B7056G70W8HR-2T [ETC]
High-end dual-socket server platform for HPC and enterprice virtualization applications;型号: | B7056G70W8HR-2T |
厂家: | ETC |
描述: | High-end dual-socket server platform for HPC and enterprice virtualization applications PC |
文件: | 总2页 (文件大小:837K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
DUAL-SOCKET
HPC PLATFORM
GN70-B7056
B7056G70V8HR / B7056G70W8HR /
B7056G70W8HR-2T
Front View
High-end dual-socket server platform for
HPC and enterprice virtualization
applications
(8) Hot-Swap 3.5” SATA-II/ SAS HDDs
Dual LGA2011 socket supports Intel® Xeon® Processor
E5-2600/E5-2600 v2 Series CPU
Intel® C602 PCH and INTEL SAS ROM key design
(8+8) 240-pin UDIMM/RDIMM/LRDIMM ECC 1066/1333/1600/1866
*Speed 1866 only for 1 slot per channel 1.5V(Blue color DIMM slot )
up to (6) PCI-E Gen3 slots by riser
Back View
(4) SATA-II connectors w/ RAID 0, 1, 10, 5 support
(2) SATA-III connectors
(8) SAS/SATA 3G ports(SCU)enabled by option ROM kit
(3) GbE (via Intel® I350-BT2 + Intel® 82574L), or (2) 10GbE (via Intel®
X540-AT2) + (1) GbE (Intel® 82574L) (-2T SKU)
(4) FH/FL PCI-E (G3) x8 slots +
(2) FH/HL PCI-E (G3) x8 slots
(7) USB2.0 ports (2 at rear, 4 via cable, 1 type A onboard)
EATX (12" x 13", 305mm x 330mm)
Specifications are subject to change without notice. Items pictured may only be representative.
GN70-B7056
Specifications
B7056G70V8HR / B7056G70W8HR /
B7056G70W8HR-2T
M7056-L24-3F
(1) FH/FL PCI-E G3 x16 slot (x16/x8)
+ (1) FH/FL PCI-E G3 x8 slot (x0/x8)
+ (1) FH/HL PCI-E G3 x8 slot
Hot-swap System FANs
(4) 6038
(8) 6038 are required for
GPU deployment
M7056-R24-3F
(1) FH/FL PCI-E G3 x8 slot (x0/x8)
+ (1) FH/FL PCI-E G3 x16 slot (x16/x8)
+ (1) FH/HL PCI-E G3 x8 slot
M1245G70-BP6-8
8-port SAS 6G/SATA-II
HDD backplane board
S7056GM3NR
(2) LGA2011 sockets
(16) R-DDR3 1600/1333/1066MHz
(3) GbE ports
M1709G70-FPB
Front Panel Board
(2) ERP1U 770W/ 700W PSUs
80-PLUS Gold (different SKUs)
M1601T70-D-PDB
Power Distribution Board
GOLD
Intel® Integrated RAID upgrade ROM 5 (-W
SKU)
Form Factor
2U Rackmount
S
Storage
Controller
SAS
(opt.)
Chassis Name
GN70
Speed
RAID
3.0 Gb/s
System
(Recommend
Chassis)
Dimension (H x W x D)
3.43" x 16.93" x 27.56" (87 x 430 x 700mm)
RAID 0/1/10
S7056GM3NR / S7056WGM3NR /
S7056WGM3NR-2T
Motherboard
Controller
Speed
RAID
Intel® C602 series
SATA
6.0 Gb/s
Gross Weight
Buttons
26KG
RAID 0/1/10/5 (INTEL RAID stack)
D-Sub 15-pin
(1) PWR (w/ LED) / (1) RST / (1) NMI / (1) ID
Connector type
Resolution
Chipset
(1) ID / (1) Warning / (1) Reserved
(3) LAN
LEDs
Front Panel
Graphic
up to 1920 x 1200
Aspeed AST2300
I/O Ports
(2) USB ports
(7) USB2.0 ports (2 at rear, 4 via cable, 1 type
A onboard)
Type / Q'ty
3.5" Hot-Swap / (8)
USB
External Drive
Bay
Supported HDD
Interface
8-bay for 3.5"HDD ,6Gb/s mini-SAS
backplane
COM
(1) port (rear)
Input /Output
System Cooling
Configuration
up to (8) 6cm hot-swap fans (Default 4 hot-
sawp FANs)
(1) D-Sub 15-pin VGA port
(2) SATA II connectors
FAN
VGA
Type
ERP1U
RJ-45
(3) GbE ports
Input Range
Full-range AC(100-240V)
Chipset
Nuvoton 83773G
Power Supply
Frequency
Output Watts
Efficiency
47 - 63 Hertz
Monitors voltage for CPU, memory, chipset &
power supply
Voltage
770 Watts
PFC / 80-PLUS Gold
Monitors temperature for CPU & system
environment
Temperature
System
Monitoring
Intel® Xeon® Processor E5-2600/E5-2600 v2
Socket R (2)
Supported CPU Series
Socket Type / Q'ty
LED (On system front
panel)
Fan fail LED indicator
Over temperature warning indicator
Processor
Chipset
Average CPU Power
(ACP) wattage
Chassis intrusion detection
Watchdog timer support
Up to 130W*
Temperature
System Bus
Chipset
QPI link upto 8GT/s
Intel® C602
Brand / ROM size
AMI / 8MB
Plug and Play (PnP) /PCI2.3 /WfM2.0
/SMBIOS2.3 /PXE boot / ACPI 2.0 power
management /Power on mode after power
recovery / User-configurable H/W monitoring /
Auto-configurable of hard disk types
Super I/O
-
BIOS
Feature
Supported DIMM Qty
(8+8) DIMM slots
UDIMM/RDIMM/LRDIMM ECC 1066/1333/
1600/1866
*Speed 1866 only for 1 slot per channel 1.5V
(Blue color DIMM slot )
DIMM Type / Speed
FCC (DoC)
CE (DoC)
Class A
Yes
Regulation
Memory
up to 128GB UDIMM / 512GB RDIMM /
512GB LRDIMM
Capacity
Operating Temp.
10° C ~ 35° C (50° F~ 95° F)
Operating
Environment
Memory channel
Memory voltage
PCI-E
4 Channels per CPU
Non-operating Temp.
- 40° C ~ 70° C (-40° F ~ 158° F)
1.5V/ 1.35V
In/Non-operating
Humidity
90%, non-condensing at 35° C
Yes
up to (6) PCI-E x8 slots by Riser Card
Recommended TYAN®
Riser Card
RoHS 6/6 Complaint
Expansion Slots
LAN
RoHS
M7056-L24-3F, PCI-E x16 2U riser card (left)
M7056-R24-3F, PCI-E x16 2U riser card (right)
(Specifications are subject to change without notice. Items pictured may only be representative.)
Port Q'ty
(3) GbE ports
Intel® 82574L + Intel® I350-BT2
Intel® 82574L + Intel® X540 (-2T SKU)
Controller
MITAC INTERNATIONAL CORP.
TYAN Business Unit
USA
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Japan
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China
Tel: +1-510-651-8868
Fax: +1-510-651-7688
Tel: +886-2-2652-5888
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Tel: +81-3-3769-8311
Fax: +81-3-3769-8328
Sales: +32 2456 1721
Technical Support: +32 2456 1722
Shanghai Tel: +86-21-61431188 Ext 1366
China Tel:-86-010-62555015 Ext 8302
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