AP919 [ETC]
iphone音箱方案 ; iphone音箱方案
| 型号： | AP919 |
| 厂家： | 
ETC |
| 描述： | iphone音箱方案
|
| 文件： | 总12页 (文件大小：214K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AP919
OTP Microcontroller with LCD Driver and
Digital Tuning System for Docking Application
AP919
OTP Microcontroller with LCD Driver
and
Digital Tuning System for
Docking Application
Datasheet
Revision 0.6
May 15, 2008
AP919
OTP Microcontroller with LCD Driver and
Digital Tuning System for Docking Application
Table of Contents
1. OVERVIEW................................................................................................................................................................1
2. APPLICATIONS ........................................................................................................................................................1
2.1.
2.2.
2.2.1
2.2.2
2.2.3
2.2.4
T
A
ARGET
A
PPLICATIONS ...................................................................................................................................................... 1
EATURES..................................................................................................................................................... 1
EATURES....................................................................................................................................... 1
EATURES...................................................................................................................................... 1
EATURES ........................................................................................................................................................... 1
EATURES............................................................................................................................................ 1
PPLICATION F
C
D
R
LOCK AND
OCKING
ADIO
THER
A
LARM
F
F
C
ONTROL
F
S
O
YSTEM
F
3. ORDERING INFORMATION .....................................................................................................................................1
4. PIN CONFIGURATION..............................................................................................................................................1
5. BLOCK DIAGRAM ....................................................................................................................................................2
6. BUILT IN PERIPHERALS .........................................................................................................................................2
7. PIN DESCRIPTION ...................................................................................................................................................3
8. ELECTRICAL SPECIFICATION ...............................................................................................................................5
8.1.
8.2.
8.3.
A
R
L
BSOLUTE
ECOMMENDED
EAKAGE URRENT AND C
M
AXIMUM
R
ATING............................................................................................................................................. 5
ONDITION........................................................................................................................... 5
APACITANCE............................................................................................................................. 5
CHARACTERISTICS .................................................................................................................................. 5
O
PERATING C
C
8.4. DC ELECTRICAL
9. BONDING AND PACKAGE INFORMATION............................................................................................................6
9.1.
9.2.
R
EFERENCE COB LAYOUT
I
NFORMATION ......................................................................................................................... 6
PACKAGE
INFORMATION ..................................................................................................................................................... 7
10. SOLDERING INDICATION........................................................................................................................................8
1.
2.
3.
4.
R
W
M
S
EFLOW
AVE
ANUAL
UITABILITY OF
S
OLDERING.......................................................................................................................................................... 8
OLDERING .............................................................................................................................................................. 8
OLDERING .......................................................................................................................................................... 8
S
S
SURFACE
MOUNT IC PACKAGES FOR
W
AVE AND
R
EFLOW
SOLDERING
METHODS ............................... 9
Revision 0.6
May 15, 2008
AP919
OTP Microcontroller with LCD Driver and
Digital Tuning System for Docking Application
1. OVERVIEW
2.2.2 Docking Control Features
The AP919 is a controller IC for docking application
with remote control function and LCD driver. It has a
built-in PLL controller for controlling external radio
tuner IC to form a complete digital tuning system (DTS).
AP919 also supports real time clock with 12/24 hour
display format and dual alarm clock timer. Built-in with
LCD driver and support for docking system of
prevalent music players and mobile phones, AP919 is
suitable for a wide range of audio applications that
have build-in clock alarm, radio and docking features.
