HD74HC109FP [ETC]

FLIP-FLOP|DUAL|J/K TYPE|HC-CMOS|SOP|16PIN|PLASTIC ; 触发器|双| J / K型| HC -CMOS |专科| 16PIN |塑料\n


型号：	HD74HC109FP
厂家：	ETC
描述：	FLIP-FLOP\|DUAL\|J/K TYPE\|HC-CMOS\|SOP\|16PIN\|PLASTIC 触发器\|双\| J / K型\| HC -CMOS \|专科\| 16PIN \|塑料\n 触发器逻辑集成电路光电二极管
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中文：	中文翻译
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HD74HC109

Dual J-K Flip-Flops (with Preset and Clear)

Description

Each flip-flop has independent J, K, preset, clear and clock inputs and Q and Q outputs. This device is

edge sensitive to the clock input and changes state on the positive going transition of the clock pulse. Clear

and preset are independent of the clock and accomplished by a low logic level on the corresponding input.

Features

•

High Speed Operation: t_pd(Clock to Q) = 15 ns typ (C_L= 50 pF)

High Output Current: Fanout of 10 LSTTL Loads

Wide Operating Voltage: V_CC= 2 to 6 V

Low Input Current: 1 µA max

Low Quiescent Supply Current: I_CC(static) = 2 µA max (Ta = 25°C)

Function Table

Inputs

Output

Preset

Clear

Clock

H*¹

Toggle

Q₀

Note: 1. Q and Q will remain high as long as preset and clear input are low, but Q and Q are

unpredictable if preset and clear input go high simultaneously.

HD74HC109

Pin Arrangement

1CLR

16 V_CC

15 2CLR

14 2J

PR CLR

1CK

1PR

13 2K

12 2CK

11 2PR

10 2Q

CLR PR

GND

(Top view)

Block Diagram (1/2)

CLR

HD74HC109

DC Characteristics

Ta = –40 to

Ta = 25°C

+85°C

Item

Symbol V_CC(V) Min Typ Max Min Max Unit Test Conditions

Input voltage

V_IH

2.0

4.5

6.0

2.0

4.5

6.0

2.0

4.5

6.0

4.5

6.0

2.0

4.5

6.0

4.5

6.0

1.5

—

0.5

1.5

3.15

4.2

—

3.15 —

—

4.2

—

V_IL

0.5

1.35

1.8

—

1.35 —

1.8

—

Output voltage

V_OH

1.9 2.0

4.4 4.5

5.9 6.0

4.18 —

5.68 —

1.9

4.4

5.9

4.13

5.63

—

Vin = V_IHor V_ILI_OH= –20 µA

—

I_OH= –4 mA

I_OH= –5.2 mA

—

V_OL

—

0.0 0.1

0.1

0.33

Vin = V_IHor V_ILI_OL= 20 µA

—

0.26 —

±0.1 —

2.0

I_OL= 4 mA

I_OL= 5.2 mA

Input current

Iin

±1.0 µA

20 µA

Vin = V_CCor GND

Quiescent supply I_CC

current

—

Vin = V_CCor GND, Iout = 0 µA

HD74HC109

AC Characteristics (C_L= 50 pF, Input t_r= t_f= 6 ns)

