FM25C640ULZN [ETC]

SPI Serial EEPROM ; SPI串行EEPROM\n
FM25C640ULZN
型号: FM25C640ULZN
厂家: ETC    ETC
描述:

SPI Serial EEPROM
SPI串行EEPROM\n

可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器
文件: 总11页 (文件大小:103K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
May 2001  
FM25C640U  
64K-Bit SPI™ Interface  
Serial CMOS EEPROM  
General Description  
Functions  
The FM25C640U is a 64K bit serial interface CMOS EEPROM  
(Electrically Erasable Programmable Read-Only Memory). This  
device fully conforms to the SPI 4-wire protocol which uses Chip  
Select (/CS), Clock (SCK), Data-in (SI) and Data-out (SO) pins to  
synchronouslycontroldatatransferbetweentheSPImicrocontroller  
andtheEEPROM.Inaddition,theserialinterfaceallowsaminimal  
pin count, packaging designed to simplify PC board layout re-  
quirementsandoffersthedesigneravarietyoflowvoltageandlow  
power options.  
I SPI MODE 0 interface  
I 64K bits organized as 8K x 8  
I Extended 2.7V to 5.5V operating voltage  
I 2.1 MHz operation @ 4.5V - 5.5V  
I Self-timed programming cycle  
I "Programming complete" indicated by STATUS REGISTER  
polling  
I /WP pin and BLOCK WRITE protection  
Features  
This SPI EEPROM family is designed to work with the 68HC11 or  
any other SPI-compatible, high-speed microcontroller and offers  
both hardware (/WP pin) and software ("block write") data protec-  
tion. For example, entering a 2-bit code into the STATUS REGIS-  
TER prevents programming in a selected block of memory and all  
I Sequential read of entire array  
I 32 byte "Page write" mode to minimize total write time per  
byte  
programming can be inhibited by connecting the /WP pin to VSS  
;
allowing the user to protect the entire array or a selected section.  
In addition, SPI devices feature a /HOLD pin, which allows a  
temporary interruption of the datastream into the EEPROM.  
I /WP pin and BLOCK WRITE protection to prevent inadvert-  
ent programming as well as programming ENABLE and  
DISABLE opcodes.  
I /HOLD pin to suspend data transfer  
Fairchild EEPROMs are designed and tested for applications  
requiring high endurance, high reliability, and low power con-  
sumption for a continuously reliable non-volatile solution for all  
markets.  
I Typical 1µA standby current (ISB) for "L" devices and 0.1µA  
standby current for "LZ" devices.  
I Endurance: Up to 1,000,000 data changes  
I Data retention greater than 40 years  
Block Diagram  
/CS  
/HOLD  
SCK  
VCC  
VSS  
Instruction  
Decoder  
Control Logic  
and Clock  
/WP  
Instruction  
SI  
Generators  
Register  
Program  
Enable  
Address  
Counter/  
Register  
High Voltage  
Generator  
and  
Program  
Timer  
VPP  
Decoder  
EEPROM Array  
Read/Write Amps  
Data In/Out Register  
8 Bits  
Data Out  
Buffer  
SO  
Non-Volatile  
Status Register  
SPI™ is a trademark of Motorola Corporation  
1
© 2001 Fairchild Semiconductor Corporation  
FM25C640U  
www.fairchildsemi.com  
Connection Diagram  
Dual-In-Line Package (N) and SO Package (M8)  
/CS  
SO  
1
2
3
4
8
7
6
5
VCC  
/HOLD  
SCK  
SI  
FM25C640U  
Top View  
/WP  
VSS  
See Package Number N08E (N) and M08A (M8)  
Pin Names  
/CS  
SO  
Chip Select Input  
Serial Data Output  
Write Protect  
/WP  
VSS  
Ground  
SI  
Serial Data Input  
Serial Clock Input  
Suspends Serial Data  
Power Supply  
SCK  
/HOLD  
VCC  
Ordering Information  
FM  
25  
C
XX  
U
LZ E  
XX  
Letter Description  
Package  
N
8-pin DIP  
M8  
8-pin SO  
Temp. Range  
None  
0 to 70°C  
V
E
-40 to +125°C  
-40 to +85°C  
Voltage Operating Range  
Blank  
L
4.5V to 5.5V  
2.7V to 4.5V  
LZ  
2.7V to 4.5V and  
<1µA Standby Current  
Ultralite  
640  
C
CS100UL Process  
64K, mode 0  
CMOS technology  
SPI  
Density/Mode  
Interface  
25  
FM  
Fairchild Nonvolatile  
Memory Prefix  
2
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FM25C640U  
Standard Voltage 4.5 VCC 5.5V Specifications  
Operating Conditions  
Absolute Maximum Ratings (Note 1)  
Ambient Operating Temperature  
FM25C640U  
Ambient Storage Temperature  
-65°C to +150°C  
0°C to +70°C  
-40°C to +85°C  
-40°C to +125°C  
All Input or Output Voltage with  
Respect to Ground  
FM25C640UE  
FM25C640UV  
+6.5V to -0.3V  
+300°C  
Lead Temp. (Soldering, 10 sec.)  
