AP-CF001GH4NR-NRQ [ETC]
ATA CF;
| 型号： | AP-CF001GH4NR-NRQ |
| 厂家： | 
ETC |
| 描述： | ATA CF |
| 文件： | 总18页 (文件大小：185K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
RoHS Compliant
ATA CF
Specifications
August 27th, 2013
Version 1.6
Apacer Technology Inc.
1F, No.32, Zhongcheng Rd., Tucheng Dist., New Taipei City, Taiwan, R.O.C
Tel: +886-2-2267-8000 Fax: +886-2-2267-2261
www.apacer.com
ATA CF
AP-CFxxxxH4NR-XXXXXXQ
Features:
ꢀ
Standard ATA/IDE bus interface bus
interface
ꢀ
ꢀ
Temperature ranges
–
Operation:
Standard: 0°C to 70°C
–
–
ATA command set compatible
ATA mode support for up to:
PIO Mode-4
Extended: -40°C to 85°C
Storage: -40°C to 100°C
–
Multiword DMA Mode-2
Ultra DMA Mode-4
Flash management
–
–
–
–
–
Advanced wear-leveling algorithms
ꢀ
ꢀ
Connector Type
50 pins female
S.M.A.R.T. technology
Built-in hardware ECC
Flash block management
Power failure management
–
Power consumption (typical)**
Supply voltage: 3.3V & 5V
–
–
–
Active mode: 80 mA/95 mA (3.3V/5.0V)
Sleep mode: 500 µA/600 µA (3.3V/5.0V)
ꢀ
Endurance (TBW: Terabytes Written)
128 MB: 3.3 TBW
256 MB: 6.7 TBW
–
–
–
–
–
–
–
–
ꢀ
ꢀ
Performance**
Sustained read: up to 29 MB/sec
Sustained write: up to 15 MB/sec
512 MB: 12.9 TBW
1 GB: 25.6 TBW
2 GB: 38.4 TBW
4 GB: 51.9 TBW
8 GB: 69.8 TBW
16 GB: 115.0 TBW
–
–
Capacity
–
128, 256, 512 MB
1, 2, 4, 8, 16 GB
ꢀ
RoHS compliant
ꢀ
ꢀ
NAND Flash Type: SLC
ꢀ
Shock & Vibration**
Shock: 1500G
Vibration: 15G
Physical Dimensions
36.4mm x 42.8mm x 3.3mm
–
–
–
ꢀ
MTBF > 2,000,000 hours
*The values addressed here for performance and power consumption are typical and may vary depending on configurations and
platforms.
**Non-operating
1
© 2013 Apacer Technology Inc.
Rev. 1.6
ATA CF
AP-CFxxxxH4NR-XXXXXXQ
Table of Contents
1. GENERAL DESCRIPTION.................................................................................................... 3
2. FUNCTIONAL BLOCK .......................................................................................................... 3
3. PIN ASSIGNMENTS ............................................................................................................... 4
4. PRODUCT SPECIFICATIONS.............................................................................................. 5
4.1 CAPACITY.............................................................................................................................................................5
4.2 PERFORMANCE .....................................................................................................................................................5
4.3 ENVIRONMENTAL .................................................................................................................................................6
4.4 ENDURANCE ........................................................................................................................................................6
4.5 MEAN TIME BETWEEN FAILURES (MTBF)...........................................................................................................6
5. FLASH MANAGEMENT........................................................................................................ 7
5.1. ADVANCED WEAR
-
LEVELING ALGORITHMS .........................................................................................................7
5.2 S.M.A.R.T. TECHNOLOGY ....................................................................................................................................7
5.3 BUILT IN HARDWARE ECC...................................................................................................................................7
5.4 FLASH BLOCK MANAGEMENT ...............................................................................................................................7
5.5 POWER ANAGEMENT...........................................................................................................................7
-
FAILURE M
6. SOFTWARE INTERFACE.................................................................................................... 8
6.1 COMMAND SET.....................................................................................................................................................8
7. ELECTRICAL SPECIFICATION ...................................................................................... 10
8. PHYSICAL CHARACTERISTICS..................................................................................... 11
8.1 DIMENSION.........................................................................................................................................................11
9. PRODUCT ORDERING INFORMATION........................................................................ 12
9.1 PRODUCT
9.2 VALID
CODE DESIGNATIONS .........................................................................................................................12
C
OMBINATIONS.......................................................................................................................................13
2
© 2013 Apacer Technology Inc.
