4322-030-51010 [ETC]
CORE IIC10P-14/4-3C30 ; CORE IIC10P - 14 / 4-3C30\n
| 型号： | 4322-030-51010 |
| 厂家： | 
ETC |
| 描述： | CORE IIC10P-14/4-3C30
|
| 文件： | 总7页 (文件大小：180K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
FERRITE CERAMICS
DATA SHEET
IIC10P-14/4
IIC10-14/4
Integrated inductive components
Product specification
1999 Dec 23
File under Ferrite Ceramics, MA01
Philips Components
Product specification
Integrated inductive components
IIC10P-14/4
IIC10P-14/4
Effective core parameters
14.4 ±0.2
0.75
0.75
SYMBOL
PARAMETER
core factor (C1)
VALUE UNIT
handbook, halfpage
Σ(I/A)
Ve
2.47
338
mm−1
mm3
mm
mm2
g
4.38
max.
4
±0.08
effective volume
effective length
effective area
Ie
28.9
11.7
≈1.85
0.3
max.
0.3
Ae
2.7
±0.2
0.1
m
mass of core half
FEATURES
• Inductive SMD component that looks like a standard IC.
• Windings are completed by PCB tracks.
• Suitable for reflow soldering.
7.2
±0.15
10.45
max.
• Partial air gap to resist saturation.
CBW368
• Number of turns can be adpated by track layout.
1.0
0.6 max.
APPLICATIONS
Dimensions in mm.
• Power inductor
• Output choke
Fig.1 IIC10P-14/4 outline.
• EMI choke with bias current.
IICs with partial air gap for use as power inductors
L (µH) FOR 10 TURNS
L (µH) FOR 10 TURNS
WITH A BIAS CURRENT OF 1 A
NO BIAS CURRENT
GRADE
TYPE NUMBER
f = 100 kHz; f = 500 kHz; f = 1 MHz; f = 100 kHz; f = 500 kHz; f = 1 MHz;
T = 25 °C
T = 25 °C
T = 25 °C
T = 25 °C
T = 25 °C
T = 25 °C
3C30
3F4
92 ±25%
−
−
−
45 ±25%
−
≥5
−
−
−
−
≥5
−
IIC10P-14/4-3C30
IIC10P-14/4-3F4
IIC10P-14/4-3F35
−
−
3F35
70 ±25%
−
≥5
IICs with partial air gap under power conditions
CORE LOSS
(mW)
GRADE
TYPE NUMBER
f = 100 kHz;
B = 100 mT;
f = 500 kHz;
B = 50 mT;
f = 1 MHz;
B = 30 mT;
ˆ
ˆ
ˆ
T = 100 °C
T = 100 °C
T = 100 °C
3C30
3F4
≤30
−
−
−
−
≤70
−
IIC10P-14/4-3C30
IIC10P-14/4-3F4
IIC10P-14/4-3F35
3F35
−
≤40
1999 Dec 23
2
Philips Components
Product specification
Integrated inductive components
IIC10-14/4
IIC10-14/4
Effective core parameters
14.4 ±0.2
0.75
0.75
SYMBOL
PARAMETER
core factor (C1)
VALUE UNIT
handbook, halfpage
Σ(I/A)
Ve
2.47
338
mm−1
mm3
mm
mm2
g
4.38
max.
4
effective volume
effective length
effective area
±0.08
Ie
28.9
11.7
≈1.85
Ae
0.3
max.
0.3
m
mass of core half
2.7
±0.2
0.1
FEATURES
• Inductive SMD component that looks like a standard IC.
• Windings are completed by PCB tracks.
7.2
±0.15
10.45
max.
• Suitable for reflow soldering.
• Several magnetic functions, depending on track layout.
CBW369
APPLICATIONS
1.0
0.6 max.
• Common-mode choke
• Mutli-line choke
Dimensions in mm.
• Power transformers
• Signal transformers
• Saturable inductor.
Fig.2 IIC10-14/4 outline.
