GM71VS65403CLJ-5 [ETC]

x4 EDO Page Mode DRAM ; X4 EDO页模式DRAM\n
GM71VS65403CLJ-5
型号: GM71VS65403CLJ-5
厂家: ETC    ETC
描述:

x4 EDO Page Mode DRAM
X4 EDO页模式DRAM\n

内存集成电路 光电二极管 动态存储器
文件: 总11页 (文件大小:107K)
中文:  中文翻译
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GM71V65403C  
GM71VS65403CL  
16,777,216 WORDS x 4 BIT  
CMOS DYNAMIC RAM  
Description  
Pin Configuration  
32 SOJ / TSOP II  
The GM71V(S)65403C/CL is the new generation  
dynamic RAM organized 16,777,216 words by 4bits.  
The GM71V(S)65403C/CL utilizes advanced CMOS  
Silicon Gate Process Technology as well as  
advanced circuit techniques for wide operating  
margins, both internally and to the system user.  
System oriented features include single power supply  
of 3.3V+/-10% tolerance, direct interfacing  
capability with high performance logic families such  
as Schottky TTL.  
1
2
3
32  
31 IO3  
VSS  
VCC  
IO0  
IO1  
NC  
30  
IO2  
4
5
6
7
29  
28  
27  
26  
NC  
NC  
NC  
NC  
VSS  
VCC  
/CAS  
The GM71V(S)65403C/CL offers Extended Data  
Out(EDO) Mode as a high speed access mode.  
25  
8
9
/OE  
/WE  
/RAS  
24 NC  
23 A11  
22 A10  
Features  
10  
A0  
* 16,777,216 Words x 4 Bit  
* Extended Data Out (EDO) Mode Capability  
* Fast Access Time & Cycle Time  
11  
12  
A1  
A2  
A3  
A9  
21  
A8  
20  
13  
14  
15  
(Unit: ns)  
A4  
A5  
19  
18  
A7  
A6  
tRAC  
tAA  
tCAC  
tRC  
tHPC  
84  
GM71V(S)65403C/CL-5  
GM71V(S)65403C/CL-6  
20  
25  
50  
60  
25  
30  
13  
15  
16  
17 VSS  
VCC  
104  
(Top View)  
*Power dissipation  
- Active : 504mW/468mW(MAX)  
- Standby : 1.8 mW ( CMOS level : MAX )  
0.54mW ( L-Version : MAX)  
*EDO page mode capability  
*Access time : 50ns/60ns (max)  
*Refresh cycles  
- RAS only Refresh  
4096 cycles/64 ms (GM71V65403C)  
4096 cycles/128ms (GM71VS65403CL)(L_Version)  
*CBR & Hidden Refresh  
4096 cycles/64 ms (GM71V65403C)  
4096 cycles/128 ms (GM71VS65403CL)( L-Version )  
*4 variations of refresh  
-RAS-only refresh  
-CAS-before-RAS refresh  
-Hidden refresh  
-Self refresh (L-Version)  
*Single Power Supply of 3.3V+/-10 % with a built-in VBB generator  
*Battery Back Up Operation ( L-Version )  
Rev 0.1 / Apr’01  
GM71V65403C  
GM71VS65403CL  
Pin Description  
Pin  
Function  
Address Inputs  
Pin  
WE  
Function  
A0-A11  
A0-A11  
RAS  
Write Enable  
I/O0 - I/O3  
VCC  
Data Input / Output  
Power (+3.3V)  
Ground  
Refresh Address Inputs  
Row Address Strobe  
Column Address Strobe  
Output Enable  
VSS  
CAS  
OE  
NC  
No Connection  
Ordering Information  
Type No.  