Rev. 1.6
ATA CF
AP-CFxxxxH4NR-XXXXXXQ
1. General Description
Apacer’s ATA CF offers reliable and high performance storage compatible with CF Type I and Type II
devices. Unlike the ordinary cards, Apacer ATA CF provides solid compatibilities for use in Point of Sale
(POS) terminals, telecom, IP-STB, medical instruments, surveillance systems, industrial PCs and
handheld applications.
With featuring technologies as wear leveling, S.M.A.R.T, built-in hardware ECC, flash block management,
and power failure management, the ATA CF is the ideal embedded storage for mission oriented
applications.
2. Functional Block
The ATA CF includes a controller and flash media, as well as the ATA CF standard interface. Figure 2-1
shows the functional block diagram.
Flash Array
Flash
Media
Flash
Media
ATA CF
Controller
ATA CF
Interface
Flash
Media
Flash
Media
Figure 2-1: Functional block diagram
3
© 2013 Apacer Technology Inc.
Rev. 1.6
ATA CF
AP-CFxxxxH4NR-XXXXXXQ
3. Pin Assignments
Table 3-1 lists the pin assignments with respective signal names for the 50-pin configuration. A “#” suffix
indicates the active low signal. The pin type can be input, output or input/output.
Table 3-1: Pin assignments
True IDE mode
True IDE mode
Pin No.
Pin No.
Signal name Pin I/O type
Signal name Pin I/O type
1
GND
D3
D4
D5
D6
-
I/O
I/O
I/O
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
#CD1
D11
D12
D13
D14
D15
#CE2
#VS1
#IORD
#IOWR
VCC
O
I/O
I/O
I/O
I/O
I/O
I
2
3
4
5
6
I/O
I/O
D7
7
8
9
#CE1
GND
GND
GND
GND
GND
VCC
GND
GND
GND
GND
A2
I
-
-
O
I
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
-
-
I
-
-
-
-
-
-
INTRQ
VCC
O
-
#CSEL
#WP_PD*
RESET
IORDY
DMARQ**
DMACK**
#DASP
#PDIAG
D8
I
I
I
-
I
O
O
I
I/O
I/O
I/O
I/O
I/O
-
A1
A0
D0
D1
I
I
I/O
I/O
I/O
O
O
D2
#IOCS16
#CD2
D9
D10
GND
*Write-Protect enabled when pin 40 assigned to GND.
**Connection required when UDMA is in use.
4
© 2013 Apacer Technology Inc.
Rev. 1.6
ATA CF
AP-CFxxxxH4NR-XXXXXXQ
4. Product Specifications
4.1 Capacity
Capacity specification of the ATA CF series is available as shown in Table 4-1. It lists the specific
capacity and the default numbers of heads, sectors and cylinders for each product line.
Table 4-1: Capacity specifications
Capacity
128 MB
256 MB
512 MB
1GB
Total bytes
128,057,344
Cylinders
977
Heads
8
Sectors
32
Max LBA
250,112
256,901,120
980
16
32
501,760
512,483,328
993
16
63
1,000,944
2,001,888
4,000,752
8,000,496
15,628,032
31,252,032
1,024,966,656
2,048,385,024
4,096,253,952
8,001,552,384
16,001,040,384
1986
16
63
2GB
3969
16
63
4GB
7937
16
63
8GB
15504
16383*
16
63
16GB
16
63
Notes:
Display of total bytes varies from operating systems.
