BFG16A/T1 [ETC]

TRANSISTOR UHF BIPOLAR BREITBAND ; 晶体管超高频双极BREITBAND\n
BFG16A/T1
型号: BFG16A/T1
厂家: ETC    ETC
描述:

TRANSISTOR UHF BIPOLAR BREITBAND
晶体管超高频双极BREITBAND\n

晶体 晶体管
文件: 总9页 (文件大小:124K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DISCRETE SEMICONDUCTORS  
DATA SHEET  
BFG16A  
NPN 2 GHz wideband transistor  
1995 Sep 12  
Product specification  
Supersedes data of November 1992  
File under Discrete Semiconductors, SC14  
Philips Semiconductors  
Product specification  
NPN 2 GHz wideband transistor  
BFG16A  
FEATURES  
PINNING  
PIN  
page  
4
High power gain  
DESCRIPTION  
emitter  
base  
Good thermal stability  
1
2
3
4
Gold metallization ensures  
excellent reliability.  
emitter  
collector  
DESCRIPTION  
NPN transistor mounted in a plastic  
SOT223 envelope.  
1
2
3
It is primarily intended for use in  
wideband amplifiers, aerial amplifiers  
and vertical amplifiers in high speed  
oscilloscopes.  
MSB002 - 1  
Top view  
Fig.1 SOT223.  
QUICK REFERENCE DATA  
SYMBOL  
PARAMETER  
collector-base voltage  
collector-emitter voltage  
DC collector current  
total power dissipation  
DC current gain  
CONDITIONS  
MIN.  
TYP. MAX. UNIT  
VCBO  
VCEO  
IC  
open emitter  
open base  
40  
25  
150  
1
V
V
mA  
W
Ptot  
hFE  
fT  
up to Ts = 110 °C; note 1  
IC = 150 mA; VCE = 5 V; Tj = 25 °C 25  
80  
1.5  
transition frequency  
IC = 100 mA; VCE = 10 V;  
f = 500 MHz; Tamb = 25 °C  
GHz  
dB  
GUM  
maximum unilateral power gain IC = 100 mA; VCE = 10 V;  
10  
f = 500 MHz; Tamb = 25 °C  
Note  
1. Ts is the temperature at the soldering point of the collector tab.  
LIMITING VALUES  
In accordance with the Absolute Maximum System (IEC 134).  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN. MAX. UNIT  
VCBO  
VCEO  
VEBO  
IC  
collector-base voltage  
collector-emitter voltage  
emitter-base voltage  
DC collector current  
total power dissipation  
storage temperature  
junction temperature  
open emitter  
open base  
40  
25  
2
V
V
open collector  
V
150  
1
mA  
W
Ptot  
Tstg  
Tj  
up to Ts = 110 °C; note 1  
65  
+150 °C  
150 °C  
Note  
1. Ts is the temperature at the soldering point of the collector tab.  
1995 Sep 12  
2
Philips Semiconductors  
Product specification  
NPN 2 GHz wideband transistor  
BFG16A  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
CONDITIONS  
VALUE  
UNIT  
Rth j-s  
thermal resistance from junction up to Ts = 110 °C; note 1  
40  
K/W  
to soldering point  
Note  
1. Ts is the temperature at the soldering point of the collector tab.  
CHARACTERISTICS  
Tj = 25 °C unless otherwise specified.  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP. MAX. UNIT  
V(BR)CBO  
collector-base breakdown  
voltage  
open emitter; IC = 0.1 mA  
25  
V
V(BR)CEO  
collector-emitter breakdown  
voltage  
open base; IC = 10 mA  
18  
V
V(BR)EBO  
ICBO  
hFE  
Cc  
emitter-base breakdown voltage open collector; IE = 0.1 mA  
3
V
collector cut-off current  
DC current gain  
IE = 0; VCB = 28 V  
20  
µA  
IC = 150 mA; VCE = 5 V  
25  
80  
2.5  
10.0  
1.5  
1.5  
collector capacitance  
emitter capacitance  
feedback capacitance  
transition frequency  
IE = ie = 0; VCB = 10 V; f = 1 MHz  
IC = ic = 0; VEB = 0.5 V; f = 1 MHz  
IC = 0; VCB = 10 V; f = 1 MHz  
pF  
Ce  
pF  
Cre  
pF  
fT  
IC = 100 mA; VCE = 10 V;  
GHz  
f = 500 MHz; Tamb = 25 °C  
GUM  
maximum unilateral power gain IC = 100 mA; VCE = 10 V;  
note 1 f = 500 MHz; Tamb = 25 °C  
10  
dB  
Note  
2
s21  
1. GUM is the maximum unilateral power gain, assuming s12 is zero. GUM = 10 log  
dB.  
------------------------------------------------------------  
(1 s11 2) (1 s22  
)
2
1995 Sep 12  
3
Philips Semiconductors  
Product specification  
NPN 2 GHz wideband transistor  
BFG16A  
MBG198  
MBB365  
1.2  
160  
handbook, halfpage  
handbook, halfpage  
P
tot  
(W)  
h
1.0  
0.8  
0.6  
0.4  
0.2  
FE  
120  
80  
40  
0
0
0
0
50  
100  
150  
200  
o
( C)  
100  
200  
I
(mA)  
C
T
s
VCE = 10 V; Tj = 25 °C.  
Fig.3 DC current gain as function of  
collector current.  
Fig.2 Power derating curve.  
MBB363  
MBB364  
2
5
handbook, halfpage  
handbook, halfpage  
f
C
T
re  
(GHz)  
1.6  
(pF)  
4
3
1.2  
0.8  
2
1
0
0.4  
0
0
40  
80  
120  
160  
0
4
8
12  
16  
V
20  
(V)  
I
(mA)  
C
CB  
IC = ic = 0; f = 1 MHz.  
VCE = 10 V; f = 500 MHz; Tamb = 25 °C.  
Fig.4 Feedback capacitance as function of  
collector-base voltage.  
Fig.5 Transition frequency as a function of  
collector current.  
