CMT2210AW-EQR [ETC]
Low-Cost 300 â 960 MHz OOK Stand-Alone RF Receiver;
| 型号： | CMT2210AW-EQR |
| 厂家： | 
ETC |
| 描述： | Low-Cost 300 â 960 MHz OOK Stand-Alone RF Receiver |
| 文件： | 总28页 (文件大小：896K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CMT2210/17AW
Low-Cost 300 – 960 MHz OOK Stand-Alone RF Receiver
Features
Applications
Embedded EEPROM
Low-Cost Consumer Electronics Applications
Home and Building Automation
Very Easy Development with RFPDK
All Features Programmable
Infrared Receiver Replacements
Industrial Monitoring and Controls
Remote Automated Meter Reading
Remote Lighting Control System
Wireless Alarm and Security Systems
Remote Keyless Entry (RKE)
Frequency Range
300 to 480 MHz (CMT2210AW)
300 to 960 MHz (CMT2217AW)
Symbol Rate: 0.1 to 40 ksps
Sensitivity: -113 dBm at 1 ksps, 0.1% BER
Configurable Receiver Bandwidth: 50 to 500 kHz
3-wire SPI Interface for EEPROM Programming
Stand-Alone, No External MCU Control Required
Configurable Duty-Cycle Operation Mode
Supply Voltage: 1.8 to 3.6 V
Ordering Information
Part Number
CMT2210AW-EQR
CMT2210AW-ESR
CMT2217AW-EQR
Frequency
433.920 MHz
433.920 MHz
868.350 MHz
Package
QFN16
SOP16
QFN16
MOQ
Low Power Consumption: 3.8 mA
Low Sleep Current
5,000 pcs
2,500 pcs
5,000 pcs
60 nA when Sleep Timer Off
440 nA when Sleep Timer On
RoHS Compliant
More Ordering Info: See Page 21
16-pin QFN 3x3 and SOP16 Package Options
Descriptions
The CMT2210/17AW devices are ultra low power, high
performance, low-cost OOK stand-alone RF receiver for
various 300 to 960 MHz wireless applications. The
CMT2210AW covers the frequency range from 300 to 480
MHz while the CMT2217AW covers the 300 to 960 MHz
frequency range. They are part of the CMOSTEK
NextGenRFTM family, which includes a complete line of
transmitters, receivers and transceivers. An embedded
EEPROM allows the frequency, symbol rate and other
features to be programmed into the device using the
CMOSTEK USB Programmer and RFPDK. Alternatively, in
stock products of 433.92/868.35 MHz are available for
immediate demands without the need of EEPROM
programming. When the CMT2210/17AW is always on, it
consumes only 3.8 mA current while achieving -113 dBm
receiving sensitivity. It consumes even less power when
working in duty-cycle operation mode via the built-in sleep
timer. The CMT2210/17AW receiver together with the
CMT211x transmitter enables an ultra low cost RF link.
QFN16 (3X3)
SOP16
VCOP
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
nRSTO
NC
12 11 10
9
VCON
GND
RFIN
GND
VDD
CSB
GND
RFIN
GND
VDD
8
7
6
5
XIN
13
14
15
16
XIN
XOUT
CLKO
DOUT
XOUT
CLKO
DOUT
NC
1
2
3
4
SDA
SCL
CMT2210/17AW Top View
Copyright © By CMOSTEK
www.hoperf.com
Rev 1.3 | Page 1/28
CMT2210/17AW
Typical Application
L2
ANT
C2
C3
X1
13
14
15
16
8
7
6
5
J1
GND
RFIN
GND
VDD
XIN
XOUT
CLKO
DOUT
VDD
CSB
C1
1
2
3
4
5
U1
CMT2210/17AW
L1
SDA
SCL
VDD
DOUT
C0
Note: Connector J1 is for
EEPROM Programming
Figure 1. CMT2210/17AW Typical Application Schematic
Table 1. BOM of 433.92/868.35 MHz Typical Application [1]
Value (Match to 50Ω ANT)
Value (Common Used ANT)
433.92 MHz 868.35 MHz
Designator
Descriptions
Unit
Manufacturer
433.92 MHz 868.35 MHz
CMT2210/17AW, low-cost
300 – 960 MHz OOK
stand-alone RF receiver
±20 ppm, SMD32*25 mm,
crystal
U1
-
-
-
CMOSTEK
X1
L1
26
26
MHz
nH
EPSON
±5%, 0603 multi-layer chip
inductor
27
22
6.8
3.9
33
22
6.8
3.9
Murata LQG18
±5%, 0603 multi-layer chip
inductor, for QFN16
±5%, 0603 multi-layer chip
inductor, for SOP16
±0.25 pF, 0402 NP0, 50 V
±20%, 0402 X7R, 25 V
±5%, 0402 NP0, 50 V
L2[2]
nH
Murata LQG18
15
--
15
--
C1
C0
3.3
2.7
2.7
2.7
pF
uF
pF
Murata GRM15
Murata GRM15
Murata GRM15
0.1
27
0.1
27
C2, C3
Note:
[1]. The 868.35 MHz application is for CMT2217AW only.
[2]. CMT2210AW devices in QFN16 and SOP16 packages share the same BOM except for the L2.