Cylinders, heads or sectors are not applicable for these capacities. Only LBA addressing applies
Notes: 1 GB = 1,000,000,000 bytes; 1 sector = 512 bytes.
LBA count addressed in the table above indicates total user storage capacity and will remain the same throughout the lifespan of the
device. However, the total usable capacity of the SSD is most likely to be less than the total physical capacity because a small portion
of the capacity is reserved for device maintenance usages.
4.2 Performance
Performances of the CF cards are listed in Table 4-2
Table 4-2: Performance specifications
Capacity
128 MB
256 MB
512 MB
1 GB
2 GB
4 GB
8 GB
16 GB
Performance
Sustained
read (MB/s)
17
4
29
8
19
7
21
12
20
11
21
11
21
13
20
15
Sustained
write (MB/s)
Notes: performance may vary depending on flash configurations or host system settings.
5
© 2013 Apacer Technology Inc.
Rev. 1.6
ATA CF
AP-CFxxxxH4NR-XXXXXXQ
4.3 Environmental
Environmental specification of the ATA CF follows the MIL-STD-810F standards as shown in Table 4-4.
Table 4-3: Environmental specifications
Environment
Specification
Operation
Storage
0°C to 70°C; -40°C to 85°C (Extended Temperature)
-40°C to 100°C
Temperature
Vibration (Non-Operation)
Shock (Non-Operation)
Sine wave : 10~2000Hz, 15G (X, Y, Z axes)
Half sine wave 1,500G (X, Y, Z ; All 6 axes)
4.4 Endurance
The endurance of a storage device is predicted by TeraBytes Written based on several factors related to
usage, such as the amount of data written into the drive, block management conditions, and daily
workload for the drive. Thus, key factors, such as Write Amplifications and the number of P/E cycles, can
influence the lifespan of the drive.
Capacity
128 MB
256 MB
512 MB
1 GB
TeraBytes Written
3.3
6.7
12.9
25.6
38.4
51.9
69.8
115.0
2 GB
4 GB
8 GB
16 GB
Notes:
ꢁ
ꢁ
The measurement assumes the data written to the SSD for test is under a typical and constant rate.
The measurement follows the standard metric: 1 TB (Terabyte) = 1000 GB.
4.5 Mean Time Between Failures (MTBF)
Mean Time Between Failures (MTBF) is predicted based on reliability data for the individual components
in our drive device. Although many component of MTBF are given in databases and often these values
are not really accurate, the prediction result for this unit more than 2,000,000 hours for its SLC flash
configuration
Notes about the MTBF:
The MTBF is predicated and calculated based on “Telcordia Technologies Special Report, SR-332, Issue
2” method.
6
© 2013 Apacer Technology Inc.
Rev. 1.6
ATA CF
AP-CFxxxxH4NR-XXXXXXQ
5. Flash Management
5.1. Advanced wear-leveling algorithms
Flash memory devices differ from Hard Disk Drives (HDDs) in terms of how blocks are utilized. For HDDs,
when a change is made to stored data, like erase or update, the controller mechanism on HDDs will
perform overwrites on blocks. Unlike HDDs, flash blocks cannot be overwritten and each P/E cycle wears
down the lifespan of blocks gradually. Repeatedly program/erase cycles performed on the same memory
cells will eventually cause some blocks to age faster than others. This would bring flash storages to their
end of service term sooner. Wear leveling is an important mechanism that level out the wearing of blocks
so that the wearing-down of blocks can be almost evenly distributed. This will increase the lifespan of
SSDs. Commonly used wear leveling types are Static and Dynamic.
