C30637EQC-04-FC [ETC]

Optoelectronic ; 光电\n


型号：	C30637EQC-04-FC
厂家：	ETC
描述：	Optoelectronic 光电\n 光电
文件：	总6页 (文件大小：285K)
中文：	中文翻译
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High-Speed InGaAs PIN

Photodiodes

Description

EVERYTHING

IN A

High-speed InGaAs photodiodes from

PerkinElmer Optoelectronics are

designed for use in OEM fiber optic

communications systems and high-

speed receiver applications including

trunk line, LAN, fiber-in-the-loop and

data communications. Ceramic

submount packages are available for

easy integration into high-speed

SONET, FDDI, or datalink receiver

modules, or as back-facet power

monitors in laser diode modules.

C30616, C30637, C30617, C30618

NEW

LIGHT.

Photodiodes are available in hermetic

TO-18 packages, or in connectorized

receptacle packages with industry

standard ST, FC or SC connectors.

These are designed for mating to either

single or multimode fibers. Photodiodes

are also available in a fibered package

with either single or multimode fiber

pigtail, which can be terminated with

either an ST, FC or SC connector.

Receptacled and fibered packages use

a ball-lens TO-18 package to maximize

coupling efficiency. All devices are

planar passivated and feature proven

high reliability mounting and contacting.

An MTTF of >10⁹hours (approximate-

ly 105 years) at 50^oC has been

demonstrated with an extended high temperature burn-

in at 200^oC for 168 hours (V^R= 10V), ensuring an

MTTF > 10⁷hours at 50^oC (E = 0.7eV). Finally, all

production devices are screened with a 16 hour, 200^oC

burn-in (V^R= 10V) and tested to meet responsivity,

spectral noise and dark current specifications.

Features

demonstrated to date from standard

production samples.

• 50, 75, 100, 350 µm diameters

• High responsivity at 1300 and 1550nm

• Low capacitance for high bandwidths (to 3.5GHz)

• Available in various package options

Quality and Reliability

PerkinElmer Optoelectronics is

committed to supplying the highest

quality product to our customers, and

we are certified to meet ISO-9001 and

operate to MIL-Q-9858A and AQAP-1

quality standards. Process control is

maintained through annual re-

Applications

• High-speed communications

• SONET/ATM, FDDI

• Datalinks & LANs

qualification of production units and

includes extensive electrical, thermal

and mechanical stress as well as an

extended lifetest. In addition, every

wafer lot is individually qualified to meet

responsivity, capacitance and dark

current specifications, and reliability is

• Fiber optic sensors

Performance Specifications (at V = V

typical), 22°C

Parameter

C30616

Typ

C30637

Typ

Min

Max

Min

Max

Units

Operating Voltage

Breakdown Voltage

Active Diameter

100

µm

Responsivity at 1300 nm

Ceramic (D1)

Responsivity at 1550 nm

Ceramic (D1)

0.80

0.85

0.90

0.80

0.85

0.90

A/W

0.95

< 1.0

< 0.02

0.95

< 1.0

< 0.02

A/W

pA/√Hz

Dark Current

2.0

0.15

2.0

0.15

Spectral Noise Current (10 kHz, 1.0 Hz)

Capacitance at V_R= V_OP(typ)

Ceramic (D1)

0.35

0.07

3.5

0.55

0.5

0.40

0.07

3.5

0.60

0.5

GHz

Rise/Fall Time (10% to 90%)

Bandwidth (-3 dB, R = 50Ω)

Available Package Types

Maximum Ratings

Maximum Forward Current

Power Dissipation

Storage Temperature

Operating Temperature

°C

100

125

100

125

-60

-40

-60

-40

°C

Figure 1: Typical spectral responsivity vs wavelength.

Dotted line shows response in D2 package (silicon window)

Figure 2: Typical capacitance vs operating voltage.

Note 1: Ceramic submount.

Specifications (at V = V

typical), 22°C

C30617

Parameter

C30618

Typ

Min

Typ

Max

Min

Max

Units

Operating Voltage

Breakdown Voltage

Active Diameter

100

350

µm

Responsivity at 1300 nm

Ceramic (D1)/TO-18 (D2)

Fiber (D6)/FC (D4)/ST (D3)/SC (D5)¹

Responsivity at 1550 nm

Ceramic (D1)/TO-18 (D2)

Fiber (D6)/FC (D4)/ST (D3)/SC (D5)¹

Dark Current

0.80

0.65

0.90

0.75

0.80

0.65

0.90

0.75

A/W

0.85

0.70

0.95

0.80

< 1.0

< 0.02

0.85

0.70

0.95

0.80

2.0

0.15

5.0

0.20

pA/√Hz

Spectral Noise Current (10 kHz, 1.0 Hz)

0.02

Capacitance at V = V

(typ)

(D1),(D6),(D3),(D5)

TO-18 (D2)

0.6

0.8

1.0

0.5

4.0

6.0

1.0

Rise/Fall Time (10% to 90%)

0.07

3.5

0.5

GHz

Bandwidth (-3 dB, R = 50 Ω)

0.75

Available Package Types

D1, D2, D3, D4, D5, D6,

D1, D2, D3, D4, D21

Maximum Ratings

Maximum Forward Current

Power Dissipation

Storage Temperature ²

Operating Temperature ²

100

125

100

125

°C

-60

-40

-60

-40

°C

Note 1. Coupled from 62.5 Fm, 0.28 NA graded index multi-mode fiber using 1300 nm SLED source.

Note 2. Maximum storage and operating temperature for connectorized and fibered devices is +85°C.

C30618

C30617

C30637

C30616

Figure 3: Typical dark current vs. voltage

Figure 4: Typical dark current vs. temperature

at V = -5V.

Standard Packages

Figure 5:

Package D1: Ceramic Submount

Figure 6:

Package D2: TO-18 low profile

Figure 8:

Package D4: FC detector module

Figure 7:

Package D3: ST receptacle module

Figure 9:

Package D5: SC receptacle module Figure 10:

Package D6: Fibered

detector module

Standard Packages

Figure 11:

Termination D8: ST connector

Figure 12: Termination D9: FC connector

Figure 13: Termination D10: SC connector

Figure 14: Package D21: TO-18 ball-lens

package

Ordering Guide

C30 # # # L M M M - X X - N N

Fiber

Termination FC:

ST:

Connector

SC:

Fiber Type

(Core/cladding/jacket in µm, NA)

04:

07:

62.5/125/900,0.29

9/125/900,0.10

Package

Type

ST:

FC:

SC:

Receptacle

QC: Fibered -XX-NN

CER: Ceramic

Flat window, ceramic

Lens

Type

TO-18, ceramic submount

submount

Connector/fibered/ball

Ball lens, TO-18, stand alone

lens

or with fiber / connector

Chip Type

616, 637, 617, 618

Note: Specific package types available for each photodiode are listed in the

table of specifications.

For more information e-mail us at opto@perkinelmer.com or visit our web site at www.perkinelmer.com/opto

PerkinElmer Optoelectronics

22001 Dumberry Road

Vaudreuil (QC) Canada

J7V 8P7

All values are nominal; specifications subject to change without notice.

Phone: (450) 424-3300

Fax: (450) 424-3411

0400

is a registered trademark of PerkinElmer, Inc.

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