G547E2P81U [ETC]
Power Distribution Switch;
| 型号： | G547E2P81U |
| 厂家： | 
ETC |
| 描述： | Power Distribution Switch |
| 文件： | 总15页 (文件大小：1784K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
G547E/F/G/H/M
Global Mixed-mode Technology
Power Distribution Switch
Features
General Description
The G547 is an integrated power switch for
self-powered and bus-powered Universal Serial Bus
(USB) applications. G547E, G547F, G547G,G547H
ꢀ
90mΩ High-Side MOSFET
(G547E,G547F,G547G,G547H, G547M)
Available with 5 Versions of Current Limits with
Foldback
ꢀ
and G547M are 90mΩ RDS(ON)
.
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
Operating Range:2.7V to 5.5V
1mS Typical Rise Time
Fast Overcurrent Response -3ꢀs (TYPICAL)
Under voltage Lockout
100ꢀA Quiescent Supply Current
1ꢀA Maximum Shutdown Supply Current
Several Protection features include current limiting with
foldback, and thermal shutdown to prevent catastrophic
switch failure caused by increasing power dissipation
when continuous heavy loads or short circuit occurs. A
built-in charge pump is used to drive the N-channel
MOSFET that is free of parasitic body diode to elimi-
nate any reversed current flow across the switch when
it is powered off.
ꢀ Logic Level Enable Pin, Available with
Active-High or Active-Low Version
No Reverse Current when Power Off
ꢀ
ꢀ Deglitched Open-Drain Over-Current Flag
OC is open-drain output report over-current or
over-temperature event and has typical 9ms deglitch
timeout period.
Output (OC )
ꢀ
ꢀ
With Output Shutdown Pull-low Resister
SOT-23-6, SOP-8, MSOP-8 and TDFN3X3-8 Pack-
ages
Applications
ꢀ
UL Approved_#E232223
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
High-Side Power Protection Switch
USB Power Managent
USB Host and Self-Powered Bubs
USB Bus-Powered Hubs
Hot Plug-In Power Supplies
Batery-Charger Circuits
ꢀ Nemko IEC 60950-1 CB/CCA_scheme Certifica-
tion Report #67291
Pin Configuration
Typical Application Circuit
G547
G547
OUT
OUT
OUT*
OC
1
2
3
4
8
7
6
5
GND
IN
EN (EN)
GND
IN
1
2
3
6
5
OC
OUT
IN
G547
Power Supply
2.7V to 5.5V
OUT
4
IN
OUT
Load
EN (EN)
*
1ꢀF
22ꢀF
0.1ꢀF
SOT-23-6
SOP-8/MSOP-8
G547
OC
EN(EN)
ON
OFF
8
OUT
OUT
OUT*
OC
GND
IN
1
2
3
4
7
6
5
Thermal
Pad
IN
EN (EN)
*: 1ꢀF of input capacitor is enough in most application cases.
If the PCB trace of power rail to IN is long, larger input capacitor is necessary.
TDFN3X3-8
Note: Recommend connecting the Thermal Pad
to the GND for excellent power dissipation.
*Pin#6 should be considered as OUT when circuit design and PCB layout, but it is NC pin actually.
UL Recognized Component
Ver:1.5
Sep 08, 2011
1
G547E/F/G/H/M
Global Mixed-mode Technology
Ordering Information
Output
MOS
RDS(ON)
90mΩ
90mΩ
90mΩ
90mΩ
90mΩ
90mΩ
90mΩ
90mΩ
90mΩ
90mΩ
90mΩ
90mΩ
90mΩ
90mΩ
90mΩ
90mΩ
90mΩ
90mΩ
90mΩ
90mΩ
90mΩ
90mΩ
0mΩ
90mΩ
90mΩ
90mΩ
90mΩ
0mΩ
90mΩ
90mΩ
90mΩ
90mΩ
90mΩ
90mΩ
90mΩ
90mΩ
90mΩ
90mΩ
90mΩ
90mΩ
Output
ORDER
NUMBER
Current
Limit
TEMP.