Table 2. Product Selection Table
Modulation/
Frequency
OOK/
Embedded
EEPROM
Product
Sensitivity
Rx Current
Package
-113 dBm
3.8 mA
(433.92 MHz)
5.2 mA
QFN16(3x3)/
SOP16
CMT2210AW
CMT2217AW
√
√
300-480 MHz
OOK/
(433.92 MHz, 1 ksps, 0.1% BER)
-110 dBm
QFN16(3x3)
300-960 MHz
(868.35 MHz, 1 ksps, 0.1% BER)
(868.35 MHz)
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Rev 1.3 | Page 2/28
CMT2210/17AW
Abbreviations
Abbreviations used in this data sheet are described below
AGC
AN
Automatic Gain Control
Application Notes
Bit Error Rate
PC
Personal Computer
Printed Circuit Board
Phase Lock Loop
PCB
PLL
PN9
POR
PUP
QFN
BER
BOM
BSC
BW
Bill of Materials
Pseudorandom Noise 9
Power On Reset
Basic Spacing between Centers
Bandwidth
Power Up
DC
Direct Current
Quad Flat No-lead
EEPROM
Electrically Erasable Programmable Read-Only RF
Radio Frequency
Memory
RFPDK
RF Products Development Kit
Restriction of Hazardous Substances
Received Signal Strength Indicator
Receiving, Receiver
Successive Approximation Register
Small Outline Package
Serial Port Interface
Threshold
ESD
ESR
Ext
Electro-Static Discharge
Equivalent Series Resistance
Extended
RoHS
RSSI
Rx
IF
Intermediate Frequency
Low Noise Amplifier
Local Oscillator
SAR
SOP
SPI
LNA
LO
LPOSC
Max
MCU
Min
Low Power Oscillator
Maximum
TH
Tx
Transmission, Transmitter
Typical
Microcontroller Unit
Minimum
Typ
USB
VCO
WOR
XOSC
XTAL/Xtal
Universal Serial Bus
Voltage Controlled Oscillator
Wake On Radio
MOQ
NP0
NC
Minimum Order Quantity
Negative-Positive-Zero
Not Connected
Crystal Oscillator
OOK
On-Off Keying
Crystal
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Rev 1.3 | Page 3/28
CMT2210/17AW
Table of Contents
1. Electrical Characteristics............................................................................................................................................ 5
1.1 Recommended Operation Conditions ................................................................................................................... 5
1.2 Absolute Maximum Ratings................................................................................................................................... 5
1.3 Receiver Specifications......................................................................................................................................... 6
1.4 Crystal Oscillator................................................................................................................................................... 7
1.5 LPOSC.................................................................................................................................................................. 7
2. Pin Descriptions .......................................................................................................................................................... 8
3. Typical Performance Characteristics....................................................................................................................... 10
4. Typical Application Schematic ................................................................................................................................. 11
5. Functional Descriptions............................................................................................................................................ 12
5.1 Overview............................................................................................................................................................. 12
5.2 Modulation, Frequency and Symbol Rate ........................................................................................................... 12
5.3 Embedded EEPROM and RFPDK ...................................................................................................................... 13
5.4 All Configurable Options ..................................................................................................................................... 13
5.5 Internal Blocks Description.................................................................................................................................. 15
5.5.1 RF Front-end and AGC............................................................................................................................ 15
5.5.2 IF Filter..................................................................................................................................................... 15
5.5.3 RSSI ........................................................................................................................................................ 15
5.5.4 SAR ADC................................................................................................................................................. 15
5.5.5 Crystal Oscillator...................................................................................................................................... 16
5.5.6 Frequency Synthesizer ............................................................................................................................ 16
5.5.7 LPOSC..................................................................................................................................................... 16
5.6 Operation Mode .................................................................................................................................................. 16
5.7 Always Receive Mode......................................................................................................................................... 17
5.8 Duty-Cycle Receive Mode................................................................................................................................... 18
5.9 Easy Duty-Cycle Configurations.......................................................................................................................... 19
5.10 The nRSTO......................................................................................................................................................... 19
5.11 The CLKO ........................................................................................................................................................... 20
6. Ordering Information................................................................................................................................................. 21
7. Package Outline......................................................................................................................................................... 22
8. Top Marking ............................................................................................................................................................... 24
8.1 CMT2210/17AW Top Marking............................................................................................................................. 24
9. Other Documentations.............................................................................................................................................. 26
10. Document Change List.............................................................................................................................................. 27
11. Contact Information .................................................................................................................................................. 28
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Rev 1.3 | Page 4/28
CMT2210/17AW
1. Electrical Characteristics
VDD = 3.3 V, TOP = 25 ℃, FRF = 433.92 MHz, sensitivities are measured in receiving a PN9 sequence and matching to 50 Ω
impedance, with the BER of 0.1%. All measurements are performed using the board CMT2210/17AW-EM V1.0, unless otherwise
noted.
1.1 Recommended Operation Conditions
Table 3. Recommended Operation Conditions
Parameter
Symbol
VDD
Conditions
Min
1.8
-40
1
Typ
Max
3.6
85
Unit
V
Operation Voltage Supply
Operation Temperature
Supply Voltage Slew Rate
TOP
℃
mV/us
1.2 Absolute Maximum Ratings
Table 4. Absolute Maximum Ratings[1]
Parameter
Supply Voltage
Symbol
Conditions
Min
Max
3.6
Unit
V
VDD
VIN
-0.3
-0.3
-40
-50
Interface Voltage
Junction Temperature
Storage Temperature
Soldering Temperature
ESD Rating[2]
VDD + 0.3
125
V
TJ
℃
TSTG
TSDR
150
℃
Lasts at least 30 seconds
Human Body Model (HBM)
@ 85 ℃
255
℃
-2
2
kV
mA
Latch-up Current
Notes:
-100
100
[1]. Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. This is a stress
rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.
[2]. The CMT2210/17AW is high-performance RF integrated circuits with VCON/P pins having an ESD rating < 2 kV HBM.
Handling and assembly of this device should only be done at ESD-protected workstations.
Caution! ESD sensitive device. Precaution should be used when handling the device in order
to prevent permanent damage.
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Rev 1.3 | Page 5/28
CMT2210/17AW
1.3 Receiver Specifications
Table 5. Receiver Specifications
Conditions
Parameter
Symbol
Min
Typ
Max
Unit
CMT2210AW
CMT2217AW
300
300
0.1
480
960
40
MHz
MHz
ksps
Frequency Range
Symbol Rate
FRF
SR
FRF = 433.92 MHz, SR = 1 ksps, BER =
S433.92
-113
-110
10
dBm
dBm
dBm
0.1%
Sensitivity
FRF = 868.35 MHz, SR = 1 ksps, BER =
0.1%
S868.35
PLVL
IDD
Saturation Input Signal
Level
FRF = 433.92 MHz
3.8
5.2
mA
mA
nA
nA
Hz
Working Current
Sleep Current
FRF = 868.35 MHz
When sleep timer is on
When sleep timer is off
440
60
ISLEEP
FRES
Frequency Resolution
Frequency Synthesizer
Settle Time
24.8
TLOCK
From XOSC settled
150
52
us
dB
dB
SR = 1 ksps, ±1 MHz offset, CW
interference
SR = 1 ksps, ±2 MHz offset, CW
interference
Blocking Immunity
BI
74
SR = 1 ksps, ±10 MHz offset, CW
interference
75
35
dB
dB
Image Rejection Ratio
Input 3rd Order Intercept
Point
IMR
IIP3
IF = 280 kHz
Two tone test at 1 MHz and 2 MHz offset
frequency. Maximum system gain settings
-25
dBm
kHz
ms
Receiver Bandwidth
BW
50
500
From power up to receive, in Always
Receive Mode
Receiver Start-up Time
Receiver Wake-up Time
TSTART-UP
7.3
From sleep to receive, in Duty-Cycle
Receive Mode
TWAKE-UP
0.61
ms
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Rev 1.3 | Page 6/28
CMT2210/17AW
1.4 Crystal Oscillator
Table 6. Crystal Oscillator Specifications
Parameter
Symbol
Conditions
Min
Typ
26
Max
Unit
MHz
ppm
pF
Crystal Frequency[1]
Crystal Tolerance[2]
Load Capacitance
Crystal ESR
FXTAL
26
26
±20
15
CLOAD
Rm
10
20
60
Ω
XTAL Startup Time[3]
tXTAL
400
us
Notes:
[1]. The CMT2210/17AW can directly work with external 26 MHz reference clock input to XIN pin (a coupling capacitor is
required) with peak-to-peak amplitude of 0.3 to 0.7 V.
