CPA2512Q10R0FS-T10 [ETC]

RES SMD 10 OHM 1% 16W 2512;


型号：	CPA2512Q10R0FS-T10
厂家：	ETC
描述：	RES SMD 10 OHM 1% 16W 2512
文件：	总3页 (文件大小：548K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Page 1 of 3

CPA Series (2512)

Construction:

Features:



High Purity Alumina ceramic

Nickel alloy thin-film resistive element

Epoxy-resin overcoat

Pre-tinned (Sn100, matte) terminations over

Ni barrier is standard (RoHS and Pb Free)

Halogen Free



TCR’s to ± 25ppm/ºC

Tolerances less than ± 1% available

Standard and custom sizes & terminations

available (Sn60Pb40 option)

High volume production, suitable for

commercial and special applications

Competitive pricing



Description:

These power resistors are designed to tolerate high current and establish a low thermal resistance interface with the circuit board. A

lower thermal resistance more efficiently sinks heat to the board, enabling a larger effective area for heat dissipation. As a result,

much lower surface temperatures are achievable in comparison to standard chip resistors for the same chip size and applied power.

Dimensions:

Size

Metric

6332

Standard Dimensions (mm)

Inch

2512

T-top

T-btm

6.3 ± 0.2

3.2 ± 0.2

0.7± 0.1

0.9 ± 0.2 2.0 ± 0.2

Call for other sizes and/or termination styles

Electrical Specifications:

Size: Inch (Metric)

Rated Power ^{1, 2}

CPA2512 Derating Curve Examples: ⁶

2512 (6332)

Up to 16W ^{1, 2}

√(PxR)

Rated Voltage

Resistance Tolerance

± 1%

3.3 to 120 Ω

Standard Resistance Values (E12)

TCR (ppm/ºC) ³

Call for other values

22 thru 120 Ω

± 25 (E)

± 50 (Q)

3.3 thru 20 Ω

Operating Temperature Range ⁴

Insulation Resistance (100V, 1min) ⁵

Notes:

-55 to 155ºC

> 1GΩ

1. Dependent on effective thermal conductivity/resistance of board construction/land design and size of board - greater power

capability for board/land with lower thermal resistance. For relatively high thermal resistance mountings, the power resistors are

capable of generating sufficient heat to reflow solder bonds without device damage.

2. Refer to Thermal Performance Plot below.

3. Per MIL-PRF-55342 (-55/25/125ºC).

4. Per MIL-PRF-55342.

5. Per IEC 60115-1.

6. Derating curves are derived from the thermal performance plots.

Page 2 of 3

Thermal Performance:

Peak Surface Temperature Rise of CPA2512 per Board Thermal Resistance and Applied Power

(see notes below for details)

250

200

150

100

16W

10W

0.1

100

Thermal Resistance of Board (C/W)

Notes:

Plots produced by characterization of thermal coefficients determined from experimental measurements (by thermal imaging

camera) at thermal equilibrium with parts mounted to various boards (with homogeneous thermal conductivity to minimize

uncertainty) per recommended solder pad dimensions and with boards pressed against a Cu carrier/heat-sink (not ideal) with a

thermal compound interface in a static environment (no air flow).

Heat flow primarily through thickness of board with virtually zero lateral heat transfer in board.

Thermal resistance of test boards were calculated based on material manufacturer specified thermal conductivity (20ºC) via the

following: Thermal Resistance (ºC/W) = L / (k • A), where Thermal Conductivity, k (W/m•K) = (L / (A • ΔT)) • ΔQ/Δt, L =

Thickness of board in meters and A = area of chip resistor in meters (2512 size = 6.3x3.2mm)

The relationships between peak surface temperature rise, power, and board thermal resistance are linear, but the x-axis is plotted

in log-scale to offer greater resolution at lower board thermal resistances.

Recommended Solder Pad Dimensions:

Feature

Standard Dimensions (mm)

1.6

7.7

3.5

Page 3 of 3

Environmental Performance Specifications:

Test

Reference

Conditions of Test

Requirement

MIL-PRF-55342,

MIL-STD-202

Method 108A

MIL-PRF-55342,

MIL-STD-202

Method 107G

MIL-PRF-55342

Life ⁴

70ºC, 2000h, rated power ³, 1.5h on, 0.5h off

± 0.5% + 0.01Ω

± 0.1% + 0.01Ω

Condition F-3, -65ºC/0.25h to 155ºC/0.25h, 100

cycles

Thermal Shock

High Temperature Exposure

Short Time Overload

155ºC, 100h

± 0.1% + 0.01Ω

2.5 x rated voltage ³, 5 sec.

85°C / 85%RH, 2,000 hours

24h/cycle, with and without bias, bias = 1.5h on,

0.5h off @ 1/10^thrated power ³

Moisture Load Life

JEDEC 22-A101

± 0.5% + 0.01Ω

± 0.1% + 0.01Ω

MIL-PRF-55342,

MIL-STD-202

Method 210F

Resistance to Soldering Heat ¹

260ºC for 15 sec., over 220ºC for 60 sec., 3 cycles

MIL-PRF-55342,

MIL-STD-202

Method 208H

IEC 60115-1 /

JIS C 5202

Precondition E: 150ºC dry bake for 16h,

Method 1 “Dip and Look Test”, 245ºC, 5 sec., Pb-

free (SnAgCu) Solder

Bend amount of 3mm, measurements during and

after bend

Min 95% coverage

of critical area

Solderability ²

Board Flex

± 0.1% + 0.01Ω,

No mech. damage

Terminal Strength

Notes:

MIL-PRF-55342

Force of 3kg for 30 sec.

1. Test conditions modified to represent the high temperature Pb-free reflow conditions and an extra cycle is added.

2. JESD22-B102D adds test conditions for Pb-free and is aligned with J-STD-002B referenced in MIL-STD-202 Method 208H.

JESD22-B102D procedure comes from EIA-638, “Surface Mount Solderability Test”.

3. Parts mounted to boards in accordance with NEMA grade FR-4 of IPC-4101 (62mils thick) with no Cu carrier/heat-sink at a rated

power of 2W (Board Therm. Res. ~ 72C/W).

4. Due to the complexity of managing the heat load of hundreds of pieces during qualification, long-term reliability testing for the

16W power rating had been conducted in terms of the equivalent current density via much thinner/narrower resistor patterns to

limit the heat load. Full power testing was conducted on a smaller scale.

Marking:

Marking shall include:

Material Designator (A = Alumina)

The 4-digit Resistance Value (MIL-STD-1285D)

Ex. A27R0 = 27.0Ω Resistance with Alumina Material

Part Numbering: (Ex. CPA2512E27R0FS-T10)

2512

27R0

Resistance

Value

Ex. 27R0

= 27.0 Ω

-T10

Product

Designator

Material

Designator

Custom

Packaging

Tape & Reel

-T10 = 1000

-T50 = 5000

Size, Inch

Refer to

TCR

Tolerance

Designator

Standard = S

Custom = TBD

E =

± 25 ppm/ºC

± 50 ppm/ºC

A = Alumina

F = ± 1%

table above Q =

Note: When requesting quotes or ordering parts, it is not necessary to add the T&R package quantity (-T##) to the end of the part

number. This will be added by us based on the quantity ordered.

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