: The maximum pressure that can be applied simultaneously to both ports of a differential

pressure sensor without causing changes in specified performance. Note that pressure should firstly be applied to

(P1).

7/23

Datasheet ESCP-BMS1

8. Wetted Matterials¹

Pressure Port1 (P1)

Dry Gas

Pressure Port2 (P2)

Dry Gas

Component

Ports and covers

Substrate

Liquid Crystal Polymer

Alumina Ceramic Al₂0₃

Epoxy or silicone based

Adhesives

Epoxy or silicone based

Silicon

Silicon, glass, solder, gold, aluminum,

ceramic, silver

Electronic components

¹Contact ES Systems Customer Service for detailed material information

9. Pinouts

Output

I²C

PIN1

Int Sel¹

NC

PIN2

VDD

PIN3

SDA

MOSI

NC

PIN4

SCL

PIN5

NC²

PIN6

NC

PIN7

NC

PIN8

GND

SPI

SCLK

NC

CS

MISO

NC

Analog

NC

Aout

NC

¹Interface select. Tie to VDD for I²C communication or GND for SPI communication

²Do not Connect

10. Environmental Specifications

Characteristic

Vibration

Shock

Parameter

15g, 10Hz to 2 kHz

100g, 6ms duration

ESD

ESD JS-001-2014 HBM ±1kV

Shelf Life

Life¹

20 years

1 million pressure cycles minimum

Soldering time and temperature:

Lead solder temperature (DIP)

4sec. max @ 250^oC [482^oF]

¹Life may vary depending on specific application in which the sensor is used

8/23

Datasheet ESCP-BMS1

11. Data & Register Description

The sensor outputs a 32 bit calibrated pressure output of the pressure range in calibration

units. The 32 bit register is a signed fixed point integer and is organized as follows. The 32 bit

register consists of four 8 bit registers in consecutive addresses. The calibrated pressure value

starts at address 0x40 and ends at address 0x43. The sensor allows for address autoincrement

hence the user only needs to request data from the initial address (in this case 0x40) and then

perform continuous reads for the remaining bytes of the 32 bit value. Data comes most

significant bit first, least significant byte first (little endian). The calibrated temperature value

starts at address 0x44 and ends at address 0x47. The same as pressure value data comes out

most significant bit first, least significant byte first (little endian).

The register organization is presented below:

Calibrated Pressure:

ADDRESS

0x40

REGISTER NAME

TYPE

DEFAULT VALUE (Hex)

Variable

MNEMONIC

Calibrated Pressure Byte 1

Calibrated Pressure Byte 2

Calibrated Pressure Byte 3

Calibrated Pressure Byte 4

R

CAL_PRESS_DATA[7:0]

CAL_PRESS_DATA[15:8]

CAL_PRESS_DATA[23:16]

CAL_PRESS_DATA[31:24]

Variable

To convert reading into pressure:

Calibrated Temperature:

ADDRESS

REGISTER NAME

TYPE

DEFAULT VALUE (Hex)

Variable

MNEMONIC

Calibrated Temperature Byte 1

Calibrated Temperature Byte 2

Calibrated Temperature Byte 3

Calibrated Temperature Byte 4

R

CAL_TEMP_DATA[7:0]

CAL_TEMP_DATA[15:8]

CAL_TEMP_DATA[23:16]

CAL_TEMP_DATA[31:24]

Variable

0x44

Variable

To convert reading into temperature:

9/23

Datasheet ESCP-BMS1

Data Register Reading Process

The process that the user must follow to read the data from BMS1 device is very similar in both

I²C and SPI interfaces. As described in the previous sections the user must first address the

register to be read and then read sequentially all the data bytes. After powering for the user to

be able to read valid data the conversions must be started. This is realized by sending the

command (0x8C) with no payload. This command puts the device in read-triggered mode

meaning that at the end of every data read transaction (single or multi read) the device starts

a new pressure and temperature conversion the data of which can be retrieved at the next

read transaction.

In case of I²C interface device the readout process for pressure is presented below:

S

SLAVE_ADD+ W bit (0x50)

A

REG_ADDRESS (0x40)

A

S

SLAVE_ADD + R bit (0x51)

A

DATA 0

A

...

DATA n

N

P

In case of an SPI interface device the same pressure readout is presented below:

MOSI

MISO

REG_ADDRESS (0x40)

-

...

-

DATA 0

DATA n

For temperature reading the readout process is identical with different register address (0x44).

Also the user can make use of the multi read feature to read both calibrated pressure and

calibrated temperature values in one transaction both in I²C or SPI mode. To realize this

transaction the MCU must start reading register (0x40) and not stop after the readout of the

calibrated pressure values (4bytes) but continue reading the next 4 bytes. The last 4 bytes are

the calibrated temperature value as described in the previous section.