Access Time  
Package  
400 Mil  
32Pin  
Plastic SOJ  
GM71V(S)65403C/CLJ-5  
GM71V(S)65403C/CLJ-66  
50ns  
60ns  
400 Mil  
32Pin  
Plastic TSOP II  
GM71V(S)65403C/CLT-5  
GM71V(S)65403C/CLT-6  
50ns  
60ns  
Absolute Maximum Ratings*  
Symbol  
Parameter  
Storage Temperature (Plastic)  
Rating  
Unit  
TSTG  
-55 to 125  
C
-0.5 to VCC + 0.5  
(MAX ; 4.6V)  
Voltage on any Pin Relative to VSS  
VT  
V
VCC  
IOUT  
PT  
Voltage on VCC Relative to VSS  
Short Circuit Output Current  
Power Dissipation  
-0.5 to 4.6  
V
50  
mA  
W
1.0  
*Note : Operation at or above Absolute Maximum Ratings can adversely affect device reliability.  
Recommended DC Operating Conditions (TA = 0 ~ 70C)  
Symbol  
VCC  
Parameter  
Supply Voltage  
Typ  
Max  
3.6  
0
Min  
3.0  
0
Unit  
Notes  
3.3  
0
V
V
1,2  
2
VSS  
Supply Voltage  
Vcc+0.3  
0.8  
VIH  
VIL  
Input High Voltage  
Input Low Voltage  
2.0  
-
V
V
1
1
-0.3  
-
TA  
Ambient Temperature under Bias  
70  
C
0
-
Rev 0.1 / Apr’01  
GM71V65403C  
GM71VS65403CL  
DC Electrical Characteristics: (VCC = 3.3V+/-10%, TA = 0 ~ 70C)  
Symbol  
Parameter  
Min Max Unit Note  
VOH  
Output Level  
Output Level Voltage (IOUT = -2mA)  
2.4  
0
VCC  
V
V
VOL  
ICC1  
Output Level  
Output Level Voltage (IOUT = 2mA)  
0.4  
Operating Current (tRC = tRC min)  
50ns  
60ns  
-
-
140  
130  
mA  
mA  
1,2  
Standby Current (TTL interface)  
Power Supply Standby Current  
(RAS, CAS= VIH, DOUT = High-Z)  
ICC2  
ICC3  
-
2
50ns  
60ns  
-
-
140  
130  
RAS-Only Refresh Current  
( tRC = tRC min)  
mA  
2
50ns  
60ns  
-
-
-
110  
100  
0.5  
ICC4  
ICC5  
Extended Data Out page Mode Current  
(RAS = VIL, CAS, Address Cycling: tHPC = tHPC min)  
mA 1,3  
mA  
CMOS interface  
(RAS, CAS>=VCC-0.2V, DOUT = High-Z)  
Standby Current(L_Version)  
-
300  
uA  
4
140  
130  
ICC6  
CAS-before-RAS Refresh Current  
(tRC = tRC min)  
50ns  
60ns  
-
-
mA  
Battery Back Up Operating Current(Standby with CBR)  
(tRC=31.25us,tRAS=300ns,Dout=High-Z)  
uA  
ICC7  
ICC8  
-
500  
4, 5  
Standby Current (CMOS)  
Power Supply Standby Current  
RAS = VIH, CAS = VIL , DOUT = Enable  
-
5
mA  
1
5
ICC9  
II(L)  
Self Refresh Current  
(RAS, CAS <=0.2V,Dout=High-Z)  
-
400  
5
uA  
uA  
uA  
Input Leakage Current, Any Input  
(0V<=VIN<=Vcc)  
-5  
-5  
IO(L)  
Output Leakage Current  
(DOUT is Disabled, 0V<=VOUT<=Vcc)  
5
Note: 1. ICC depends on output load condition when the device is selected. ICC(max) is specified at the  
output open condition.  
2. Address can be changed once or less while RAS = VIL.  
3. Measured with one sequential address change per EDO cycle, tHPC.  
4. VIH>=VCC-0.2V, 0V<=VIL<=0.2V  
5. L-Version  
Rev 0.1 / Apr’01  
GM71V65403C  
GM71VS65403CL  
Capacitance (VCC = 3.3V+/-10%, TA = 25C)  
Symbol  
CI1  
Parameter  
Typ  
Max  
Unit  
pF  
Note  
1
-
Input Capacitance (Address)  
Input Capacitance (Clocks)  
5
7
7
CI2  
-
-
pF  
1
CI/O  
Output Capacitance (Data-in,Data-Out)  
pF  
1, 2  
Note: 1. Capacitance measured with Boonton Meter or effective capacitance measuring method.  
