AT29LV040A-20JC [ETC]

EEPROM|FLASH|512KX8|CMOS|LDCC|32PIN|PLASTIC ;
AT29LV040A-20JC
型号: AT29LV040A-20JC
厂家: ETC    ETC
描述:

EEPROM|FLASH|512KX8|CMOS|LDCC|32PIN|PLASTIC

内存集成电路 异步传输模式 ATM 可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器
文件: 总15页 (文件大小:219K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Features  
Single Voltage, Range 3V to 3.6V Supply  
3-volt Only Read and Write Operation  
Software Protected Programming  
Fast Read Access Time - 150 ns  
Low Power Dissipation  
– 15 mA Active Current  
– 40 µA CMOS Standby Current  
Sector Program Operation  
– Single Cycle Reprogram (Erase and Program)  
– 2048 Sectors (256 Bytes/Sector)  
4-megabit  
(512K x 8)  
3-volt Only  
256-byte Sector  
Flash Memory  
– Internal Address and Data Latches for 256 Bytes  
Two 16K Bytes Boot Blocks with Lockout  
Fast Sector Program Cycle Time - 20 ms Max.  
Internal Program Control and Timer  
DATA Polling for End of Program Detection  
Typical Endurance > 10,000 Cycles  
CMOS and TTL Compatible Inputs and Outputs  
Commercial and Industrial Temperature Ranges  
Description  
The AT29LV040A is a 3-volt only in-system Flash Programmable and Erasable Read  
Only Memory (PEROM). Its 4 megabits of memory is organized as 524,288 words by  
8 bits. Manufactured with Atmel’s advanced nonvolatile CMOS EEPROM technology,  
the device offers access times to 150 ns, and a low 54 mW power dissipation. When  
the device is deselected, the CMOS standby current is less than 40 µA. The device  
endurance is such that any sector can typically be written to in excess of 10,000 times.  
The programming algorithm is compatible with other devices in Atmel’s 3-volt only  
Flash memories.  
AT29LV040A  
Pin Configurations  
TSOP Top View  
Pin Name  
A0 - A18  
CE  
Function  
Type 1  
Addresses  
A11  
A9  
1
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
OE  
2
A10  
CE  
Chip Enable  
Output Enable  
Write Enable  
Data Inputs/Outputs  
No Connect  
A8  
3
A13  
A14  
A17  
WE  
VCC  
A18  
A16  
A15  
A12  
A7  
4
I/O7  
I/O6  
I/O5  
I/O4  
I/O3  
GND  
I/O2  
I/O1  
I/O0  
A0  
OE  
5
6
WE  
7
8
I/O0 - I/O7  
NC  
9
10  
11  
12  
13  
14  
15  
16  
A6  
A1  
PLCC Top View  
A5  
A2  
A4  
A3  
A7  
A6  
A5  
A4  
A3  
5
6
7
8
9
29 A14  
28 A13  
27 A8  
26 A9  
25 A11  
24 OE  
23 A10  
22 CE  
21 I/O7  
A2 10  
A1 11  
A0 12  
I/O0 13  
Rev. 0334F–FLASH–05/02  
To allow for simple in-system reprogrammability, the AT29LV040A does not require high input  
voltages for programming. Three-volt-only commands determine the operation of the device.  
Reading data out of the device is similar to reading from an EPROM. Reprogramming the  
AT29LV040A is performed on a sector basis; 256 bytes of data are loaded into the device and  
then simultaneously programmed.  
During a reprogram cycle, the address locations and 256 bytes of data are captured at micro-  
processor speed and internally latched, freeing the address and data bus for other operations.  
Following the initiation of a program cycle, the device will automatically erase the sector and  
then program the latched data using an internal control timer. The end of a program cycle can  
be detected by DATA polling of I/O7. Once the end of a program cycle has been detected, a  
new access for a read or program can begin.  
Block Diagram  
Device  
Operation  
READ: The AT29LV040A is accessed like an EPROM. When CE and OE are low and WE is  
high, the data stored at the memory location determined by the address pins is asserted on  
the outputs. The outputs are put in the high impedance state whenever CE or OE is high. This  
dual-line control gives designers flexibility in preventing bus contention.  
SOFTWARE DATA PROTECTION PROGRAMMING: The AT29LV040A has 2048 individual  
sectors, each 256 bytes. Using the software data protection feature, byte loads are used to  
enter the 256 bytes of a sector to be programmed. The AT29LV040A can only be programmed  
or reprogrammed using the software data protection feature. The device is programmed on a  
sector basis. If a byte of data within the sector is to be changed, data for the entire 256-byte  