•
•
Docking control through front panel buttons or
remote controller
PLAY, PAUSE, STOP, FAST FORWARD, FAST
BACKWARD, RANDOM, REPEAT functions
Device charging through docking system
Support Apple Authentication Coprocessor
•
•
2.2.3 Radio Features
•
•
Auto/Manual radio station scanning
Programmable radio station memory ( independent
memory slots for FM and AM )
2. APPLICATIONS
2.1. Target Applications
•
•
Docking System
Clock Radio
2.2.4 Other System Features
•
Support 24 segment x 4 common or 6 common,
1/3 bias LCD display
2.2. Application Features
•
•
Automatic detection of AC power
Low standby current
2.2.1 Clock and Alarm Features
•
•
•
12/24 hour clock display mode selectable by user
Dual alarm clocks
User selectable alarm mode – wake-to-buzzer,
wake-to-radio or wake-to-docked_device
Fixed snooze feature
3. ORDERING INFORMATION
ORDERING NUMBER
PINS
PACKAGE
Bare Dice
LQFP
AP919-DC-L
100
AP919-LQ-L
100
•
•
Programmable sleep timer
4. PIN CONFIGURATION
P90 / SPIDIO
P91 / SPICLK
1
2
75
P71 / SEG18
P72 / SEG19
P73 / SEG20
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
50
49
P11
/ BOUT1
74 P70 / SEG17
P10 / TONE
3
4
5
6
7
8
9
73
P92 / SPIDI / AST0
P63 / SEG16
P80
P81
/
/
SEG21
SEG22
48 P113 / I2CDAT2
47 P112 / I2CCLK2
46 ADCIO5
P93 / AST1
RSTB
72
71
70
69
68
P62 / SEG15
P61 / SEG14
P60 / SEG13
P53 / SEG12
P52 / SEG11
P82 / SEG23
P83 / SEG24
VLCD2
PWRDET
AVDD
ADCIO4
45
44 ADCIO3
VLCD1
VLCD
ACIN
ADCIO2
43
PLLFLT
AGND
ADCIO1
ADCIO0
W2
P133
P132 / TONE
42
41
40
39
38
37
67 P51
/
SEG10
GND 10
OSCI 11
OSCO 12
VDD 13
VPP 14
66
65
64
63
62
61
60
P50
GND
/ SEG9
P120 / TX1
AP919
P121
/
RX1
P43
P42
/
SEG8
SEG7
P122 / BOUT1
P123
TESTB3
/
W3
36 TESTB2
35 DTSPLLFLT
34 GND
Dice Form
P41 / SEG6
P40 / SEG5
P33 / SEG4
PGM
P130 15
P131 16
WDTEN 17
W0 18
ATONE
VDD
XOSCO
33 IFIN
59
58
57
56
55
54
53
P32 / SEG3
P31 / SEG2
P30 / SEG1
AMIN
32
XOSCI
31 FMIN
19
GND
W1
30
VDD
29 P103
28
TESTB0 / EMU_SCLR
/
/
/
/
PWMO
BOUT0
RX0
P00 / I2CCLK0 20
P01 / I2CDAT0 21
P02 / PWMO 22
P23 / COM1
TESTB1 / EMU_SDI
P102
27 P101
P100
P22 / COM2
P21 / COM3
P20 / COM4
EMU_SCLK 99
EMU_SDO 100
26
TX0
23
P03 / REMO
P110 / RCK 24
P111 / RCD
52
51
P13
P12
/
/
COM5
COM6
/
/
RX1
TX1
25
Figure 1 100-Pin LQFP Package of AP919
Figure 2 Dice Form of AP919
Revision 0.6
Page 1 of 10
May 15, 2008
AP919
OTP Microcontroller with LCD Driver and
Digital Tuning System for Docking Application
5. BLOCK DIAGRAM
The following diagram shows the system blocks embedded in AP919.
Figure 3 Internal Block Diagram of AP919
6. BUILT IN PERIPHERALS
•
High performance 8 bit CPU
•
External interrupt
o
Support C language programming
o
4 channels
•
•
•
32 kbyte one time program ROM
1.5 kbyte data RAM
Interrupt Controller
•
•
IR remote control unit
Buzzer unit
o
output level control available
o
10 priority levels
•
•
Rotary type switch counter unit
UART interface
•
•
•
•
Watchdog reset
o
2 units
Real time clock
Embedded RC oscillator
Programmable timer
•
•
•
I2C interface
o
SPI interface
o
2 channels
1 channel
o
LCD driver
o
2 units
•
Selectable oscillator option
24 segment x 4 common or 6
common, 1/3 bias LCD display
o
o
o
XOSC : low speed 32.768kHz / 75kHz crystal
OSC : high speed 3.6864 MHz crystal
RCOSC: medium speed 1MHz
internal RC oscillator
•
•
DTS PLL unit
6-bit ADC
o
6 channels
•
AC line frequency detection unit
Revision 0.6