ESD Rating  
Power Supply (VCC  
)
4.5V to 5.5V  
2000V  
DC and AC Electrical Characteristics 4.5V VCC 5.5V (unless otherwise specified)  
Symbol  
Parameter  
Conditions  
Min  
Max  
Units  
ICC  
ICCSB  
IIL  
Operating Current  
/CS = VIL  
3
50  
mA  
µA  
µA  
µA  
V
Standby Current  
/CS = VCC  
Input Leakage  
VIN = 0 to VCC  
VOUT = GND to VCC  
-1  
-1  
+1  
IOL  
Output Leakage  
+1  
VIL  
CMOS Input Low Voltage  
CMOS Input High Voltage  
Output Low Voltage  
Output High Voltage  
SCK Frequency  
-0.3  
VCC * 0.3  
VCC + 0.3  
0.4  
VIH  
VOL  
VOH  
fOP  
0.7 * VCC  
V
IOL = 1.6 mA  
IOH = -0.8 mA  
V
VCC - 0.8  
V
2.1  
2.0  
2.0  
MHz  
µs  
µs  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ms  
tRI  
Input Rise Time  
tFI  
Input Fall Time  
tCLH  
tCLL  
tCSH  
tCSS  
tDIS  
tHDS  
tCSN  
tDIN  
tHDN  
tPD  
Clock High Time  
Clock Low Time  
(Note 2)  
(Note 2)  
(Note 3)  
190  
190  
240  
240  
100  
90  
Min /CS High Time  
/CS Setup Time  
Data Setup Time  
/HOLD Setup Time  
/CS Hold Time  
240  
100  
90  
Data Hold Time  
/HOLD Hold Time  
Output Delay  
CL = 200 pF  
240  
tDH  
Output Hold Time  
/HOLD to Output Low Z  
Output Disable Time  
/HOLD to Output High Z  
Write Cycle Time  
0
tLZ  
100  
240  
100  
10  
tDF  
CL = 200 pF  
tHZ  
tWP  
116 Bytes  
Capacitance TA = 25°C, f = 2.1/1 MHz (Note 4)  
AC Test Conditions  
Output Load  
CL = 200 pF  
Symbol  
COUT  
Test  
Typ Max Units  
Input Pulse Levels  
0.1 * VCC 0.9 * VCC  
Output Capacitance  
Input Capacitance  
3
2
8
6
pF  
pF  
Timing Measurement Reference Level 0.3 * VCC - 0.7 * VCC  
CIN  
Note 1: Stress above those listed under Absolute Maximum Ratingsmay cause permanent damage to the device. This is a stress rating only, and functional operation of the  
device at these or any other conditions above those indicated in the operational sections of the specification is not implied. Exposure to absolute maximum rating conditions for  
extended periods may affect device reliability.  
Note 2: The fOP frequency specification specifies a minimum clock period of 1/fOP. Therefore, for every fOP clock cycle, tCLH + tCLL must be equal to or greater than 1/fOP. For  
example, for a fOP of 2.1MHz, the period equals 476ns. In this case if t CLH = is set to 190ns, then tCLL must be set to a minimum of 286ns.  
Note 3: /CS must be brought high for a minimum of tCSH between consecutive instruction cycles.  
Note 4: This parameter is periodically sampled and not 100% tested.  
