4322-025-16300 [ETC]

CORE FULL EFD15-3C90 PAIR ; CORE FULL EFD15-3C90 PAIR\n
4322-025-16300
型号: 4322-025-16300
厂家: ETC    ETC
描述:

CORE FULL EFD15-3C90 PAIR
CORE FULL EFD15-3C90 PAIR\n

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Philips Components  
Product specification  
EFD cores and accessories  
EFD15  
CORES  
Effective core parameters  
SYMBOL  
PARAMETER  
core factor (C1)  
VALUE UNIT  
handbook, halfpage  
7.5  
5.5  
0.25  
Σ(I/A)  
Ve  
2.27  
510  
mm1  
mm3  
mm  
mm2  
mm2  
g
0.15  
effective volume  
effective length  
effective area  
Ie  
34.0  
15.0  
12.2  
1.4  
Ae  
15 0.4  
Amin  
m
minimum area  
mass of core half  
11 0.35  
5.3  
0.15  
4.65  
0.15  
0.2  
2.4  
0.1  
MGC350  
Dimensions in mm.  
Fig.1 EFD15 core half.  
Core sets  
Clamping force 20 ±5 N.  
AL  
(nH)  
AIR GAP  
(µm)  
GRADE  
µe  
TYPE NUMBER  
3F3  
63 ±5%  
100 ±8%  
115  
180  
350  
170  
100  
0  
EFD15-3F3-A63-S  
EFD15-3F3-A100-S  
EFD15-3F3-A160-S  
EFD15-3F3-S  
160 ±10%  
780 ±25%  
63 ±5%  
290  
1400  
115  
3F4  
350  
160  
90  
0  
EFD15-3F4-A63-S  
EFD15-3F4-A100-S  
EFD15-3F4-A160-S  
EFD15-3F4-S  
100 ±8%  
180  
160 ±10%  
400 ±25%  
2000 +40/30%  
3600 +40/30%  
290  
720  
3E4  
3E5  
3610  
6500  
0  
EFD15-3E4-S  
0  
EFD15-3E5-S  
Properties of core sets under power conditions  
B (mT) at  
CORE LOSS (W) at  
H = 250 A/m;  
f = 25 kHz;  
T = 100 °C  
f = 100 kHz;  
B = 100 mT;  
T = 100 °C  
f = 400 kHz;  
B = 50 mT;  
T = 100 °C  
f = 1 MHz;  
B = 30 mT;  
T = 100 °C  
f = 3 MHz;  
B = 10 mT;  
T = 100 °C  
GRADE  
ˆ
ˆ
ˆ
ˆ
3F3  
3F4  
315  
250  
0.06  
0.10  
0.10  
0.16  
1997 Nov 21  
293  
Philips Components  
Product specification  
EFD cores and accessories  
EFD15  
COIL FORMERS  
General data  
PARAMETER  
SPECIFICATION  
Coil former material  
phenolformaldehyde (PF), glass reinforced, flame retardant in accordance with  
“UL 94V-0”; UL file number E167521(M)  
Pin material  
copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated  
Maximum operating temperature 180 °C, “IEC 85” class H  
Resistance to soldering heat  
Solderability  
“IEC 68-2-20”, Part 2, Test Tb, method 1B, 350 °C, 3.5 s  
“IEC 68-2-20”, Part 2, Test Ta, method 1: 235 °C, 2 s  
0
0.15  
3.75  
10.55  
0.05  
0
10.4  
0
0.1  
0.1  
0
6.95  
5.55  
0.15  
(8.85 min)  
0
0.15  
0.1  
0
0
0.1  
7.5  
8
max  
4
13.75  
2.6  
3.6  
MGC351  
O 0.6  
13.75  
16.7 max  
3.75  
0.15  
0
1
11.25  
15.2 max  
Dimensions in mm.  
Fig.2 EFD15 coil former; 8-pins.  
Winding data for EFD15 coil former with 8-pins  
MINIMUM  
AVERAGE  
LENGTH OF  
TURN  
WINDING  
AREA  
(mm2)  
NUMBER OF  
SECTIONS  
WINDING  
WIDTH  
(mm)  
TYPE NUMBER  
(mm)  
1
14.8  
8.85  
26.3  
CSH-EFD15-1S-8P  
1997 Nov 21  
294  
Philips Components  
Product specification  
