ESCP-MIS1-1-070BA-02 [ES]

MEMS Capacitive Pressure & Temperature Sensor for gases & liquids.;


型号：	ESCP-MIS1-1-070BA-02
厂家：	ES Systems
描述：	MEMS Capacitive Pressure & Temperature Sensor for gases & liquids.
文件：	总19页 (文件大小：1577K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Datasheet ESCP-MIS1

MEMS Capacitive Pressure & Temperature Sensor for gases & liquids.

•

State of the art performance due to MEMS capacitive technology

Outstanding overpressure tolerance (up to 100x)

Absolute operation

Full scale pressure sensor options from 10 to 350 bar

Temperature sensor: -40^oC to +125^oC

Calibrated & temperature compensated output

I²C, SPI or analog interface

Excellent accuracy, resolution, long term stability

Low power consumption

No external components required

Product Summary

ES Systems has developed a series of medium isolated pressure sensors suitable for

applications with harsh environmental conditions where resistance to corrosive fluids or gases

is required. Each sensor integrates a MEMS capacitive pressure sensor die, and a CMOS ASIC

for the signal conditioning. The MEMS pressure sensor dies are underpinned by ES Systems’

innovative microfabrication process for silicon capacitive sensors.

The capacitive pressure sensor dies integrated into the medium isolated pressure systems

provide state-of-the-art accuracy and resolution, excellent long-term stability combined with

very good repeatability and hysteresis. The total overall error including thermal offsets is lower

than ±0.25% FS.

The ESCP-MIS1 is a family of pressure sensors in the standard Ø19 stainless steel 316L capsule.

In this type of sensors, the pressure is transferred hydraulically to the hermetically sealed

sensing element through the oil used to fill the cavity between the sensing element and the

stainless steel diaphragm. The pressure capsule interface is either I²C, SPI or analog. The

sensors are provided calibrated and compensated at various temperature and pressure

ranges from 10 bara to 350 bara. Custom materials like Hastelloy or Titanium are available

upon request.

Typical Applications

•

Gas, Liquid Pressure Measurement

Corrosive Fluids and Gas Measurement Systems

Sealed Systems

Manifold Pressure Measurement

Submersible Depth Monitoring

Medical Instruments

Industrial Process Control

Pressure Calibrator

Pressure Transmitter Integration

Refrigeration Equipment & Air Conditioner

OEM equipment

v1.6

Datasheet ESCP-MIS1

1. Total Error Band

Total Error Band (TEB) is a single specification that includes all possible sources of error in a pressure measurement.

TEB should not be confused with accuracy, which is actually a component of TEB. TEB is the worst error that the sensor

could experience. The TEB specification on a datasheet may be confusing. ES Systems uses the TEB specification in its

datasheet because it is the most comprehensive measurement of a sensor’s true accuracy. ES Systems also provides

the accuracy specification in order to provide a common comparison with competitors’ literature that does not use the

TEB specification.

All Possible Errors

Offset

Full Scale Span

Pressure Non-Linearity

Pressure Hysteresis

Accuracy

TEB

Noise

Pressure Non-Repeatability

Thermal Effect on Offset

Thermal Effect on Span

Thermal Hysteresis

The figure below, illustrates the accuracy as well as the total error of the pressure measurement of ESCP-MIS1

sensors.

Accuracy Performance

Range: 10, 12, 13, 14, 18, 20, 28, 30, 35, 70,

100, 200, 350 bar

Total Error Band Performance

Range: 10, 12, 13, 14, 18, 20, 28, 30, 35, 70, 100,

0% FS to 100%FS = ±0.25%FS

Range: 200, 350 bar

0% FS to 100%FS = ±0.125%FS

0% FS to 100%FS = ±0.5%FS

2/19

Datasheet ESCP-MIS1

2. Absolute Maximum Ratings¹

Characteristic

Min.

Max.