Page 2 of 10
May 15, 2008
AP919
OTP Microcontroller with LCD Driver and
Digital Tuning System for Docking Application
7. PIN DESCRIPTION
Pin
Name
Alternative
Function
Type
Drive
(mA)
Pullup
/down
Reset
State
Descriptions
1
2
P90
P91
SPIDIO
SPICLK
IO,S
IO,S
2
2
PU
PU
Z
Z
General purpose IO port / SPI data IO
General purpose IO port / SPI clock IO
General purpose IO port / SPI data input / Auto-
strobe output 0
General purpose IO port / Auto-strobe output 1
Active low chip reset input
Low-voltage detect
Analog supply voltage
PLL filter
Analog ground
3
P92
SPIDI / AST0
AST1
IO,S
2
2
PU
Z
Z
4
5
6
7
8
9
P93
RSTB
PWRDET
AVDD
PLLFLT
AGND
GND
IO,S
I,S
IA
PU
U
OA
10
11
12
13
14
15
16
17
18
19
20
21
22
23
Ground
OSCI
OSCO
VDD
I
O
3.6864MHz oscillator input
3.6864MHz oscillator output
Power supply
Power supply
General purpose IO port pin
General purpose IO port pin
Watchdog enable ( active high)
MCU external interrupt input pin
MCU external interrupt input pin
General purpose IO port / I2C0 clock output
General purpose IO port / I2C0 data IO port
General purpose IO port / PWMO
General purpose IO port / Remote receiver input
General purpose IO port or rotary switch counter
input
VPP
P130
P131
WDTEN
W0
W1
P00
P01
P02
P03
IO,S
IO,S
I,S
I,S
I,S
IO,S
IO,S
IO,S
IO,S
2
2
PU
PU
U
PU
PU
PU
PU
PU
PU
Z
Z
I2CCLK0
I2CDAT0
PWMO
2
2
2
2
Z
Z
Z
Z
REMO
24
25
P110
P111
RCK
RCD
IO,S
IO,S
2
2
PU
PU
Z
Z
General purpose IO port or rotary switch counter
input
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
P100
P101
P102
P103
VDD
FMIN
AMIN
IFIN
GND
TX0
RX0
BOUT0
PWMO
IO,S
IO,S
IO,S
IO,S
2
2
2
2
PU
PU
PU
PU
Z
Z
Z
Z
General purpose IO port or UART0 TX output
General purpose IO port or UART0 RX input
General purpose IO port or UART0 clock output
General purpose IO port pin / PWM output
Power supply
FM input clock
AM input clock
IF input clock
ground
DTS PLL control voltage output
Active low chip test enable
Active low chip test enable
General purpose IO port pin / buzzer
General purpose IO port pin
MCU external interrupt input pin
ADC input channel 0 / General purpose IO port
ADC input channel 1 / General purpose IO port
ADC input channel 2 / General purpose IO port
ADC input channel 3 / General purpose IO port
ADC input channel 4 / General purpose IO port
ADC input channel 5 / General purpose IO port
General purpose IO port pin / I2C1 clock output
General purpose IO port pin / I2C1 data IO
General purpose IO port pin / buzzer output
General purpose IO port pin / UART1 clock *Note
General purpose IO port / LCD common 6 / UART1
TX *Note
IA
IA
IA
DTSPLLFLT
TESTB2
TESTB3
P132
OA
I,S
I,S
IO,S
IO,S
I,S
IO,S
IO,S
IO,S
IO,S
IO,S
IO,S
IO,S
IO,S
IO,S
IO,S
U
U
PU
PU
PU
TONE
2
2
Z
Z
P133
W2
ADCIO0
ADCIO1
ADCIO2
ADCIO3
ADCIO4
ADCIO5
P112
P113
P10
P11
2
2
2
2
2
2
2
2
2
2
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
I2CCLK1
I2CDAT1
TONE
PU
PU
PU
PU
BOUT1
51
52
P12
P13
COM6 / TX1
COM5 / RX1
IO,S,L
IO,S,L
2
2
PU
PU
Z
Z
General purpose IO port / LCD common 5 / UART1
RX *Note
53
54
55
56
57
P20
P21
P22
P23
P30
COM4
COM3
COM2
COM1
SEG1
IO,S,L
IO,S,L
IO,S,L
IO,S,L
IO,S,L
2
2
2
2
2
PU
PU
PU
PU
PU
Z
Z
Z
Z
Z
General purpose IO port / LCD common 4
General purpose IO port / LCD common 3
General purpose IO port / LCD common 2
General purpose IO port / LCD common 1
General purpose IO port / LCD segment 1
Revision 0.6