3
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FM25C640U  
Low Voltage 2.7V VCC 4.5V Specifications  
Operating Conditions  
Absolute Maximum Ratings (Note 5)  
Ambient Storage Temperature  
-65°C to +150°C  
Ambient Operating Temperature  
FM25C640UL/LZ  
0°C to +70°C  
-40°C to +85°C  
-40°C to +125°C  
All Input or Output Voltage with  
Respect to Ground  
FM25C640ULE/LZE  
FM25C640ULV  
+6.5V to -0.3V  
+300°C  
Lead Temp. (Soldering, 10 sec.)  
ESD Rating  
Power Supply (VCC  
)
2.7V4.5V  
2000V  
DC and AC Electrical Characteristics 2.7V VCC 4.5V (unless otherwise specified)  
25C640UL/LE  
25C640ULZ/ZE  
25C640ULV  
Symbol  
Parameter  
Part  
Conditions  
Min.  
Max.  
Min  
Max  
Units  
ICC  
Operating Current  
Standby Current  
/CS = VIL  
3
3
mA  
ICCSB  
L
LZ  
/CS = VCC  
10  
1
10  
N/A  
µA  
µA  
IIL  
Input Leakage  
VIN = 0 to VCC  
-1  
-1  
1
1
-1  
-1  
1
1
µA  
µA  
V
IOL  
Output Leakage  
Input Low Voltage  
Input High Voltage  
Output Low Voltage  
Output High Voltage  
SCK Frequency  
Input Rise Time  
VOUT = GND to VCC  
VIL  
-0.3  
VCC * 0.3  
-0.3  
VCC * 0.3  
VIH  
VOL  
VOH  
fOP  
tRI  
VCC * 0.7 VCC + 0.3  
VCC * 0.7 VCC + 0.3  
V
IOL = 0.8 mA  
0.4  
0.4  
V
IOH = 0.8 mA  
VCC - 0.8  
VCC - 0.8  
V
1.0  
1.0  
MHz  
µs  
µs  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ms  
2.0  
2.0  
tFI  
Input Fall Time  
2.0  
2.0  
tCLH  
tCLL  
tCSH  
tCSS  
tDIS  
tHDS  
tCSN  
tDIN  
tHDN  
tPD  
Clock High Time  
Clock Low Time  
Min. /CS High Time  
/CS Setup Time  
Data Setup Time  
/HOLD Setup Time  
/CS Hold Time  
(Note 6)  
(Note 6)  
(Note 7)  
410  
410  
500  
500  
100  
240  
500  
100  
240  
500  
0
410  
410  
500  
500  
100  
240  
500  
100  
240  
500  
0
Data Hold Time  
/HOLD Hold Time  
Output Delay  
CL = 200 pF  
tDH  
tLZ  
Output Hold Time  
/HOLD Output Low Z  
Output Disable Time  
/HOLD to Output Hi Z  
Write Cycle Time  
240  
500  
240  
15  
240  
500  
240  
15  
tDF  
CL = 200 pF  
1-16 Bytes  
tHZ  
tWP  
Capacitance TA = 25°C, f = 2.1/1 MHz (Note 8)  
AC Test Conditions  
Output Load  
CL = 200pF  
Symbol  
COUT  
Test  
Typ Max Units  
Input Pulse Levels  
0.1 * VCC - 0.9 * VCC  
Output Capacitance  
Input Capacitance  
3
2
8
6
pF  
pF  
Timing Measurement Reference Level 0.3 * VCC - 0.7 * VCC  
CIN  
Note 5: Stress above those listed under Absolute Maximum Ratingsmay cause permanent damage to the device. This is a stress rating only, and functional operation of the device  
at these or any other conditions above those indicated in the operational sections of the specification is not implied. Exposure to absolute maximum rating conditions for extended  
periods may affect device reliability.  
Note 6: The fOP frequency specification specifies a minimum clock period of 1/fOP. Therefore, for every fOP clock cycle, tCLH + tCLL must be equal to or greater than 1/fOP. For  
example, for a fOP of 1MHz, the period equals 1000ns. In this case if tCLH = is set to 410ns, then tCLL must be set to a minimum of 590ns.  
Note 7: /CS must be brought high for a minimum of tCSH between consecutive instruction cycles.  
Note 8: This parameter is periodically sampled and not 100% tested.  