RANGE
PACKAGE
(Green)
MARKING
ENABLE
Shutdown
Resistor
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Ys
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
G547E1TB1U
G547E2TB1U
G547F1TB1U
G547F2TB1U
G547G1TB1U
G547G2TB1U
G547H1TB1U
G547H2TB1U
G547M1TB1U
G547M2TB1U
G547E1P11U
G547E2P11U
G547F1P11U
G547F2P11U
G547G1P11U
G547G2P11U
G547H1P11U
G547H2P11U
G547M1P11U
G547M2P11U
G547E1P81U
G547E2P81U
G547F1P81U
G547F2P81U
G547G1P81U
G547G2P81U
G547H1P81U
G547H2P81U
G547M1P81U
G547M2P81U
G547E1RD1U
G547E2RD1U
G547F1RD1U
G547F2RD1U
G547G1RD1U
G547G2RD1U
G547H1RD1U
G547H2RD1U
G547M1RD1U
G547M2RD1U
57EAx
57EBx
Active High
Active Low
Active High
Active Low
Active High
Active Low
Active High
Active Low
Active High
Active Low
Active High
Active Low
Active High
Active Low
Active High
Active Low
Active High
Active Low
Active High
Active Low
Active High
Active Low
Active High
Active Low
Active High
Active Low
ActiHigh
Aow
Acte High
Active Low
Active High
Active Low
Active High
Active Low
Active High
Active Low
Active High
Active Low
Active High
Active Low
2.5A
2.5A
2A
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
SOT-23-6
SOT-23-6
SOT-23-6
SOT-23-6
SOT-23-6
SOT-23-6
SOT-23-6
SOT-23-6
SOT-23-6
SOT-23-6
SOP-8
57FAx
57FBx
2A
57GAx
57GBx
57HAx
1.5A
1.5A
1A
57HBx
1A
57MAx
57MBx
G547E1
G547E2
G547F1
G547F2
G547G1
G547G2
G547H1
G547H2
G547M1
G547M2
G547E1
G547E2
G547F1
G547F2
G547G1
G547G2
G547H1
G547H2
G547M1
G547M2
547E1
3.7A
3.7A
2.5A
2.5A
2A
SOP-8
SOP-8
2A
SOP-8
1.5A
1.5A
1A
SOP-8
SOP-8
SOP-8
1A
SOP-8
3.7A
3.7A
2.5A
2.5A
2A
SOP-8
SOP-8
MSOP-8
MSOP-8
MSOP-8
MSOP-8
MSOP-8
MSOP-8
MSOP-8
MSOP-8
MSOP-8
MSOP-8
TDFN3X3-8
TDFN3X3-8
TDFN3X3-8
TDFN3X3-8
TDFN3X3-8
TDFN3X3-8
TDFN3X3-8
TDFN3X3-8
TDFN3X3-8
TDFN3X3-8
2A
1.5A
1.5A
1A
1A
3.7A
3.7A
5A
2.5A
2A
547E2
547F1
547F2
2A
547G1
1.5A
1.5A
1A
547G2
547H1
547H2
1A
547M1
547M2
3.7A
3.7A
Note: TB: SOT-23-6 P1: SOP-8 P8: MSOP-8 RD: TDFN3X3-8
1: Bonding Code
U: Tape & Reel
Ver:1.5
Sep 08, 2011
2
G547E/F/G/H/M
Global Mixed-mode Technology
Absolute Maximum Ratings
SOP-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.71W
MSOP-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.64W
TDFN3X3-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.67W
Junction Temperature . . . . . . . . . . . . . . . .. . . . . 150°C
Storage Temperature (TS) . . . . . . . . . . .-65°C to +150°C
Reflow Temperature (soldering, 10sec) . . . . . . . 260°C
ESD Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2kV
Supply Voltage (VIN) . . . . . . . . . . . . . . . . . . . . . . . . .6V
Output Voltage (VOUT) . . . . . . . . . . . . . . . . . . . . . . . 6V
Output Current (IOUT) . . . . . . . . . . . . . Internally Limited
Enable Input (VEN) . . . . . . . . . . . . . . . . . . . .-0.3V to 6V
Thermal Resistance Junction to Ambient, (θJA)*
SOT-23-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . 250°C/W
SOP-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .160°C/W
MSOP-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .180°C/W
TDFN3X3-8 . . . . . . . . . . . . . . . . . . . . . . . . . . .170°C/W
Continuous Power Dissipation (TA = +25°C)*
Operating Ratings
Supply Voltage (VIN) . . . . . . . . . . . . . . . . . . . 3V to 5.5V
Operating Temperature (TA) . . . . . . . . -40°C to +85°C
SOT-23-6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5W
*Please refer to Minimum Footprint PCB Layout Section.