If the user performs a read transaction other than reading temperature and pressure data (eg

serial number) the conversions automatically stop and need to be restarted from the user.

10/23

Datasheet ESCP-BMS1

Serial Number Reading Process

Like data readout, serial number readout is the same for both I²C and SPI interfaces. Unlike

data readout the serial number is located at a different memory and the readout process is

somewhat different than the data readout. In this case the user must write the 2 byte

command (0x238A) to the device after the slave address (0x50). After the command is sent the

user can read the 7 bytes of the serial number and translate them as described below:

ADDRESS

BYTE NAME

TYPE DEFAULT VALUE (Hex)

MNEMONIC

PFC[7:0]

Fixed ID

Product Family Code Byte 1

Product Family Code Byte 2

Product code Byte 1

R

PFC[15:8]

PC[7:0]

-

Product code Byte 2

Lot number

PC[15:8]

LN [7:0]

SN[7:0]

SN[15:8]

Serial number 1

Serial number 2

The serial number consists of 4 parts: [Product Family Code]-[Product Code] [Lot number]-

[Serial Number].

S

SLAVE_ADD+ W bit (0x50)

A

OPCODE_LO (0x23)

A

OPCODE_HI (0x8A)

A

S

SLAVE_ADD + R bit (0x51)

A

PFC[7:0]

A

...

SN[15:8]

N

P

For example the serial number 0x8803530104001C translates to: 904-339 04-0028

11/23

Datasheet ESCP-BMS1

12. I²C Interface

The sensors obey the full I²C protocol standard with the difference that they operate up to SCL

(I²C Clock) speeds of 100 kHz. The sensors support clock stretching functionality. If the device

is not ready to transmit data, holds the clock (SCL) line low and releases it once it is ready. The

master must consider this condition and either identify it and wait until the clock is released or

exit with a repeated start condition.

The sensor can operate with single read or single write transactions as well as multi read

transactions. For data readout the multi read transaction is highly recommended as it ensures

data integrity. The sensors allow for register address auto increment starting from the first

address definition.

In order to ensure data integrity when the BMS1 device is connected to a multi-slave I²C bus,

the user must drive IntSel pin low when communicating with other devices other than the

BMS1. When the user wants to communicate with the BMS1 device he must drive IntSel pin

high.

I²C Specification

Both signals (SCL and SDA) are bidirectional. They are connected via resistors to a positive

power supply voltage. This means that when the bus is free, both lines are high. All devices on

the bus must have open-collector or open-drain pins. Activating the line means pulling it

down. The number of the devices on a single bus is limited to 127 and the only requirement is

that the bus capacitance does not exceed 400pF. For each clock pulse one bit of data is

transferred. The SDA signal can only change when the SCL signal is low – when the clock is

high the data should be stable.

Each I²C command initiated by a master device starts with a START condition and ends with a

STOP condition. For both conditions SCL has to be high. A high to low transition of SDA is

considered as START and a low to high transition as STOP.

After the Start condition the bus is considered as busy and can be used by another master only

after a Stop condition is detected. After the Start condition the master can generate a repeated

Start. This is equivalent to a normal Start and is followed by the slave I²C address.

12/23

Datasheet ESCP-BMS1

Microcontrollers that have dedicated I²C hardware can easily detect bus changes and behave

also as I²C slave devices. However, if the I²C communication is implemented in software, the

bus signals must be sampled at least two times per clock cycle in order to detect necessary

changes.

Data on the I²C bus is transferred in 8-bit packets (bytes). There is no limitation on the number

of bytes, however, each byte must be followed by an Acknowledge bit. This bit signals whether

the device is ready to proceed with the next byte. For all data bits including the Acknowledge

bit, the master must generate clock pulses. If the slave device does not acknowledge the trans-

fer this means that there is no more data, or the device is not ready for the transfer yet. The

master device must either generate Stop or Repeated Start condition.

Each slave device on the bus should have a unique 7-bit address. The communication starts

with the Start condition, followed by the 7-bit slave address and the data direction bit. If this

bit is 0 then the master will write to the slave device. Otherwise, if the data direction bit is 1,

the master will read from slave device. After the slave address and the data direction is sent,

the master can continue with reading or writing. The communication is ended with the Stop

condition which also signals that the I²C bus is free. If the master needs to communicate with

other slaves, it can generate a repeated start with another slave address without generation

Stop condition. All the bytes are transferred with the MSB bit shifted first.

A general I²C communication diagram is shown below:

I²C read diagram

I²C write diagram

13/23

Datasheet ESCP-BMS1

I²C Slave address

The sensor is factory programmed with the default 7 bit slave address of 0x28. The end user

only needs to program the R/W bit that corresponds to the direction of communication as

shown below.