sector must be loaded into the device. The AT29LV040A automatically does a sector erase  
prior to loading the data into the sector. An erase command is not required.  
Software data protection protects the device from inadvertent programming. A series of three  
program commands to specific addresses with specific data must be presented to the device  
before programming may occur. The same three program commands must begin each pro-  
gram operation. All software program commands must obey the sector program timing  
specifications. Power transitions will not reset the software data protection feature, however  
the software feature will guard against inadvertent program cycles during power transitions.  
Any attempt to write to the device without the 3-byte command sequence will start the internal  
write timers. No data will be written to the device; however, for the duration of tWC, a read oper-  
ation will effectively be a polling operation.  
After the software data protections 3-byte command code is given, a byte load is performed  
by applying a low pulse on the WE or CE input with CE or WE low (respectively) and OE high.  
The address is latched on the falling edge of CE or WE, whichever occurs last. The data is  
latched by the first rising edge of CE or WE.  
2
AT29LV040A  
0334FFLASH05/02  
AT29LV040A  
The 256 bytes of data must be loaded into each sector. Any byte that is not loaded during the  
programming of its sector will be erased to read FFH. Once the bytes of a sector are loaded  
into the device, they are simultaneously programmed during the internal programming period.  
After the first data byte has been loaded into the device, successive bytes are entered in the  
same manner. Each new byte to be programmed must have its high-to-low transition on WE  
(or CE) within 150 µs of the low-to-high transition of WE (or CE) of the preceding byte. If a  
high-to-low transition is not detected within 150 µs of the last low-to-high transition, the load  
period will end and the internal programming period will start. A8 to A18 specify the sector  
address. The sector address must be valid during each high-to-low transition of WE (or CE).  
A0 to A7 specify the byte address within the sector. The bytes may be loaded in any order;  
sequential loading is not required. Once a programming operation has been initiated, and for  
the duration of tWC, a read operation will effectively be a polling operation.  
HARDWARE DATA PROTECTION: Hardware features protect against inadvertent pro-  
grams to the AT29LV040A in the following ways: (a) VCC sense if VCC is below 1.8V (typical),  
the program function is inhibited; (b) VCC power on delay once VCC has reached the VCC  
sense level, the device will automatically time out 10 ms (typical) before programming; (c) Pro-  
gram inhibit holding any one of OE low, CE high or WE high inhibits program cycles; and  
(d) Noise filter pulses of less than 15 ns (typical) on the WE or CE inputs will not initiate a  
program cycle.  
INPUT LEVELS: While operating with a 3.3V 10% power supply, the address inputs and  
control inputs (OE, CE and WE) may be driven from 0 to 5.5V without adversely affecting the  
operation of the device. The I/O lines can only be driven from 0 to 3.6V.  
PRODUCT IDENTIFICATION: The product identification mode identifies the device and  
manufacturer as Atmel. It may be accessed by hardware or software operation. The hardware  
operation mode can be used by an external programmer to identify the correct programming  
algorithm for the Atmel product. In addition, users may wish to use the software product identi-  
fication mode to identify the part (i.e., using the device code), and have the system software  
use the appropriate sector size for program operations. In this manner, the user can have a  
common board design for 256K to 4-megabit densities and, with each densitys sector size in  
a memory map, have the system software apply the appropriate sector size.  
For details, see Operating Modes (for hardware operation) or Software Product Identification.  
The manufacturer and device code is the same for both modes.  