[2]. This is the total tolerance including (1) initial tolerance, (2) crystal loading, (3) aging, and (4) temperature dependence.
The acceptable crystal tolerance depends on RF frequency and channel spacing/bandwidth.
[3]. This parameter is to a large degree crystal dependent.
1.5 LPOSC
Table 7. LPOSC Specifications
Parameter
Symbol
Conditions
Min
Typ
1
Max
Unit
kHz
%
Calibrated Frequency[1]
Frequency Accuracy
Temperature Coefficient[2]
Supply Voltage Coefficient[3]
Initial Calibration Time
Notes:
FLPOSC
After calibration
1
-0.02
+0.5
4
%/°C
%/V
ms
tLPOSC-CAL
[1]. The LPOSC is automatically calibrated to the crystal oscillator during the PUP state, and is periodically calibrated since
then.
[2]. Frequency drifts when temperature changes after calibration.
[3]. Frequency drifts when supply voltage changes after calibration.
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Rev 1.3 | Page 7/28
CMT2210/17AW
2. Pin Descriptions
12 11 10
9
GND
RFIN
GND
VDD
8
7
6
5
XIN
13
14
15
16
XOUT
CLKO
DOUT
1
2
3
4
Figure 2. CMT2210/17AW Pin Assignments in QFN16 (3x3) Package
Table 8. CMT2210/17AW Pin Descriptions in QFN16 (3x3) Package
Pin Number
Name
I/O
Descriptions
1
2
CSB
SDA
I
IO
I
3-wire SPI chip select input for EEPROM programming, internally pulled high
3-wire SPI data input and output for EEPROM programming
3-wire SPI clock input for EEPROM programming, internally pulled low
Not connected, leave floating
3
SCL
4,9
5
NC
NA
O
O
O
I
DOUT
CLKO
XOUT
XIN
Received data output
6
Programmable clock output to drive an external MCU
Crystal oscillator output
7
8
Crystal oscillator input or external reference clock input
Active-low power-on-reset output to reset an external MCU
10
11
12
13, 15
14
16
nRSTO
VCOP
VCON
GND
RFIN
VDD
O
IO
VCO tank, connected to an external inductor
I
I
I
Ground
RF signal input to the LNA
Power supply input
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Rev 1.3 | Page 8/28
CMT2210/17AW
VCOP
VCON
GND
RFIN
GND
VDD
1
2
3
4
5
6
7
8
nRSTO
NC
16
15
14
13
12
11
10
9
XIN
XOUT
CLKO
DOUT
NC
CSB
SCL
SDA
Figure 3. CMT2210AW Pin Assignments in SOP16 Package
Table 9. CMT2210AW Pin Assignments in SOP16 Package
Pin Number
Name
I/O
Descriptions
1
2
VCOP
VCON
GND
RFIN
VDD
IO
VCO tank, connected to an external inductor
3, 5
4
I
I
Ground
RF signal input to the LNA
Power supply input
6
I
7
CSB
I
3-wire SPI chip select input for EEPROM programming
8
SDA
IO
I
3-wire SPI data input and output for EEPROM programming
3-wire SPI clock input for EEPROM programming
Not connected, leave floating
9
SCL
10,15
11
12
13
14
16
NC
-
DOUT
CLKO
XOUT
XIN
O
O
O
I
Received data output
Programmable clock output to drive an external MCU
Crystal oscillator output
Crystal oscillator input or external reference clock input
Active-low power-on-reset output to reset an external MCU
nRSTO
O
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Rev 1.3 | Page 9/28
CMT2210/17AW
3. Typical Performance Characteristics
Current vs. Supply Voltage
Current vs. Temperature
6.00
6.60
6.20
5.80
5.40
5.00
4.60
4.20
3.80
3.40
3.00
5.50
5.00
4.50
4.00
3.50
868.35MHz/3.6V
868.35MHz/3.3V
868.35MHz/1.8V
433.92MHz/3.6V
433.92MHz/3.3V
433.92MHz/1.8V
868.35 MHz
3.00
433.92 MHz
2.50
2.00
1.60
1.85
2.10
2.35
2.60
2.85
3.10
3.35
3.60
3.85
-50
-30
-10
10
30
50
70
90
Supply Voltage (V)
Temperature (℃)
Figure 5. Current vs. Voltage, FRF = 433.92 /
868.35 MHz, SR = 1 ksps
Figure 4. Current vs. Temperature, FRF
433.92/868.35 MHz, SR = 1 ksps
=
Sensitivity vs. Temperature
Sensitivity vs. Supply Voltage
-108
-107.0
-109
-110
-111
-112
-108.0
-109.0
-110.0
868.35 MHz
-111.0
433.92 MHz
-113
-112.0
-113.0
-114.0
-115.0
868.35 MHz
-114
433.92 MHz
-115
-116
1.6
1.9
2.2
2.5
2.8
3.1
3.4
3.7
4
-60
-40
-20
0
20
40
60
80
100
Temperature (℃)
Supply Voltage (V)
Figure 7. Sensitivity vs. Supply Voltage, SR
= 1 ksps, BER = 0.1%
Figure 6. Sensitivity vs. Temperature, FRF = 433.92
/ 868.35 MHz, SR = 1 ksps, BER = 0.1%
Sensitivity vs. Symbol Rate
Sensitivity vs. BER
-108
-90
-109
-110
-111
-112
-113
-114
-95
-100
-105
868.35 MHz
433.92 MHz
-110
-115
-115
868.35 MHz
-116
433.92 MHz
-120
-117
0
5
10
15
20
25
30
35
40
0.01%
0.10%
1.00%
10.00%
SymbolRate (ksps)
Bit Error Rate
Figure 8. Sensitivity vs. SR, FRF = 433.92 /
868.35 MHz, VDD = 3.3 V, BER = 0.1%
Figure 9. Sensitivity vs. BER, FRF = 433.92
/ 868.35MHz, VDD = 3.3 V, SR = 1 ksps
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Rev 1.3 | Page 10/28
CMT2210/17AW
4. Typical Application Schematic
L2
ANT
C2
C3
X1
13
8
7
6
5
J1
GND
XIN
XOUT
CLKO
DOUT
VDD
CSB
C1
14
1
2
3
4
5
RFIN
U1
L1
SDA
SCL
15
CMT2210/17AW
GND
VDD
16
VDD
DOUT
C0
Figure 10. Typical Application Schematic
Notes:
