AP-CF001GE3NR-ETNRQ [ETC]

Compact Flash Series Ⅲ Industrial CF Specifications;
AP-CF001GE3NR-ETNRQ
型号: AP-CF001GE3NR-ETNRQ
厂家: ETC    ETC
描述:

Compact Flash Series Ⅲ Industrial CF Specifications

内存集成电路
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Compact Flash series  
AP-CFxxxxE3NR-XXXXXXQ  
RoHS Compliant  
Compact Flash Series  
Industrial CF Specifications  
August 11th, 2013  
Version 1.1  
Apacer Technology Inc.  
1F, No.32, Zhongcheng Rd., Tucheng Dist., New Taipei City, Taiwan, R.O.C  
Tel: +886-2-2267-8000 Fax: +886-2-2267-2261  
www.apacer.com  
0
© 2013 Apacer Technology Inc.  
Rev. 1.1  
Compact Flash series  
AP-CFxxxxE3NR-XXXXXXQ  
Features:  
Compact Flash Association  
Specification Revision 3.0 Standard  
Interface  
ATA command set compatible  
Temperature ranges  
Operating:  
Standard: 0°C to 70°C  
Extended: -40°C to 85°C  
Storage: -40°C to 100°C  
ATA mode support for up to:  
PIO Mode-6  
Flash management  
Multiword DMA Mode-4  
Ultra DMA Mode-4  
Advanced wear-leveling algorithms  
S.M.A.R.T. technology  
Built-in hardware ECC  
Flash block management  
Power failure management  
Connector Type  
50 pins female  
Power consumption (typical)*  
Supply voltage: 3.3V & 5V  
Endurance (TBW: Terabytes Written)  
128 MB: 3.3 TBW  
256 MB: 6.7 TBW  
Active mode: 80 mA/95 mA (3.3V/5.0V)  
Sleep mode: 700 µA/900 µA (3.3V/5.0V)  
512 MB: 12.9 TBW  
1 GB: 25.6 TBW  
2 GB: 38.4 TBW  
4 GB: 51.9 TBW  
8 GB: 69.8 TBW  
16 GB: 115.0 TBW  
Performance*  
Sustained read: up to 29 MB/sec  
Sustained write: up to 15 MB/sec  
Capacity  
128, 256, 512 MB  
1, 2, 4, 8, 16 GB  
Physical Dimensions  
36.4mm x 42.8mm x 3.3mm  
NAND Flash Type: SLC  
Shock & Vibration**  
RoHS compliant  
Shock: 1,500 G  
Vibration: 15 G  
*Varies from capacities. The values addressed for Performance and Power consumptions are typical and may vary depending on  
settings and platforms.  
**Non-operating  
1
© 2013 Apacer Technology Inc.  
Rev. 1.1  
Compact Flash series  
AP-CFxxxxE3NR-XXXXXXQ  
Table of Contents  
1. GENERAL DESCRIPTION.................................................................................................... 3  
2. FUNCTIONAL BLOCK .......................................................................................................... 3  
3. PIN ASSIGNMENTS ............................................................................................................... 4  
4. PRODUCT SPECIFICATIONS.............................................................................................. 6  
4.1 CAPACITY.............................................................................................................................................................6  
4.2 PERFORMANCE  
SPECIFICATION.............................................................................................................................6  
4.3 ENVIRONMENTAL  
SPECIFICATIONS.......................................................................................................................7  
4.5 ENDURANCE ........................................................................................................................................................7  
5. FLASH MANAGEMENT........................................................................................................ 8  
5.1. ADVANCED WEAR  
-
LEVELING ALGORITHMS .........................................................................................................8  
5.2 S.M.A.R.T. TECHNOLOGY ....................................................................................................................................8  
5.3 BUILT IN HARDWARE ECC...................................................................................................................................8  
5.4 FLASH BLOCK MANAGEMENT ...............................................................................................................................8  
5.5 POWER ANAGEMENT...........................................................................................................................8  
-
FAILURE M  
6. SOFTWARE INTERFACE.................................................................................................... 9  
6.1 COMMAND SET.....................................................................................................................................................9  
7. ELECTRICAL SPECIFICATION ...................................................................................... 11  
8. PHYSICAL CHARACTERISTICS..................................................................................... 12  
8.1 DIMENSION.........................................................................................................................................................12  
9. PRODUCT ORDERING INFORMATION........................................................................ 13  
9.1 PRODUCT  
9.2 VALID  
CODE DESIGNATIONS .........................................................................................................................13  
C
OMBINATIONS .......................................................................................................................................14  
2
© 2013 Apacer Technology Inc.  