IICs for use as transformer or common-mode chokes
AL (nH) at
CORE LOSS (mW)
f = 500 kHz; f = 1 MHz;
T = 25 °C B = 50 mT; T = 100 °C B = 30 mT; T = 100 °C
GRADE
TYPE NUMBER
f = 10 kHz; f = 500 kHz; f = 1 MHz;
ˆ
ˆ
T = 25 °C
T = 25 °C
3F4
−
−
−
450 ±25%
−
−
≤70
−
IIC10-14/4-3F4
IIC10-14/4-3E6
IIC10-14/4-3F35
3E6
3F35
6000 ±30%
−
−
−
700 ±25%
≤40
−
IIC for use as a common-mode choke or multi-line choke
Z Ω for 1 turn at
f = 100 MHz; T = 25 °C(1)
GRADE
TYPE NUMBER
3S4
≈35
IIC10-14/4-3S4
Note
1. Minimum value, Z min is −20%.
IIC with rectangular hysteresis loop for use in magnetic regulators
E t product (V.µs) at
GRADE
TYPE NUMBER
f = 100 kHz; H = 800 A/m;
f = 100 kHz; H = 800 A/m;
T = 100 °C; Ireset = 70 mA; 10 turns
T = 100 °C; Ireset = 0 mA; 10 turns
3R1
≥33
≤12
IIC10-14/4-3R1
1999 Dec 23
3
Philips Components
Product specification
Integrated inductive components
IIC10-14/4
GENERAL DATA
Rdc
Isolation resistance
>100 MΩ between leads.
≈65 mΩ (25 °C) and ≈85 mΩ (100 °C) for 10 turns
including 20 solder joints (assuming 70 µm Cu PCB
tracks).
Inter winding capacitance
2 windings of 5 turns:
unifilar ≈5 pF
Leadframe material
bifilar ≈10 pF.
Copper, plated with tin-lead alloy SnPb (85/15).
(depending on track layout; see Figs 1 and 2)
Solderability
Leakage inductance
Compatible with reflow soldering, “IEC 60068-2-58, part 2,
test Ta, method 1”.
2 windings of 5 turns:
unifilar ≈1.8 µH
Moulding material
bifilar ≈0.2 µH.
Liquid crystal polymer (LCP), flame retardant in
accordance with “UL 94V-0”.
Maximum continuous current (DC)
4 A (depending on copper track thickness on PCB).
Isolation voltage
Maximum peak current
>500 V (DC) between leads and between leads and ferrite
core.
10 A.
ndbook, 4 columns
ndbook, 4 columns
Remove for use
as 5+5 turns
CBW540
CBW541
Fig.3 Unifilar track pattern.
Fig.4 Bifilar track pattern.
1999 Dec 23
4
Philips Components
Product specification
IIC10P-14/4
IIC10-14/4
Integrated inductive components
MOUNTING
Soldering information
300
CCB814
preheating 100 s max.
soldering 10 s max.
215 to 280 °C
natural cooling
200
180 °C
160 °C
max.
100
α =
10 K/s
max.
0
t (s)
60 s min.
1 minute max.
Fig.5 Recommended temperature profile for reflow soldering.
RECOMMENDED SOLDER LANDS
1.4
1.1
1.0
0.9 0.6 0.5
8.15
CCB815
10.95
solder paste
solder lands
clearance
Fig.6 Recommended solder lands
1999 Dec 23
5
Philips Components
Product specification
IIC10P-14/4
IIC10-14/4
Integrated inductive components
PACKAGING
Tape and reel specifications
All tape and reel specifications are in accordance with the second edition of “IEC 60286-3”. Basic dimensions are given
in Figs 7 and 8, and Table 1.
Blister tape
P
K
0
0
D
P
2
T
0
cover tape
W
B
0
CCB842
A
D
0
1
P
1
direction of unreeling
K0: chosen so that the orientation of the component cannot change.
For dimensions see Table 1.
Fig.7 Blister tape.
Table 1 Dimensions of blister tape; see Fig.7
SYMBOL DIMENSIONS
10.6
TOL.
UNIT
A0
±0.1
±0.1
±0.1
±0.3
±0.1
±0.25
±0.1
±0.1
±0.1
±0.1
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
B0
14.75
4.75
24
K0
W
D0
1.5
1.5
4
D1
P0; note 1
P1
P2
T
12
6
0.3
Note
1. P0 pitch tolerance over any 10 pitches is ±0.2 mm.
1999 Dec 23
6
Philips Components
Product specification
IIC10P-14/4
IIC10-14/4
Integrated inductive components
Reel specifications
100
±5
330
±2
+0.15
20.5
12.75
0
CCB816
<28.4
Dimensions in mm.
Fig.8 Reel.
Packaging quantities
IICs are delivered taped and reeled in quantities of 1000 units.
Storage requirements
These storage requirements should be observed in order to ensure the soldering of the exposed electrode:
• Maximum ambient temperature shall not exceed 40 °C. Storage temperature higher than 40 °C could result in the
deformation of packaging materials.
• Maximum relative humidity recommended for storage is 70% RH. High humidity with high temperature can accelerate
the oxidation of the tin-lead plating on the termination and reduce the solderability of the components.
• Products shall not be stored in environments with the presence of harmful gases containing sulfur or chlorine.
1999 Dec 23
7
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