MSB

0

LSB

1

0

1

0

R/W

Hence for write transactions the salve address byte is 0x50 and for read transactions the slave

address byte is 0x51. Slave address is shifted left one and the R/W bit appended.

The sensor supports SCL clock frequencies up to 100 kHz.

I²C communication example

A typical use case is presented bellow. The user powers up the ESCP-BMS1 either by applying

power to the system. After initializing, the user reads the device’s serial number, initiates

sensor conversions and reads the pressure and temperature values periodically. If the user

reads anything other than calibrated pressure or temperature the conversion start command

needs to be sent again. The readout of serial number is optional step but it is essential to

clarify that if the user interrupts the sample reading loop the “start conversions” command

must be issued before any attempt to read pressure or temperature.

14/23

Datasheet ESCP-BMS1

13. SPI Interface

The sensor can communicate with two different serial interfaces, I²C and SPI (only one at the

same time). The interface select pin selects which interface is active. Pulling the interface select

pin high enables I²C interface whereas pulling it low enables SPI interface. In this document

the SPI interface is described hence the interface select pin must be pulled low to operate in

this mode.

The sensor obeys the full SPI protocol standard. The SPI specifications are depicted in the

following tables.

SPI Parameter

CPOL

CPHA

Descripꢀon

Clock Polarity

Clock Phase

Seꢁng

0

1

Mode

SPI Mode

DORD

Bit Sequence order

0, MSB

SPI Read Transaction

SPI Write Transaction

15/23

Datasheet ESCP-BMS1

The timing specification of the SPI interface for the device are depicted in the following table:

Timing Parameter

Serial Clock Frequency

Value

1

Units

MHz

ns

Serial Clock Pulse width HI state

Serial Clock Pulse width LOW state

CS enable-to-valid latch

500

150

500

100

ns

CS pulse width between write cycles

Data setup time prior to clock edge

Data hold time after clock edge

Data valid after clock edge

ns

The sensor can operate with single read or single write transactions as well as multi read and

multi write transactions. For data readout a multi read transaction is highly recommended as it

ensures data integrity. The sensor allows for register address auto increment starting from the

first address definition.

After the CS change from HI to LOW the master (MCU) should transmit the register address

that want to address. After the addressing the BMS1 device will shift the contents of the

register addressed at every clock cycle. After the completion of a full byte transfer the BMS1

device will continue to shift the data of the next register thus realizing the auto increment

functionality.

In the diagram below a transaction example is shown:

16/23

Datasheet ESCP-BMS1

SPI communication example

A typical use case is presented bellow. The user powers up the ESCP-BMS1 either by applying

power to the system. After initializing, the user reads the device’s serial number, initiates

sensor conversions and reads the pressure and temperature values periodically. If the user

reads anything other than calibrated pressure or temperature the conversion start command

needs to be sent again. The readout of serial number is optional step but it is essential to

clarify that if the user interrupts the sample reading loop the “start conversions” command

must be issued before any attempt to read pressure or temperature.

17/23

Datasheet ESCP-BMS1

15. Analog Interface

Similar to the PWM versions the analog version of the BMS1 device outputs an output voltage

raging from 0 to Vdd according to the calibrated pressure measured. The output is not

buffered so the output is a high impedance signal of several hundreds Kohms and the user

must take this in to consideration as the load can distort the signal.

The characteristics of the analog output are described in the table below:

Value

0

Unit

V

Vout min

Vout max

Vdd

V

Depends on specified

conversion rate and load

capacitance

Response time (10%-90%)

V ripple

<10

220

mV p-p

Output impedance

kohm

The pressure output is proportional to the voltage and is calculated from the equation below:

18/23

Datasheet ESCP-BMS1

16. Mechanical Drawings (mm)

Option 11

High Side Port

Low Side Port

Option 02

19/23

Datasheet ESCP-BMS1

16. Mechanical Drawings (mm)

Option 15

Option 08

20/23

Datasheet ESCP-BMS1

17. PCB Layout (All dimensions in mm)

18. Instructions of Mounting

Tubing outside PCB

Tubing inside PCB

For optimal performance, ensure that the ESCP-BMS1 sensor is correctly mounted to the PCB

as illustrated in the figures above. No mechanical stress should be applied to the sensor

during or following its installation. The suggested internal diameter for the tubes is 2.5 mm.

19. Instructions of Operation

The ESCP-BMS1 sensor features digital temperature compensation. The temperature is

measured on the MEMS element by an on-chip temperature sensor. This data is fed to a

compensation circuit that is also integrated on the microprocessor. Thus, no external

temperature compensation is necessary.