4
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FM25C640U  
FIGURE 1. Synchronous Data Timing Diagram  
t
CSI  
/CS  
t
t
t
t
CSH  
CSS  
CLH  
CLL  
Mode 3  
Mode 0  
Mode 3  
Mode 0  
SCK  
SI  
t
t
DIH  
DIS  
Valid Input  
t
t
t
DF  
PD  
DH  
High Z  
SO  
Valid Output  
FIGURE 2. SPI Protocol  
/CS  
Mode 3  
Mode 3  
SCK  
Don't Care  
SI  
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0  
High Z  
SO  
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0  
FIGURE 3. HOLD Timing  
CS  
Low state ( /CS = 0)  
t
t
t
t
HDH  
HDS HDH  
HDS  
Don't Care  
SCK  
/HOLD  
t
t
HZ  
LZ  
High Z  
Output (n+2)  
Output (n+1)  
Input (n+1)  
Output (n)  
Output (n)  
Input (n)  
SO  
t
DIS  
Input (n+2)  
Input (n)  
Don't Care  
SI  
5
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FM25C640U  
Pin Description  
Functional Description  
The Serial Peripheral Interface (SPI) of FM25C640U consists of  
an 8-bit Instruction register to decode a specific instruction to be  
executed. Six different instructions (Opcodes) are incorporated  
on FM25C640U for various operations. Table2 lists the instruc-  
tions set and the format for proper operation. All Opcodes, Array  
addresses and Data are transferred in MSB first-LSB last”  
fashion. Detailed information is provided under individual instruc-  
tion descriptions.  
Chip Select (/CS)  
This is an active low input pin to the EEPROM and is generated by  
a master that is controlling the EEPROM. A low level on this pin  
selects the EEPROM and a high level deselects the EEPROM. All  
serial communications with the EEPROM is enabled only when  
this pin is held low.  
Serial Clock (SCK)  
TABLE 2. Instruction Set  
ThisisaninputpintotheEEPROMandisgeneratedbythemaster  
that is controlling the EEPROM. This is a clock signal that  
synchronizes the communication between a master and the  
EEPROM. All input information (SI) to the EEPROM is latched on  
the rising edge of this clock input, while output data (SO) from the  
EEPROM is driven after the falling edge of this clock input.  
Instruction Instruction  
Operation  
Name  
WREN  
WRDI  
Opcode  
00000110  
00000100  
00000101  
00000001  
00000011  
Write Enabled  
Write Disabled  
Serial Input (SI)  
RDSR  
WRSR  
READ  
Read Status Register  
Write Status Register  
ThisisaninputpintotheEEPROMandisgeneratedbythemaster  
that is controlling the EEPROM. The master transfers Input  
information (Instruction Opcodes, Array addresses and Data)  
serially via this pin into the EEPROM. This Input information is  
latched on the rising edge of the SCK.  
Read Data from Memory  
Array  
WRITE  
00000010  
Write Data to Memory Array  
Serial Output (SO)  
In addition to the Instruction register, FM25C640U also contains  
an8-bitStatusregisterthatcanbeaccessedbyRDSRandWRSR  
instructions. Only the least significant (LSB) 4 bits are defined at  
present and the most significant (MSB) 4 bits are undefined (dont  
care).TheLSB4bitsdefineBlockWriteProtectionlevels(BP1and  
BP0), Write-enable status (WEN) and Busy/Rdy status (/RDY) of  
the EEPROM. Table 3 illustrates the format:  
This is an output pin from the EEPROM and is used to transfer  
Output data via this pin to the controlling master. Output data is  
serially shifted out on this pin after the falling edge of the SCK.  
Hold (/HOLD)  
This is an active low input pin to the EEPROM and is generated by  
the master that is controlling the EEPROM. When driven low, this  
pin suspends any current communication with the EEPROM. The  
suspended communication can be resumed by driving this pin  
high. This feature eliminates the need to re-transmit the entire  
sequence by allowing the master to resume the communication  
from where it was left off. This pin should be tied high if this feature  
is not used. Refer Hold Function description for additional  
details.  
TABLE 3. Status Register Format  
Bit  
7
Bit  
6
Bit  
5
Bit  
4
Bit  
3
Bit  
2
Bit  
1
Bit  
0
X
X
X
X
BP1  
BP0 WEN RDY  
Refer RDSR and WRSR instruction descriptions for additional  
information on Status register operations.  