5.2 S.M.A.R.T. technology
S.M.A.R.T. is an acronym for Self-Monitoring, Analysis and Reporting Technology, an open standard
allowing disk drives to automatically monitor their own health and report potential problems. It protects the
user from unscheduled downtime by monitoring and storing critical drive performance and calibration
parameters. Ideally, this should allow taking proactive actions to prevent impending drive failure. Apacer
SMART feature adopts the standard SMART command B0h to read data from the drive. When the Apacer
SMART Utility running on the host, it analyzes and reports the disk status to the host before the device is
in critical condition.
5.3 Built-in hardware ECC
The ATA-Disk Module uses BCH Error Detection Code (EDC) and Error Correction Code (ECC)
algorithms which correct up to eight random single-bit errors for each 512-byte block of data. High
performance is fulfilled through hardware-based error detection and correction.
5.4 Flash block management
Current production technology is unable to guarantee total reliability of NAND flash memory array. When
a flash memory device leaves factory, it comes with a minimal number of initial bad blocks during
production or out-of-factory as there is no currently known technology that produce flash chips free of bad
blocks. In addition, bad blocks may develop during program/erase cycles. When host performs
program/erase command on a block, bad block may appear in Status Register. Since bad blocks are
inevitable, the solution is to keep them in control. Apacer flash devices are programmed with ECC, block
mapping technique and S.M.A.R.T to reduce invalidity or error. Once bad blocks are detected, data in
those blocks will be transferred to free blocks and error will be corrected by designated algorithms.
5.5 Power Failure Management
Power Failure Management plays a crucial role when experiencing unstable power supply. Power
disruption may occur when users are storing data into the SSD. In this urgent situation, the controller
would run multiple write-to-flash cycles to store the metadata for later block rebuilding. This urgent
operation requires about several milliseconds to get it done. At the next power up, the firmware will
perform a status tracking to retrieve the mapping table and resume previously programmed NAND blocks
to check if there is any incompleteness of transmission.
7
© 2013 Apacer Technology Inc.
Rev. 1.6
ATA CF
AP-CFxxxxH4NR-XXXXXXQ
6. Software Interface
6.1 Command Set
Table 6-1 summarizes the command set with the paragraphs that follow describing the individual
commands and the task file for each.
Table 6-1: Command set (1 of 2)
Command
Check-Power-Mode
Code
E5H or 98H
90H
Execute-Drive-Diagnostic
Erase Sector(s)
Flush-Cache
C0H
E7H
Format Track
50H
Identify-Drive
ECH
Idle
E3H or 97H
E1H or 95H
91H
Idle-Immediate
Initialize-Drive-Parameters
NOP
00H
Read-Buffer
E4H
Read-DMA
C8H or C9H
C4H
Read-Multiple
Read-Sector(s)
Read-Verify-Sector(s)
Recalibrate
20H or 21H
40H or 41H
1XH
Request-Sense
Security-Disable-Password
Security-Erase-Prepare
Security-Erase-Unit
Security-Freeze-Lock
Security-Set-Password
Security-Unlock
Seek
03H
F6H
F3H
F4H
F5H
F1H
F2H
7XH
Set-Features
EFH
8
© 2013 Apacer Technology Inc.
Rev. 1.6
ATA CF
AP-CFxxxxH4NR-XXXXXXQ
Table 6-1: Command set (2 of 2)
Command
Code
B0H
SMART
Set-Multiple-Mode
Set-Sleep-Mode
Standby
C6H
E6H or 99H
E2H or 96H
E0H or 94H
87H
Standby-lmmediate
Translate-Sector
Write-Buffer
E8H
Write-DMA
CAH or CBH
C5H
Write-Multiple
Write-Multiple-Without-Erase
Write-Sector(s)
Write-Sector-Without-Erase
Write-Verify
CDH
30H or 31H
38H
3CH
9
© 2013 Apacer Technology Inc.