1995 Sep 12  
4
Philips Semiconductors  
Product specification  
NPN 2 GHz wideband transistor  
BFG16A  
50  
3 GHz  
25  
100  
10  
250  
+ j  
10  
25  
50  
100  
250  
0
– j  
250  
10  
40 MHz  
100  
25  
MBB366  
50  
IC = 70 mA; VCE = 15 V; Zo = 50 .  
Fig.6 Common emitter input reflection coefficient (S11).  
o
90  
o
o
60  
120  
40 MHz  
o
o
150  
30  
50  
40  
30  
20  
10  
o
o
0
180  
3 GHz  
o
o
30  
150  
o
o
60  
120  
o
MBB367  
90  
IC = 70 mA; VCE = 15 V.  
Fig.7 Common emitter forward transmission coefficient (S21).  
5
1995 Sep 12  
Philips Semiconductors  
Product specification  
NPN 2 GHz wideband transistor  
BFG16A  
o
90  
o
o
60  
120  
o
o
150  
30  
3 GHz  
0.5 0.4  
0.3  
0.2  
0.1  
o
o
0
180  
40 MHz  
o
o
30  
150  
o
o
60  
120  
o
MBB368  
90  
IC = 70 mA; VCE = 15 V.  
Fig.8 Common emitter reverse transmission coefficient (S12).  
50  
25  
100  
10  
3 GHz  
25  
250  
+ j  
– j  
10  
50  
100  
250  
0
40 MHz  
250  
10  
100  
25  
MBB369  
50  
IC = 70 mA; VCE = 15 V; Zo = 50 .  
Fig.9 Common emitter output transmission coefficient (S22).  
6
1995 Sep 12  
Philips Semiconductors  
Product specification  
NPN 2 GHz wideband transistor  
BFG16A  
PACKAGE OUTLINE  
0.95  
0.85  
0.1 S  
S
seating plane  
6.7  
6.3  
0.32  
0.24  
B
3.1  
2.9  
M
0.2  
A
4
A
0.10  
0.01  
3.7  
3.3  
7.3  
6.7  
o
o
16  
16  
max  
1
2
3
o
10  
max  
1.80  
max  
0.80  
0.60  
M
2.3  
0.1  
B
(4x)  
MSA035 - 1  
4.6  
Dimensions in mm.  
Fig.10 SOT223.  
1995 Sep 12  
7
Philips Semiconductors  
Product specification  
NPN 2 GHz wideband transistor  
BFG16A  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
Short-form specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
The data in this specification is extracted from a full data sheet with the same type  
number and title. For detailed information see the relevant data sheet or data handbook.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
1995 Sep 12  
8
Philips Semiconductors – a worldwide company  
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Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,  
Tel. +31 40 27 83749, Fax. +31 40 27 88399  
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Tel. +43 1 60 101, Fax. +43 1 60 101 1210  
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Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,  
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773  
Philippines: Philips Semiconductors Philippines Inc.,  
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,  
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474  
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Brazil: see South America  
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,  
Tel. +48 22 612 2831, Fax. +48 22 612 2327  
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,  
51 James Bourchier Blvd., 1407 SOFIA,  
Tel. +359 2 689 211, Fax. +359 2 689 102  
Portugal: see Spain  
Romania: see Italy  
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,  
Tel. +1 800 234 7381, Fax. +1 708 296 8556  
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,  
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Czech Republic: see Austria  
Slovakia: see Austria  
Slovenia: see Italy  
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,  
Tel. +45 32 88 2636, Fax. +45 31 57 1949  
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Tel. +55 11 821 2333, Fax. +55 11 829 1849  
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Tel. +49 40 23 52 60, Fax. +49 40 23 536 300  
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,  
Tel. +46 8 632 2000, Fax. +46 8 632 2745  
Greece: No. 15, 25th March Street, GR 17778 TAVROS,  
Tel. +30 1 4894 339/911, Fax. +30 1 4814 240  
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Hungary: see Austria  
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.  
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Uruguay: see South America  
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Middle East: see Italy  
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,  
Internet: http://www.semiconductors.philips.com/ps/  
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825  
© Philips Electronics N.V. 1996  
SCA50  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
647021/1200/01/pp12  
Date of release: 1996 Jul 17  
Document order number: 9397 750 00971  

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