Unit

3.1

5.5

Vdc

Supply voltage (V_supply

Voltage on any pin

Current on any pin

Burst pressure

)

-0.3

5.5

1000

bara

^oC[^oF]

bara

-40[-40]

+125[+257]

1000

Storage temperature

Maximum pressure applied

Absolute maximum ratings are the extreme limits the device will withstand without damage. The electrical and

performance characteristics are not guaranteed as the maximum limits are approached, nor will the device necessarily

operate as specified at absolute maximum ratings. Prolonged operation at absolute maximum ratings will degrade

the device performance

CAUTION

IMPROPER HANDLE

PRODUCT DAMAGE

Do not touch the sensing membrane.

Failure to comply with the instructions may

result in product damage.

Do not disassemble these products.

Failure to comply with the instructions may

result in product damage.

3. Operating Specifications

Characteristic

Supply voltage (V_supply

Supply current

Output

Min.

Typ.

3.3

Max.

5.5

Unit

)

3.1

2.3

Calibrated Pressure & Temperature

I²C, SPI, Analog (0.5 to 2.5V)

Output Interface

Digital bus frequency

SPI t_setup

100

kHz

usec

100

150

1000

I²C/SPI voltage Level

Low

%V_supply

High

Pull up on SDA / SCL

4.7

kOhm

Ohm

msec

^oC[^oF]

% RH

Analog Output Resistance

Start-up time²

10k

Operating temp. range

Relative humidity (non-condensing)

Material

-40[-40]

+125[+257]

100

Stainless Steal, Titanium, Hastelloy

Silicon, Food, Fluorinated

Filling Oil

Sealing type

O-ring (FKM, EPDM, NBR, VMQ, HNBR), weld

Gases, liquids

Media Compatibility

¹The sensor is not reverse polarity protected. Incorrect application of supply voltage or ground to the wrong pin may

cause electrical failure.

²After 95% of V_supplyreached.

3/19

Datasheet ESCP-MIS1

4. Pressure Sensor Specifications

Absolute

Typ.

Characteristic

Unit

Min.

Max.

Pressure Type

Pressure Range

Full scale ranges

absolute

Up to 350

bara

10, 12, 13, 14, 18, 20, 28, 30, 35, 70, 100, 200, 350

Compensated temp range¹

Option 01

Option 02

0[32]

-20[-4]

-40[-40]

+60[+140]

+85[+185]

+125[+257]

^oC[^oF]

bits

Option 03

Effective Resolution

Response Time (10Hz)

Response Time (1kHz)

Total error band²< 100 bar

0 to +60 ^oC

±0.25

-20 to +85 ^oC

-40 to +125 ^oC

%FS³

Total error band> 100 bar

0 to +60 ^oC

±0.5

-20 to +85 ^oC

-40 to +125 ^oC

Accuracy⁴

±0.125

%FS

Long term stability⁵

±0.25

%FSS⁶

The temperature range over which the sensor will produce an output proportional to pressure within the specified

performance limits. Note that for valid datasheet values, ambient and medium temperatures must be the same

²The maximum deviation from ideal transfer function over the entire compensated temperature and pressure range.

Includes all errors due to offset, full scale span, accuracy, thermal effect on offset, thermal effect on span and thermal

hysteresis

³% of the full scale

The maximum deviation in output from a Best Fit Straight Line (BFSL) fitted to the output measured over the

pressure range at 21^oC [69.8^oF]. Includes all errors due to pressure non-linearity, pressure hysteresis, non-repeatability

and noise

⁵Accelerated Life Test Profile: 100hours at 90^oC

⁶Full Scale Span (FSS): The algebraic difference between the output signal measured at the maximum (P_max) and the

minimum (P_min) limits of the pressure range

5. Temperature Sensor Operating Specifications

Characteristic

Min.

Typ.

Max.