2. RAS, CAS = VIH to disable DOUT.  
AC Characteristics (VCC = 3.3V+/-10%, TA = 0 ~ 70C, Notes 1, 2,19)  
Test Conditions  
Input rise and fall times : 2ns  
Input level : VIL/VIH = 0.0/3.0V  
Input timing reference levels : VIL/VIH = 0.8/2.0V  
Output timing reference levels : VOL/VOH = 0.8/2.0V  
Output load : 1 TTL gate+CL (100pF)  
(Including scope and jig)  
Read, Write, Read-Modify-Write and Refresh Cycles (Common Parameters)  
GM71V(S)65403C/CL-5 GM71V(S)65403C/CL-6  
Symbol  
Parameter  
Notes  
Unit  
Min  
84  
Min  
Max  
Max  
104  
-
-
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
t
t
RC  
RP  
Random Read or Write Cycle Time  
RAS Precharge Time  
30  
40  
-
-
8
-
10000  
10000  
-
10  
60  
10  
0
-
CAS Precharge Time  
t
CP  
50  
10000  
t
t
t
t
t
t
t
t
t
t
t
t
t
t
RAS  
CAS  
ASR  
RAH  
ASC  
CAH  
RCD  
RAD  
RSH  
CSH  
CRP  
ODD  
DZO  
DZC  
RAS Pulse Width  
10000  
8
0
CAS Pulse Width  
-
-
Row Address Set-up Time  
Row Address Hold Time  
Column Address Set-up Time  
Column Address Hold Time  
RAS to CAS Delay Time  
RAS to Column Address Delay Time  
RAS Hold Time  
10  
0
8
-
-
0
-
10  
8
-
-
ns  
ns  
3
4
14  
12  
15  
12  
10  
13  
35  
5
37  
25  
-
45  
30  
-
ns  
ns  
ns  
ns  
40  
5
-
-
-
-
CAS Hold Time  
CAS to RAS Precharge Time  
OE to DIN Delay Time  
OE Delay Time from DIN  
15  
13  
0
-
-
-
-
ns  
ns  
ns  
5
0
0
-
6
6
7
-
0
CAS Delay Time from DIN  
TransitionTime (Rise and Fall)  
Refresh Period  
50  
t
T
2
-
2
-
50  
64  
ns  
ms  
ms  
4096  
cycles  
4096  
t
REF  
64  
-
-
Refresh Period ( L-Version )  
128  
128  
cycles  
Rev 0.1 / Apr’01  
GM71V65403C  
GM71VS65403CL  
Read Cycles  
GM71V(S)65403C/CL-6  
GM71V(S)65403C/CL-5  
Symbol  
Parameter  
Notes  
Unit  
Min  
Max  
50  
Max  
60  
Min  
-
-
-
-
Access Time from RAS  
t
RAC  
CAC  
ns 8,9  
13  
15  
Access Time from CAS  
ns 9,10,17  
ns 9,11,17  
t
-
-
25  
13  
-
-
30  
15  
-
Access Time from Column Address  
Access Time from OE  
tAA  
9
t
OAC  
RCS  
ns  
0
0
0
Read Command Set-up Time  
-
ns  
t
12  
ns  
0
-
-
Read Command Hold Time to CAS  
Read Command Hold Time to RAS  
Column Address to RAS Lead Time  
Column Address to CAS Lead Time  
Output Buffer Turn-off Delay Time from CAS  
Output Buffer Turn-off Delay Time from OE  
-
-
t
RCH  
RRH  
12  
ns  
0
0
t
30  
18  
25  
15  
-
-
-
ns  
t
RAL  
CAL  
OFF  
OEZ  
CDD  
-
ns  
t
-
-
13  
13  
-
-
-
15  
15  
t
ns 13,21  
13  
ns  
t
13  
-
-
5
ns  
ns  
15  
15  
CAS to DIN Delay Time  
RAS to DIN Delay Time  
t
-
13  
tRDD  
15  
-
-
-
WE to DIN Delay Time  
13  
-
ns  
ns  
t
WDD  
13,21  
13  
Output Buffer Turn-off Delay Time from RAS  
13  
13  
15  
15  
t
OFR  
-
3
-
tWEZ  
Output Buffer Turn-off Delay Time from WE  
Output Data Hold Time  
ns  
ns  
ns  
3
21  
-
-