Page 3 of 10
May 15, 2008
AP919
OTP Microcontroller with LCD Driver and
Digital Tuning System for Docking Application
Pin
Name
Alternative
Function
Type
Drive
(mA)
Pullup
/down
Reset
State
Descriptions
58
59
60
61
62
63
64
65
P31
P32
P33
P40
P41
P42
P43
GND
SEG2
SEG3
SEG4
SEG5
SEG6
SEG7
SEG8
IO,S,L
IO,S,L
IO,S,L
IO,S,L
IO,S,L
IO,S,L
IO,S,L
2
2
2
2
2
2
2
PU
PU
PU
PU
PU
PU
PU
Z
Z
Z
Z
Z
Z
Z
General purpose IO port / LCD segment 2
General purpose IO port / LCD segment 3
General purpose IO port / LCD segment 4
General purpose IO port / LCD segment 5
General purpose IO port / LCD segment 6
General purpose IO port / LCD segment 7
General purpose IO port / LCD segment 8
Ground
General purpose IO port / LCD segment 9/ 8-bit MPU
interface
General purpose IO port / LCD segment 10 / 8-bit
MPU interface
General purpose IO port / LCD segment 11 / 8-bit
MPU interface
General purpose IO port / LCD segment 12 / 8-bit
MPU interface
General purpose IO port / LCD segment 13 / 8-bit
MPU interface
General purpose IO port / LCD segment 14 / 8-bit
MPU interface
General purpose IO port / LCD segment 15 / 8-bit
MPU interface
General purpose IO port / LCD segment 16 / 8-bit
MPU interface
General purpose IO port / LCD segment 17 / 8-bit
MPU interface
General purpose IO port / LCD segment 18 / 8-bit
MPU interface
General purpose IO port / LCD segment 19 / 8-bit
MPU interface
General purpose IO port / LCD segment 20 / 8-bit
MPU interface
66
67
68
69
70
71
72
73
74
75
76
77
P50
P51
P52
P53
P60
P61
P62
P63
P70
P71
P72
P73
SEG9 / LCDD0
SEG10 / LCDD1
SEG11 / LCDD2
SEG12 / LCDD3
SEG13 / LCDD4
SEG14 / LCDD5
SEG15 / LCDD6
SEG16 / LCDD7
IO,S,L
IO,S,L
IO,S,L
IO,S,L
IO,S,L
IO,S,L
IO,S,L
IO,S,L
IO,S,L
IO,S,L
IO,S,L
IO,S,L
2
2
2
2
2
2
2
2
2
2
2
2
PU
PU
PU
PU
PU
PU
PU
PU
PU
PU
PU
PU
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
SEG17 /
LCDWRB
SEG18 / LCDRDB
SEG19 / LCDA0
SEG20 / LCDCSB
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
P80
P81
P82
SEG21
SEG22
SEG23
SEG24
IO,S,L
IO,S,L
IO,S,L
IO,S,L
2
2
2
2
PU
PU
PU
PU
Z
Z
Z
Z
General purpose IO port / LCD segment 21
General purpose IO port / LCD segment 22
General purpose IO port / LCD segment 23
General purpose IO port / LCD segment 24
1/3 x VLCD voltage
2/3 x VLCD voltage
LCD driver supply voltage
AC detection input
P83
VLCD2
VLCD1
VLCD
ACIN
P120
P121
P122
P123
W3
TEST4
ATONE
VDD
XOSCO
XOSCI
GND
TESTB0
TESTB1
TEST5
TESTOUT1
I,S
IO,S,L
IO,S,L
IO,S,L
IO,S,L
I,S
U
TX1
RX1
BOUT1
2
2
2
2
PU
PU
PU
PU
PU
D
Z
Z
Z
Z
General purpose IO port / UART1 TX
*Note
General purpose IO port / UART1 RX
*Note
General purpose IO port / UART1 clock output
*Note
General purpose IO port
MCU external interrupt input pin
Active high chip test enable
Buzzer output with level control
Power supply
32.768kHz / 75kHz oscillator output
32.768kHz / 75kHz oscillator input
Ground
Active low chip test enable
Active low chip test enable
Active high chip test enable
Chip test output
I,S
OA
O
I
I,S
I,S
I,S
O
U
U
D
2
0
I
O
IO
IA
OA
- Input pin
- Output pin
- Bidirectional pin
- Analog input pin
- Analog output pin
S
(P)U
(P)D
L
- CMOS Schmitt Trigger
- (Programmable) Pull-up
- (Programmable) Pull-down
- LCD Pad
0,1,Z - Logic state 0, Logic state 1,High impedance
*Note:
Depending on the UART1 control register’s content, either P12[2:0] or P1[3:1] can be used as the UART1 ports.