Rev. 1.1  
Compact Flash series  
AP-CFxxxxE3NR-XXXXXXQ  
1. General Description  
Apacer’s value-added Industrial CompactFlash Card offers high performance, high reliability and power-  
efficient storage. Regarding standard compliance, this CompactFlash Card complies with CompactFlash  
specification revision 4.1, supporting transfer modes up to Programmed Input Output (PIO) Mode 6, Multi-  
word Direct Memory Access (DMA) Mode 4, Ultra DMA Mode 5, and PCMCIA Ultra DMA Mode 5.  
Apacer’s value-added CFC provides complete PCMCIA – ATA functionality and compatibility. Apacer ‘s  
CompactFlash technology is designed for applications in Point of Sale (POS) terminals, telecom, IP-STB,  
medical instruments, surveillance systems, industrial PCs and handheld applications such as the new  
generation of Digital Single Lens Reflex (DSLR) cameras.  
2. Functional Block  
The Compact Flash Card (CFC) includes a controller and flash media, as well as the Compact Flash  
standard interface. Figure 2-1 shows the functional block diagram.  
Flash Array  
Flash  
Media  
Flash  
Media  
Compact Flash  
Controller  
Compact Flash  
Interface  
Flash  
Media  
Flash  
Media  
Figure 2-1: Functional block diagram  
3
© 2013 Apacer Technology Inc.  
Rev. 1.1  
Compact Flash series  
AP-CFxxxxE3NR-XXXXXXQ  
3. Pin Assignments  
Table 3-1 lists the pin assignments with respective signal names for the 50-pin configuration. A “#” suffix  
indicates the active low signal. The pin type can be input, output or input/output.  
Table 3-1: Pin assignments (1 of 2)  
Pin No.  
Memory card mode  
I/O card mode  
True IDE mode  
Signal name Pin I/O type  
Signal name  
Pin I/O type  
Signal name Pin I/O type  
1
GND  
D3  
D4  
D5  
D6  
-
I/O  
I/O  
I/O  
GND  
D3  
D4  
D5  
D6  
-
I/O  
I/O  
I/O  
GND  
D3  
D4  
D5  
D6  
-
I/O  
I/O  
I/O  
2
3
4
5
6
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
D7  
D7  
D7  
7
8
9
#CE1  
A10  
#OE  
A9  
A8  
A7  
VCC  
A6  
A5  
A4  
A3  
I
I
I
#CE1  
A10  
#OE  
A9  
A8  
A7  
VCC  
A6  
A5  
A4  
A3  
I
I
I
#CE1  
A101  
#OE  
A91  
I
I
I
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
I
I
I
I
I
I
A81  
I
-
I
-
A71  
I
-
VCC  
A61  
I
I
I
I
I
I
I
I
I
A51  
A41  
I
I
I
I
A31  
A2  
I
I
A2  
A1  
A0  
D0  
A2  
A1  
A0  
D0  
I
I
I
I
A1  
A0  
D0  
D1  
I
I
I/O  
I/O  
I/O  
O
O
O
I/O  
I/O  
I/O  
I/O  
I/O  
I
I/O  
I/O  
I/O  
O
O
O
I/O  
I/O  
I/O  
I/O  
I/O  
I
I/O  
I/O  
I/O  
O
O
O
I/O  
I/O  
I/O  
I/O  
I/O  
I
D1  
D2  
D1  
D2  
D2  
WP  
#IOCS16  
#CD2  
#CD1  
D11  
D12  
D13  
D14  
D15  
#CE2  
#VS1  
#IORD  
#IOWR  
#WE  
-IREQ  
VCC  
#CSEL  
#VS2  
RESET  
#IOCS16  
#CD2  
#CD1  
D11  
#CD2  
#CD1  
D11  
D12  
D13  
D14  
D15  
#CE2  
#VS1  
#IORD  
#IOWR  
#WE  
RDY/-BSY  
VCC  
#CSEL  
#VS2  
RESET  
D12  
D13  
D14  
D15  
#CE2  
#VS1  
#IORD  
#IOWR  
#WE  
INTRQ  
VCC  
#CSEL  
#VS2  
RESET  
O
I
I
O
I
I
O
I
I
I
O
-
I
O
I
I
O
-
I
O
I
I
O
-
I
O
I
4
© 2013 Apacer Technology Inc.  