-
-
-
-
-
-
tOH  
Output Data Hold Time from RAS  
3
3
21  
tOHR  
50  
3
Read Command Hold Time from RAS  
Output data hold time from OE  
CAS to Output in Low - Z  
60  
3
ns  
ns  
ns  
tRCHR  
-
-
t
OHO  
0
0
tCLZ  
Rev 0.1 / Apr’01  
GM71V65403C  
GM71VS65403CL  
Write Cycles  
GM71V(S)65403C/CL-5  
GM71V(S)65403C/CL-6  
Notes  
Symbol  
Parameter  
Unit  
Min  
Min  
0
Max  
Max  
0
8
-
-
-
-
-
14  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
t
WCS  
WCH  
WP  
RWL  
CWL  
Write Command Set-up Time  
Write Command Hold Time  
10  
10  
15  
10  
0
-
-
-
-
-
-
t
8
Write Command Pulse Width  
t
13  
8
Write Command to RAS Lead Time  
t
-
-
t
Write Command to CAS Lead Time  
Data-in Set-up Time  
15  
15  
0
t
t
DS  
10  
8
-
Data-in Hold Time  
DH  
Read-Modify-Write Cycles  
GM71V(S)65403C/CL-5  
GM71V(S)65403C/CL-6  
Notes  
Symbol  
Parameter  
Unit  
Min  
116  
67  
Min  
Max  
Max  
140  
-
-
-
-
-
-
Read-Modify-Write Cycle Time  
ns  
ns  
ns  
ns  
ns  
t
RWC  
RWD  
CWD  
AWD  
OEH  
79  
34  
49  
15  
-
-
14  
14  
t
RAS to WE Delay Time  
30  
t
CAS to WE Delay Time  
42  
14  
-
-
t
Column Address to WE Delay Time  
OE Hold Time from WE  
13  
t
Refresh Cycles  
GM71V(S)65403C/CL-5 GM71V(S)65403C/CL-6  
Notes  
Symbol  
Unit  
Parameter  
Min  
Min  
Max  
Max  
CAS Set-up Time  
(CAS-before-RAS Refresh Cycle)  
-
ns  
-
5
t
CSR  
5
CAS Hold Time  
(CAS-before-RAS Refresh Cycle)  
8
0
-
-
-
-
10  
0
ns  
ns  
t
t
CHR  
WRP  
WE setup time  
(CAS-before-RAS Refresh Cycle)  
WE hold time  
(CAS-before-RAS Refresh Cycle)  
8
5
-
-
10  
5
-
-
ns  
ns  
t
t
WRH  
RPC  
RAS Precharge to CAS Hold Time  
Rev 0.1 / Apr’01  
GM71V65403C  
GM71VS65403CL  
Extended Data Out Mode Cycles  
GM71V(S)65403C/CL-5  
GM71V(S)65403C/CL-6  
Notes  
Symbol  
Parameter  
Unit  
Min  
20  
8
Min  
Max  
Max  
25  
-
-
EDO Page Mode Cycle Time  
t
HPC  
WPE  
ns  
-
ns  
20  
10  
-
-
-
t
Write pulse width during CAS Precharge  
EDO Mode RAS Pulse Width  
100000  
-
100000  
t
t
RASP  
ACP  
16  
ns  
ns  
ns  
ns  
ns  
ns  
Access Time from CAS Precharge  
-
35  
-
9,17  
28  
-
-
35  
10  
t
RHCP  
28  
8
RAS Hold Time from CAS Precharge  
-
-
-
-
t
COL  
COP  
CAS Hold Time Referred OE  
CAS to OE set-up Time  
5
-
5
t
35  
t
RCHP  
28  
-
Read Command Hold Time from CAS  
Precharge  
t
t
DOH  
OEP  
ns  
ns  
Output Data Hold Time from CAS Low  
OE Precharge Time  
3
8
-
-
-
-
3
9,22  
10  
EDO Page Mode Read-Modify-Write cycle  
GM71V(S)65403C/CL-5  
GM71V(S)65403C/CL-6  
Notes  
Symbol  
Parameter  
Unit  
Min  
57  
Min  
68  
Max  
Max  
EDO Read-Modify-Write Cycle Time  
-
-
-
-
ns  
ns  
t
t
HPRWC  
CPW  
45  
54  
14  
EDO Page Mode Read-Modify-Write Cycle  
CAS Precharge to WE Delay Time  
Self Refresh Cycles (L_Version)  
GM71V(S)65403C/CL-5  
