HCC4041UBF [ETC]

Inverter/Buffer ; 逆变器/缓冲器\n


型号：	HCC4041UBF
厂家：	ETC
描述：	Inverter/Buffer 逆变器/缓冲器\n 触发器逻辑集成电路栅
文件：	总12页 (文件大小：297K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

HCC/HCF4041UB

QUAD TRUE/COMPLEMENT BUFFER

BALANCED SINK AND SOURCE CURRENT ;

APPROXIMATELY 4 TIMES STANDARD ”B”

DRIVE

EQUALIZED DELAY TO TRUE AND COMPLE-

MENT OUTPUTS

QUIESCENT CURRENT SPECIFIED TO 20V

FOR HCC DEVICE

5V, 10V AND 15V PARAMETRIC RATINGS

INPUT CURRENT OF 100nA AT 18V AND 25°C

FOR HCC DEVICE

100 % TESTED FOR QUIESCENT CURRENT

MEETS ALLREQUIREMENTS OF JEDECTEN-

TATIVESTANDARDN°13A, ”STANDARD SPE-

CIFICATIONS FOR DESCRIPTION OF ”B”

SERIES CMOS DEVICES”

(Plastic Package)

(Ceramic Frit Seal Package)

(Plastic Chip Carrier)

(Micro Package)

ORDER CODES :

HCC4041BF

HCF4041BM1

HCF4041BEY

HCF4041BC1

PIN CONNECTIONS

DESCRIPTION

The HCC4041UB (extended temperature range)

and HCF4041UB (intermediate temperature range)

are monolithic integrated circuits, available in 14-

lead dual in-line plastic or ceramic package and

plastic micro package.

TheHCC/HCF4041UB types arequad true/comple-

ment buffers consisting of n- and p-channel units

having low channel resistance and high current

(sourcing and sinking) capability. The HCC/-

HCF4041UB is intended for use as a buffer, line

driver, or COS/MOS-to-TTL driver. It can be used as

an ultra-low power resistor-network driver for A/D

and D/A conversion, as a transmission-line driver,

and in other applications where high noise immunity

and low-power dissipation are primary design re-

quirements.

June 1989

1/12

HCC/HCF4041UB

FUNCTIONAL DIAGRAM

ABSOLUTE MAXIMUM RATINGS

Symbol

Parameter

Value

Unit

V_DD

Supply Voltage : HCC Types

HCF Types

– 0.5 to + 20

– 0.5 to + 18

V_i

I_I

Input Voltage

– 0.5 to V_DD+ 0.5

DC Input Current (any one input)

± 10

P_{t ot}

Total Power Dissipation (per package)

Dissipation per Output Transistor

200

for T_op= Full Package-temperature Range

100

T_{o p}

T_stg

Operating Temperature : HCC Types

HCF Types

– 55 to + 125

– 40 to + 85

°C

Storage Temperature

– 65 to + 150

°C

Stresses above those listed under ”Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress

rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections

of this specification is not implied. Exposure to absolute maximum rating conditions for external periods may affect device reliability.

* All voltage values are referred to V_SSpin voltage.

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

Supply Voltage : HCC Types

HCF Types

Value

Unit

V_DD

3 to + 18

3 to + 15

V_I

Input Voltage

0 to V_DD

T_{o p}

Operating Temperature : HCC Types

HCF Types

– 55 to + 125

– 40 to + 85

°C

2/12

HCC/HCF4041UB

SCHEMATIC DIAGRAM

STATIC ELECTRICAL CHARACTERISTICS (over recommended operating conditions)

Test Conditions

Value

Symbol

Parameter

Unit

V_I

V_O

|I_O

V_{D D}

T _{Lo w}

25°C

T _High*

(V)

(µA) (V)

Min. Max. Min. Typ. Max. Min. Max.

I_L

Quiescent

Current

0/ 5

0/10

0/15

0/20

0/ 5

0/10

0/15

0/ 5

0/10

0/15

5/0

0.02

0.04

0.02

HCC

Types

120

600

µA

HCF

Types

120

V_OH

V_OL

V_IH

Output High

Voltage

< 1

4.95

9.95

4.95

9.95

10 9.95

15 14.95

14.95

Output Low

Voltage

0.05

10/0

15/0

Input High

Voltage

0.5/4.5 < 1

1/9 < 1

1.5/13.5 < 1

15 12.5

12.5

* T_Low= – 55°C for HCC device : – 40°C for HCF device.

* T_High= + 125°C for HCC device : + 85°C for HCF device.

The Noise Margin for both ”1” and ”0” level is : 1V min. with V_DD= 5V, 2V min. with V_DD= 10V, 2.5V min. with V_DD= 15V.

3/12

HCC/HCF4041UB

STATIC ELECTRICAL CHARACTERISTICS (continued)

Test Conditions

Value

Symbol

Parameter

Unit

V_I

V_O

|I_O

V_{D D}

T _{Lo w}

25°C

T _High*

(V)

(µA) (V)

Min. Max. Min. Typ. Max. Min. Max.