DATA POLLING: The AT29LV040A features DATA polling to indicate the end of a program  
cycle. During a program cycle an attempted read of the last byte loaded will result in the com-  
plement of the loaded data on I/O7. Once the program cycle has been completed, true data is  
valid on all outputs and the next cycle may begin. DATA polling may begin at any time during  
the program cycle.  
TOGGLE BIT: In addition to DATA polling the AT29LV040A provides another method for  
determining the end of a program or erase cycle. During a program or erase operation, suc-  
cessive attempts to read data from the device will result in I/O6 toggling between one and  
zero. Once the program cycle has completed, I/O6 will stop toggling and valid data will be  
read. Examining the toggle bit may begin at any time during a program cycle.  
OPTIONAL CHIP ERASE MODE: The entire device can be erased by using a 6-byte soft-  
ware code. Please see Software Chip Erase application note for details.  
BOOT BLOCK PROGRAMMING LOCKOUT: The AT29LV040A has two designated mem-  
ory blocks that have a programming lockout feature. This feature prevents programming of  
data in the designated block once the feature has been enabled. Each of these blocks con-  
sists of 16K bytes; the programming lockout feature can be set independently for either block.  
While the lockout feature does not have to be activated, it can be activated for either or both  
blocks.  
3
0334FFLASH05/02  
These two 16K memory sections are referred to as boot blocks. Secure code which will bring  
up a system can be contained in a boot block. The AT29LV040A blocks are located in the first  
16K bytes of memory and the last 16K bytes of memory. The boot block programming lockout  
feature can therefore support systems that boot from the lower addresses of memory or the  
higher addresses. Once the programming lockout feature has been activated, the data in that  
block can no longer be erased or programmed; data in other memory locations can still be  
changed through the regular programming methods. To activate the lockout feature, a series  
of seven program commands to specific addresses with specific data must be performed.  
Please see Boot Block Lockout Feature Enable Algorithm.  
If the boot block lockout feature has been activated on either block, the chip erase function will  
be disabled.  
BOOT BLOCK LOCKOUT DETECTION: A software method is available to determine  
whether programming of either boot block section is locked out. See Software Product Identifi-  
cation Entry and Exit sections. When the device is in the software product identification mode,  
a read from location 00002H will show if programming the lower address boot block is locked  
out while reading location.  
7FFF2H will do so for the upper boot block. If the data is FE, the corresponding block can be  
programmed; if the data is FF, the program lockout feature has been activated and the corre-  
sponding block cannot be programmed. The software product identification exit mode should  
be used to return to standard operation.  
Absolute Maximum Ratings*  
Temperature Under Bias................................ -55°C to +125°C  
*NOTICE:  
Stresses beyond those listed under Absolute  
Maximum Ratingsmay cause permanent dam-  
age to the device. This is a stress rating only and  
functional operation of the device at these or any  
other conditions beyond those indicated in the  
operational sections of this specification is not  
implied. Exposure to absolute maximum rating  
conditions for extended periods may affect  
device reliability.  
Storage Temperature..................................... -65°C to +150°C  
All Input Voltages (Including NC Pins)  
with Respect to Ground ...................................-0.6V to +6.25V  
All Output Voltages  
with Respect to Ground .............................-0.6V to VCC + 0.6V  
Voltage on A9 (Including NC Pins)  
with Respect to Ground ...................................-0.6V to +13.5V  
4
AT29LV040A  
0334FFLASH05/02  
AT29LV040A  
DC and AC Operating Range  
AT29LV040A-15  
0°C - 70°C  
AT29LV040A-20  
0°C - 70°C  
AT29LV040A-25  
0°C - 70°C  