GM71V(S)65403C/CL-6  
Symbol  
Parameter  
Notes  
Unit  
Min  
100  
90  
Min  
100  
110  
-50  
Max  
Max  
us  
-
-
-
-
-
-
t
RASS  
26  
26  
RAS Pulse Width(Self-Refresh)  
ns  
ns  
t
t
RPS  
CHS  
RAS Precharge Time(Self-Refresh)  
CAS Hold Time(Self-Refresh)  
-50  
Rev 0.1 / Apr’01  
GM71V65403C  
GM71VS65403CL  
Notes:  
T
AC measurements assume t = 2  
ns  
.
1.  
2.  
AC initial pause of 200  
is required after power up followed by a minimum of eight  
us  
initialization cycles ( any combination of cycles containing RAS-only refresh or CAS-before-  
RAS refresh)  
RCD  
RAC  
RCD  
Operation with the t (max) limit insures that t (max) can be met, t (max) is specified as a  
3.  
4.  
5.  
RCD  
RCD  
reference point only: if t  
controlled exclusively by t  
is greater than the specified t  
(max) limit, then access time is  
CAC  
.
RAD  
RAC  
RAD  
Operation with the t (max) limit insures that t (max) can be met, t (max) is specified as a  
RAD  
RAD  
reference point only: if t  
controlled exclusively by t .  
is greater than the specified t  
(max) limit, then access time is  
AA  
OED  
CDD  
Either t or t must be satisfied.  
DZO  
DZC  
6. Either t or t must be satisfied.  
IH  
IL  
7. V (min) and V (max) are reference levels for measuring timing of input signals. Also,  
IH  
IL  
transition times are measured between V (min) and V (max).  
RCD  
RCD  
t
RAD  
RAD  
RCD  
RAD  
8. Assumes that t  
(max) and t  
t
£
(max). If t  
or t is greater than the maximum  
£
RAC  
recommended value shown in this table, t exceeds the value shown.  
9. Measured with a load circuit equivalent to 1 TTL loads and 100 pF.  
³
RCD  
RAD  
RCD  
RCD  
CAC  
RAD  
AA  
10. Assumes that t  
t
(max) and t + t (max)  
t
+ t (max).  
³
£
11.  
RAD  
t
RCD  
CAC  
RAD  
t
AA  
Assumes that t  
(max) and t +t (max)  
+t (max).  
³
12.  
RCH  
RRH  
Either t or t must be satisfied for a read cycles.  
OFF  
t
OEZ(  
OFR  
WEZ  
13.  
(max), t max), t (max) and t (max) define the time at which the outputs achieve the  
open circuit condition and is not referenced to output voltage levels.  
WCS  
RWD  
CWD, AWD,  
CPW  
14.  
t
, t  
data sheet as electrical characteristics only: if t  
and the data out pin will remain open circuit (high impedance) throughout the entire cycle: if  
, t  
t
and t  
are not restrictive operating parameters. They are included in the  
WCS  
WCS  
t
(min), the cycle is an early write cycle  
³
RWD  
t
RWD  
CWD  
AWD  
AWD  
CPW CPW  
t
³
t
(min), tCWD ³  
t
(min), t  
t
(min) and t  
(min), the cycle is a read-  
³
³
modify-write and the data output will contain data read from the selected cell: if neither of the  
above sets of conditions is satisfied, the condition of the data out (at access time) is  
indeterminate.  