Write Protect (/WP)  
This is an active low input pin to the EEPROM. This pin allows  
enabling and disabling of writes to memory array and status  
register of the EEPROM. When this pin is held low, writes to the  
memory array and status register are disabled. When this pin is  
held high, writes to the memory array and status register are  
enabled. Status of this pin does not affect operations other than  
array write and status register write. /WP signal going low at any  
time will inhibit programming, except when an internal write has  
already begun. If an internal write cycle has already begun, /WP  
signal going low will have no effect on the write. Refer Table1 for  
Write Protection matrix.  
Table1. Write Protection Matrix  
Protected Blocks  
/WP Pin  
Low  
WEN Bit  
Status Register  
Write Protected  
Write Protected  
Write Allowed  
(by BP1-BP0)  
Write Protected  
Write Protected  
Write Protected  
Unprotected Blocks  
Write Protected  
X
0
1
High  
Write Protected  
High  
Write Allowed  
6
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FM25C640U  
SPI Modes 0 and 3 (00 and 11)  
Functional Description (Continued)  
FM25C640U supports both Mode 0 and Mode 3 of operations.  
The difference between Mode 0 and Mode 3 is determined by the  
state of the SCK clock signal when a SPI cycle starts (when /CS  
is driven low) as well as when the SPI cycle ends (when /CS is  
drivenhigh).UnderMode0ofoperation,theSCKsignalisheldlow  
both at the start and at the end of a SPI cycle. Under Mode 1 of  
operation, the SCK signal is held high both at the start and at the  
end of a SPI cycle. However in both of these two modes, the input  
data(SI)issampled(latchedin)attherisingedgeoftheSCKclock  
signal and the output data (SO) is driven after the falling edge of  
the SCK clock signal. See Figure 1 and Figure 2.  
SPI communication  
As mentioned before, serial communication with the EEPROM is  
enabled when the /CS pin is held low and the /HOLD pin is held  
high. Input data (Instruction Opcodes, Array addresses and Data)  
on the SI pin is latched in on the rising edges of SCK clock signal,  
startingfromthefirstrisingedgeafterthe/CSpingoeslow. During  
the time the SI data is input into the EEPROM, the SO pin remains  
in high impedance state. If the intended instruction is of read  
nature (Array read and Status register read), then data from the  
EEPROM is driven out actively on the SO pin from every falling  
edge of the SCK after the last input data (SI) is latched in. During  
the time the SO data is output from the EEPROM, the data on the  
SI pin is ignored. Figure 2 illustrates the above. Refer Figure 1 for  
timing information.  
READ SEQUENCE (READ)  
Reading the memory via the serial SPI link requires the following  
sequence. The/CS pin is pulled low to select the EEPROM. The  
READ opcode is transmitted on the SI pin followed by two bytes of  
address, "High byte addr" (A15-A8) and "Low byte addr" (A7-A0).  
After this is done, data on the SI pin becomes don't care. The data  
(D7-D0)formtheaddressspecifiedisthenshiftedoutontheSOpin.  
If only one byte is to be read, the /CS pin can be pulled back to the  
high level. It is possible to continue the READ sequence as the byte  
address is automatically incremented and data will continue to be  
shifted out as clock pulses are continuously applied. When the end  
ofmemoryarrayisreached(lastbytelocation),theaddresscounter  
rolls over to the start of memory array (first byte location) allowing  
the entire memory to be read in one continuous READ cycle. See  
Figure 5. Note that only A12-A0 address bits are treated valid by  
FM25C640U while bits A15-A13 are ignored.  
HOLD function  
An active communication with the EEPROM can be temporarily  
suspended by bringing the /HOLD pin low when a EEPROM is  
selected (/CS pin should be low) and a serial sequence with the  
EEPROM is currently underway. To suspend the communication,  
/HOLDpinmustbedrivenlowwhileSCKislow,otherwisetheHold  
function will not be invoked until the next SCK high to low  
transition. The EEPROM must remain selected during this se-  
quence. TransitionsontheSCKandSIpinsareignoredduringthe  
time the part is suspended and the SO pin will be in high  
impedance state. Releasing the /HOLD pin back to high state will  
allow the operation to resume from the point it was suspended.  
/HOLD pin must be driven high while the SCK pin is low, otherwise  
serial communication will not resume until the next SCK high to  
low transition. Asserting a low on the /HOLD pin at any time will tri-  
state the SO pin. Figure 3 illustrates Hold timing.  
FIGURE 5. Read Sequence  
CS  
Read  
Opcode  
High Byte  
Addr  
Low Byte  
Addr  
SI  
System Configuration  
WhenmultipleSPIperipherals(fore.g.EEPROMs)arepresenton  
the bus, the SI, SO and the SCK signals can be tied together.  