Revision 0.6 Page 4 of 10 May 15, 2008
AP919
OTP Microcontroller with LCD Driver and
Digital Tuning System for Docking Application
8. ELECTRICAL SPECIFICATION
8.1. Absolute Maximum Rating
Item
Symbol
Rating
Unit
Power Supply Voltage (logic)
Power Supply Voltage (analog)
Power Supply Voltage (LCD)
Input Voltage
Power Dissipation (Ta = 70°C)
Storage Temperature
VDD
AVDD
VLCD/VLCD1/VLCD2
-0.5 to 6.0
-0.5 to 6.0
-0.5 to 6.0
-0.5 to VDD+0.5
TBD
V
V
V
VIN
Pd
TSTG
Topr
V
mW
°C
°C
-20 to 125
0 to 70
Operating Temperature
8.2. Recommended Operating Condition
Item
Symbol
Min.
Typ.
Max.
Unit
Power Supply Voltage (logic)
Power Supply Voltage (analog)
Power Supply Voltage (LCD)
VDD
AVDD
VLCD
VLCD1
VLCD2
VIN
3.0
3.0
-
3.6
3.6
V
V
V
-
-
-
-
-
-
VDD
VLCD
VLCD1
VDD
VDD
70
VLCD2
0
0
0
0
Input Voltage (digital)
Input Voltage (analog)
Operating Temperature
V
V
°C
VIN
TOPR
8.3. Leakage Current and Capacitance
Symbol Parameter
Condition
Min.
Typ. Max.
Unit
IIN
IOZ
CIN
CIN
CBID
Input current
No pull-up or pull-down
-10
-10
±1
±1
3.0
3.0
3.0
10
10
ꢁA
ꢁA
pF
pF
pF
Tri-state leakage current
Input capacitance *Note1
Output capacitance *Note1
Bidirectional buffer capacitance *Note1
*Note1: capacitance value are specified without the package
8.4. DC Electrical Characteristics
(VDD=3.3V±10%, AVDD=3.3V±10%, operating temperature = 0°C - 70°C unless specified otherwise)
Symbol Parameter
Condition
Min.
Typ.
Max.
Unit
VDD
Supply Voltage (logic)
Core operating mode
Clock mode
3.0
2.4
-
3.6
3.6
V
AVDD
Supply Voltage (analog)
Core operating mode
Clock mode
3.0
2.4
-
3.6
3.6
V
VIH
VIL
RPU
RPD
VINA
IOL
Input high voltage
Input low voltage
Pull-up resistance
Pull-down resistance
FMIN,AMIN,IFIN input voltage
Output low current
Output high current
Core operating current
0.7*VDD
-
-
-
-
V
V
Ω
0.3*VDD
75k
VIN = 0V
VIN = VDD
30k
30k
150
45k
45k
75k
Ω
mVpp
mA
mA
mA
ꢁA
VOL = 0.4V
VOH = VDD-0.4V
*Note2
2.8
2.5
7
IOH
Idd_opr
10
100
Idd_idle Clock Mode current
80
VDD=3.3V, T=25°C *Note3
*Note2: LCD is ON. The CPU clock source is from the 3.6864 MHz oscillator pads. No active load is being
driven. All inputs = 0V or VDD.
*Note3: LCD is ON. The CPU clock source is from the 75 kHz oscillator pads. No active load is being driven. All
inputs = 0V or VDD.
Revision 0.6
Page 5 of 10
May 15, 2008
AP919
OTP Microcontroller with LCD Driver and
Digital Tuning System for Docking Application
9. BONDING AND PACKAGE INFORMATION
9.1. Reference COB Layout Information
Libraries of reference COB PCB layout and dice connection layout are available upon request.
Revision 0.6
Page 6 of 10
May 15, 2008
AP919
OTP Microcontroller with LCD Driver and
Digital Tuning System for Docking Application
9.2. Package Information
Revision 0.6
Page 7 of 10
May 15, 2008
AP919
OTP Microcontroller with LCD Driver and
Digital Tuning System for Docking Application
10.SOLDERING INDICATION
This section gives a very brief insight to a complex technology. There is no soldering method that is ideal for all
surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for
fine pitch SMDs. In these situations reflow soldering is recommended.
1. Reflow Soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stenciling or pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from 215 to 250°C. The top-surface temperature of the packages should
preferable be kept below 220 °C for thick/large packages, and below 235 °C for small/thin packages.
2. Wave Soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically developed.
If wave soldering is used, the following conditions must be observed for optimal results:
ꢀ
ꢀ
Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth
laminar wave.
For packages with leads on two sides and a pitch:
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction
of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-
circuit board.
The footprint must incorporate solder thieves at the downstream end.