V_IL

Input Low

Voltage

4.5/0.5 < 1

9/1 < 1

13.5/1.5 < 1

2.5

I_OH

Output

Drive

Current

0/ 5

0/10

0/15

0/ 5

0/10

0/15

0/ 5

0/10

0/15

0/ 5

0/10

0/15

2.5

4.6

9.5

13.5

2.5

4.6

9.5

13.5

0.4

0.5

1.5

0.4

0.5

1.5

– 8.4

– 2.1

– 6.4 – 12.8

– 1.6 – 3.2

– 5 – 10

– 4.6

– 1.2

– 3.5

– 13

– 4.08

– 1.02

– 3.18

–12.11

1.2

HCC

Types

10 – 6.25

15 – 24

– 19 – 38

– 5.44 – 12.8

– 1.36 – 3.2

– 4.25 – 10

–16.15 – 38

– 6.8

– 1.7

HCF

Types

10 – 5.31

15 –20.18

I_OL

Output

Sink

Current

2.1

1.6

3.2

HCC

Types

10 6.25

3.5

1.7

1.36 3.2

4.25 10

16.15 38

1.02

HCF

Types

10 5.31

3.18

15 20.18

12.11

_IH, I_IL

Input

leakage

Current

HCC

Types

0/18

± 0.1

± 0.3

±10^–5± 0.1

± 1

Any Input

µA

HCF 0/15

Types

±10^–5± 0.3

C_I

Input Capacitance

22.5

* T_Low= – 55°C for HCC device : – 40°C for HCF device.

* T_High= + 125°C for HCC device : + 85°C for HCF device.

The Noise Margin for both ”1” and ”0” level is : 1V min. with V_DD= 5V, 2V min. with V_DD= 10V, 2.5V min. with V_DD= 15V.

DYNAMIC ELECTRICAL CHARACTERISTICS (T_amb= 25°C, C_L= 50pF, R_L= 200kΩ,

typical temperature coefficient for all V_DDvalues is 0.3 %/°C, all input rise and fall times = 20ns)

Test Conditions

Value

Symbol

Parameter

Unit

V _DD(V) Min. Typ. Max.

t_PLH, t_PHLPropagation Delay Time

120

_THL, t_{TL H}Transition Time

4/12

HCC/HCF4041UB

Minimum Output High (source) Current Charac-

teristics.

Typical Output Low (sink) Current.

Minimum Output Low (sink) Current Charac-

teristics.

Typical Output High (source) Current Charac-

teristics.

Typical Transition Time vs. Load Capacitance.

Typical Propagation Delay Time vs. Load Capacit-

ance.

5/12

HCC/HCF4041UB

Minimum and Maximum Transfer Characteristics-true Output-and Test Circuit.

Minimum Maximum Transfer Characteristics Complement Output-and Test Circuit.

Typical Power Dissipation vs. Input Rise and Fall

Time per Output Pair.

Typical Power Dissipation vs. Frequency per Out-

put Pair.

6/12

HCC/HCF4041UB

TEST CIRCUITS

Quiescent Device Current.

Noise Immunity.

Input Leakage Current.

7/12

HCC/HCF4041UB

Plastic DIP14 MECHANICAL DATA

inch

TYP.

DIM.

MIN.

TYP.

MAX.

MIN.

0.020

0.055

MAX.

0.51

1.39

1.65

0.065

0.5

0.020

0.010

0.25

0.787

8.5

2.54

15.24

0.335

0.100

0.600

7.1

5.1

0.280

0.201

3.3

0.130

1.27

2.54

0.050

0.100

P001A

8/12

HCC/HCF4041UB

Ceramic DIP14/1 MECHANICAL DATA

inch

DIM.

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

0.787

0.276

7.0

3.3

0.130

0.600

0.38

0.015

15.24

2.29

0.4

2.79

0.55

1.52

0.31

2.54

10.3

8.05

5.08

0.090

0.016

0.046

0.009

0.060

0.110

0.022

0.060

0.012

0.100

0.406

0.317

0.200

1.17

0.22

1.52

7.8

0.307

P053C

9/12

HCC/HCF4041UB

SO14 MECHANICAL DATA

inch

TYP.

DIM.

MIN.

TYP.

MAX.

1.75

0.2

MIN.

MAX.

0.068

0.007

0.064

0.018

0.010

0.1

0.003

1.65

0.46

0.25

0.35

0.19

0.013

0.007

0.5

0.019

45° (typ.)

8.55

5.8

8.75

6.2

0.336

0.228

0.344

0.244

1.27

7.62

0.050

0.300

3.8

4.6

0.5

4.0

5.3

0.149

0.181

0.019

0.157

0.208

0.050

0.026

1.27

0.68

8° (max.)

P013G

10/12

HCC/HCF4041UB

PLCC20 MECHANICAL DATA

inch

DIM.

MIN.

9.78

8.89

4.2

TYP.

MAX.

10.03

9.04

MIN.

0.385

0.350

0.165

TYP.

MAX.

0.395

0.356

0.180

4.57

2.54

0.56

0.100

0.022

7.37

8.38

0.290

0.330

0.004

1.27

5.08

0.38

0.050

0.200

0.015

0.101

1.27

1.14

0.050

0.045

P027A

11/12

HCC/HCF4041UB

Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the

consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No

license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specificationsmentioned

in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.

SGS-THOMSON Microelectronicsproductsare notauthorized foruse ascritical componentsin life support devices or systems without express

written approval of SGS-THOMSON Microelectonics.

SGS-THOMSON Microelectronics GROUP OF COMPANIES

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12/12

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