Rev. 1.1  
Compact Flash series  
AP-CFxxxxE3NR-XXXXXXQ  
Table 3-1: Pin assignments (2 of 2)  
Pin No.  
Memory card mode  
Signal name Pin I/O type  
I/O card mode  
True IDE mode  
Signal name  
Pin I/O type  
Signal name Pin I/O type  
42  
43  
44  
45  
46  
47  
48  
49  
50  
#WAIT  
#INPACK  
-REG  
BVD2  
BVD1  
D8  
O
O
I
#WAIT  
#INPACK  
#REG  
#SPKR  
#STSCHG  
D8  
O
O
I
IORDY  
DMARQ2  
DMACK2  
#DASP  
#PDIAG  
D8  
O
O
I
I/O  
I/O  
I/O  
I/O  
I/O  
-
O
O
O
O
I/O  
I/O  
I/O  
-
I/O  
I/O  
I/O  
-
D9  
D10  
GND  
D9  
D10  
GND  
D9  
D10  
GND  
1. The signal should be tied to VCC by the host.  
2. Connection required when UDMA is in use.  
5
© 2013 Apacer Technology Inc.  
Rev. 1.1  
Compact Flash series  
AP-CFxxxxE3NR-XXXXXXQ  
4. Product Specifications  
4.1 Capacity  
Capacity specification of the Compact Flash Card series (CFC) is available as shown in Table 4-1. It lists  
the specific capacity and the default numbers of heads, sectors and cylinders for each product line.  
Table 4-1: Capacity specifications  
Capacity  
128 MB  
256 MB  
512 MB  
1GB  
Total bytes1,2  
128,450,560  
Cylinders  
980  
Heads  
8
Sectors  
32  
Max LBA  
250,880  
256,901,120  
980  
16  
32  
501,760  
512,483,328  
993  
16  
63  
1,000,944  
2,001,888  
4,001,760  
8,027,712  
16,007,040  
32,014,080  
1,024,966,656  
2,048,901,120  
4,110,188,544  
8,195,604,480  
16,391,208,960  
1,986  
3,970  
7,964  
15,880  
16,3833  
16  
63  
2GB  
16  
63  
4GB  
16  
63  
8GB  
16  
63  
16GB  
16  
63  
Notes:  
Display of total bytes varies from operating systems.  
Cylinders, heads or sectors are not applicable for these capacities. Only LBA addressing applies  
Notes: 1 GB = 1,000,000,000 bytes; 1 sector = 512 bytes.  
LBA count addressed in the table above indicates total user storage capacity and will remain the same throughout the lifespan of the  
device. However, the total usable capacity of the SSD is most likely to be less than the total physical capacity because a small portion  
of the capacity is reserved for device maintenance usages.  
4.2 Performance Specification  
Performances of the CF cards are listed in Table 4-2  
Table 4-2: Performance specifications  
Capacity  
128 MB  
256 MB  
512 MB  
1 GB  
2 GB  
4 GB  
8 GB  
16 GB  
Performance  
Sustained  
read (MB/s)  
17  
4
29  
8
19  
7
21  
12  
20  
11  
21  
11  
21  
13  
20  
15  
Sustained  
write (MB/s)  
Notes: performance may vary depending on flash configurations or host system settings.  