Operating  
Temperature (Case)  
Com.  
Ind.  
-40°C - 85°C  
3.3V 0.3V  
-40°C - 85°C  
3.3V 0.3V  
-40°C - 85°C  
3.3V 0.3V  
V
CC Power Supply(1)  
Notes: 1. After power is applied and VCC is at the minimum specified datasheet value, the system should wait 20 ms before an opera-  
tional mode is started.  
2.  
Not recommended for New Designs.  
Operating Modes  
Mode  
CE  
VIL  
VIL  
VIH  
X
OE  
VIL  
VIH  
X(1)  
X
WE  
VIH  
VIL  
X
Ai  
Ai  
Ai  
X
I/O  
Read  
DOUT  
DIN  
Program(2)  
Standby/Write Inhibit  
Program Inhibit  
Program Inhibit  
Output Disable  
Product Identification  
Hardware  
High Z  
VIH  
X
X
VIL  
VIH  
X
X
High Z  
VIL  
VIL  
VIH  
A1 - A18 = VIL, A9 = VH(3), A0 = VIL  
A1 - A18 = VIL, A9 = VH(3), A0 = VIH  
A0 = VI  
Manufacturer Code(4)  
Device Code(4)  
Software(5)  
Manufacturer Code(4)  
Device Code(4)  
A0 = VIH  
Notes: 1. X can be VIL or VIH.  
2. Refer to AC Programming Waveforms.  
3. VH = 12.0V 0.5V.  
4. Manufacturer Code: 1F, Device Code: C4.  
5. See details under Software Product Identification Entry/Exit.  
DC Characteristics  
Symbol  
Parameter  
Condition  
Min  
Max  
1
Units  
µA  
µA  
µA  
µA  
mA  
mA  
V
ILI  
Input Load Current  
Output Leakage Current  
VCC Standby Current CMOS  
VIN = 0V to VCC  
VI/O = 0V to VCC  
CE = VCC - 0.3V to VCC  
ILO  
1
ISB1  
Com.  
Ind.  
40  
50  
1
ISB2  
ICC  
VCC Standby Current TTL  
VCC Active Current  
Input Low Voltage  
CE = 2.0V to VCC  
f = 5 MHz; IOUT = 0 mA; VCC = 3.6V  
15  
0.6  
VIL  
VIH  
VOL  
VOH  
Input High Voltage  
Output Low Voltage  
Output High Voltage  
2.0  
2.4  
V
IOL = 1.6 mA; VCC = 3.0V  
.45  
V
IOH = -100 µA; VCC = 3.0V  
V
5
0334FFLASH05/02  
AC Read Characteristics  
AT29LV040A-15  
AT29LV040A-20  
AT29LV040A-25  
Symbol  
Parameter  
Min  
Max  
150  
150  
50  
Min  
Max  
200  
200  
100  
50  
Min  
Max  
250  
250  
120  
60  
Units  
ns  
tACC  
Address to Output Delay  
CE to Output Delay  
OE to Output Delay  
CE or OE to Output Float  
(1)  
tCE  
ns  
(2)  
tOE  
0
0
0
0
0
0
0
0
0
ns  
(3)(4)  
tDF  
30  
ns  
tOH  
Output Hold from OE, CE or Address,  
Whichever Occurred First  
ns  
Note:  
Not recommended for New Designs.  
AC Read Waveforms(1)(2)(3)(4)  
Notes: 1. CE may be delayed up to tACC - tCE after the address transition without impact on tACC  
2. OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE or by tACC - tOE after an address change  
without impact on tACC  
.
.
3. tDF is specified from OE or CE whichever occurs first (CL = 5 pF).  
4. This parameter is characterized and is not 100% tested.  
6
AT29LV040A  
0334FFLASH05/02  
AT29LV040A  
Input Test Waveforms and Measurement Level  
tR, tF < 5 ns  
Output Test Load  
Pin Capacitance  
f = 1 MHz, T = 25°C(1)  
Symbol  
CIN  
Typ  
4
Max  
6
Units  
pF  
Conditions  
VIN = 0V  
COUT  
8
12  
pF  
VOUT = 0V  
Note:  
1. These parameters are characterized and not 100% tested.  
7
0334FFLASH05/02  
AC Byte Load Characteristics  
Symbol  
Parameter  
Min  
10  
Max  
Units  
ns  
tAS, tOES  
Address, OE Set-up Time  
Address Hold Time  
tAH  
tCS  
tCH  
tWP  
tDS  
100  
0
ns  
Chip Select Set-up Time  
Chip Select Hold Time  
Write Pulse Width (WE or CE)  
Data Set-up Time  
ns  
0
ns  
200  
100  
10  
ns  
ns  
tDH, tOEH  
Data, OE Hold Time  
Write Pulse Width High  
ns  
tWPH  
200  
ns  
AC Byte Load Waveforms(1)(2)  
WE Controlled  
CE Controlled  
Notes: 1. The 3-byte address and data commands shown on the next page must be applied prior to byte loads.  
2. A complete sector (256 bytes) should be loaded using these waveforms shown in these byte load waveform diagrams.  
8
AT29LV040A  
0334FFLASH05/02  
AT29LV040A  
Program Cycle Characteristics  
Symbol  
Parameter  
Min  
Max  
Units  
ms  
ns  
tWC  
Write Cycle Time  
Address Set-up Time  
Address Hold Time  
Data Set-up Time  
Data Hold Time  
20  
tAS  
10  
100  
100  
10  
tAH  
ns  
tDS  
ns  
tDH  
ns  
tWP  
Write Pulse Width  
Byte Load Cycle Time  
Write Pulse Width High  
200  
ns  
tBLC  
tWPH  
150  
µs  
200  
ns  
Software Protected Program Waveform  
Notes: 1. OE must be high when WE and CE are both low.  