1. Connector J1 is a must for the CMT2210/17AW EEPROM access during development or manufacture.
2. The general layout guidelines are listed below. For more design details, please refer to “AN107 CMT221x Schematic and
PCB Layout Design Guideline”.
Use as much continuous ground plane metallization as possible.
Use as many grounding vias (especially near to the GND pins) as possible to minimize series parasitic inductance
between the ground pour and the GND pins.
Avoid using long and/or thin transmission lines to connect the components.
Place C0 as close to the CMT2210/17AW as possible for better filtering.
3. The table below shows the BOM of typical application.
Table 10. BOM of 433.92/868.35 MHz Typical Application [1]
Value (Match to 50Ω ANT)
Value (Common Used ANT)
433.92 MHz 868.35 MHz
Designator
Descriptions
Unit
Manufacturer
433.92 MHz 868.35 MHz
CMT2210/17AW, low-cost
300 – 960 MHz OOK
stand-alone RF receiver
±20 ppm, SMD32*25 mm,
crystal
U1
-
-
-
CMOSTEK
X1
L1
26
26
MHz
nH
EPSON
±5%, 0603 multi-layer chip
inductor
27
22
6.8
3.9
33
22
6.8
3.9
Murata LQG18
±5%, 0603 multi-layer chip
inductor, for QFN16
±5%, 0603 multi-layer chip
inductor, for SOP16
±0.25 pF, 0402 NP0, 50 V
±20%, 0402 X7R, 25 V
±5%, 0402 NP0, 50 V
L2[2]
nH
Murata LQG18
15
--
15
--
C1
C0
3.3
2.7
2.7
2.7
pF
uF
pF
Murata GRM15
Murata GRM15
Murata GRM15
0.1
27
0.1
27
C2, C3
Note:
[1]. The 868.35 MHz application is for CMT2217AW only.
[2]. CMT2210AW devices in QFN16 and SOP16 packages share the same BOM except for the L2.
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Rev 1.3 | Page 11/28
CMT2210/17AW
5. Functional Descriptions
AGC
I-LMT
I-MXR
OOK
CSB
DEMOD
Image
RFI
Rejection
Band-pass
Filter
Radio
Controller
LNA
RSSI
SAR
3-wire SPI
SCL
SDA
GND
AFC & AGC
Q-MXR
Q-LMT
VCO
26 MHz
Loop
Filter
LO GEN
PFD/CP
EEPROM
CLKO
DOUT
LDOs
Bandgap
POR
DIVIDER
LPOSC
XOSC
VDD
GND
AFC & Σ-Δ Modulator
XIN XOUT
nRSTO
VCON VCOP
Figure 11. Functional Block Diagram
5.1 Overview
The CMT2210/17AW devices are ultra low power, high performance, low-cost OOK stand-alone RF receiver for various 300 to
960 MHz wireless applications. The CMT2210AW covers the frequency range from 300 to 480 MHz while the CMT2217AW
covers the 300 to 960 MHz frequency range. They are part of the CMOSTEK NextGenRFTM family, which includes a complete
line of transmitters, receivers and transceivers. The chip is based on a fully integrated, low-IF receiver architecture. The low-IF
architecture facilitates a very low external component count and does not suffer from powerline - induced interference problems.
The synthesizer contains a VCO and a low noise fractional-N PLL with an output frequency resolution of 24.8 Hz. The VCO
operates at 2x the Local Oscillator (LO) frequency to reduce spurious emissions. Every analog block is calibrated on each
Power-on Reset (POR) to the internal reference voltage. The calibration helps the device to finely work under different
temperatures and supply voltages. The baseband filtering and demodulation is done by the digital demodulator. The
demodulated signal is output to the external MCU via the DOUT pin. No external MCU control is needed in the applications.
The 3-wire SPI interface is only used for configuring the device. The configuration can be done with the RFPDK and the USB
Programmer. The RF Frequency, symbol rate and other product features are all configurable. This saves the cost and simplifies
the design, development and manufacture. Alternatively, in stock products of 433.92/868.35 MHz are available for immediate
demands with no need of EEPROM programming. The CMT2210/17AW operates from 1.8 to 3.6 V so that it can finely work with
most batteries to their useful power limits. The receive current is only 3.8 mA at 433.92 MHz and 5.2 mA at 868.35 MHz. The
CMT2210/17AW receiver together with the CMT211x transmitter enables an ultra low cost RF link.
5.2 Modulation, Frequency and Symbol Rate
The CMT2210/17AW supports OOK demodulation with the symbol rate from 0.1 to 40 ksps. The CMT2210AW continuously
covers the frequency range from 300 to 480 MHz, including the license free ISM frequency band around 315 MHz and 433.92
MHz. And the CMT2217AW covers the frequency range from 300 MHz to 960 MHz, including the license free ISM frequency
band around 315 MHz, 433.92 MHz, 868.35 MHz and 915 MHz. The internal frequency synthesizer contains a high-purity VCO
and a low noise fractional-N PLL with an output frequency resolution of 24.8 Hz. See the table below for the demodulation,
frequency and symbol rate information.
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Rev 1.3 | Page 12/28
CMT2210/17AW
Table 11. Modulation, Frequency and Symbol Rate
Parameter
Demodulation
Value
Unit
OOK
300 to 480
300 to 960
24.8
-
Frequency (CMT2210AW)
Frequency (CMT2217AW)
Frequency Resolution
Symbol Rate
MHz
MHz
Hz
0.1 to 40
ksps
5.3 Embedded EEPROM and RFPDK
The RFPDK is a PC application developed to help the user to configure the CMOSTEK NextGenRFTM products in the most
intuitional way. The user only needs to connect the USB Programmer between the PC and the device, fill in/select the proper
value of each parameter on the RFPDK, and click the “Burn” button to program the configurations into the device. The
configurations of the device will then remain unchanged until the next programming. No external MCU control is required in the
application program.
