CD-02-05-C-34 [ETC]

THERM PAD 1.319" X 1.319";


型号：	CD-02-05-C-34
厂家：	ETC
描述：	THERM PAD 1.319" X 1.319"
文件：	总3页 (文件大小：346K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

ulTIMiFlux Dielectric Phase Change Thermal Material

CD-02-05

60^oC/140^oF PHASE-CHANGE TEMPERATURE

FEATURES AND BENIFITS

● Low Thermal Impedance

● Excellent Replacement for Thermal Greases

● Thixotropic / Prevents Compound Run-Out

● Excellent Mechanical & Dielectric Properties

● Cost Effective “Drop in Place” Solution

● RoHS and Halogen Free Compliant

Wakefield-Vette's ulTIMiFlux line of thermal interface materials offer high performance, low cost,

configurability and custom sizes for your thermal system needs. Thermal Interface Materials (TIM) are

a secondary material installed between the heat sink and the device which are designed to improve the

thermal transfer to the heat sink. Regardless of how flat or smooth the device and heat sink are, there

will always be small air voids between the two surfaces. Since air is a not a great conductor of heat, a

TIM replaces the air and fills the voids. There are many types of TIMs and each has its best case

usages. Wakefield-Vetts’s line of dielectric phase change thermal materials are intended to fill voids

between a device and the heat sink and utilizes a polyimide film to act as a thermally conductive carrier

in order to deliver a uniform thickness coating of phase-change thermal compound on both sides.

Through the development of this unique formulation,

Wakefield-Vette’s phase change solution offers

efficient thermal transfer by phase-changing during

normal device operating temperatures while

maintaining a uniform bond line thus driving out the

air and adjusting for any surface imperfections or

flatness conditions that may exist across the interface.

This construction is useful in a wide range of

electronic cooling applications from transistors,

diodes or any type of heat generating non-isolated

power device.

Standard Phase Change Pad Construction

Phase Change Compound

Polyimide Substrate Carrier

Phase Change Compound

A primary advantage of utilizing a phase-

change system is the ability to drive out air

from within the interface during initial device

cycling causing phase change and surface

wetting of the thermal compound coating.

The phase-change compound is available in

specific die cut patterns for common TO

packages and can be placed instantly and

immediately ready for component mounting.

Due to it’s thixotropic formulation design,

compound is held within the interface with no

worries of run-out into unwanted areas during

normal device/component operation.

www.wakefield-vette.com

ulTIMiFlux Dielectric PhaseChange Thermal Material

CD-02-05

Wakefield-Vette's phase-change product is a solvent free high performance dielectric thermal interface material

that is designed to provide efficient thermal transfer by providing precision phase-change and a uniform bond line

thickness across a device/component mounting interface. The pads are designed as a pre-formed thermally

conductive “drop in place” solution that offers excellent thermal transfer characteristics. From an installation

perspective, thermal greases are difficult to dispense as well as provide inadequate coverage and a uniform

thickness across the interface most often leaving trapped air leading to poor thermal transfer. Not to mention the

thermal grease clean up required in unwanted areas afterwards.

Wakefield-Vette offers the following pad sizes and die-cut TO package sizes for ease of installation:

WV Part Number

CD-02-05-220

CD-02-05-247

CD-02-05-264

CD-02-05-025

CD-02-05-127

CD-02-05-190

CD-02-05-LED-1

CD-02-05-LED-2

CD-02-05-220-N

CD-02-05-247-N

CD-02-05-220-2

CD-02-05-220-3

CD-02-05-247-2

CD-02-05-247-3

CD-02-05-218

CD-02-05-126

CD-02-05-66

Description

Phase Change TO-220 Pad with mounting hole

Phase Change TO-247 Pad with mounting hole

Phase Change TO-264 Pad with mounting hole

Phase Change 1” x 1” Square Pad

Size

For use with

0.70” x 0.50”, single mounting hole T0-220, with mounting holes

0.95” x 0.75”, single mounting hole TO-247, with mounting holes

1.05” x 0.85”, single mounting hole TO-264, with mounting holes

1” x 1”, no holes

5” x 5”, no holes

7.75” x 10.00”, no holes

1.00" Diameter Circle, No ID

2.00" Diameter Circle, No ID

0.70" x 0.50" NO HOLE

0.95" x 0.75" NO HOLE

1.00" x 0.50" 2 holes

1.50" x 0.50", 3 holes

1.50" x 0.95", 2 holes

2.25" x 0.95", 3 holes

0.80" x 0.60" with hole

0.50" x 0.35" with hole

1.25" x 0.70", 2 pin

General Use

Phase Change 5” x 5” Square Pad

Phase Change 7.75” x 10.00” Rectangular Pad

Phase Change LED 1 Inch OD Circle Pad

Phase Change LED 2 Inch OD Circle Pad

Phase Change TO-220 Pad, NO HOLE

Phase Change TO-247 Pad, NO HOLE

Phase Change Dual Mount TO-220 Pad, 2 holes

Phase Change Triple Mount TO-220 Pad, 3 holes

Phase Change Dual Mount TO-247 Pad, 2 holes

Phase Change Triple Mount TO-247 Pad, 3 holes

Phase Change TO-218 Pad with hole

LED

TO-220 with no mounting hole

TO-247 with no mounting hole

Dual Mount TO-220

Triple Mount TO-220

Dual Mount TO-247

Triple Mount TO-247

TO-218 with mounting hole

TO-126 with mounting hole

TO-66 (std 2 pin)

