B7058Y190X2-045GV4H [ETC]

High-Density 1U dual-socket SMP server implementation for IPDC and enterprise virtualization applications;


型号：	B7058Y190X2-045GV4H
厂家：	ETC
描述：	High-Density 1U dual-socket SMP server implementation for IPDC and enterprise virtualization applications 光电二极管
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中文：	中文翻译
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HIGH-DENSITY

1U SERVER

PLATFORM

YR190-B7058-X2

B7058Y190X2-045SV4H / B7058Y190X2-045GV4H

High-Density 1U dual-socket SMP

server implementation for IPDC and

enterprise virtualization applications

Front View

‧1U w/ 2x dual-socket computing nodes implementation

‧ (4) Hot-Swap 2.5” HDD carriers included

 Dual LGA2011 socket supports (2) Intel® Xeon® Processor E5-2600/E5-2600 v2

Series

 Intel® C602 PCH

 (4+4) 240-pin UDIMM/RDIMM/LRDIMM ECC 1066/1333/1600/1866

*Speed 1866 only for 1 slot per channel 1.5V(Blue color DIMM slot )

 (1) HH/HL PCI-E (G3) x16 slot each node

 (4) hot-swap 2.5" SAS/SATA 6G HDDs

Back View

 (2) GbE + (1) dedicated for IPMI

(via Intel® I350-AM2 + via Realtek® RTL8201EL)

 Onboard BMC w/ IPMI and iKVM support

‧ (1) HH/HL PCI-E (G3) x16 slot each node

Specifications are subject to change without notice. Items pictured may only be representative.

YR190-B7058

Specifications

B7058Y190X2-045SV4H / B7058Y190X2-045GV4H

Easy-swap System FANs

ERP1U 450W cold-swap PSU

80-plus Silver / 80-plus Gold

(3) 4056

M7018-R16-1L

Provide (1) HH/HL

PCI-E (Gen. 3) x16 slot

M7018-BP-SG

4-port SAS/SATA 6G

HDD backplane board

S7058GM2NR

(2) LGA2011 sockets (R)

(4+4) R-DDR3

M1706G62-FPB

Integrated front panel board

1066/1333/1600/1866MHz

Max.256GB , (2) GbE ports

Port Q'ty

(2) GbE ports + (1) dedicated for IPMI

Form Factor

Chassis Name

Dimension (H x W x D)

Motherboard

Gross Weight

Buttons

1U Rackmount

LAN

(per blade)

Controller

Intel^®I350-AM2 + Realtek^®RTL8201EL

YR190

Connector

(4) SATA

Intel^®C602

3.0 Gb/s

System

28.74" x 17.32" x 1.72" (730 x 440 x 43.6mm)

Controller

Speed

Storage

(per blade)

SATA

S7058GM2NR

17KG

RAID 0/1/10/5 (Intel RSTe 3.x)

RAID

(1) RST / (1) PWR / (1) ID

Display Port(consolidating VGA and 2 x

USB2.0 signal)

Connector type

(1) BMC / (2) LAN / (1) HDD / (1) PWR/ ID

Front Panel

(per blade)

Graphic (per

blade)

LEDs

LED

Chipset

Aspeed AST2300

I/O Ports

(2) USB ports

USB

VGA

RJ-45

(2) ports (2 at front)

Input /Output

(per blade)

External Drive Type / Q'ty

Bay (per

2.5" Hot-Swap / (4)

SAS / SATA 6.0Gb/s

(1) Display Port(consolidating VGA and 2 x USB2.0 signal)

(3) ports (1 dedicate port for IPMI)

Supported HDD

blade)

Interface

Chipset

Voltage

Aspeed AST2300

System

Cooling

Configuration

(per blade)

System

Monitoring

(per blade)

Monitors temperature for CPU & system

environment

FAN

(3) 4056 fans

Fan fail LED indicator / Over temperature

warning indicator

LEDs

Type

ERP1U

Onboard Chipset

Onboard Aspeed AST2300

Input Range

Output Watts

100-127V /8A, 200-240V/ 4A

450 Watts

Power Supply

(per blade)

IPMI 2.0 compliant baseboard management

controller (BMC) / Supports storage over IP

and remote platform-flash / USB 2.0 virtual

hub

System

Management

(per blade)

80-plus Silver (B7058Y190X2-045SV4H SKU)

80-plus Gold (B7058Y190X2-045GV4H SKU)

AST2300 IPMI Feature

Efficiency

Supported CPU

Series

Intel^®Xeon^®Processor E5-2600/E5-2600 v2 Series

LGA2011 / (2)

24-bit high quality video compression /

10/100 Mb/s MAC interface

AST2300 iKVM

Feature

Socket Type / Q'ty

Processor

(per blade)

Brand / ROM size

AMI / 8MB

Thermal Design

Power (TDP) wattage

Max up to 130W 6/8 core CPU

Plug and Play (PnP) /PCI2.3 /WfM2.0

BIOS

(per blade)

/SMBIOS2.3 /PXE boot / ACPI 2.0 power

management /Power on mode after power

recovery / User-configurable H/W monitoring /

Up to 8.0/ 7.2/ 6.4 GT/s with Intel QuickPath

Interconnect (QPI) support

Intel^®C602

System Bus

Feature

Chipset

(per blade)

Super I/O

FCC (DoC)

Class A

Regulation

Supported DIMM Qty (4)+(4) DIMM slots

CE (DoC)

Yes

Operating Temp.

10° C ~ 35° C (50° F~ 95° F)

LRDIMM ECC 1066/1333/1600/1866 memory

DIMM Type / Speed

Capacity

R-DDR3 ECC 1066/1333/1600/1866 memory

U-DDR3 ECC 1066/1333/1600/1866 memory

Operating

Environment

Non-operating Temp. - 40° C ~ 70° C (-40° F ~ 158° F)

Memory

(per blade)

In/Non-operating

90%, non-condensing at 35° C

Humidity

Up to 64GB UDIMM / 128GB RDIMM / 256GB

LRDIMM

RoHS 6/6 Complaint Yes

RoHS

Memory channel

Memory voltage

4 Channels per CPU

1.5V/ 1.35V

(Specifications are subject to change without notice. Items pictured may only be representative.)

PCI-E

(1) PCI-E Low-Profile Gen.3 x16 slot

Expansion

Slots

(per blade)

Pre-install TYAN

Riser Card

M7018-R16-1L, 1U PCI-E x16 riser card (right)

MITAC INTERNATIONAL CORP.

TYAN Business Unit

USA

Taiwan

Japan

Europe

China

Tel: +1-510-651-8868

Fax: +1-510-651-7688

Tel: +886-2-2652-5888

Fax: +886-2-2652-5805

Tel: +81-3-3769-8311

Fax: +81-3-3769-8328

Sales: +32 2456 1721

Technical Support: +32 2456 1722

Shanghai Tel: +86-21-61431188 Ext 1366

China Tel:-86-010-62555015 Ext 8302

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