Rev. 1.6
ATA CF
AP-CFxxxxH4NR-XXXXXXQ
7. Electrical Specification
Caution: Absolute Maximum Stress Ratings – Applied conditions greater than those listed under
“Absolute Maximum Stress Ratings” may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these conditions or conditions greater than those defined in
the operational sections of this data sheet is not implied. Exposure to absolute maximum stress rating
conditions may affect device reliability.
Table 7-1: Operating range
Operating Temperature
Supply voltage
0°C to +70°C
-40°C to +85°C
5
4.75-5.25V)
3.135-3.465V)
3.3V
Table 7-2: Absolute maximum power pin stress ratings
Parameter
Symbol
VDD
Conditions
Input Power
-0.3V min. to 6.5V max.
-0.5V min. to VDD + 0.5V max.
Voltage on any pin except VDD with respect to GND
V
Table 7-3: Recommended system power-up timing
Symbol
Parameter
Typical
200
Maximum
Units
ms
TPU-READY
*
Power-up to Ready Operation
Power-up to Write Operation
1000
1000
TPU-WRITE
*
200
ms
*This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
10
© 2013 Apacer Technology Inc.
Rev. 1.6
ATA CF
AP-CFxxxxH4NR-XXXXXXQ
8. Physical Characteristics
8.1 Dimension
T
ABLE 8-1: Type I CFC physical specification
36.40 +/- 0.15mm (1.433+/- 0.06 in.)
42.80 +/- 0.10mm (1.685+/- 0.04 in.)
3.3mm+/-0.10mm (0.130+/-0.04in.)
Length:
Width:
Thickness (Including Label Area):
Unit: mm
F
IGURE 8-1: Physical dimension
11
© 2013 Apacer Technology Inc.
Rev. 1.6
ATA CF
AP-CFxxxxH4NR-XXXXXXQ
9. Product Ordering Information
9.1 Product Code Designations
A P – C F x x x x H 4 X R – XXXXXX Q
FW Version
Specification
NR: Non-Removable Setting
NDNR: Non-DMA + Non-Removable
ETNR: Ext. Temp. + Non-Removable
ETNDNR: Ext. Temp + Non-DMA + Non-Removable
RoHS Compliant
Configuration
N: Standard
Controller Type
CFC Type
Capacity:
128M: 128MB
256M: 256MB
512M: 512MB
001G:
002G:
004G:
008G:
016G:
1GB
2GB
4GB
8GB
16GB
Model Name
Apacer Product Code
12
© 2013 Apacer Technology Inc.
Rev. 1.6
ATA CF
AP-CFxxxxH4NR-XXXXXXQ
9.2 Valid Combinations
Standard Temperature
Non-Removable
Capacity
Model Number
128MB AP-CF128MH4NR-NRQ
256MB AP-CF256MH4NR-NRQ
512MB AP-CF512MH4NR-NRQ
1GB
2GB
4GB
8GB
AP-CF001GH4NR-NRQ
AP-CF002GH4NR-NRQ
AP-CF004GH4NR-NRQ
AP-CF008GH4NR-NRQ
16GB AP-CF016GH4NR-NRQ
Non-DMA & Non-Removable
Capacity
Model Number
128MB AP-CF128MH4NR-NDNRQ
256MB AP-CF256MH4NR-NDNRQ
512MB AP-CF512MH4NR-NDNRQ
1GB
2GB
4GB
8GB
AP-CF001GH4NR-NDNRQ
AP-CF002GH4NR-NDNRQ
AP-CF004GH4NR-NDNRQ
AP-CF008GH4NR-NDNRQ
16GB AP-CF016GH4NR-NDNRQ
13
© 2013 Apacer Technology Inc.