Unit

^oC[^oF]

Full Scale range

-40[-40]

+125[+257]

Accuracy

0.5

^oC

bits

Resolution

Output Rate

250

msec

4/19

Datasheet ESCP-MIS1

6. Pressure Range Specifications

Pressure Range

Proof Pressure¹

Port

Burst Pressure²

Port

Pressure Range

Unit

P_min

P_max

Absolute

010BA

0.25

0.5

bar

1000

012BA

013BA

014BA

018BA

020BA

028BA

030BA

035BA

0.5

bar

1000

070BA

100BA

200BA

350BA

100

200

350

¹Overpressure: The maximum pressure which may safely be applied to the product for it to remain in specification once

pressure is returned to the operating pressure range. Exposure to higher pressures may cause permanent damage to

the product. Unless otherwise specified this applies to all available pressure ports at any temperature with the operat-

ing temperature range

Burst pressure: The maximum pressure that may be applied to the specified port (P1 or P2) of the product without

causing escape of pressure media. Product should not be expected to function after exposure to any pressure beyond

the burst pressure

7. Wetted Matterials¹

Pressure Port

Component

Dry Gas or Liquid Media

Material

O-ring

Stainless Steel 316L²

FKM³

17g

Weight

¹Contact ESS Customer Service for detailed material information

²Titanium, Hastelloy are also available

³EPDM, NBR, VMQ, HNBR are also available

5/19

Datasheet ESCP-MIS1

8. Data & Register Description

The ESCP-MIS1 sensors provide measurement and status data. The measurement data are

Pressure and Temperature. The data are stored in specific data registers as described

below. The readout is performed by using multibyte read transactions. Both I²C and SPI

communication share the same structure. First byte is the register address which defines the

appropriate register to be written/read and then follows the payload in either direction. The

difference between the two serial interfaces is that in I²C version the user need to address

ESCP-MIS1 device and confirm each byte reception/transmit by receiving an ack after each

transaction.

Result Registers [0x0X]

After every conversion is completed, based on the programed rate and data output, ECSP-

MIS1 sensor updates the corresponding data registers values. Data are in IEEE-754 floating

point format (32bit) and are returned in MSB first sequence.

ADDRESS

TYPE DEFAULT VALUE (Hex)

MNEMONIC

Calibrated Pressure Byte 1

Calibrated Pressure Byte 2

Variable

CAL_PRESS_DATA[31:24]

CAL_PRESS_DATA[23:16]

0x01

Calibrated Pressure Byte 3

Calibrated Pressure Byte 4

Variable

CAL_PRESS_DATA[15:8]

CAL_PRESS_DATA[7:0]

Address 0x01 holds the pressure result in bars. The lowest and highest value depends on the

pressure range of the sensor and cannot exceed the maximum range. Over and under

pressure conditions are indicated in status register (see the corresponding register 0x13).

An example of a pressure measurement is:

Calibrated Pressure Byte 1 = 0x40

Calibrated Pressure Byte 2 = 0xAB

Calibrated Pressure Byte 3 = 0x85

Calibrated Pressure Byte 4 = 0x1E

6/19

Datasheet ESCP-MIS1

The result is represented in the IEEE 754 format and any device that has a IEEE 754 compatible

arithmetic unit does not need to convert it.

IEEE 754 float format conversion:

IEEE 754 format consists of 3 parts: the sign bit (bit 32), exponent part (bits 30:23), mantissa or

fractional part (bits 22:0) as shown in the example above:

The sign bit (s) represents the sign of the number and it is positive (+) for 0 and negative (-) for

1. For the absolute value of the number we need to calculate the mantissa and the exponent

part. The 8 bits of the exponent part are translated as an unsigned integer ranging from 0 to

255 with offset 127. For the mantissa part we need to calculate the above sum:

After calculating the above the final result is given by the equation:

In the example for 0x40AB851E (b0100 0000 1010 1011 1000 0101 0001 1110) we get:

Sign = 0,

Exponent = 129,

Mantissa = 1.33999991417

Finally pressure measured is P = + 1.33999991417 X 2 ^130-127= 5.36 bar

Embedded software conversion:

In practice, the user should just cast the received bytes from registers 0x0X to a float variable

with IEEE 754 format and the calculations will be done automatically by the compiler.

7/19

Datasheet ESCP-MIS1

ADDRESS

TYPE DEFAULT VALUE (Hex)

MNEMONIC

Calibrated Temperature Byte 1

Calibrated Temperature Byte 2

Variable

CAL_TEMP_DATA[31:24]

CAL_TEMP_DATA[23:16]

0x02

Calibrated Temperature Byte 3

Calibrated Temperature Byte 4

Variable

CAL_TEMP_DATA[15:8]

CAL_TEMP_DATA[7:0]

Address 0x02 holds the temperature result in degrees Celsius . The conversion from IEEE 754

format is the same as for register 0x01.