ꢀ
For packages with leads on four sides, the footprint must be placed at a 45angle to the transport direction of the
printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time is 4 seconds at 250°C.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
3. Manual Soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron
applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C.
When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and
320 °C.
Revision 0.6
Page 8 of 10
May 15, 2008
AP919
OTP Microcontroller with LCD Driver and
Digital Tuning System for Docking Application
4. Suitability of Surface Mount IC Packages for Wave and Reflow Soldering Methods
Soldering Method
Wave
Not suitable (2)
Package
Reflow (1)
Suitable
BGA, HBGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS
PLCC (3), SO, SOJ
Not suitable
Suitable
Suitable
Suitable
Suitable
Suitable
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
Not recommended (3)(4)
Not recommended (5)
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks
may occur due to vaporization of the moisture in them (the so called popcorn effect).
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at
bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, the package must be placed at a 45angle to the solder wave direction. The package
footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch equal to or larger than 0.8 mm; it is
definitely not suitable for packages with a pitch equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch equal to or smaller than 0.5 mm.
Revision 0.6
Page 9 of 10
May 15, 2008
AP919
OTP Microcontroller with LCD Driver and
Digital Tuning System for Docking Application
Valence Semiconductor Design Limited
Unit 2001, 20/F, APEC Plaza,
49 Hoi Yuen Road, Kwun Tong, Hong Kong
Tel: (852) 2797 3288
Fax: (852) 2776 7770
Email: inquiry@valencetech.com
Website: http://www.valencetech.com
IMPORTANT NOTICE
“Preliminary” product information describes products that are in production, but for which full characterization data is not yet available. ValenceTech Ltd. and its affiliates (“Valence”) believe that the
information contained in this document is accurate and reliable. However, the information is subject to change without notice and is provided “AS IS” without warranty of any kind (express or implied).
Customers are advised to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the
terms and conditions of sale supplied at the time of order acknowledgment, including those pertaining to warranty, patent infringement, and limitation of liability. No responsibility is assumed by
Valence for the use of this information, including use of this information as the basis for manufacture or sale of any items, or for infringement of patents or other rights of third parties. This document
is the property of Valence and by furnishing this information, Valence grants no license, express or implied under any patents, mask work rights, copyrights, trademarks, trade secrets or other
intellectual property rights. Valence owns the copyrights associated with the information contained herein and gives consent for copies to be made of the information only for use within your
organization with respect to Valence integrated circuits or other products of Valence. This consent does not extend to other copying such as copying for general distribution, advertising or
promotional purposes, or for creating any work for resale. An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies
described in this material and controlled under the “Foreign Exchange and Foreign Trade Law” is to be exported or taken out of Japan. An export license and /or quota needs to be obtained from the
competent authorities of the Chinese Government if any of the products or technologies described in this material is subject to the PRC Foreign Trade Law and is to be exported or taken out of the
PRC. CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR
ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). VALENCE PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN AIRCRAFT SYSTEMS, MILITARY
APPLICATIONS, PRODUCTS SURGICALLY IMPLANTED INTO THE BODY, LIFE SUPPORT PRODUCTS OR OTHER CRITICAL APPLICATIONS (INCLUDING MEDICAL DEVICES, AIRCRAFT
SYSTEMS OR COMPONENTS AND PERSONAL OR AUTOMOTIVE SAFETY OR SECURITY DEVICES). INCLUSION OF VALENCE PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD
TO BE FULLY AT THE CUSTOMER’S RISK AND VALENCE DISCLAIMS AND MAKES NO WARRANTY, EXPRESS, STATUTORY OR IMPLIED, INCLUDING THE IMPLIED WARRANTIES OF
MERCHANTABILITY AND FITNESS FOR PARTICULAR PURPOSE, WITH REGARD TO ANY VALENCE PRODUCT THAT IS USED IN SUCH
A MANNER. IF THE CUSTOMER OR
CUSTOMER’S CUSTOMER USES OR PERMITS THE USE OF VALENCE PRODUCTS IN CRITICAL APPLICATIONS, CUSTOMER AGREES, BY SUCH USE, TO FULLY INDEMNIFY VALENCE,
ITS OFFICERS, DIRECTORS, EMPLOYEES, DISTRIBUTORS AND OTHER AGENTS FROM ANY AND ALL LIABILITY, INCLUDING ATTORNEYS’ FEES AND COSTS, THAT MAY RESULT
FROM OR ARISE IN CONNECTION WITH THESE USES.
Revision 0.6
Page 10 of 10
May 15, 2008
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