Figure 4 illustrates a typical system configuration with respect to  
/CS, SCK, SI and SO pins.  
Data  
(1)  
Data  
(2)  
Data  
(n)  
SO  
READ STATUS REGISTER (RDSR):  
The Read Status Register (RDSR) instruction provides read  
access to the status register. As mentioned before, of the 8bits of  
data, only the LSB 4bits are valid and they indicate Block Protec-  
tion information (BP1 and BP0), Write Enable status (WEN) and  
Busy/Ready status (/RDY) of the EEPROM. MSB 4bits of are  
invalid (Dont cares) Following is the format of RDSR data:  
FIGURE 4. System Configuration  
MASTER MCU  
FM25Cxxx  
DATA OUT (MOSI)  
SI  
DATA IN (MISO)  
SO  
SERIAL CLOCK (SPICK)  
SCK  
TABLE 3. Status Register Format  
SS0  
SS1  
SS2  
SS3  
/CS  
Bit  
7
Bit  
6
Bit  
5
Bit  
4
Bit  
3
Bit  
2
Bit  
1
Bit  
0
SPI  
SI  
SO  
SCK  
/CS  
CHIP  
X
X
X
X
BP1  
BP0 WEN RDY  
SELECTION  
Bit3 (BP1) and Bit2 (BP0) together indicate Block write protection  
previously set on the EEPROM. Refer Table 2.  
SI  
Bit1 (WEN) indicates the Write enable status of the EEPROM.  
This bit is a read-only bit and is read by executing RDSR  
instruction. If this bit is 1then the EEPROM is write enabled. If  
this bit is 0then the EEPROM is write disabled.  
SO  
SCK  
/CS  
SI  
SO  
SCK  
/CS  
7
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FM25C640U  
Bit0 (/RDY) indicates the Busy/Ready status of the EEPROM.  
This bit is a read-only bit and is read by executing RDSR  
instruction. If this bit is 1then the EEPROM is busy doing a  
program cycle. If this bit is 0then the EEPROM is ready.  
WRITE SEQUENCE (WRITE):  
Write to the array is enabled only when /WP pin is held high and  
the EEPROM is write enabled previously (via WREN instruction).  
Also, the address of the memory location(s) to be programmed  
must be outside the protected address field selected by the Block  
Write Protection Level. See Table 4.  
Note that if a RDSR instruction is executed when an internal  
programming cycle is in progress, only the /RDY bit is valid.  
All other bits are don’t cares.  
TABLE 4. Block Write Protection Levels  
The RDSR command requires the following sequence. The /CS  
pin is pulled low to select the EEPROM and then the RDSR  
opcode is transmitted on the SI pin. After this is done, data on the  
SI pin becomes dont care. The data from the Status Register is  
then shifted out on the SO pin starting with D7 bit first and D0 last.  
See Figure 6.  
Level  
Status Register Bits  
Array  
Address  
Protected  
None  
BP1  
0
BP0  
0
0
1
2
3
0
1
1
1
0
1
1800-1FFF  
1000-1FFF  
0000-1FFF  
FIGURE 6. Read Status Register  
/CS  
A WRITE command requires the following sequence. The /CS pin  
is pulled llow to select the EEPROM, then the WRITE opcode is  
transmitted on the SI pin followed by two bytes of address, "High  
byteaddr"(A15-A8)and"Lowbyteaddr"(A7-A0), furtherfollowed  
bythedata(D7-D0)tobewritten.SeeFigure9.NotethatonlyA12-  
A0 address bits are treated valid by FM25C640U while bits A15-  
A13 are ignored.  
RDSR  
OP-CODE  
SI  
SO  
RDSR DATA  
WRITE ENABLE (WREN):  
When VCC is applied to the EEPROM, it powers upin a write-  
disabledstate.Therefore,allprogrammingmodes(Writetomemory  
array and Status register), must be preceded by a WRITE EN-  
ABLE (WREN) instruction. See Figure 7.  
FIGURE 9. Byte Write  
CS  
FIGURE 7. Write Enable  
Write  
Opcode  
High Addr  
Byte  
Low Addr  
Byte  
Data  
SI  
/CS  
High Z  
SO  
SI  
WREN Op-Code  
Internally, the programming will start after the /CS pin is brought  
back to a high level. Note that the LOW to HIGH transition of the  
/CS pin must occur during the SCK low time immediately after  
clocking in the D0 data bit. See Figure 10.  