Electrical Characteristics
VIN = 5V, CIN=1ꢀF, COUT=1ꢀF, RL=10Ω TA = 25°C.
The device is not guaranteed to function outside its operating conditions. Parameters with MIN and/or MAX limits are 100%
tested at +25°C, unless otherwise specified.
PARAMETER
Input Voltage Rage
CONDITION
MIN
2.7
TYP
---
MAX UNITS
5.5
V
G547E1/G547E2, IOUT=2A
G547F1/G547F2, IOUT=1.5A
G547G1/G547G2, IOUT=1A
G547H1/G547H2, IOUT=0.5A
G547M1/G547M2, IOUT=2.5A
Output MOS RDS(ON)
---
90
110
mΩ
Supply Current
---
0.4
2.01
1.6
1.1
0.6
2.8
0.2
0.2
0.2
0.2
0.2
1.4
0.8
---
100
1
135
1.5
3
ꢀA
ms
Output Turn-on Rising Time
RL=10Ω, 90% Settling
G547E1/G547E2,VOUT=4V
2.5
2
G547F1/G547F2,VO=4V
2.7
2
Current Limit Threshold
Short-circuit Current
A
G547G1/G547G2,VUT=4V
1.5
1
G547H1/G7H2,VOUT=4V
1.45
5
7M1/G547M2,VOUT=4V
3.7
1.7
1.3
1
1/G547E2,VOUT=0V7V<VIN<5.5V
G547F1/G547F2,VT=0V, 2.7V<VIN<5.5V
G547G1/G5472,VOUT=0V, 2.7V<VIN<5.5V
G547H1/G547H2, VOUT=0V, 2.7V<VIN<5.5V
G547M1/G547M2, VOUT=0V, 2.7V<VIN<5.5V
2.6
2
A
1.6
1.2
3.5
1.8
1.6
1
0.7
2
EN Input Threshold-High VIH
EN Input Threshold-Low VIL
Shutdown Supply Current
Shutdown Pull Low Resistance
Output Leakage Current
VIN Under Voltage Lockout
VIN Under Voltage Hysteresis
Thermal Limit
1.6
1.3
0.1
75
0.5
2.5
200
135
20
V
V
ꢀA
Ω
---
150
1
EN=”0”, VOUT=0V
---
ꢀA
V
2.2
---
2.7
---
mV
°C
°C
---
---
Thermal Limit Hysteresis
---
---
4
9
---
---
3
15
0.4
1
ms
V
OC Deglitch
OC assertion or deassertion
I OC = 2mA
---
---
---
OC Output Low Voltage
V OC = 5V
ꢀA
ꢀs
OC Off-State Current
tS Response Time to Short Circuit
VIN=5V, see figure 1.
---
ISC
IOUT
tS
Figure 1
Ver:1.5
Sep 08, 2011
3
G547E/F/G/H/M
Global Mixed-mode Technology
Typical Performance Characteristics
(VIN= 5V, CIN=1ꢀF, COUT=1ꢀF, VEN=0V, TA=25°C, test by G547F1, unless otherwise noted.)
