5962-8860503QLA [ETC]
Buffer/Driver ; 缓冲器/驱动器\n型号: | 5962-8860503QLA |
厂家: | ETC |
描述: | Buffer/Driver
|
文件: | 总14页 (文件大小:73K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
REVISIONS
LTR
A
DESCRIPTION
DATE (YR-MO-DA)
90-08-14
APPROVED
Paragraph 1.3 absolute maximum, correct input voltage range. Editorial
changes throughout.
W. K. Heckman
B
Add vendor cage 0DKS7. Add device type 03. Update boilerplate to
MIL-PRF-38535 requirements. Editorial changes throughout – jak.
01-03-05
Thomas M. Hess
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
REV
B
1
B
2
B
3
B
4
B
5
B
6
B
7
B
8
B
9
B
B
B
B
SHEET
10
11
12
13
PMIC N/A
PREPARED BY
Greg A. Pitz
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
CHECKED BY
Raymond Monnin
STANDARD
MICROCIRCUIT
DRAWING
APPROVED BY
Michael A. Frye
MICROCIRCUIT, DIGITAL, BIPOLAR HIGH
PERFORMANCE 10-BIT BUFFER, MONOLITHIC
SILICON
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
DRAWING APPROVAL DATE
88-03-08
AMSC N/A
SIZE
A
CAGE CODE
REVISION LEVEL
B
5962-88605
67268
SHEET
1
OF
13
DSCC FORM 2233
APR 97
5962-E051-01
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M)
and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or
Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
1.2 PIN. The PIN is as shown in the following examples.
For devices 01 - 02:
5962-88605
01
L
X
Drawing number
For device 03
Device type
(see 1.2.2)
Case outline
(see 1.2.4)
Lead finish
(see 1.2.5)
5962
-
88605
01
Q
L
X
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
/
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
Generic number
Circuit function
01
02
03
29827A
29828A
29827A
High performance 10-bit inverting buffer, three-state
High performance 10-bit inverting buffer, three-state
High performance 10-bit inverting buffer, three-state
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed
below. Since the device class designator has been added after the original issuance of this drawing, for device types 01 and 02
device classes M and Q designators will not be included in the PIN and will not be marked on the device.
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN
class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Q or V
Certification and qualification to MIL-PRF-38535
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
Package style
K
L
3
GDFP2-F24 or CDFP3-F24
GDIP3-T24 or CDIP4-T24
CQCC1-N28
24
24
28
Flat pack
Dual-in-line
Square leadless chip carrier
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-88605
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
B
SHEET
2
DSCC FORM 2234
APR 97
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings. 1/
Supply voltage range (VCC)............................................................................. -0.5 V dc to +7.0 V dc
DC input voltage range (VIN)............................................................................ -1.5 V dc to 6.0 V dc
DC output voltage range (VOUT)....................................................................... -0.5 V dc to 5.5 V dc
DC output current into output........................................................................... +100 mA
DC output current out of output........................................................................ -50 mA
DC input current into input................................................................................ -30 mA to +5.0 mA
Storage temperature range (TSTG).................................................................... -65°C to +150°C
Maximum power dissipation (PD) 2/................................................................ 1.82 W
Lead temperature (soldering, 10 seconds)....................................................... +300°C
Thermal resistance, junction-to-case (qJC) ....................................................... See MIL-STD-1835
Junction temperature (TJ)................................................................................. +150°C
1.4 Recommended operating conditions.
Supply voltage (VCC) ......................................................................................... +4.5 V dc to +5.5 V dc
Minimum high level input voltage (VIH)............................................................. 2.0 V dc
Maximum low level input voltage (VIL)............................................................... 0.7 V dc
Case temperature operating range (TC) ........................................................... -55°C to +125°C
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of
this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue
of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883
MIL-STD-1835
-
-
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ Must withstand the added PD due to short circuit test, e.g., IOS
.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-88605
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
B
SHEET
3
DSCC FORM 2234
APR 97
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific
exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device
class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth tables. The truth tables shall be as specified on figure 2.
3.2.4 Logic diagrams. The logic diagram shall be as specified on figure 3.
3.2.5 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 4.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical
performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating
temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests
for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked
as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the
manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator
shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M
shall be in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed
manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing
shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or
for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in
MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to
this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein)
involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535, appendix A.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the
option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available
onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit
group number 2 (see MIL-PRF-38535, appendix A).
