CXG1146EN [ETC]
High Power SP3T Switch with Logic Control ; 大功率SP3T开关与逻辑控制\n
| 型号： | CXG1146EN |
| 厂家： | 
ETC |
| 描述： | High Power SP3T Switch with Logic Control
|
| 文件： | 总5页 (文件大小：52K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CXG1146EN
High Power SP3T Switch with Logic Control
Description
10 pin VSON (Plastic)
The CXG1146EN is a high power SP3T switch
MMIC.This IC can be used in wireless communication
systems, for example, W-CDMA handsets.
The CXG1146EN has on-chip logic for operation
with 2 CMOS control inputs.
The Sony's J-FET process is used for low insertion
loss and on-chip logic circuit.
Features
• Low insertion loss: 0.35dB @1.95GHz,
0.45dB @2.14GHz
• 2 CMOS compatible control line
• Small package size: 10-pin VSON
Applications
• Antenna switch for cellular handsets
• W-CDMA
Structure
GaAs J-FET MMIC
Absolute Maximum Ratings (Ta = 25°C)
• DC power supply voltage VDD
7
5
V
V
• Control voltage
Vctl
• Operating temperature
• Storage temperature
Topr
–35 to +85 °C
Tstg –65 to +150 °C
GaAs MMICs are ESD sensitive devices. Special handling precautions are required.
The actual ESD measurement data will be available later.
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
– 1 –
E02710-PS
CXG1146EN
Pin Configuration and Block Diagram
GND
6
7
5
4
3
2
1
RF1
RF2
F1
F2
GND
GND
V
DD
8
RF3
GND
9
CTLB
CTLA
10
RF4
F3
GND
Pin Description
Pin No. Symbol
Description
1
2
RF4
RF input/output. Connect capacitor (recommended value: 100pF) in use.
GND
RF3
GND
3
RF input/output. Connect capacitor (recommended value: 100pF) in use.
4
GND
RF2
GND
5
RF input/output. Connect capacitor (recommended value: 100pF) in use.
6
RF1
RF input/output. Connect capacitor (recommended value: 100pF) in use.
7
GND
VDD
GND
8
DC power supply
Logic control B
Logic control A
9
CTLB
CTLA
10
– 2 –
CXG1146EN
Recommended Circuit
GND
6
7
5
4
3
2
1
RF1
RF2
F1
F2
L1 (15nH)
CRF
GND
GND
VDD
8
RF3
Cbypass (100pF)
9
GND
CTLB
CTLA
Rctl (1kΩ)
Cbypass (100pF)
RF4
10
F3
Rctl (1kΩ)
CRF
Cbypass (100pF)
GND
When using this IC, the following external components should be used:
Rctl:
This resistor is used to improve ESD performance. 1kΩ is recommended.
This capacitor is used for RF de-coupling and must be used for all applications.
CRF:
Cbypass: This capacitor is used for DC line filtering. 100pF is recommended.
TruthTable
State CTLA CTLB
On state
RF1 – RF2
RF1 – RF3
RF1 – RF4
F1
F2
F3
1
2
3
H
L
H
H
L
ON OFF OFF
OFF ON OFF
OFF OFF ON
H/L
DC Bias Condition
(Ta = 25°C)
Item
Vctl (H)
Min.
Typ.
3.0
—
Max.
Unit
V
2.0
0
3.6
0.4
3.6
Vctl (L)
V
VDD
2.5
3.0
V
– 3 –
CXG1146EN
Electrical Characteristics
(Ta = 25°C)
Max. Unit
Item
Symbol State
Condition
Min.
Typ.
0.35
0.45
0.45
0.55
0.90
1.00
25
1
1
1
1
1
1
1
1
1
1920MHz to 1980MHz
2110MHz to 2170MHz
1920MHz to 1980MHz
2110MHz to 2170MHz
1920MHz to 1980MHz
2110MHz to 2170MHz
0.55
0.65
0.65
0.75
1.10
1.20
dB
dB
1
2
3
RF1 – RF2
RF1 – RF3
RF1 – RF4
dB
Insertion loss
IL
dB
dB
dB
2, 3
3, 1
1, 2
RF1 – RF2, 1920MHz to 2170MHz
RF1 – RF3, 1920MHz to 2170MHz
RF1 – RF4, 1920MHz to 2170MHz
20
20
20
dB
1
Isolation
ISO.
30
dB
30
dB
VSWR
VSWR
50Ω
1.2
1.5
5
—
1
Switching speed TSW
1
µs
2
2
2
2
ACLR1 ±5MHz
–60
–65
–80
–80
0.25
30
–50
–55
–55
–55
0.42
70
dBc
dBc
dBc
dBc
mA
µA
ACLR
ACLR2 ±10MHz
2fo
3fo
IDD
Ictl
Harmonics
Bias current
VDD = 3.0V
Control current
Vctl (H) = 3V
Condition
1
Pin = 25dBm, 0/3V control, VDD = 3.0V
2
Pin = 25dBm, 0/3V control, VDD = 3.0V, 1920MHz to 1980MHz, 50Ω
Note: Specification value is one on the IC terminal except for the specific description.
– 4 –
CXG1146EN
Package Outline
Unit: mm
10PIN VSON(PLASTIC)
+ 0.1
0.8 – 0.05
0.6
2.5
0.05
S
A
S
6
10
PIN 1 INDEX
1
5
B
x2
0.4
0.8
0.35 ± 0.1
S
0.15
B
x4
0.15
AB
S
A
B
0.05 M
S
Solder Plating
0.13 ± 0.025
+ 0.09
0.14 – 0.03
TERMINAL SECTION
1) The dimensions of the terminal section apply to the
NOTE:
ranges of 0.1mm and 0.25mm from the end of a terminal.
PACKAGE STRUCTURE
EPOXY RESIN
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
SOLDER PLATING
COPPER ALLOY
0.013g
SONY CODE
VSON-10P-01
EIAJ CODE
JEDEC CODE
PACKAGE MASS
LEAD SPECIFICATIONS
ITEM
LEAD MATERIAL
LEAD TREATMENT
SPEC.
COPPER ALLOY
Sn-Bi 2.5%
LEAD TREATMENT THICKNESS 5-18µm
Sony Corporation
– 5 –
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