Supply Current vs. Input Voltage
Shutdown Supply Current vs. Input Voltage
120
100
80
60
40
20
0
1
0.8
0.6
T =85 C
°
A
T =25 C
0.4
0.2
0
°
T =85 C
A
°
A
T =25 C
T =-45 C
°
A
°
A
-0.2
-0.4
-0.6
-0.8
-1
T =-45 C
°
A
VEN=0V
VEN=5V
2.5
3.0
3.5
4.0
4.5
5.0
5.5
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Input Voltage VIN (V)
Input Voltage VIN (V)
Enable Input Threshold vs. Input Voltage
Enable Input Threshold vs. Temperature
2.0
2.0
1.8
1.6
1.4
1.2
1.0
0.8
1.8
1.6
1.4
1.2
1.0
V
Falling
Rising
EN
V
Falling
EN
V
EN
V
Rising
EN
VIN=5V
3.0
3.5
4.0
4.5
5.0
5.5
-45 -35 -25 -15 -5
5
15 25 35 45 55 65 75 85
Input Voltage VIN (V)
Ambient Temperature ( C)
°
OC Deglitch Time vs. Input Voltage
UVLO Threshold vs. Temperature
14
3.2
3.0
2.8
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
OC deassertion
13
12
11
10
9
VIN Rising
VIN Falling
OC assertion
2.5
3
3.5
4
4.5
5
5.5
-45 -35 -25 -15 -5
5
15 25 35 45 55 65 75 85
Input Voltage VIN (V)
Ambient Temperature ( C)
°
Ver:1.5
Sep 08, 2011
4
G547E/F/G/H/M
Global Mixed-mode Technology
Typical Performance Characteristics (continued)
ON-Resistance vs. Input Voltage
ON-Resistance vs. Temperature
200
140
120
100
80
IOUT=1A
180
160
140
120
100
80
IOUT=1A
VIN=3V
T =85 C
°
A
T =25 C
°
A
VIN=5V
VIN=3.5V
60
60
40
40
T =-45 C
°
A
20
20
0
0
3.0
3.5
4.0
4.5
5.0
5.5
-45 -35 -25 -15 -5
5
15 25 35 45 55 65 75 85
Input Voltage VIN (V)
Temperature ( C)
°
Current Limit Threshold vs. Input Voltage
Short Circuit Current vs. Input Voltage
2.7
2.4
2.1
1.8
1.5
1.2
2.1
T =-45 C
°
A
1.8
1.5
1.2
0.9
0.6
0.3
0
T =-45 C
°
A
T =85 C
°
A
T =25 C
A
T =25 C
°
A
°
T =85 C
°
A
VOUT=VIN - 1
VOUT=0V
3.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
2.5
3.5
4.0
4.5
5.0
5.5
Input Voltage VIN (V)
Input Voltage VIN (V)
Overcurrent Protection Characteristics
Overcurrent Protection Characteristics
5.1
4.8
4.5
4.2
3.9
3.6
3.3
3.0
2.7
2.4
2.1
1.8
1.5
1.2
0.9
0.6
0.3
0.0
2.7
2.4
2.1
1.8
1.5
1.2
0.9
0.6
0.3
0.0
T =85 C
°
A
T =85 C
°
A
T =25 C
°
A
T =25 C
°
A
T =-45 C
°
A
T =-45 C
°
A
VIN=2.7V
VIN=5V
0
0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6
0
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6 1.8
2
2.2 2.4
Output Current (A)
Output Current (A)
Ver:1.5
Sep 08, 2011
5
G547E/F/G/H/M
Global Mixed-mode Technology
Typical Performance Characteristics (continued)
Turn on Delay Time and Rise Time
Turn off Delay Time and Fall Time
Inrush Current With Different Load Capacitance
Thermal Shutdown Response
UVLO Protection at Rising
UVLO Protection at Falling
Ver:1.5
Sep 08, 2011
6
G547E/F/G/H/M
Global Mixed-mode Technology
Typical Performance Characteristics (continued)
Short Circuit Response at Start up
Inrush Short Circuit Response
Short-Circuit Current, Device Enable into Short
Resistance Load Inrush Response
Capacitance Load Inrush Response
Capacitance Load Inrush Response
Ver:1.5
Sep 08, 2011
7
G547E/F/G/H/M
Global Mixed-mode Technology
Minimum Footprint PCB Layout Section
SOT-23-6
SOP-8
MSOP-8
TDFN3X3-8
Ver:1.5
Sep 08, 2011
8
G547E/F/G/H/M
Global Mixed-mode Technology
Pin Description
PIN
NAME
PIN FUNCTION
SOT-23-6 SOP-8/MSOP-8 TDFN3X3-8
2
1
1
GND
IN
Ground
Input Supply: Output MOSFET Drain, which also supplies IC's in-
ternal circuitry. Connect to positive supply.
Enable: Logic level enable input.
3
2,3
2,3
1
6
4
5
4
5
EN(EN )
OC
Make sure EN pin never floating.