6
© 2013 Apacer Technology Inc.  
Rev. 1.1  
Compact Flash series  
AP-CFxxxxE3NR-XXXXXXQ  
4.3 Environmental Specifications  
Environmental specification of the Compact Flash Card series (CFC) follows the MIL-STD-810F  
standards as shown in Table 4-3.  
Table 4-3: Environmental specifications  
Environment  
Specification  
Operation  
Storage  
0°C to 70°C; -40°C to 85°C (Extended Temperature)  
-40°C to 100°C  
Temperature  
Vibration (Non-Operation)  
Shock (Non-Operation)  
Sine wave : 10~2000Hz, 15G (X, Y, Z axes)  
Half sine wave 1,500G (X, Y, Z ; All 6 axes)  
4.5 Endurance  
The endurance of a storage device is predicted by TeraBytes Written based on several factors related to  
usage, such as the amount of data written into the drive, block management conditions, and daily  
workload for the drive. Thus, key factors, such as Write Amplifications and the number of P/E cycles, can  
influence the lifespan of the drive.  
Capacity  
128 MB  
256 MB  
512 MB  
1 GB  
TeraBytes Written  
3.3  
6.7  
12.9  
25.6  
38.4  
51.9  
69.8  
115.0  
2 GB  
4 GB  
8 GB  
16 GB  
Notes:  
The measurement assumes the data written to the SSD for test is under a typical and constant rate.  
The measurement follows the standard metric: 1 TB (Terabyte) = 1000 GB.  
7
© 2013 Apacer Technology Inc.  
Rev. 1.1  
Compact Flash series  
AP-CFxxxxE3NR-XXXXXXQ  
5. Flash Management  
5.1. Advanced wear-leveling algorithms  
Flash memory devices differ from Hard Disk Drives (HDDs) in terms of how blocks are utilized. For HDDs,  
when a change is made to stored data, like erase or update, the controller mechanism on HDDs will  
perform overwrites on blocks. Unlike HDDs, flash blocks cannot be overwritten and each P/E cycle wears  
down the lifespan of blocks gradually. Repeatedly program/erase cycles performed on the same memory  
cells will eventually cause some blocks to age faster than others. This would bring flash storages to their  
end of service term sooner. Wear leveling is an important mechanism that level out the wearing of blocks  
so that the wearing-down of blocks can be almost evenly distributed. This will increase the lifespan of  
SSDs. Commonly used wear leveling types are Static and Dynamic.  
5.2 S.M.A.R.T. technology  
S.M.A.R.T. is an acronym for Self-Monitoring, Analysis and Reporting Technology, an open standard  
allowing disk drives to automatically monitor their own health and report potential problems. It protects the  
user from unscheduled downtime by monitoring and storing critical drive performance and calibration  
parameters. Ideally, this should allow taking proactive actions to prevent impending drive failure. Apacer  
SMART feature adopts the standard SMART command B0h to read data from the drive. When the Apacer  
SMART Utility running on the host, it analyzes and reports the disk status to the host before the device is  
in critical condition.  
5.3 Built-in hardware ECC  
The ATA-Disk Module uses BCH Error Detection Code (EDC) and Error Correction Code (ECC)  
algorithms which correct up to eight random single-bit errors for each 512-byte block of data. High  
performance is fulfilled through hardware-based error detection and correction.  
5.4 Flash block management  
Current production technology is unable to guarantee total reliability of NAND flash memory array. When  
a flash memory device leaves factory, it comes with a minimal number of initial bad blocks during  
production or out-of-factory as there is no currently known technology that produce flash chips free of bad  
blocks. In addition, bad blocks may develop during program/erase cycles. When host performs  
program/erase command on a block, bad block may appear in Status Register. Since bad blocks are  
inevitable, the solution is to keep them in control. Apacer flash devices are programmed with ECC, block  
mapping technique and S.M.A.R.T to reduce invalidity or error. Once bad blocks are detected, data in  
those blocks will be transferred to free blocks and error will be corrected by designated algorithms.  