2. A8 through A18 must specify the sector address during each high-to-low transition of WE (or CE) after the software code  
has been entered.  
3. All words that are not loaded within the sector being programmed will be indeterminate.  
Programming Algorithm(1)  
LOAD DATA AA  
TO  
ADDRESS 5555  
LOAD DATA 55  
TO  
ADDRESS 2AAA  
Notes: 1. Data Format: I/O7 - I/O0 (Hex);  
Address Format: A14 - A0 (Hex).  
2. Data Protect state will be re-activated at  
end of program cycle.  
3. 256 bytes of data MUST BE loaded.  
LOAD DATA A0  
TO  
ADDRESS 5555  
WRITES ENABLED  
ENTER DATA  
LOAD DATA  
TO  
SECTOR (256 BYTES)(3) PROTECT STATE(2)  
9
0334FFLASH05/02  
Data Polling Characteristics(1)  
Symbol  
Parameter  
Min  
10  
Typ  
Max  
Units  
ns  
tDH  
Data Hold Time  
tOEH  
tOE  
OE Hold Time  
10  
ns  
OE to Output Delay(2)  
Write Recovery Time  
ns  
tWR  
0
ns  
Notes: 1. These parameters are characterized and not 100% tested.  
2. See tOE spec in AC Read Characteristics.  
Data Polling Waveforms  
Toggle Bit Characteristics(1)  
Symbol  
Parameter  
Min  
10  
Typ  
Max  
Units  
ns  
tDH  
Data Hold Time  
tOEH  
tOE  
tOEHP  
tWR  
OE Hold Time  
10  
ns  
OE to Output Delay(2)  
OE High Pulse  
ns  
150  
0
ns  
Write Recovery Time  
ns  
Notes: 1. These parameters are characterized and not 100% tested.  
2. See tOE spec in AC Read Characteristics.  
Toggling Bit Waveforms(1)(3)  
Notes: 1. Toggling either OE or CE or both OE and CE will operate toggle bit.  
2. Beginning and ending state of I/O6 will vary.  
3. Any address location may be used by the address should not vary.  
10  
AT29LV040A  
0334FFLASH05/02  
AT29LV040A  
Software Product Identification Entry(1)  
Boot Block Lockout  
Feature Enable Algorithm(1)  
LOAD DATA AA  
TO  
LOAD DATA AA  
ADDRESS 5555  
TO  
ADDRESS 5555  
LOAD DATA 55  
TO  
LOAD DATA 55  
TO  
ADDRESS 2AAA  
ADDRESS 2AAA  
LOAD DATA 90  
TO  
LOAD DATA 80  
TO  
ADDRESS 5555  
ADDRESS 5555  
PAUSE 20 mS  
ENTER PRODUCT  
IDENTIFICATION  
MODE(2)(3)(5)  
LOAD DATA AA  
TO  
ADDRESS 5555  
Software Product Identification Exit(1)  
LOAD DATA 55  
TO  
LOAD DATA AA  
ADDRESS 2AAA  
TO  
ADDRESS 5555  
LOAD DATA 40  
TO  
LOAD DATA 55  
TO  
ADDRESS 5555  
ADDRESS 2AAA  
LOAD DATA 00  
TO  
ADDRESS 00000H(2)  
LOAD DATA FF  
TO  
LOAD DATA F0  
TO  
ADDRESS FFFFFH(3)  
ADDRESS 5555  
PAUSE 20 mS  
PAUSE 20 mS  
PAUSE 20 mS  
EXIT PRODUCT  
IDENTIFICATION  
MODE(4)  
Notes: 1. Data Format: I/O7 - I/O0 (Hex);  
Address Format: A14 - A0 (Hex).  
Notes: 1. Data Format: I/O7 - I/O0 (Hex);  
Address Format: A14 - A0 (Hex).  
2. Lockout feature set on lower address boot block.  
3. Lockout feature set on higher address boot block.  
2. A1 - A18 = VIL.  
Manufacturer Code is read for A0 = VIL;  
Device Code is read for A0 = VIH.  
3. The device does not remain in identification mode if  
powered down.  
4. The device returns to standard operation mode.  
5. Manufacturer Code is 1F. The Device Code is C4.  
11  
0334FFLASH05/02  
Ordering Information  
I
Active  
15  
CC (mA)  
tACC  
(ns)  
Standby  
Ordering Code  
Package  
Operation Range  
150  
200  
250  
0.04  
0.05  
0.04  
0.05  
0.04  
0.05  
AT29LV040A-15TC  
AT29LV040A-15JC  
32T  
32J  
Commercial  
(0° to 70°C)  
15  
15  
15  
15  
15  
AT29LV040A-15TI  
AT29LV040A-15JI  
32T  
32J  
Industrial  
(-40° to 85°C)  
AT29LV040A-20TC  
AT29LV040A-20JC  
32T  
32J  
Commercial  
(0° to 70°C)  
AT29LV040A-20TI  
AT29LV040A-20JI  
32T  
32J  
Industrial  
(-40° to 85°C)  
AT29LV040A-25TC  
AT29LV040A-25JC  
32T  
32J  
Commercial  
(0° to 70°C)  
AT29LV040A-25TI  
AT29LV040A-25JI  
32T  
32J  
Industrial  
(-40° to 85°C)  
Note:  
Not recommended for New Designs.  
Package Type  
32J  
32T  
32-lead, Plastic J-leaded Chip Carrier (PLCC)  
32-lead, Thin Small Outline Package (TSOP)  
12  
AT29LV040A  
0334FFLASH05/02  
AT29LV040A  
Packaging Information  
32J – PLCC  
1.14(0.045) X 45˚  
PIN NO. 1  
IDENTIFIER  
1.14(0.045) X 45˚  
0.318(0.0125)  
0.191(0.0075)  
E2  
E1  
E
B1  
B
e
A2  
A1  
D1  
D
A
0.51(0.020)MAX  
45˚ MAX (3X)  
COMMON DIMENSIONS  
(Unit of Measure = mm)  
MIN  
3.175  
1.524  
0.381  
12.319  
11.354  