The RFPDK also allows the user to save the active configuration into a list by clicking on the “List” button, so that the saved
configuration can be directly reloaded from the list in the future. Furthermore, it supports exporting the configuration into a
hexadecimal file by clicking on the “Export” button. This file can be used to burn the same configuration into a large amount of
devices during the mass production. See the figure below for the accessing of the EEPROM.
CMT2210/17AW
RFPDK
EEPROM
CSB
SCL
SDA
CMOSTEK USB
Programmer
Interface
Figure 12. Accessing Embedded EEPROM
For more details of the CMOSTEK USB Programmer and the RFPDK, please refer to “AN103 CMT211xA-221xA One-Way RF
Link Development Kits Users Guide”.
5.4 All Configurable Options
Beside the demodulation, frequency and symbol rate, more options can be used to customize the device. The following is a table
of all the configurable options. On the RFPDK, the Basic Mode only contains a few options allowing the user to perform easy and
fast configurations. The Advanced Mode shows all the options that allow the user to customize the device in a deeper level. The
options in “Basic Mode” are a subset of that in the “Advanced Mode”.
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Rev 1.3 | Page 13/28
CMT2210/17AW
Table 12. Configurable Parameters in RFPDK
Category
Parameters
Descriptions
Default
Mode
The receive radio frequency, the range is from
Basic
Advanced
Basic
Frequency (CMT2210AW)
Frequency (CMT2217AW)
Demodulation
433.920 MHz
300 to 480 MHz, with resolution of 0.001 MHz.
The receive radio frequency, the range is from
300 to 960 MHz, with resolution of 0.001 MHz.
The demodulation type, only OOK
868.350 MHz
OOK
Advanced
Basic
demodulation is supported in this product.
The receiver symbol rate, the range is from 0.1
to 40 ksps, with resolution of 0.1 ksps.
Advanced
Basic
Symbol Rate
Squelch TH
2.4 ksps
54 / 40
Advanced
Basic
RF
The threshold of the squelch circuit to suppress
Settings
(CMT2210AW/CMT2217AW) the noise, the range is from 0 to 255.
The sum of the crystal frequency tolerance of
Advanced
±150 ppm | 200
kHz
Xtal Tol. | Rx BW
the Tx and the Rx, the range is from 0 to ±300
Basic
(CMT2210AW/CMT2217AW) ppm. And the calculated BW is configured and
displayed.
/ ±40 ppm | 100
kHz
Advanced
Time for the device to wait for the crystal to get
Basic
Xtal Stabilizing Time
settled after power up. The options are: 78, 155,
310, 620, 1240 or 2480 us.
310 us
Advanced
Turn on/off the duty-cycle receive mode, the
options are: on or off.
Basic
Advanced
Basic
Duty-Cycle Mode
Sleep Time
Rx Time
On
The sleep time in duty-cycle receive mode, the
range is from 3 to 134,152,192 ms.
3 ms
Advanced
Basic
The receive time in duty-cycle receive mode,
the range is from 0.04 to 2,683,043.00 ms.
The extended receive time in duty-cycle receive
mode, the range is from 0.04 to 2,683,043.00
ms. It is only available when WOR is on.
Turn on/off the wake-on radio function, the
options are: on or off.
2,000 ms
Advanced
Rx Time Ext
200.00 ms
Off
Advanced
Advanced
Advanced
Advanced
Wake-On Radio
Wake-On Condition
System Clock Output
Operation
Settings
The condition to wake on the radio. The options
are: Extended by Preamble, or Extended by
RSSI. It is only available when WOR is on.
Turn on/off the system clock output on CLKO,
the options are: on or off.
Extended by
Preamble
Off
The system clock output frequency, the options
are: 13.000, 6.500, 4.333, 3.250, 2.600, 2.167,
1.857, 1.625, 1.444, 1.300, 1.182, 1.083, 1.000,
0.929, 0.867, 0.813, 0.765, 0.722, 0.684, 0.650,
0.619, 0.591, 0.565, 0.542, 0.520, 0.500, 0.481,
0.464, 0.448, 0.433, 0.419 or 0.406 MHz. It is
only available when System Clock Output is on.
The OOK demodulation methods, the options
are: Peak TH, or Fixed TH
System Clock
Frequency
6.5 MHz
Advanced
Demod Method
Peak TH
60 / 50
Advanced
Advanced
The threshold value when the Demod Method is
“Fixed TH”, the minimum input value is the
value of Squelch Threshold set on the RFPDK,
the maximum value is 255.
OOK
Settings
Fixed Demod TH
(CMT2210AW/CMT2217AW)
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Rev 1.3 | Page 14/28
CMT2210/17AW
Category
Parameters
Peak Drop
Descriptions
Default
Mode
Turn on/off the RSSI peak drop function, the
options are on, or off.
On
Advanced
The RSSI peak drop step, the options are: 1, 2,
3, 5, 6, 9, 12 or 15.
Peak Drop Step
Peak Drop Rate
AGC
1
Advanced
Advanced
Advanced
Advanced
The RSSI peak drop rate, the options are: 1
step/4 symbols, 1 step/2 symbols, 1 step /1
symbol, or 1 step/0.5 symbol.
1 step /
4 symbols
Automatic Gain Control, the options are: on or
off.
On
The size of the valid preamble, the options are:
1-byte, 2-byte, 3-byte, or 4-byte. It is only
available when WOR is on.
Decode
Settings
Preamble
2-byte
5.5 Internal Blocks Description
5.5.1 RF Front-end and AGC
The CMT2210/17AW features a low-IF receiver. The RF front-end of the receiver consists of a Low Noise Amplifier (LNA), I/Q
mixer and a wide-band power detector. Only a low-cost inductor and a capacitor are required for matching the LNA to any
common used antennas. The input RF signal induced on the antenna is amplified and down-converted to the IF frequency for
further processing.
By means of the wide-band power detector and the attenuation networks built around the LNA, the Automatic Gain Control (AGC)
loop regulates the RF front-end’s gain to get the best system linearity, selectivity and sensitivity performance, even though the
receiver suffers from strong out-of-band interference.