SO  
FIGURE 10. Start of Programming  
WRITE DISABLE (WRDI):  
Executing this instruction disables all programming modes (Write  
to memory array and Status register), preventing the EEPROM  
from accidental writes. Once WRDI instruction is executed,  
WREN instruction should be executed to re-enable all program-  
ming modes. See Figure 8.  
/CS  
Start of internal  
programming  
SCK  
FIGURE 8. Write Disable  
D2  
D1  
D0  
SI  
/CS  
High Z  
SO  
Programming status (Busy/Ready) of the EEPROM can be deter-  
mined by executing a READ STATUS REGISTER (RDSR) in-  
struction after a write command. Upon executing the RDSR  
instruction, if Bit 0 of the RDSR data is 1, it indicates the WRITE  
cycleisstillinprogress. Ifitis0thentheWRITEcyclehasended.  
Note that while the internal programming is still in progress (Bit 0  
= 1), only the RDSR instruction is enabled. It is recommended that  
no other instruction be issued till the internal programming is  
complete.  
SI  
WRDI Op-Code  
SO  
8
www.fairchildsemi.com  
FM25C640U  
The FM25C640U is also capable of a 32 byte PAGE WRITE  
operation. Page write is performed similar to byte write operation  
describedabove.DuringaPagewriteoperation,afterthefirstbyte  
of data, additional bytes (up to 31 bytes) can be input, before  
bringing the /CS pin high to start the programming. After receipt of  
each byte of data, the EEPROM internally increments the four low  
order address bits (A4-A0) by one. The high order address bits  
(A12-A5) will remain constant. If the master should transmit more  
than 32 bytes of data, the address counter (A4-A0) will roll over”  
and the previously loaded data will be reloaded. See Figure 11.  
FIGURE 12. Write Status Register  
/CS  
WRSR  
Op-Code  
SR Data  
xxxxBP1BP0xx  
SI  
SO  
FIGURE 11. Page Write  
Programming will start after the /CS pin is forced back to a high  
level. As in the WRITE instruction the LOW to HIGH transition of  
the /CS pin must occur during the SCK low time immediately after  
clocking in the last dont care bit. See Figure 13.  
CS  
Write  
Opcode  
High Addr  
Byte  
Low Addr  
Byte  
Data  
(1)  
Data  
(2)  
Data  
(32)  
SI  
FIGURE 13. Start WRSR Condition  
High Z  
SO  
At the completion of a write cycle the EEPROM is automatically  
returnedtothewritedisabledstate.NotethatiftheEEPROMisnot  
write enabled (WEN=0) before issuing the WRITE instruction, the  
EEPROM will ignore the WRITE instruction and return to the  
standby state when /CS is brought high.  
/CS  
SCK  
WRITE STATUS REGISTER (WRSR):  
BP0  
SI  
The Write Status Register (WRSR) instruction provides write  
access to the status register. This instruction is used to set Block  
Write protection to a portion of the array as defined under Table  
4. During a WRSR instruction only Bit3 (BP1) and Bit2 (BP0) can  
be written with valid information while other bits are ignored.  
Following is the format of WRSR data:  
SO  
At the completion of this instruction the EEPROM is automatically  
returned to write disabled state.  
Status Register Write Data  
INVALID OPCODE  
Bit  
7
Bit  
6
Bit  
5
Bit  
4
Bit  
3
Bit  
2
Bit  
1
Bit  
0
If an invalid code is received, then no data is shifted into the  
EEPROM, and the SO data output pin remains high impedance  
state until a new /CS falling edge reinitializes the serial communi-  
cation. See Figure 14.  
X
X
X
X
BP1  
BP0  
X
X
X = Dont Care  
Note that the first four bits are dont care bits followed by BP1 and  
BP0 and two more dont care bits.  
FIGURE 14. Invalid Op-Code  
/CS  
WRSR instruction is enabled only when /WP pin is held high and  
the EEPROM is write enabled previously (via WREN instruction).  
WRSR command requires the following sequence. The /CS pin is  
pulled low to select the EEPROM and then the WRSR opcode is  
transmitted on the SI pin followed by the data to be programmed.  
See Figure 12.  