Over-Current: Open-Drain OC output.
Switch Output: Output MOSFET Source of switch. Typically connect
to switched side of load.
4,5
6,7,8
6,7,8
OUT
Recommend connecting the Thermal Pad to the GND for excellent
power dissipation.
Thermal Pad
Block Diagram
IN
EN
(EN)
Clock
Gate Control
Current
Sense
BandGap
Reference
Overcurr
Limiting
OUT
CMP
Shutdown Signal
OC
UVLO
OC Deglitch logic
Thermal Sense
GND
Ver:1.5
Sep 08, 2011
9
G547E/F/G/H/M
Global Mixed-mode Technology
Functional Description
Input and Output
OC Function
IN (input) is the power supply connection to the logic
circuitry and the drain of the output MOSFET. OUT
(output) is the source of the output MOSFET. In a
typical application, current flows through the switch
from IN to OUT toward the load. Both OUT pins must
be connected together to the load.
The OC open-drain output is asserted (active low)
when an over current or overtemperature shutdown
condition is encountered after a 9-ms deglitch timeout.
The output remains asserted until the overcurrent or
overtemperature condition is removed.
Thermal Shutdown
Applications Information
Thermal shutdown protects G547 from excessive
power dissipation. If the die temperature exceeds
135°C, the MOSFETS switch is shut off. 20°C of hys-
tersis prevents the switch from turning on until the die
temperature drops to 115°C. Thermal shutdown circuit
functions only when the switch is enabled.
Supply Filtering
A 1ꢀF bypass capacitor from IN to GND, located
near the G547, is strongly recommended to control
supply transients. Without a bypass capacitor, an
output short may cause sufficient ringing on the input
(from supply lead inductance) to damage internal
control circuitry.
Undervoltage Lockout
UVLO (undervoltage lockout) prevents the output
MOSFET from turning on until IN (input voltage) ex-
ceeds 2.5V typically. After the switch turns on, if the
voltage drops below 2.3V typically, UVLO shuts off the
output MOSFET.
Input transients must not exceed the absolute maxi-
mum supply voltage (VIN max = 6V) even for a short
duration.
EN, the Enable Input
EN must be driven logic high or logic low for a clearly
defined input. Floating the input may cause unpre-
dictable operation. EN should not be allowed to go
negative with respect to GND.
Current Limiting
The typical current limit value of G547 is 3.7A, 2.5A, 2A,
1.5A, 1A . There is foldback of current limit when VOUT
1.5V (See Typical Performance Characteristics).
<
Ver:1.5
Sep 08, 2011
10
G547E/F/G/H/M
Global Mixed-mode Technology
Test Circuit
VOUT
IOUT
Device
Under
Test
OUT
RL CL
IL
COUT
Current Probe
Timing Diagrams
tR
tF
90%
90%
10%
VOUT
10%
Output Rise and Fall Times
50%
VEN
tOFF
tON
90%
VOUT
10%
Switch Delay Times
Ver:1.5
Sep 08, 2011
11
G547E/F/G/H/M
Global Mixed-mode Technology
Package Information
SOT23-6 Package
Taping Specification
PACKAGE
Q’TY/REEL
SOT-23-6
3,000 ea
Ver:1.5
Sep 08, 2011
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G547E/F/G/H/M
Global Mixed-mode Technology
SOP-8 Package
Taping Specification
PACKAGE
Q’TY/REEL
SOP-8
2,500 ea
Ver:1.5
Sep 08, 2011
13
G547E/F/G/H/M
Global Mixed-mode Technology
MSP-8 Package
Taping Specification
PACKAGE
Q’TY/REEL
MSOP-8
3,000 ea
Ver:1.5
Sep 08, 2011
14
G547E/F/G/H/M
Global Mixed-mode Technology
TDFN3X3-8 Package
Taping Specification
PACKAGE
Q’TY/REEL
TDFN3X3-8
3,000 ea
GMT Inc.doesnotassumeanyresponsibilityforuseofanycircuitrydescribed,nocircuitpatentlicensesareimpliedandGMT Inc.reservestherightatanytimewithoutnoticetochangesaidcircuitryandspecifications.
Ver:1.5
Sep 08, 2011
15
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