Phase Change TO-126 Pad with hole

Phase Change TO-66 Pad, 2 pin

CD-02-05-3-2

CD-02-05-3-4

CD-02-05-3-8

CD-02-05-DO4

CD-02-05-DO4-5

CD-02-05-DO5

CD-02-05-REC-125

Phase Change TO-3 Pad, 2 pin

Phase Change TO-3 Pad, 4 pin

Phase Change TO-3 Pad, 8 pin

Phase Change DO-4 Pad, 0.625" OD / 0.203" ID

Phase Change DO4/5 Pad 0.800" OD / 0.260" ID

Phase Change DO-5 Pad 1.00" OD / 0.250" ID

Phase Change Rectifier Pad 1.25" x 1.25" with hole

1.55" x 1.05", 2 pin

1.55" x 1.05", 4 Pin

1.55" x 1.05", 8 Pin

0.625" OD / 0.203" ID

0.800" OD / 0.260" ID

1.00" OD / 0.250" ID

1.25" x 1.25" with hole

1.25" X 1.25", NO HOLE

1.12" x 1.12" with hole

TO-3 (2 pin configuration)

TO-3 (4 pin configuration)

TO-3 (8 pin configuration)

DO-4

DO-4 / DO-5

DO-5

Rectifier

Bridge Rectifier

17.5mm x 17.5mm, chipset

19.5mm x 19.5mm, chipset

21.5mm x 21.5mm, chipset

25.5mm x 25.5mm, chipset

33.5mm x 33.5mm, chipset

38.5mm X 38.5mm, chipset

46mm X 46mm, chipset

48.5mm X 48.5mm, chipset

53.5mm x 53.5mm, chipset

CD-02-05-REC-125-N Phase Change Rectifier Pad 1.25" X 1.25", NO HOLE

CD-02-05-REC-112

CD-02-05-BRI-225

CD-02-05-C-18

CD-02-05-C-20

CD-02-05-C-22

CD-02-05-C-26

CD-02-05-C-34

CD-02-05-C-39

CD-02-05-C-46

CD-02-05-C-49

CD-02-05-C-54

Phase Change Rectifier Pad 1.12" x 1.12" with hole

Phase Change Bridge Rectifier Pad 2.25" x 1.75", 2 End Slots 2.25" x 1.75", 2 End Slots

Phase Change Chipset Pad 0.689" x 0.689", No Hole

Phase Change Chipset Pad 0.768" x 0.768", No Hole

Phase Change Chipset Pad 0.846" x 0.846", No Hole

Phase Change Chipset Pad 1.003" x 1.003", No Hole

Phase Change Chipset Pad 1.319" x 1.319", No Hole

Phase Change Chipset Pad 1.516" x 1.516", No Hole

Phase Change Chipset Pad 1.811" x 1.811", No Hole

Phase Change Chipset Pad 1.909" x 1.909", No Hole

Phase Change Chipset Pad 2.106" x 2.106", No Hole

0.689" x 0.689", No Hole

0.768" x 0.768", No Hole

0.846" x 0.846", No Hole

1.003" x 1.003", No Hole

1.319" x 1.319", No Hole

1.516" x 1.516", No Hole

1.811" x 1.811", No Hole

1.909" x 1.909", No Hole

2.106" x 2.106", No Hole

Specific tests should be performed by the end user to determine the product suitability for the particular

application. Contact Wakefield-Vette sales and engineering support with any inquiries.

www.wakefield-vette.com

ulTIMiFlux Dielectric PhaseChange Thermal Material

CD-02-05

Wakefield-Vette's phase-change product physical properties / characteristics:

Property/Characteristics

Base Phase Change Formulation

Electrical Isolation

Value

Proprietary

9200V

Phase Change Temperature

Viscosity @ Phase Change

60oC / 140oF

Thixotropic

Overall Thickness

Color

0.003” +/- 10%

Orange

Separator Liner / Color

White

Total Mass Loss, % TML

Collectible Volatile, Condensable Matter, % CVC

Water Vapor Gain, % WVR

Storage Condition and Temperature

Shelf Life

0.138

0.130

0.021

Cool Dry Location at or below 35oC / 95oF

Indefinite if stored per conditions above

Due to temperature sensitive design, it is

recommended to ship air freight during warmer

months to prevent phase-change of thermal

compound during long ground transit (May-

September)

Transit Methods / Conditions

Thermal Impedence

0.107 oC-in2 / Watt (@100 PSI)

UL94V-0

UL Flammability Rating

Specific tests should be performed by the end user to determine the product suitability for the particular

application. Contact Wakefield-Vette sales and engineering support with any inquiries.

www.wakefield-vette.com

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