5.5.2 IF Filter
The signals coming from the RF front-end are filtered by the fully integrated 3rd-order band-pass image rejection IF filter which
achieves over 35 dB image rejection ratio typically. The IF center frequency is dynamically adjusted to enable the IF filter to
locate to the right frequency band, thus the receiver sensitivity and out-of-band interference attenuation performance are kept
optimal despite the manufacturing process tolerances. The IF bandwidth is automatically computed according to the three basic
system parameters input from the RFPDK: RF frequency, Xtal tolerance, and symbol rate.
5.5.3 RSSI
The subsequent multistage I/Q Log amplifiers enhance the output signal from IF filter before it is fed for demodulation. Receive
Signal Strength Indicator (RSSI) generators are included in both Log amplifiers which produce DC voltages that are directly
proportional to the input signal level in both of I and Q path. The resulting RSSI is a sum of both these two paths. Extending from
the nominal sensitivity level, the RSSI achieves over 66 dB dynamic range.
The CMT2210/17AW integrates a patented DC-offset cancellation engine. The receiver sensitivity performance benefits a lot
from the novel, fast and accurate DC-offset removal implementation.
5.5.4 SAR ADC
The on-chip 8-bit SAR ADC digitalizes the RSSI for OOK demodulation.
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Rev 1.3 | Page 15/28
CMT2210/17AW
5.5.5 Crystal Oscillator
The crystal oscillator is used as the reference clock for the PLL frequency synthesizer and system clock for the digital blocks. A
26 MHz crystal should be used with appropriate loading capacitors (C2 and C3 in Figure 10 of Page 11). The values of the
loading capacitors depend on the total load capacitance CL specified for the crystal. The total load capacitance seen between the
XIN and XOUT pin should equal CL for the crystal to oscillate at 26 MHz.
1
CL
=
+ Cparasitic
1
C
1
C
+
2
3
The parasitic capacitance is constituted by the input capacitance and PCB tray capacitance. The ESR of the crystal should be
within the specification in order to ensure a reliable start-up. An external signal source can easily be used in place of a
conventional XTAL and should be connected to the XIN pin. The incoming clock signal is recommended to have a peak-to-peak
swing in the range of 300 mV to 700 mV and AC-coupled to the XIN pin.
5.5.6 Frequency Synthesizer
A fractional-N frequency synthesizer is used to generate the LO frequency for the down conversion I/Q mixer. The frequency
synthesizer is fully integrated except the VCO tank inductor which enables the ultra low-power receiver system design. Using the
26 MHz reference clock provided by the crystal oscillator or the external clock source, it can generate any receive frequency
between 300 to 480 MHz with a frequency resolution of 24.8 Hz.
The VCO always operates at 2x of LO frequency. A high Q (at VCO frequency) tank inductor should be chosen to ensure the
VCO oscillates at any conditions meanwhile burns less power and gets better phase noise performance. In addition, properly
layout the inductor matters a lot of achieving a good phase noise performance and less spurious emission. The recommended
VCO inductors for different LO frequency bands are shown as bellow.
Table 13. VCO Inductor for 315/433.92/868.35/915 MHz Frequency Band
LO Frequency Band (MHz)
315
33
433.92
22
868.35
3.9
915
3.9
--
VCO Inductor for QFN16 package (nH)
VCO Inductor for SOP16 package (nH)
27
15
--
Multiple subsystem calibrations are performed dynamically to ensure the frequency synthesizer operates reliably in any working
conditions.
5.5.7 LPOSC
An internal 1 kHz low power oscillator is integrated in the CMT2210/17AW. It generates a clock to drive the sleep timer to
periodically wake the device from sleep state. The Sleep Time can be configured from 3 to 134,152,192 ms (more than 37 hours)
when the device works in duty-cycle receive mode. Since the frequency of the LPOSC drifts when the temperature and supply
voltage change, it is automatically calibrated during the PUP state, and is periodically calibrated since then. The calibration
scheme allows the LPOSC to maintain its frequency tolerance to less than ±1%.
5.6 Operation Mode
An option “Duty-Cycle On-Off” on the RFPDK allows the user to determine how the device behaves. The device is able to work in
two operation modes, as shown in the figure below.
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Rev 1.3 | Page 16/28
CMT2210/17AW
PUP
SLEEP
TUNE
PUP
SLEEP
XTAL
RX
RX
TUNE
Always Receive Mode
(“Duty-Cycle Mode” is set to Off )
Duty-Cycle Receive Mode
(“Duty-Cycle Mode” is set to On )
Figure 13. Two different operation modes
Power Up (PUP) State
Once the device is powered up, the device will go through the Power Up (PUP) sequence which includes the task of releasing the
Power-On Reset (POR), turning on the crystal and calibrating the internal blocks. The PUP takes about 4 ms to finish in the
always receive mode, and about 9.5 ms to finish in the duty-cycle receive mode. This is because that the LPOSC and sleep timer
is turned off in the always receive mode, while it must be turned on and calibrated during the PUP in the duty-cycle receive mode.
The average current of the PUP sequence is about 0.9 mA.
SLEEP State
In this state, all the internal blocks are powered down except the sleep timer. In Always Receive Mode, the sleep time is fixed at
about 3 ms. In Duty-Cycle Receive Mode, the sleep time is defined by the option “Sleep Time” on the RFPDK. The sleep current
is about 60 nA in the always receive mode, and about 440 nA (with LPOSC and sleep timer turned on) in the duty-cycle receive
mode.
XTAL State
The XTAL state only exists in the duty-cycle receive mode. Once the device wakes up from the SLEEP State, the crystal oscillator
restarts to work. The option “XTAL Stabilizing Time” on the RFPDK defines the time for the device to wait for the crystal oscillator
to settle. The current consumption in this state is about 520 uA.
TUNE State
The device is tuned to the desired frequency defined by the option “Frequency” on the RFPDK and ready to receive. It usually
takes approximately 300 us to complete the tuning sequence. The current consumption in this state is about 2 mA.
RX State
The device receives the incoming signals and outputs the demodulated data from the DOUT pin. In duty-cycle receive mode, the
device only stays in the RX State for a certain amount of time, which is defined by the option “Rx Time” on the RFPDK. The
current in this state is about 3.8 mA.
5.7 Always Receive Mode
If the duty-cycle receive mode is turned off, the device will go through the Power Up (PUP) sequence, stay in the SLEEP state for
about 3 ms, tune the receive frequency, and finally stay in the RX state until the device is powered down. The power up sequence,
which takes about 4 ms to finish, includes the task of turning on the crystal and calibrating the internal blocks. The device will
continuously receive the incoming RF signals during the RX state and send out the demodulated data on the DOUT pin. The
configurable system clock is also output from the CLKO pin if it is enabled in the Advanced Mode on the RFPDK. The figure
below shows the timing characteristics and current consumption of the device from the PUP to RX.