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-88605
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
B
SHEET
4
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
Test
Symbol
VOH
Test conditions
Device
types
Group A
subgroups
Limits
Unit
V
-55°C £ TC £ +125°C
+4.5 V £ VCC £ +5.5 V
unless otherwise specified
Min
2.4
Max
High level output
voltage
VCC = 4.5 V
IOH = -15 mA
IOH = -24 mA
All
1, 2, 3
VIL = 0.8 V
VIH = 2.0 V
2.0
Low level output
voltage
VOL
VCC = 4.5 V, VIH = 2.0 V,
VIL = 0.8 V, IOL = 32 mA
VCC = 4.5 V
All
All
1, 2, 3
1, 2, 3
0.5
V
V
Input clamp voltage
VIC
-1.2
IIN = -18 mA
Input hysteresis
VHYST
01, 02
03
1, 2, 3
1, 2, 3
1, 2, 3
200
150
mV
Low level input current IIL
VCC = 5.5 V, VIN = 0.4 V
VCC = 5.5 V, VIN 2.7 V
VCC = 5.5 V, VIN 5.5 V
VCC = 5.5 V, VOUT 2.7 V
VCC = 5.5 V, VOUT = 0.4 V
VCC = 5.5 V, VOUT = 0.0 V
All
-0.5
50
mA
High level input current IIH1
All
All
All
1, 2, 3
1, 2, 3
1, 2, 3
mA
IIH2
Offstate output current IOZH
IOZL
100
50
mA
-50
-250
Short circuit output
current
IOS
1/
All
1, 2, 3
1, 2, 3
-75
mA
Bus leakage current
Supply current
IOFF
VCC = 0.0 V, VOUT = 2.9 V
All
All
All
All
100
80.0
55.0
70.0
mA
ICC
VCC = 5.5 V
Outputs open
VIL = 0.8 V
VIH = 2.0 V
Outputs logic low
mA
Outputs logic high
Outputs logic
three-state
Functional tests
VCC = 5.5 V
See 4.4.1c
All
7, 8
L
H
See footnotes at end of table.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-88605
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
B
SHEET
5
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Test conditions
Device
types
Group A
subgroups
Limits
Unit
ns
-55°C £ TC £ +125°C
+4.5 V £ VCC £ +5.5 V
unless otherwise specified
Min
Max
9.0
Propagation delay time, tPLH
from Di to Yi
VCC = 5.0 V
01, 03
02
9, 10, 11
9, 10, 11
9, 10, 11
9, 10, 11
9, 10, 11
9, 10, 11
CL = 50 pF ±10%
R1 = 500W, R2 = 500W
See figure 4
8.0
tPHL
01, 03
02
9.0
10.0
12.0
14.0
13.0
15.0
10.0
Propagation delay time, tPZH
output enable, from
VCC = 5.0 V
01, 02
03
ns
ns
CL = 50 pF ±10%
R1 = 500W, R2 = 500W
See figure 4
OEi to Yi or Yi
tPZL
01, 02
03
Propagation delay time, tPHZ
output disable, from
VCC = 5.0 V
All
CL = 50 pF ±10%
R1 = 500W, R2 = 500W
See figure 4
OEi to Yi or Yi
tPLZ
01, 02
03
10.0
12.0
1/ Not more than one output should be shorted at a time and the duration of the short circuit condition should not exceed 100
milliseconds.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-88605
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
B
SHEET
6
DSCC FORM 2234
APR 97
01, 03
02
01, 03
02
Device types
Case outlines
K and L
3
Terminal symbol
Terminal number
1
OE1
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
GND
OE2
Y9
OE1
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
GND
OE2
Y9
NC
NC
OE1
D0
D1
D2
D3
D4
NC
D5
D6
D7
2
OE1
D0
D1
D2
D3
D4
NC
D5
D6
D7
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
D8
D9
GND
NC
OE2
Y9
D8
D9
GND
NC
OE2
Y9
Y8
Y8
Y7
Y7
Y6
Y6
Y5
Y5
Y8
Y8
Y4
Y4
Y7
Y7
Y3
Y3
Y6
Y6
Y2
Y2
Y5
Y5
Y1
Y1
NC
Y4
NC
Y4
Y0
Y0
VCC
- - -
- - -
- - -
- - -
VCC
- - -
- - -
- - -
- - -
Y3
Y3
Y2
Y2
Y1
Y1
Y0
Y0
VCC
VCC
NC = no connection
FIGURE 1. Terminal connections.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-88605
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
B
SHEET
7
DSCC FORM 2234
APR 97
Device types 01 and 03
Ouputs
Inputs
OE2
L
Function
OE1
L
Di
H
Yi
H
Data output
Transparent
L
X
H
L
H
X
L
X
X
L
Z
Z
High impedance
High impedance
Device type 02
Inputs
OE2
L
Ouputs
Function
OE1
L
Di
H
Yi
L
Data output
Transparent
L
X
H
L
H
X
L
X
X
H
Z
Z
High impedance
High impedance
H = High voltage level
L = Low level voltage
X = Irrelevant
Z = High impedance
Figure 2. Truth tables.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-88605
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
B
SHEET
8
DSCC FORM 2234
APR 97
FIGURE 3. Logic diagrams.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-88605
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
B
SHEET
9
DSCC FORM 2234
APR 97
FIGURE 4. Switching waveforms and test circuit.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-88605
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
B
SHEET
10
DSCC FORM 2234
APR 97
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-
PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not
affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance
with MIL-PRF-38535, appendix A.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on
all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with
method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.
4.2.1 Additional criteria for device class M.
a. Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify
the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test
method 1015.
(2) TA = +125°C, minimum.
b. Interim and final electrical test parameters shall be as specified in table II herein.