Sensor Handling

The ESCP-BMS1 sensor is designed to be robust and shock resistant. Nevertheless, the

accuracy of the high-precision ESCP-BMS1 can be degraded by rough handling. ES Systems

does not guarantee proper operation in case of improper handling.

21/23

Datasheet ESCP-BMS1

20. Ordering Information

ESCP-BMS1-N-NNNNNNN-NN-NN-NN-N-N

Temperature Sensor

Media

Yes

Dry gases only

Y

G

No

N

Pressure Range

Absolute

Gauge

Differential

00010MD

00050MD

00100MD

00150MD

00200MD

00250MD

00500MD

00750MD

01000MD

00001KD

00005KD

00010KD

00015KD

00020KD

00025KD

00050KD

00075KD

00100KD

00001PD

00002PD

00003PD

00004PD

00005PD

00006PD

00007PD

00010PD

00015PD

Pressure Response Time

15Hz

00500MA

01000MA

01250MA

02000MA

05000MA

10000MA

00050KA

00100KA

00125KA

00200KA

00500KA

01000KA

00010PA

00015PA

00020PA

00030PA

00075PA

00145PA

1

2

00060MG

00100MG

00160MG

00250MG

00400MG

00600MG

01500MG

05500MG

07000MG

11000MG

00006KG

00010KG

00016KG

00025KG

00040KG

00060KG

00150KG

00550KG

00700KG

01100KG

00001PG

00002PG

00003PG

00004PG

00005PG

00010PG

00020PG

00080PG

00100PG

00160PG

1kHz

Compensated Temperature

0^oC to 60^oC

01

02

-20^oC to 85^oC

Pressure Port

11

02

08

15

Output Type

SPI / I²C (address 0x28)

05

Analog

01

02

03

04

SPI / I²C (address 0x29)

SPI / I²C (address 0x2A)

SPI / I²C (address 0x2B)

22/23

Datasheet ESCP-BMS1

Important Notes

No warranty applies to any party other than the original

Customer. The remedies of the Customer set forth

herein are exclusive and the total liability of ES Systems

with respect to this order, whether based on contract,

warranty, negligence, indemnification, strict liability or

otherwise, shall not exceed the purchase price of the

component upon which liability is based.

PERSONAL INJURY

DO NOT USE these products as safety or emergency

stop devices, or in any other application where

failure of the product could result in personal injury.

Failure to comply with these instructions could result in

death or serious injury.

In no event shall ES Systems be liable for consequential,

incidental or special damages.

WARRANTY

ES Systems warrants this Product to be free of defects in

materials and workmanship for a period of one (1) year

from the date of purchase.

Specifications may change without notice. The

information supplied is believed to be accurate and

reliable as of this issue; however, ES Systems assumes no

responsibility for its use.

Upon examination by ES Systems, if the unit is found to

be defective it will be repaired or replaced at no charge.

ES Systems' WARRANTY does not apply to defects

resulting from any action of the purchaser, including but

not limited to mishandling, improper interfacing,

operation outside of design limits, improper repair, or

unauthorized modification. This WARRANTY is VOID if the

unit shows evidence of having been tampered with or

Contact Information

ES Systems S.A.

Head Office:

7, Stratigi St., GR-154 51

Neo Psychico, Greece

Tel: (+30) 210 672 8610,

Fax (+30) 210 672 8624

shows evidence of being damaged as

excessive corrosion; or current, heat, moisture or

vibration;

a result of

Factory:

57, I.Metaxa str., GR-194 41

Koropi, Greece

Tel: (+30) 216 2000 500,

Fax (+30) 216 2000 555

improper specification; misapplication; misuse or other

operating conditions outside of ES Systems' control.

Components which wear are not warranted.

ES Systems neither assumes responsibility for any

omissions or errors nor assumes liability for any

damages that result from the use of its Product in

accordance with information provided by ES Systems,

either verbal or written. ES Systems warrants only that

the parts manufactured by it will be as specified and free

of defects.

ES SYSTEMS MAKES NO OTHER WARRANTIES OR

REPRESENTATIONS OF ANY KIND WHATSOEVER,

EXPRESSED OR IMPLIED, EXCEPT THAT OF TITLE, AND

ALL

IMPLIED

WARRANTIES

INCLUDING

ANY

WARRANTY OF MERCHANTABILITY AND FITNESS FOR

A PARTICULAR PURPOSE ARE HEREBY DISCLAIMED.

No representative of ES Systems is authorized to extend

this Warranty or to change it in any manner whatsoever.

23/23


型号：	ESCP-BMS1-G-00100KD-01
厂家：	ES Systems
描述：	MEMS Capacitive Pressure & Temperature Sensor for gases.
文件：	总23页 (文件大小：1508K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

ESCP-BMS1-G-00100KD-01 [ES]

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