SI  
INVALID CODE  
SO  
9
www.fairchildsemi.com  
FM25C640U  
Physical Dimensions inches (millimeters) unless otherwise noted  
0.189 - 0.197  
(4.800 - 5.004)  
8
7
6
5
0.228 - 0.244  
(5.791 - 6.198)  
1
2
3
4
Lead #1  
IDENT  
0.150 - 0.157  
(3.810 - 3.988)  
0.053 - 0.069  
(1.346 - 1.753)  
0.010 - 0.020  
(0.254 - 0.508)  
0.004 - 0.010  
(0.102 - 0.254)  
x 45°  
8° Max, Typ.  
All leads  
Seating  
Plane  
0.004  
(0.102)  
All lead tips  
0.0075 - 0.0098  
(0.190 - 0.249)  
Typ. All Leads  
0.014  
(0.356)  
0.016 - 0.050  
(0.406 - 1.270)  
Typ. All Leads  
0.050  
(1.270)  
Typ  
0.014 - 0.020  
Typ.  
(0.356 - 0.508)  
Molded Small Out-Line Package (M8)  
Package Number M08A  
10  
www.fairchildsemi.com  
FM25C640U  
Physical Dimensions inches (millimeters) unless otherwise noted  
0.373 - 0.400  
(9.474 - 10.16)  
0.090  
(2.286)  
8
7
0.032 0.005  
(0.813 0.127)  
RAD  
8
7
6
3
5
4
0.092  
(2.337)  
DIA  
0.250 - 0.005  
(6.35 0.127)  
Pin #1  
IDENT  
+
Pin #1 IDENT  
1
Option 1  
1
2
Option 2  
0.280  
MIN  
0.040  
(1.016)  
Typ.  
(7.112)  
0.030  
0.145 - 0.200  
(3.683 - 5.080)  
0.039  
(0.991)  
MAX  
(0.762)  
0.300 - 0.320  
(7.62 - 8.128)  
20° 1°  
0.130 0.005  
(3.302 0.127)  
0.125 - 0.140  
95° 5°  
(3.175 - 3.556)  
0.065  
(1.651)  
0.125  
(3.175)  
DIA  
0.020  
90° 4°  
Typ  
0.009 - 0.015  
(0.229 - 0.381)  
(0.508)  
Min  
NOM  
0.018 0.003  
(0.457 0.076)  
+0.040  
-0.015  
0.325  
0.100 0.010  
+1.016  
-0.381  
8.255  
(2.540 0.254)  
0.045 0.015  
(1.143 0.381)  
0.060  
(1.524)  
0.050  
(1.270)  
Molded Dual-In-Line Package (N)  
Package Number N08E  
Life Support Policy  
Fairchild's products are not authorized for use as critical components in life support devices or systems without the express written  
approval of the President of Fairchild Semiconductor Corporation. As used herein:  
1. Life support devices or systems are devices or systems which,  
(a)areintendedforsurgicalimplantintothebody,or(b)support  
or sustain life, and whose failure to perform, when properly  
used in accordance with instructions for use provided in the  
labeling, can be reasonably expected to result in a significant  
injury to the user.  
2. A critical component is any component of a life support device  
or system whose failure to perform can be reasonably ex-  
pected to cause the failure of the life support device or system,  
or to affect its safety or effectiveness.  
Fairchild Semiconductor  
Americas  
Fairchild Semiconductor  
Europe  
Fairchild Semiconductor  
Hong Kong  
Fairchild Semiconductor  
Japan Ltd.  
Customer Response Center  
Tel. 1-888-522-5372  
Fax:  
Tel:  
Tel:  
Tel:  
Tel:  
+44 (0) 1793-856858  
8/F, Room 808, Empire Centre  
68 Mody Road, Tsimshatsui East  
Kowloon. Hong Kong  
Tel; +852-2722-8338  
Fax: +852-2722-8383  
4F, Natsume Bldg.  
Deutsch  
English  
Français  
Italiano  
+49 (0) 8141-6102-0  
+44 (0) 1793-856856  
+33 (0) 1-6930-3696  
+39 (0) 2-249111-1  
2-18-6, Yushima, Bunkyo-ku  
Tokyo, 113-0034 Japan  
Tel: 81-3-3818-8840  
Fax: 81-3-3818-8841  
11  
www.fairchildsemi.com  
FM25C640U  

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