4.2.2 Additional criteria for device classes Q and V.
a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device
manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document
revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test
method 1015 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table II herein.
c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in
MIL-PRF-38535, appendix B.
4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in
accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups
A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with
MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein except where option 2 of
MIL-PRF-38535 permits alternate in-line control testing. Quality conformance inspection for device class M shall be in accordance
with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for device class M shall be those specified
in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
4.4.1 Group A inspection.
a. Tests shall be as specified in table II herein.
b. Subgroups 4, 5, and 6 are omitted.
c. Subgroups 7 and 8 tests shall verify the truth tables.
4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table II herein.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-88605
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
B
SHEET
11
DSCC FORM 2234
APR 97
TABLE II. Electrical test requirements.
Test requirements
Subgroups
Subgroups
(in accordance with
MIL-STD-883,
(in accordance with
MIL-PRF-38535, table III)
method 5005, table I)
Device
class M
Device
class Q
Device
class V
Interim electrical
1
1
1
parameters (see 4.2)
Final electrical
1/
1, 2, 3,
1/
1, 2, 3,
1/
1, 2, 3,
parameters (see 4.2)
7, 8, 9, 10, 11
1, 2, 3, 7, 8,
9, 10, 11
7, 8, 9, 10, 11
1, 2, 3, 7, 8,
9, 10, 11
7, 8, 9, 10, 11
1, 2, 3, 7, 8,
9, 10, 11
Group A test
requirements (see 4.4)
Group C end-point electrical
parameters (see 4.4)
1, 2, 3
1, 2, 3
1, 2, 3
Group D end-point electrical
parameters (see 4.4)
1, 2, 3
----
1, 2, 3
----
1, 2, 3
----
Group E end-point electrical
parameters (see 4.4)
1/ PDA applies to subgroup 1.
4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883:
a. Test condition A, B, C or D. The test circuit shall be maintained by the manufacturer under document revision level control
and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs,
outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-
STD-883.
b. TA = +125°C, minimum.
c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or
approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test
circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-
STD-883.
4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table II herein.
4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured
(see 3.5 herein).
a. End-point electrical parameters shall be as specified in table II herein.
b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified
in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to radiation
hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device classes
must meet the postirradiation end-point electrical parameter limits as defined in table I at
TA = +25°C ±5°C, after exposure, to the subgroups specified in table II herein.
c. When specified in the purchase order or contract, a copy of the RHA delta limits shall be supplied.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-88605
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
B
SHEET
12
DSCC FORM 2234
APR 97
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q
and V or MIL-PRF-38535, appendix A for device class M.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original
equipment), design applications, and logistics purposes.
6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor prepared
specification or drawing.
6.1.2 Substitutability. Device class Q devices will replace device class M devices.
6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the
individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus when a system application
requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users and this list will
be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC
5962) should contact DSCC-VA, telephone (614) 692-0544.
6.4 Comments. Comments on this drawing should be directed to DSCC-VA , Columbus, Ohio 43216-5000, or telephone (614)
692-0674.
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535 and MIL-HDBK-1331.
6.6 Sources of supply.
6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. The
vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to this
drawing.
6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103. The
vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to
and accepted by DSCC-VA.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-88605
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
B
SHEET
13
DSCC FORM 2234
APR 97
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 01-03-05
Approved sources of supply for SMD 5962-88605 are listed below for immediate acquisition information only and shall
be added to MIL-HDBK-103 and QML 38535 during the next revision. MIL-HDBK-103 and QML 38535 will be revised
to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of
compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next dated revision of
MIL-HDBK-103. and QML 38535
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor similar
PIN 2/
Generic
Part number
2/
5962-8860501LX
5962-8860501KX
5962-88605013X
5962-8860502LX
5962-8860502KX
5962-88605023X
5962-8860503QLA
5962-8860503QLC
5962-8860503QKA
5962-8860503QKC
3/
3/
AM29827A/BLA
AM29827A/BKA
AM29827A/B3A
AM29828A/BLA
AM29828A/BKA
AM29828A/B3A
GEM19303QLA
GEM19303QLC
GEM19303QKA
GEM19303QKC
3/
3/
3/
3/
0DKS7
0DKS7
0DKS7
0DKS7
29827A
29827A
29827A
29827A
1/ The lead finish shown for each PIN representing
a hermetic package is the most readily available
from the manufacturer listed for that part. If the
desired lead finish is not listed contact the vendor
to determine its availability.
2/ Caution. Do not use this number for item
acquisition. Items acquired to this number may not
satisfy the performance requirements of this drawing.
3/ Not available from an approved source of supply.
Vendor CAGE
number
Vendor name
and address
0DKS7
David Sarnoff Research Center
201 Washington Road
Princeton, NJ 08540-5300
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.
相关型号:
5962-8860601EX
HC/UH SERIES, OTHER DECODER/DRIVER, TRUE OUTPUT, CDIP16, FRIT SEALED, CERDIP-16
RENESAS
5962-88607013X
LS SERIES, 16-BIT RIGHT PARALLEL IN SERIAL OUT SHIFT REGISTER, TRUE OUTPUT, CQCC28
TI
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