9.906  
14.859  
13.894  
12.471  
0.660  
0.330  
MAX  
3.556  
2.413  
NOM  
NOTE  
SYMBOL  
A
D2  
A1  
A2  
D
12.573  
D1  
D2  
E
11.506 Note 2  
10.922  
Notes:  
1. This package conforms to JEDEC reference MS-016, Variation AE.  
2. Dimensions D1 and E1 do not include mold protrusion.  
Allowable protrusion is .010"(0.254 mm) per side. Dimension D1  
and E1 include mold mismatch and are measured at the extreme  
material condition at the upper or lower parting line.  
15.113  
E1  
E2  
B
14.046 Note 2  
13.487  
0.813  
3. Lead coplanarity is 0.004" (0.102 mm) maximum.  
B1  
e
0.533  
1.270 TYP  
10/04/01  
TITLE  
DRAWING NO.  
REV.  
2325 Orchard Parkway  
San Jose, CA 95131  
32J, 32-lead, Plastic J-leaded Chip Carrier (PLCC)  
32J  
B
R
13  
0334FFLASH05/02  
32T TSOP  
PIN 1  
0º ~ 8º  
c
Pin 1 Identifier  
D1  
D
L
b
L1  
e
A2  
E
GAGE PLANE  
A
SEATING PLANE  
COMMON DIMENSIONS  
(Unit of Measure = mm)  
A1  
MIN  
MAX  
1.20  
0.15  
1.05  
20.20  
NOM  
NOTE  
SYMBOL  
A
A1  
A2  
D
0.05  
0.95  
19.80  
18.30  
7.90  
0.50  
1.00  
Notes:  
1. This package conforms to JEDEC reference MO-142, Variation BD.  
2. Dimensions D1 and E do not include mold protrusion. Allowable  
protrusion on E is 0.15 mm per side and on D1 is 0.25 mm per side.  
3. Lead coplanarity is 0.10 mm maximum.  
20.00  
18.40  
8.00  
D1  
E
18.50 Note 2  
8.10  
0.70  
Note 2  
L
0.60  
L1  
b
0.25 BASIC  
0.22  
0.17  
0.10  
0.27  
0.21  
c
e
0.50 BASIC  
10/18/01  
DRAWING NO. REV.  
32T  
TITLE  
2325 Orchard Parkway  
San Jose, CA 95131  
32T, 32-lead (8 x 20 mm Package) Plastic Thin Small Outline  
Package, Type I (TSOP)  
B
R
14  
AT29LV040A  
0334FFLASH05/02  
Atmel Headquarters  
Atmel Operations  
Corporate Headquarters  
2325 Orchard Parkway  
San Jose, CA 95131  
TEL 1(408) 441-0311  
FAX 1(408) 487-2600  
Memory  
RF/Automotive  
Theresienstrasse 2  
Postfach 3535  
74025 Heilbronn, Germany  
TEL (49) 71-31-67-0  
FAX (49) 71-31-67-2340  
2325 Orchard Parkway  
San Jose, CA 95131  
TEL 1(408) 441-0311  
FAX 1(408) 436-4314  
Europe  
Atmel Sarl  
Route des Arsenaux 41  
Case Postale 80  
CH-1705 Fribourg  
Switzerland  
Microcontrollers  
2325 Orchard Parkway  
San Jose, CA 95131  
TEL 1(408) 441-0311  
FAX 1(408) 436-4314  
1150 East Cheyenne Mtn. Blvd.  
Colorado Springs, CO 80906  
TEL 1(719) 576-3300  
FAX 1(719) 540-1759  
Biometrics/Imaging/Hi-Rel MPU/  
High Speed Converters/RF Datacom  
Avenue de Rochepleine  
TEL (41) 26-426-5555  
FAX (41) 26-426-5500  
La Chantrerie  
BP 70602  
44306 Nantes Cedex 3, France  
TEL (33) 2-40-18-18-18  
FAX (33) 2-40-18-19-60  
Asia  
Room 1219  
Chinachem Golden Plaza  
77 Mody Road Tsimshatsui  
East Kowloon  
BP 123  
38521 Saint-Egreve Cedex, France  
TEL (33) 4-76-58-30-00  
FAX (33) 4-76-58-34-80  
ASIC/ASSP/Smart Cards  
Zone Industrielle  
Hong Kong  
TEL (852) 2721-9778  
FAX (852) 2722-1369  
13106 Rousset Cedex, France  
TEL (33) 4-42-53-60-00  
FAX (33) 4-42-53-60-01  
Japan  
1150 East Cheyenne Mtn. Blvd.  
Colorado Springs, CO 80906  
TEL 1(719) 576-3300  
9F, Tonetsu Shinkawa Bldg.  
1-24-8 Shinkawa  
Chuo-ku, Tokyo 104-0033  
Japan  
FAX 1(719) 540-1759  
TEL (81) 3-3523-3551  
FAX (81) 3-3523-7581  
Scottish Enterprise Technology Park  
Maxwell Building  
East Kilbride G75 0QR, Scotland  
TEL (44) 1355-803-000  
FAX (44) 1355-242-743  
e-mail  
literature@atmel.com  
Web Site  
http://www.atmel.com  
© Atmel Corporation 2002.  
Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Companys standard warranty  
which is detailed in Atmels Terms and Conditions located on the Companys web site. The Company assumes no responsibility for any errors  
which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does  
not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Atmel are granted  
by the Company in connection with the sale of Atmel products, expressly or by implication. Atmels products are not authorized for use as critical  
components in life support devices or systems.  
ATMEL® is the registered trademark of Atmel.  
Other terms and product names may be the trademarks of others.  
Printed on recycled paper.  
0334FFLASH05/02  
xM  