Rev. 1.6
ATA CF
AP-CFxxxxH4NR-XXXXXXQ
Extended Temperature
Non-Removable
Capacity
Model Number
128MB AP-CF128MH4NR-ETNRQ
256MB AP-CF256MH4NR-ETNRQ
512MB AP-CF512MH4NR-ETNRQ
1GB AP-CF001GH4NR-ETNRQ
2GB AP-CF002GH4NR-ETNRQ
4GB AP-CF004GH4NR-ETNRQ
8GB AP-CF008GH4NR-ETNRQ
16GB AP-CF016GH4NR-ETNRQ
Non-DMA & Non-Removable
Capacity
Model Number
128MB AP-CF128MH4NR-ETNDNRQ
256MB AP-CF256MH4NR-ETNDNRQ
512MB AP-CF512MH4NR-ETNDNRQ
1GB AP-CF001GH4NR-ETNDNRQ
2GB AP-CF002GH4NR-ETNDNRQ
4GB AP-CF004GH4NR-ETNDNRQ
8GB AP-CF008GH4NR-ETNDNRQ
16GB AP-CF016GH4NR-ETNDNRQ
14
© 2013 Apacer Technology Inc.
Rev. 1.6
ATA CF
AP-CFxxxxH4NR-XXXXXXQ
Revision History
Revision
0.1
Date
Description
Remark
02/16/2009
02/18/2009
02/23/2009
03/06/2009
04/01/2009
01/06/2010
Preliminary
0.2
Updated pin assignments
Official release
1.0
1.1
Product name changed
Updated feature and valid combination wording
Corrected valid combinations
1.2
1.3
Updated Performance Specification & Product Ordering
Information
1.4
1.5
1.6
03/22/2011
03/22/2012 Updated performance information
Updated performance information due to change in flash
configurations
08/27/2013
15
© 2013 Apacer Technology Inc.
Rev. 1.6
ATA CF
AP-CFxxxxH4NR-XXXXXXQ
Global Presence
Apacer Technology Inc.
Apacer Technology Inc.
Taiwan (Headquarters)
1F., No.32, Zhongcheng Rd., Tucheng Dist.,
New Taipei City 236, Taiwan R.O.C.
Tel: 886-2-2267-8000
Fax: 886-2-2267-2261
amtsales@apacer.com
Apacer Memory America, Inc.
386 Fairview Way, Suite102,
Milpitas, CA 95035
Tel: 1-408-518-8699
Fax: 1-408-935-9611
sa@apacerus.com
U.S.A.
Japan
Europe
China
India
Apacer Technology Corp.
5F, Matsura Bldg., Shiba, Minato-Ku
Tokyo, 105-0014, Japan
Tel: 81-3-5419-2668
Fax: 81-3-5419-0018
jpservices@apacer.com
Apacer Technology B.V.
Science Park Eindhoven 5051 5692 EB Son,
The Netherlands
Tel: 31-40-267-0000
Fax: 31-40-267-0000#6199
sales@apacer.nl
Apacer Electronic (Shanghai) Co., Ltd
1301, No.251,Xiaomuqiao Road, Shanghai,
200032, China
Tel: 86-21-5529-0222
Fax: 86-21-5206-6939
sales@apacer.com.cn
Apacer Technologies Pvt. Ltd.
# 535, 1st Floor, 8th cross, JP Nagar 3rd Phase,
Bangalore – 560078, India
Tel: 91-80-4152-9061
sales_india@apacer.com
16
© 2013 Apacer Technology Inc.
Rev. 1.6
Mouser Electronics
Authorized Distributor
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AP-CF128MH4NR-NDNRQ AP-CF002GH4NR-NDNRQ AP-CF512MH4NR-NRQ AP-CF004GH4NR-NDNRQ AP-
CF256MH4NR-NRQ AP-CF512MH4NR-NDNRQ AP-CF004GH4NR-NRQ AP-CF016GH4NR-NDNRQ AP-
CF002GH4NR-NRQ AP-CF001GH4NR-NRQ AP-CF128MH4NR-NRQ AP-CF016GH4NR-NRQ AP-CF008GH4NR-
NDNRQ AP-CF008GH4NR-NRQ AP-CF001GH4NR-NDNRQ AP-CF256MH4NR-NDNRQ
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