ADDRESS

TYPE DEFAULT VALUE (Hex)

MNEMONIC

Calibrated Pressure Byte 1

Calibrated Pressure Byte 2

Calibrated Pressure Byte 3

Calibrated Pressure Byte 4

Calibrated Temperature Byte 1

Calibrated Temperature Byte 2

Calibrated Temperature Byte 3

Calibrated Temperature Byte 4

Variable

CAL_PRESS_DATA[31:24]

CAL_PRESS_DATA[23:16]

CAL_PRESS_DATA[15:8]

CAL_PRESS_DATA[7:0]

CAL_TEMP_DATA[31:24]

CAL_TEMP_DATA[23:16]

CAL_TEMP_DATA[15:8]

CAL_TEMP_DATA[7:0]

0x00

Address 0x00 returns all available results sequentially. Reading register 0x00 equals reading

sequentially the results at registers 0x01, 0x02 without having to start a new transaction. It is

especially convenient when the user wants to read calibrated pressure and temperature on

one I²C transaction.

8/19

Datasheet ESCP-MIS1

Info and Status registers [0x1X]

The 0x1X registers set provides info for the specific device, firmware version and working

status. Also provides the user the means to perform a software reset of the device.

ADDRESS

0x10

TYPE DEFAULT VALUE (Hex)

No payload

MNEMONIC

Software reset

Addressing register 0x10 results in a software reset of the ESCP-MIS1 device right after the

reception of the register address. This will reset the settings that the user programed during

the last operation cycle and will return the device on its default state.

ADDRESS

Product Family Code Byte 1

Product Family Code Byte 2

Product code Byte 1

TYPE DEFAULT VALUE (Hex)

MNEMONIC

PFC[7:0]

Fixed ID

PFC[15:8]

PC[7:0]

0x11

Product code Byte 2

Lot number

PC[15:8]

LOT_NUMBER [7:0]

SERIAL_NUMBER[7:0]

SERIAL_NUMBER[15:8]

Serial number 1

Serial number 2

consists of 4 parts: [Product Family Code]-[Product Code] [Lot number]-[Serial Number]. For

example the serial number 0x8803530104001C translates to: 904-339 04-0028

9/19

Datasheet ESCP-MIS1

ADDRESS

0x12

TYPE DEFAULT VALUE (Hex)

MNEMONIC

Fixed version

Fw version Major

Fw version Minor

MAJOR_VER[7:0]

MINOR_VER[7:0]

Fw version sub-Minor

SUB_MINOR_VER[7:0]

version number, second number is the minor firmware version and the last Byte represents

the sub minor firmware version.

ADDRESS

0x13

TYPE DEFAULT VALUE (Hex)

MNEMONIC

RUNNING_BIT[7:7]

RESERVED[6:2]

Variable

Status Register

UNDER_PRESSURE[1:1]

OVER_PRESSURE[0:0]

RUNNING_BIT : when the device ha started conversions the bit is 1. If the conversions are not

started or the user has stopped the conversions then the bit is 0

UNDER_PRESSURE: when the pressure sensor is exposed in pressure under the rated

pressure range the bit is set to 1 and the result is clipped.

OVER_PRESSURE: when the pressure sensor is exposed in pressure over the rated pressure

range the bit is set to 1 and the result is clipped.

RESERVED: internal functionality should return 0

10/19

Datasheet ESCP-MIS1

9. I²C Interface

VDD

SENSOR

GND

4k7

SDA

SCL

MCU

At power on reset, the sensor needs 30ms to initialize. After that time the device is ready to

communicate as an I2C slave device with 7-bit address 0x28.

If the master device transmits the selected sensor 7-bit address (0x50) with R/W bit set, and

the appropriate register address, the sensor returns the result specified in the previous

section after acknowledging (ACK) by holding the SDA line low. In order for the master to

receive the data requested, should send 8 clock pulses for each data byte and provide an

acknowledge bit at the 9^thclock cycle by holding the SDA line low. When the last byte is

received a stop condition is issued from the master indicating the termination of the

transaction.