相关型号:

AT29LV040A-20JI

x8 Flash EEPROM
ETC

AT29LV040A-20JU

Flash, 512KX8, 200ns, PQCC32, PLASTIC, MS-016AE, LCC-32
ATMEL

AT29LV040A-20PC

x8 Flash EEPROM
ETC

AT29LV040A-20PI

x8 Flash EEPROM
ETC

AT29LV040A-20TC

4 Megabit 512K x 8 3-volt Only 256 Byte Sector CMOS Flash Memory
ATMEL

AT29LV040A-20TI

4 Megabit 512K x 8 3-volt Only 256 Byte Sector CMOS Flash Memory
ATMEL

AT29LV040A-20TIT/R

Flash, 512KX8, 200ns, PDSO32, PLASTIC, TSOP-32
ATMEL

AT29LV040A-20TU

Flash, 512KX8, 200ns, PDSO32, 8 X 20 MM, PLASTIC, MO-142BD, TSOP1-32
ATMEL

AT29LV040A-25DC

x8 Flash EEPROM
ETC

AT29LV040A-25DI

x8 Flash EEPROM
ETC

AT29LV040A-25JC

EEPROM|FLASH|512KX8|CMOS|LDCC|32PIN|PLASTIC
ETC

AT29LV040A-25JI

x8 Flash EEPROM
ETC