5.5 Power Failure Management  
Power Failure Management plays a crucial role when experiencing unstable power supply. Power  
disruption may occur when users are storing data into the SSD. In this urgent situation, the controller  
would run multiple write-to-flash cycles to store the metadata for later block rebuilding. This urgent  
operation requires about several milliseconds to get it done. At the next power up, the firmware will  
perform a status tracking to retrieve the mapping table and resume previously programmed NAND blocks  
to check if there is any incompleteness of transmission.  
8
© 2013 Apacer Technology Inc.  
Rev. 1.1  
Compact Flash series  
AP-CFxxxxE3NR-XXXXXXQ  
6. Software Interface  
6.1 Command Set  
Table 6-1 summarizes the command set with the paragraphs that follow describing the individual  
commands and the task file for each.  
Table 6-1: Command set (1 of 2)  
Command  
Check-Power-Mode  
Code  
E5H or 98H  
90H  
Execute-Drive-Diagnostic  
Erase Sector(s)  
Flush-Cache  
C0H  
E7H  
Format Track  
Identify-Drive  
Idle  
50H  
ECH  
E3H or 97H  
E1H or 95H  
91H  
Idle-Immediate  
Initialize-Drive-Parameters  
NOP  
00H  
Read-Buffer  
E4H  
Read-DMA  
C8H or C9H  
C4H  
Read-Multiple  
Read-Sector(s)  
Read-Verify-Sector(s)  
Recalibrate  
20H or 21H  
40H or 41H  
1XH  
Request-Sense  
Seek  
03H  
7XH  
Set-Features  
EFH  
SMART  
B0H  
Set-Multiple-Mode  
Set-Sleep-Mode  
Standby  
C6H  
E6H or 99H  
E2H or 96H  
E0H or 94H  
87H  
Standby-lmmediate  
Translate-Sector  
Write-Buffer  
E8H  
Write-DMA  
CAH or CBH  
C5H  
Write-Multiple  
Write-Multiple-Without-Erase  
CDH  
9
© 2013 Apacer Technology Inc.  
Rev. 1.1  
Compact Flash series  
AP-CFxxxxE3NR-XXXXXXQ  
Write-Sector(s)  
30H or 31H  
38H  
Write-Sector-Without-Erase  
Write-Verify  
3CH  
10  
© 2013 Apacer Technology Inc.  
Rev. 1.1  
Compact Flash series  
AP-CFxxxxE3NR-XXXXXXQ  
7. Electrical Specification  
Caution: Absolute Maximum Stress Ratings – Applied conditions greater than those listed under  
“Absolute Maximum Stress Ratings” may cause permanent damage to the device. This is a stress rating  
only and functional operation of the device at these conditions or conditions greater than those defined in  
the operational sections of this data sheet is not implied. Exposure to absolute maximum stress rating  
conditions may affect device reliability.  
Table 7-1: Operating range  
Standard Operating Temperature  
0°C to +70°C  
Extended Operating Temperature  
Supply voltage  
-40°C to +85°C  
5
4.75-5.25V)  
3.135-3.465V)  
3.3V  
Table 7-2: Absolute maximum power pin stress ratings  
Parameter  
Symbol  
VDD  
Conditions  
Input Power  
-0.3V min. to 6.5V max.  
-0.5V min. to VDD + 0.5V max.  
Voltage on any pin except VDD with respect to GND  
V
Table 7-3: Recommended system power-up timing  
Symbol  
Parameter  
Typical  
200  
Maximum  
Units  
ms  
1
TPU-READY  
Power-up to Ready Operation  
Power-up to Write Operation  
1000  
1000  
1
TPU-WRITE  
200  
ms  
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.  
11  
© 2013 Apacer Technology Inc.  