An example of such a transaction is shown below.

I²C Read

11/19

Datasheet ESCP-MIS1

I2C communication example

A typical use case is presented bellow. The user powers up the ESCP-MIS1 either by applying

power to the system or by sending a reset command to the device. After initializing, the user

reads the device’s serial number and firmware version and reads the pressure and

temperature values periodically. At any time the user can read the status register to check that

the sensor is converting and the maximum or minimum pressure limit is not exceeded

12/19

Datasheet ESCP-MIS1

10. SPI Interface

VDD

MOSI

MISO

SCLK

SENSOR

MCU

GND

SPI serial peripheral interface follows the same register mapping as described in section 8. The

sensor uses mode 0 SPI with CPOL = 0 and CPHA = 0.

The SPI communication requires to send, via the MOSI signal, the address to read and then

the following clock pulses will produce the required result on the MISO line. After the address

setting the slave requires a t_setuptime before issuing the data clock pulses in order to fetch the

data to output buffer. The CS line should be driven low and kept low during the transaction.

The following example describe the SPI transactions for reading the pressure output of the

SPI Read

13/19

Datasheet ESCP-MIS1

SPI communication example

A typical use case is presented bellow. The user powers up the ESCP-MIS1 either by applying

power to the system or by sending a reset command to the device. After initializing, the user

reads the device’s serial number and firmware version and reads the pressure and

temperature values periodically. At any time the user can read the status register to check that

the sensor is converting and the maximum or minimum pressure limit is not exceeded.

14/19

Datasheet ESCP-MIS1

11. Analog Interface

3.0V INT REF

0.5-2.5V Range

SENSOR

ADC

GND

The analog output of the sensor is updated at the default digital rate of 10Hz. The calibrated

output is in the range of 0.5 - 2.5 VDC . The output resistance of the sensor is 10kOhms. The

user must ensure that the input of the ADC is at high enough impedance to allow elimination

of potential voltage division errors.

12. Pinouts²

Output

PIN1

PIN2

PIN3

PIN4

PIN5

PIN6

NC¹

SDA

SCL

VDD

GND

I²C

MOSI

SCLK

MISO

AOUT

VDD

GND

SPI

Analog

¹Do not Connect

²Electrical Connection: BM06B-SRSS-TB(LF)(SN)

13. Environmental Specifications

Characteristic

Vibration

Shock

Parameter

20g for 5 to 2000 Hz

175g for 11ms and 100g for 1ms

ESD IEC6100-4-2 air discharge up to 8 kV, or direct

contact discharge up to 4 kV

ESD

level 3 from 80 MHz to 1000 MHz per IEC61000-4-

3, 1m shielded cable with 3cm exposed leads at

connector.

EMC/EMI

20 years

Shelf Life

Life¹

1 million pressure cycles minimum

¹Life may vary depending on specific application in which the sensor is used

15/19

Datasheet ESCP-MIS1

14. Mechanical Drawings (mm)

The drawings below show the standard mechanical dimensions of the ESCP-MIS1 sensor

FS range ≤ 35 bar

FS range > 35 bar

The drawings below show the mechanical dimensions of the –40C to +125C option of the ESCP-

MIS1 sensor

FS range ≤ 35 bar

FS range > 35 bar

16/19

Datasheet ESCP-MIS1

15. Instructions of Mounting

O-ring option

Recommended installation for pressure sensor with FKM O-ring for temperature range –20^oC

to +125^oC. Working temperature range should be taken into account when designing the

installation cavity. During installation, O-ring should be lubricated with suitable grease (In O₂

applications do no not use any grease).

Weld option

Recommended installation for pressure sensor with laser welding

16. Instructions of Operation

The ESCP-MIS1 sensor features digital temperature compensation. The temperature is

measured on the MEMS element by an on-chip temperature sensor. This data is fed to a

compensation circuit that is also integrated on the microprocessor. Thus, no external

temperature compensation is necessary.