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Rev 1.3 | Page 17/28
CMT2210/17AW
Data
(DOUT pin)
System Clock
(CLKO pin)
3.8 mA
Current
2.0 mA
900 uA
440 nA
PUP
TUNE
RX
SLEEP
State
about
3 ms
about
300 us
about 4 ms
Figure 14. Timing and Current Consumption for Always Receive Mode
5.8 Duty-Cycle Receive Mode
If the duty-cycle mode is turned on, after the PUP the device will automatically repeat the sequence of SLEEP, XTAL, TUNE and
RX until the device is powered down. This allows the device to re-tune the synthesizer regularly to adept to the changeable
environment and therefore remain its highest performance. The device will continuously receive any incoming signals during the
RX state and send out the demodulated data on the DOUT pin. The configurable system clock output is output from the CLKO
pin during the TUNE and RX state. The PUP sequence consumes about 9.5 ms which is longer than the 4 ms in the Always
Receive Mode. This is because the LPOSC, which drives the sleep timer, must be calibrated during the PUP.
Data
(DOUT pin)
System Clock
(CLKO pin)
3.8 mA
3.8 mA
Current
2.0 mA
2.0 mA
900 uA
520 uA
520 uA
440 nA
440 nA
PUP
SLEEP
XTAL
TUNE
RX
SLEEP
XTAL
TUNE RX
State
Sleep
Time
Sleep
Time
Xtal Stabilizing
Time
about
300 us
Xtal Stabilizing
Time
about
300 us
about 9.5 ms
Rx Time
Rx Time
Figure 15. Timing and Current Consumption for Duty-Cycle Receive Mode
It is strongly recommended for the user to turn on the duty-cycle receive mode option. The advantages are:
Maintaining the highest performance of the device by regular frequency re-tune.
Increasing the system stability by regular sleep (resetting most of the blocks).
Saving power consumptions of both of the Tx and Rx device.
As long as the Sleep Time and Rx Time are properly configured, the transmitted data can always be captured by the device.
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Rev 1.3 | Page 18/28
CMT2210/17AW
5.9 Easy Duty-Cycle Configurations
When the user wants to take the advantage of maintaining the highest system stability and performance, and the power
consumption is not the first concern in the system, the Easy Configuration can be used to let the device to work in the duty-cycle
mode without complex calculations, the following is a good example:
TX Data
T = Packet Length (72 ms)
A missed packet
Two missed packets
RX State
time
SLEEP, XTAL and TUNE
RX
T = Rx Time (1000 ms)
T = Sleep Time (3 ms) +
XTAL Stabilizing Time (310 us) +
Tuning Time (300 us) = 3.61 ms
output data corrupted
output data corrupted
Data
(DOUT pin)
Figure 16. Tx and Rx relationship of Easy Configuration
In this example, the Tx device transmits the data at 1.2 ksps and there are 60 symbols in one data packet. Thus, the packet
length is 50 ms. The user can do the following:
Set the Sleep Time to the minimum value of 3 ms.
Set the Rx Time to 1 second which is much longer than the packet length.
Let the Tx device to send out 3 continuous data packets in each transmission.
Because the Sleep Time is very short, the non-receive time is only about 3.61 ms (the sum of the Sleep Time, XTAL stabilizing
time and the tuning time), which is much shorter than the packet length of 50 ms. Therefore, this non-receive time period will only
have a change to corrupt no more than 2 packets receiving. During the non-receive time period, the DOUT pin will output logic 0.
Because the Rx Time is very long, and 3 continuous data packets are sent in each transmission, there is at least 1 packet that
can be completely received by the device and sent out via the DOUT pin with no corruption. The external MCU will only need to
observe the DOUT pin status to perform data capturing and further data processing.
If the system power consumption is a sensitive and important factor in the application, the Precise Configuration can be used.
Also, based on the duty-cycle receive mode, the “Wake-On Radio” technique allows the device to even save more power. For the
precise duty-cycle configurations and the use of wake-on radio, please refer to the “AN108 CMT2210/17AW Configuration
Guideline”.
5.10 The nRSTO
By default, an active low reset signal is generated by the internal POR and output via the nRSTO pin. It can be used to reset the
external MCU if it is required.
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Rev 1.3 | Page 19/28
CMT2210/17AW
Trise
VDD
Vth
TPOR
(POR)
nRSTO
Figure 17. nRSTO Timing Characteristics
On the above figure, Trise is the time taken for the VDD to rise from 0 V to its ultimate stabilized level. After the internal Power-On
Reset circuit detects that the VDD has risen over the threshold voltage (Vth), it takes the time TPOR for the POR to change its state
from logical 0 to 1. The Vth is about 1.2 V. The value of TPOR varies according to the time taken for the VDD to rise from 0 to 3 V, as
listed in the table below. When the VDD falls, the nRSTO follows with the VDD simultaneously.
Table 14. TPOR Timing Characteristics
TRISE (us)
3,000
1,000
300
TPOR (us)
500
300
160
100
100
30
70
10
60
5.11 The CLKO
A clock divided down from the crystal oscillator clock is output via the CLKO pin if the “System Clock Output” is set to “On” on the
RFPDK. This clock can be used to drive the external MCU, and is available when the device is in the XTAL, TUNE and RX states.
The clock frequency is selected by the option “System Clock Frequency”.
More details of using the CLKO can be referred to the “AN108 CMT2210/17AW Configuration Guideline”.
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Rev 1.3 | Page 20/28
CMT2210/17AW
6. Ordering Information
Table 15. CMT2210/17AW Ordering Information
Package
Type
Package
Option
Operating
MOQ /
Part Number
Descriptions
Condition
1.8 to 3.6 V,
-40 to 85 ℃
1.8 to 3.6 V,
-40 to 85 ℃
1.8 to 3.6 V,
-40 to 85 ℃
1.8 to 3.6 V,
-40 to 85 ℃
Multiple
Low-Cost 300 – 480 MHz OOK
Stand-Alone RF Receiver
CMT2210AW-EQR[1]
CMT2210AW-ESR[1]
CMT2210AW-ESB[1]
QFN16 (3x3)
SOP16
Tape & Reel
Tape & Reel
Tube
5,000
2,500
1,000
5,000
Low-Cost 300 – 480 MHz OOK
Stand-Alone RF Receiver
Low-Cost 300 – 480 MHz OOK
Stand-Alone RF Receiver
SOP16
Low-Cost 300 – 960 MHz OOK
Stand-Alone RF Receiver
CMT2217AW-EQR[1]
QFN16 (3x3)
Tape & Reel
Note:
[1]. “E” stands for extended industrial product grade, which supports the temperature range from -40 to +85 ℃.