Rev. 1.1  
Compact Flash series  
AP-CFxxxxE3NR-XXXXXXQ  
8. Physical Characteristics  
8.1 Dimension  
T
ABLE 8-1: Type I CFC physical specification  
36.40 +/- 0.15mm (1.433+/- 0.06 in.)  
42.80 +/- 0.10mm (1.685+/- 0.04 in.)  
3.3mm+/-0.10mm (0.130+/-0.04in.)  
Length:  
Width:  
Thickness (Including Label Area):  
Unit: mm  
F
IGURE 8-1: Physical dimension  
12  
© 2013 Apacer Technology Inc.  
Rev. 1.1  
Compact Flash series  
AP-CFxxxxE3NR-XXXXXXQ  
9. Product Ordering Information  
9.1 Product Code Designations  
A P – C F x x x x E 3 N R – XXXXXX Q  
Firmware  
Specification  
NR: Non-Removable Setting  
NDNR: Non-DMA + Non-Removable  
ETNR: Ext. Temp. + Non-Removable  
ETNDNR: Ext. Temp + Non-DMA + Non-Removable  
RoHS Compliant  
Configuration  
N: Standard  
Controller Type  
CFC Type  
Capacity:  
128M: 128MB  
256M: 256MB  
512M: 512MB  
001G:  
002G:  
004G:  
008G:  
016G:  
1GB  
2GB  
4GB  
8GB  
16GB  
Model Name  
Apacer Product Code  
13  
© 2013 Apacer Technology Inc.  
Rev. 1.1  
Compact Flash series  
AP-CFxxxxE3NR-XXXXXXQ  
9.2 Valid Combinations  
Standard Temperature  
Non-Removable  
Capacity  
128MB  
256MB  
512MB  
1GB  
Model Number  
AP-CF128ME3NR-NRQ  
AP-CF256ME3NR-NRQ  
AP-CF512ME3NR-NRQ  
AP-CF001GE3NR-NRQ  
AP-CF002GE3NR-NRQ  
AP-CF004GE3NR-NRQ  
AP-CF008GE3NR-NRQ  
AP-CF016GE3NR-NRQ  
2GB  
4GB  
8GB  
16GB  
Non-DMA & Non-Removable  
Capacity  
128MB  
256MB  
512MB  
1GB  
Model Number  
AP-CF128ME3NR-NDNRQ  
AP-CF256ME3NR-NDNRQ  
AP-CF512ME3NR-NDNRQ  
AP-CF001GE3NR-NDNRQ  
AP-CF002GE3NR-NDNRQ  
AP-CF004GE3NR-NDNRQ  
AP-CF008GE3NR-NDNRQ  
AP-CF016GE3NR-NDNRQ  
2GB  
4GB  
8GB  
16GB  
14  
© 2013 Apacer Technology Inc.  
Rev. 1.1  
Compact Flash series  
AP-CFxxxxE3NR-XXXXXXQ  
Extended Temperature  
Non-Removable  
Capacity  
128MB  
256MB  
512MB  
1GB  
Model Number  
AP-CF128ME3NR-ETNRQ  
AP-CF256ME3NR-ETNRQ  
AP-CF512ME3NR-ETNRQ  
AP-CF001GE3NR-ETNRQ  
AP-CF002GE3NR-ETNRQ  
AP-CF004GE3NR-ETNRQ  
AP-CF008GE3NR-ETNRQ  
AP-CF016GE3NR-ETNRQ  
2GB  
4GB  
8GB  
16GB  
Non-DMA & Non-Removable  
Capacity  
128MB  
256MB  
512MB  
1GB  
Model Number  
AP-CF128ME3NR-ETNDNRQ  
AP-CF256ME3NR-ETNDNRQ  
AP-CF512ME3NR-ETNDNRQ  
AP-CF001GE3NR-ETNDNRQ  
AP-CF002GE3NR-ETNDNRQ  
AP-CF004GE3NR-ETNDNRQ  
AP-CF008GE3NR-ETNDNRQ  
AP-CF016GE3NR-ETNDNRQ  
2GB  
4GB  
8GB  
16GB  
15  
© 2013 Apacer Technology Inc.  