EFD cores and accessories  
EFD15  
COIL FORMERS  
General data  
PARAMETER  
SPECIFICATION  
Coil former material  
liquid crystal polymer (LCP), glass reinforced, flame retardant in accordance with  
“UL 94V-0”; UL file number E83005(M)  
Pin material  
copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated  
Maximum operating temperature 155 °C, “IEC 85” class H  
Resistance to soldering heat  
Solderability  
“IEC 68-2-20”, Part 2, Test Tb, method 1B, 350 °C, 3.5 s  
“IEC 68-2-20”, Part 2, Test Ta, method 1: 235 °C, 2 s  
0
0.15  
10.55  
3.75  
0.05  
0
0.1  
0.1  
0
0
10.4  
6.65  
5.55  
0.15  
(9.15 min)  
0
0.1  
0.1  
0
7.5  
max  
0.3  
3.7  
2.6  
13.75  
3.8 0.3  
0.3  
0.7  
13.75  
18.7 max  
3.75  
11.25  
2
MGC352  
0.15  
0
16.7 max  
1
Dimensions in mm.  
Fig.3 EFD15 coil former (SMD); 8-pins.  
Winding data for EFD15 coil former (PCB) with 8-pins  
MINIMUM  
WINDING  
AREA  
(mm2)  
AVERAGE  
LENGTH OF  
TURN  
NUMBER OF  
SECTIONS  
WINDING  
WIDTH  
(mm)  
TYPE NUMBER  
(mm)  
1
16.7  
9.15  
25.6  
CPH-EFD15-1S-8P  
1997 Nov 21  
295  
Philips Components  
Product specification  
EFD cores and accessories  
EFD15  
COIL FORMERS  
General data  
PARAMETER  
SPECIFICATION  
Coil former material  
liquid crystal polymer (LCP), glass reinforced, flame retardant  
in accordance with “UL 94V-0”; UL file number E83005(M)  
Solder pad material  
copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated  
155 °C, “IEC 85” class F  
Maximum operating temperature  
Resistance to soldering heat  
Solderability  
“IEC 68-2-20”, Part 2, Test Tb, method 1B, 350 °C, 3.5 s  
“IEC 68-2-20”, Part 2, Test Ta, method 1: 235 °C, 2 s  
2
0
10.55  
6.65  
5.55  
0.15  
0
0.1  
+0.1  
0
10.4  
2.8  
0.15  
(9.15 min.)  
0
7.5  
max.  
+0.1  
0
0
0.1  
0.3  
15  
2.6  
3.7  
1.8  
1
0.3  
16  
3.75  
18.7 max.  
2
11.25  
16.7 max.  
CBW086  
3.75  
Dimensions in mm.  
Fig.4 EFD15 coil former (SMD); 8-solder pads.  
Winding data for EFD15 coil former (SMD) with 8-solder pads  
MINIMUM  
AVERAGE  
LENGTH OF  
TURN  
WINDING  
AREA  
(mm2)  
NUMBER OF  
SECTIONS  
NUMBER OF  
SOLDER PADS  
WINDING  
WIDTH  
(mm)  
TYPE NUMBER  
(mm)  
1
8
16.7  
9.15  
25.6  
CPHS-EFD15-1S-8P  
1997 Nov 21  
296  
Philips Components  
Product specification  
EFD cores and accessories  
EFD15  
MOUNTING PARTS  
General data  
ITEM  
REMARKS  
FIGURE  
TYPE NUMBER  
Clip  
stainless steel (CrNi); clamping force 12.5 N  
stainless steel (CrNi); clamping force 25 N  
6
5
CLI-EFD15  
CLM-EFD15  
Clamp  
0
16.5  
0.3  
13.5  
15 ±0.2  
12  
12.5  
4
CBW168  
4
14 ±0.2  
Dimensions in mm.  
Fig.5 Clamp CLM-EFD15.  
4.5  
5
handbook, halfpage  
19 13.3  
MGC354  
2.6  
Dimensions in mm.  
Fig.6 Clip CLI-EFD15.  
1997 Nov 21  
297  

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