“Q” stands for the package type of QFN16 (3x3).
“S” stands for the package type of SOP16.
“R” stands for the tape and reel package option, the minimum order quantity (MOQ) is 5,000 pieces for QFN package
type and 1,000 pieces for SOP package type.
“B” stands for the tube package option, the MOQ is 1,000 pieces for SOP16 package type.
The default frequency for CMT2210AW is 433.920 MHz, and for CMT2217AW is 868.350 MHz. Please refer to the Table
12 in Page 14 for details of other settings.
Visit www.cmostek.com/products to know more about the product and product line.
Contact sales@cmostek.com or your local sales representatives for more information.
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Rev 1.3 | Page 21/28
CMT2210/17AW
7. Package Outline
The 16-pin QFN 3x3 illustrates the package details for the CMT2210/17AW. The table below lists the values for the dimensions
shown in the illustration.
D
e
b
D2
16
16
1
1
Top View
Side View
Bottom View
Figure 18. 16-Pin QFN 3x3 Package
Table 16. 16-Pin QFN 3x3 Package Dimensions
Size (millimeters)
Symbol
Min
0.7
Max
0.8
A
A1
b
—
0.05
0.30
0.25
3.10
1.75
0.18
0.18
2.90
1.55
0.50 BSC
2.90
1.55
0.35
c
D
D2
e
E
3.10
1.75
0.45
E2
L
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Rev 1.3 | Page 22/28
CMT2210/17AW
The CMT2210AW is also available in the SOP16 package, see below figures and tables for the dimension details.
D
h
A3
A1
0.25
A
A2
c
θ
L
L1
E
E1
e
b
Figure 19. SOP16 Package
Table 17. SOP16 Package Dimensions
Size (millimeters)
Symbol
Min
Typ
Max
A
A1
A2
A3
b
-
-
1.75
0.225
1.50
0.70
0.48
0.26
10.10
6.20
4.10
0.05
1.30
0.60
0.39
0.21
9.70
5.80
3.70
-
1.40
0.65
-
c
-
D
9.90
E
6.00
E1
e
3.90
1.27 BSC
h
0.25
0.50
-
0.50
0.80
L
-
L1
θ
1.05 BSC
-
0
8°
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Rev 1.3 | Page 23/28
CMT2210/17AW
8. Top Marking
8.1 CMT2210/17AW Top Marking
2 1 0 A
2 1 7 A
④
④
① ② ③
① ② ③
Y WW
Y WW
Figure 20. CMT2210 (Left) and CMT2217AW (Right) Top Marking in QFN16 Package
Table 18. CMT2210/17AW QFN16 Top Marking Explanation
Mark Method
Laser
Pin 1 Mark
Font Size
Circle’s diameter = 0.3 mm
0.5 mm, right-justified
210A, represents part number CMT2210AW
217A, represents part number CMT2217AW
Line 1 Marking
Line 2 Marking
Line 3 Marking
①②③④ Internal tracking number
Date code assigned by the assembly house. Y represents the last digit of the mold year and
WW represents the workweek
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Rev 1.3 | Page 24/28
CMT2210/17AW
C M T 2 2 1 0 A
Y Y W W
①②③④
⑤⑥
Figure 21. CMT2210AW Top Marking in SOP16 Package
Table 19. CMT2210AW SOP16 Top Marking Explanation
Mark Method
Pin 1 Mark
Laser
Circle’s diameter = 1 mm
Font Size
0.35 mm, right-justified
Line 1 Marking
CMT2210A, represents part number CMT2210AW
YYWW is the Date code assigned by the assembly house. YY represents the last two digits of the
mold year and WW represents the workweek
Line 2 Marking
①②③④⑤⑥ is the internal tracking number
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CMT2210/17AW
9. Other Documentations
Table 20. Other Documentations for CMT2210/17AW
Brief
Name
Descriptions
User’s Guides for CMT211xA and CMT221xA Development Kits,
including Evaluation Board and Evaluation Module, CMOSTEK
USB Programmer and RFPDK.
CMT211xA-221xA One-Way RF Link
Development Kits Users Guide
AN103
Details of CMT2210/13/17/19AW and CMT2210LW PCB
schematic and layout design rules, RF matching network and
other application layout design related issues.
CMT221x Schematic and PCB Layout
Design Guideline
AN107
AN108
CMT2210/17A Configuration Guideline
Details of configuring CMT2210/17AW features on the RFPDK.
www.hoperf.com
Rev 1.3 | Page 26/28
CMT2210/17AW
10.Document Change List
Table 21. Document Change List
Rev. No.
Chapter
Description of Changes
Initial released version
Date
All
0.9
1.0
1.1
1.2
1.3
2014-06-14
2014-06-30
2015-01-23
2015-05-04
2015-06-17
5
Update Section 5.7 and Figure 14
All
All
All
Add Product CMT2217AW to the datasheet
Add SOP16 to product CMT2210AW
Update the VCO inductor for CMT2210AW in SOP16 package
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Rev 1.3 | Page 27/28
CMT2210/17AW
11.Contact Information
Hope Microelectronics Co., Ltd
Address: 2/F,Building3,Pingshan Private Enterprise science and Technology Park,Xili Town,Nanshan
District,Shenzhen,China
Tel: +86-755-82973805
Fax: +86-755-82973550
Email: sales@hoperf.com
hoperf@gmail.com
Website: http://www.hoperf.com
http://www.hoperf.cn
Copyright. CMOSTEK Microelectronics Co., Ltd. All rights are reserved.
The information furnished by CMOSTEK is believed to be accurate and reliable. However, no responsibility is assumed for
inaccuracies and specifications within this document are subject to change without notice. The material contained herein is
the exclusive property of CMOSTEK and shall not be distributed, reproduced, or disclosed in whole or in part without prior
written permission of CMOSTEK. CMOSTEK products are not authorized for use as critical components in life support
devices or systems without express written approval of CMOSTEK. The CMOSTEK logo is a registered trademark of
CMOSTEK Microelectronics Co., Ltd. All other names are the property of their respective owners.
www.hoperf.com
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