Rev. 1.1  
Compact Flash series  
AP-CFxxxxE3NR-XXXXXXQ  
Revision History  
Revision  
Date  
Description  
Remark  
1.0  
05/19/2011  
Official release  
Updated performance and product ordering information due  
to change in NAND flash use  
1.1  
08/11/2013  
Updated the address of Taiwan headquarter  
Added endurance TBW section to replace MTBF  
16  
© 2013 Apacer Technology Inc.  
Rev. 1.1  
Compact Flash series  
AP-CFxxxxE3NR-XXXXXXQ  
Global Presence  
Apacer Technology Inc.  
Apacer Technology Inc.  
Taiwan (Headquarters)  
1F., No.32, Zhongcheng Rd., Tucheng Dist.,  
New Taipei City 236, Taiwan R.O.C.  
Tel: 886-2-2267-8000  
Fax: 886-2-2267-2261  
amtsales@apacer.com  
Apacer Memory America, Inc.  
386 Fairview Way, Suite102,  
Milpitas, CA 95035  
Tel: 1-408-518-8699  
Fax: 1-408-935-9611  
sa@apacerus.com  
U.S.A.  
Japan  
Europe  
China  
India  
Apacer Technology Corp.  
5F, Matsura Bldg., Shiba, Minato-Ku  
Tokyo, 105-0014, Japan  
Tel: 81-3-5419-2668  
Fax: 81-3-5419-0018  
jpservices@apacer.com  
Apacer Technology B.V.  
Science Park Eindhoven 5051 5692 EB Son,  
The Netherlands  
Tel: 31-40-267-0000  
Fax: 31-40-267-0000#6199  
sales@apacer.nl  
Apacer Electronic (Shanghai) Co., Ltd  
1301, No.251,Xiaomuqiao Road, Shanghai,  
200032, China  
Tel: 86-21-5529-0222  
Fax: 86-21-5206-6939  
sales@apacer.com.cn  
Apacer Technologies Pvt. Ltd.  
# 535, 1st Floor, 8th cross, JP Nagar 3rd Phase,  
Bangalore – 560078, India  
Tel: 91-80-4152-9061  
sales_india@apacer.com  
17  
© 2013 Apacer Technology Inc.  
Rev. 1.1  
Mouser Electronics  
Authorized Distributor  
Click to View Pricing, Inventory, Delivery & Lifecycle Information:  
Apacer:  
AP-CF004GE3NR-ETNDNRQ AP-CF016GE3NR-NDNRQ AP-CF001GE3NR-ETNDNRQ AP-CF001GE3NR-ETNRQ  
AP-CF001GE3NR-NDNRQ AP-CF008GE3NR-NRQ AP-CF002GE3NR-ETNDNRQ AP-CF008GE3NR-ETNDNRQ  
AP-CF256ME3NR-ETNRQ AP-CF002GE3NR-NRQ AP-CF004GE3NR-NDNRQ AP-CF256ME3NR-NDNRQ AP-  
CF128ME3NR-ETNRQ AP-CF512ME3NR-NRQ AP-CF016GE3NR-ETNRQ AP-CF001GE3NR-NRQ AP-  
CF256ME3NR-ETNDNRQ AP-CF002GE3NR-NDNRQ AP-CF008GE3NR-NDNRQ AP-CF016GE3NR-ETNDNRQ AP-  
CF004GE3NR-NRQ AP-CF128ME3NR-ETNDNRQ AP-CF128ME3NR-NDNRQ AP-CF016GE3NR-NRQ AP-  
CF004GE3NR-ETNRQ AP-CF512ME3NR-ETNRQ AP-CF256ME3NR-NRQ AP-CF512ME3NR-NDNRQ AP-  
CF512ME3NR-ETNDNRQ AP-CF128ME3NR-NRQ AP-CF008GE3NR-ETNRQ AP-CF002GE3NR-ETNRQ  

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