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元器件品牌
51-0826-Z001
[ETC]
KUPPLUNG ELEKTROMAG CR FLANSCHMONT GR 08 ; KUPPLUNG ELEKTROMAG CR FLANSCHMONT GR 08\n
元器件型号：
51-0826-Z001
生产厂家：
ETC
描述和应用：
KUPPLUNG ELEKTROMAG CR FLANSCHMONT GR 08
KUPPLUNG ELEKTROMAG CR FLANSCHMONT GR 08\n
局域网
PDF文件：
总2页 (文件大小：212K)
下载文档：
下载PDF数据表文档文件
型号参数：51-0826-Z001参数
查看货源
51-0828-Z001
KUPPLUNG ELEKTROMAG CL FLANSCHMONT GR 08
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ETC
510-83-179-18-112101
PGA / BGA / PLCC SOCKETS
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PREDIP
510-83-257-19-081101
PGA / BGA / PLCC SOCKETS
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PREDIP
510-87-179-18-112101
PGA / BGA / PLCC SOCKETS
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PREDIP
51089-1005
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Dual Row, 10 Circuits
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MOLEX
51089-1205
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Dual Row, 12Circuits
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16
MOLEX
51089-1405
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Dual Row, 14Circuits
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15
MOLEX
51089-1605
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Dual Row, 16Circuits
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MOLEX
51089-1805
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Dual Row, 18Circuits
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17
MOLEX
51089-2005
Assembly Item,
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-
0
MOLEX
51089-2205
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Dual Row, 22 Circuits
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11
MOLEX
51089-2405
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Dual Row, 24Circuits
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MOLEX
51089-2405
Assembly Item,
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-
0
MOLEX
51089-2605
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Dual Row, 26Circuits
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13
MOLEX
51089-2805
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Dual Row, 28Circuits
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MOLEX
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