DS  
DH  
15.  
t and t are referred to CAS leading edge in early write cycles and to WE leading edge in  
delayed write or read-modify-write cycles.  
RASP  
16.  
17.  
18.  
t
defines RAS pulse width in extended data out mode cycles.  
AA, CAC  
CPA  
and t  
Access time is determined by the longest among t  
t
.
In delayed write or read-modify-write cycles, OE must disable output buffer prior to applying  
data to the device.  
19.  
When output buffers are enabled once, sustain the low impedance state until valid daa is  
obtained. When output buffer is turned on and off within a very short time, generally it causes  
CC  
SS  
IH  
IL  
large V /V line noise, which causes to degrade V min/V max level.  
Rev 0.1 / Apr’01  
GM71V65403C  
GM71VS65403CL  
HPC  
t
(min) can be achieved during a series of EDO mode early write cycles or EDO mode read  
20.  
21.  
cycles. If both write and read operation are mixed in a EDO mode, RAS cycle { EDO mode mix  
cycle (1),(2) } minimum value of CAS cycle t  
specified t (min) value.  
EDO page mode mix cycle (1) and (2).  
HPC CAS  
CP  
T
(t + t + 2t ) becomes greater than the  
HPC  
The value of CAS cycle time of mixed EDO page mode is shown in  
Data output turns off and becomes high impedance from later rising edge of RAS and CAS.  
Hold time and turn off time are specified by the timing specifications of later rising edge of RAS  
and CAS between t and t , and between t and t  
OHR  
OH  
OFR  
OFF  
.
DOH  
OL  
OH  
t
defines the time at which the output level go cross.  
V
=0.8V, V =2.0V of output timing  
22.  
23.  
reference level.  
Before and after self refresh mode, execute CBR refresh to all refresh addresses in or within 64  
ms  
period on the condition a and b below.  
a. Enter self refresh mode within 15.6us after either burst refresh or distributed refresh at equal  
interval to all refresh addresses are completed.  
b. Start burst refresh or distributed refresh at equal interval to all refresh addressed within 15.6us  
after exiting from self refresh mode.  
In case of entering from RAS-only-refresh, it is necessary to execute CBR refresh before and  
after self refresh mode according as note 23.  
24.  
25.  
26.  
27.  
For L_Version, it is available to apply each 128 ms and 31.2 us instead of 64  
note 23.  
and 15.6us at  
ms  
tRASS  
RASS  
At t  
100 us , self refresh mode is activated, and not active at  
10us It is undefined  
<
>
RASS  
t
RPS  
within the range of 10 us  
100 us. for tRASS 10 us , it is necessary to satisfy t  
>
.
<
<
IH  
IN  
IH  
IH  
IN  
IH  
XXX: H or L ( H : V (min)  
V
V (max), L: V (min) V (max))  
V
<= <= <= <=  
///////: Invalid Dout  
When the address, clock and input pins are not described on timing waveforms, their pins must  
IH  
IL.  
be applied V or V  
Rev 0.1 / Apr’01  
GM71V65403C  
GM71VS65403CL  
SOJ 32 pin PKG Dimension  
Unit: mm  
0.64 MIN  
1.16 MAX  
2.09 MIN  
3.01 MAX  
20.95 MIN  
21.38 MAX  
1.165 MAX  
0.33 MIN  
0.53 MAX  
1.27  
0.33 MIN  
0.49 MAX  
0.10  
Rev 0.1 / Apr’01  
GM71V65403C  
GM71VS65403CL  
TSOPII 32 PIN Package Dimension  
O
0.40 MIN  
Unit: mm  
20.95 MIN  
21.35 MAX  
0 ~ 5  
0.60 MAX  
NORMAL TYPE  
0.145 0.05  
0.125 0.04  
0.80  
1.15 MAX  
0.42 0.08  
0.40 0.06  
1.27  
0.08 MIN  
0.18 MAX  
0.10  
Dimension including the plating thickness  
Base material dimension  
Rev 0.1 / Apr’01  

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