Sensor Handling

The ESCP-MIS1 sensor is designed to be robust and shock resistant. Nevertheless, the

accuracy of the high-precision ESCP-MIS1 can be degraded by rough handling. ES Systems

does not guarantee proper operation in case of improper handling.

17/19

Datasheet ESCP-MIS1

17. Ordering Information

ESCP-MIS1-N-NNNNN-NN-NN-NN-NN-NN-N-N

Temperature Sensor

Pressure Type

Yes

Absolute

Pressure Response Time

Pressure Range

10Hz

Absolute

Full Scale

10 bar

12 bar

13 bar

1kHz

010BA

012BA

013BA

Output Type

I2C (address 0x28) 05

SPI

I2C (address 0x29) 06

I2C (address 0x2A)

I2C (address 0x2B)

Analog

014BA

018BA

020BA

028BA

030BA

035BA

070BA

100BA

200BA

350BA

14 bar

18 bar

20 bar

28 bar

30 bar

35 bar

70 bar

100 bar

200 bar

350 bar

Compensated Temperature

0^oC to 60^oC

-20^oC to 85^oC

-40^oC to 125^oC

Sealing Type

O-ring FKM

O-ring EPDM

O-ring NBR

O-ring VMQ

O-ring HNBR

Laser Weld

Filling Oil

Silicon

Food

Fluorinated

Material

SS316L

Hastelloy

Titanium

18/19

Datasheet ESCP-MIS1

Important Notes

No warranty applies to any party other than the original

Customer. The remedies of the Customer set forth

herein are exclusive and the total liability of ES Systems

with respect to this order, whether based on contract,

warranty, negligence, indemnification, strict liability or

otherwise, shall not exceed the purchase price of the

component upon which liability is based.

PERSONAL INJURY

DO NOT USE these products as safety or emergency

stop devices, or in any other application where

failure of the product could result in personal injury.

Failure to comply with these instructions could result in

death or serious injury.

In no event shall ES Systems be liable for consequential,

incidental or special damages.

WARRANTY

ES Systems warrants this Product to be free of defects in

materials and workmanship for a period of one (1) year

from the date of purchase.

Specifications may change without notice. The

information supplied is believed to be accurate and

reliable as of this issue; however, ES Systems assumes no

responsibility for its use.

Upon examination by ES Systems, if the unit is found to

be defective it will be repaired or replaced at no charge.

ES Systems' WARRANTY does not apply to defects

resulting from any action of the purchaser, including but

not limited to mishandling, improper interfacing,

operation outside of design limits, improper repair, or

unauthorized modification. This WARRANTY is VOID if the

unit shows evidence of having been tampered with or

Contact Information

ES Systems S.A.

Head Office:

7, Stratigi St., GR-154 51

Neo Psychico, Greece

Tel: (+30) 210 672 8610,

Fax (+30) 210 672 8624

shows evidence of being damaged as

excessive corrosion; or current, heat, moisture or

vibration;

a result of

Factory:

57, I.Metaxa str., GR-194 41

Koropi, Greece

Tel: (+30) 216 2000 500,

Fax (+30) 216 2000 555

improper specification; misapplication; misuse or other

operating conditions outside of ES Systems' control.

Components which wear are not warranted.

ES Systems neither assumes responsibility for any

omissions or errors nor assumes liability for any

damages that result from the use of its Product in

accordance with information provided by ES Systems,

either verbal or written. ES Systems warrants only that

the parts manufactured by it will be as specified and free

of defects.

ES SYSTEMS MAKES NO OTHER WARRANTIES OR

REPRESENTATIONS OF ANY KIND WHATSOEVER,

EXPRESSED OR IMPLIED, EXCEPT THAT OF TITLE, AND

ALL

IMPLIED

WARRANTIES

INCLUDING

ANY

WARRANTY OF MERCHANTABILITY AND FITNESS FOR

A PARTICULAR PURPOSE ARE HEREBY DISCLAIMED.

No representative of ES Systems is authorized to extend

this Warranty or to change it in any manner whatsoever.

19/19

ESCP-MIS1-1-070BA-02 [ES]

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