Ta = –40 to

+85°C

Ta = 25°C

Symbol V_CC(V) Min Typ Max Min Max Unit Test Conditions

Item

Maximum clock

frequency

f_max

2.0

4.5

6.0

2.0

4.5

6.0

2.0

4.5

6.0

2.0

4.5

6.0

2.0

4.5

6.0

2.0

4.5

6.0

2.0

4.5

6.0

2.0

4.5

6.0

—

MHz

Propagation delay t_PLH

175 —

220 ns

Clock to Q or Q

time

t_PHL

15 35

—

190 —

240 ns

Preset or Clear to Clock

14 38

—

Removal time

Setup time

Hold time

t_rem

t_su

t_h

—

100 —

125

—

–4

—

Pulse width

t_w

—

100

—

Output rise/fall

time

t_TLH

t_THL

—

Input capacitance Cin

Unit: mm

19.20

20.00 Max

1.3

1.11 Max

7.62

+ 0.13

– 0.05

0.25

2.54 ± 0.25

0.48 ± 0.10

0° – 15°

Hitachi Code

DP-16

JEDEC

EIAJ

Conforms

Weight (reference value) 1.07 g

Unit: mm

10.06

10.5 Max

+ 0.20

7.80

– 0.30

0.80 Max

1.15

0° – 8°

1.27

0.70 ± 0.20

*0.42 ± 0.08

0.40 ± 0.06

0.15

0.12

Hitachi Code

JEDEC

EIAJ

FP-16DA

—

Conforms

*Dimension including the plating thickness

Base material dimension

Weight (reference value) 0.24 g

Unit: mm

9.9

10.3 Max

1.27

+ 0.10

6.10

– 0.30

1.08

0.635 Max

0° – 8°

+ 0.67

0.60

– 0.20

*0.42 ± 0.08

0.40 ± 0.06

0.15

0.25

Hitachi Code

JEDEC

EIAJ

FP-16DN

Conforms

*Dimension including the plating thickness

Base material dimension

Weight (reference value) 0.15 g

Unit: mm

5.00

5.30 Max

0.65

0.13 M

0.65 Max

1.0

+ 0.08

– 0.07

*0.22

0.20 ± 0.06

6.40 ± 0.20

0° – 8°

0.50 ± 0.10

0.10

Hitachi Code

JEDEC

EIAJ

TTP-16DA

—

*Dimension including the plating thickness

Base material dimension

Weight (reference value) 0.05 g

Cautions

1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,

Hitachi bears no responsibility for problems that may arise with third party’s rights, including

intellectual property rights, in connection with use of the information contained in this document.

2. Products and product specifications may be subject to change without notice. Confirm that you have

received the latest product standards or specifications before final design, purchase or use.

3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,

contact Hitachi’s sales office before using the product in an application that demands especially high

quality and reliability or where its failure or malfunction may directly threaten human life or cause risk

of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,

traffic, safety equipment or medical equipment for life support.

4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly

for maximum rating, operating supply voltage range, heat radiation characteristics, installation

conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used

beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable

failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-

safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other

consequential damage due to operation of the Hitachi product.

5. This product is not designed to be radiation resistant.

6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without

written approval from Hitachi.

7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor

products.

Hitachi, Ltd.

Semiconductor & Integrated Circuits.

Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan

Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109

URL

NorthAmerica

Europe

: http:semiconductor.hitachi.com/

: http://www.hitachi-eu.com/hel/ecg

Asia (Singapore)

Asia (Taiwan)

: http://www.has.hitachi.com.sg/grp3/sicd/index.htm

: http://www.hitachi.com.tw/E/Product/SICD_Frame.htm

Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm

Japan

: http://www.hitachi.co.jp/Sicd/indx.htm

For further information write to:

Hitachi Semiconductor

(America) Inc.

Hitachi Europe GmbH

Hitachi Asia (Hong Kong) Ltd.

Group III (Electronic Components)

7/F., North Tower, World Finance Centre,

Harbour City, Canton Road, Tsim Sha Tsui,

Kowloon, Hong Kong

Tel: <852> (2) 735 9218

Fax: <852> (2) 730 0281

Hitachi Asia Pte. Ltd.

16 Collyer Quay #20-00

Hitachi Tower

Singapore 049318

Tel: 535-2100

Electronic components Group

Dornacher Stra§e 3

D-85622 Feldkirchen, Munich

Germany

Tel: <49> (89) 9 9180-0

Fax: <49> (89) 9 29 30 00

179 East Tasman Drive,

San Jose,CA 95134

Tel: <1> (408) 433-1990

Fax: <1>(408) 433-0223

Fax: 535-1533

Hitachi Asia Ltd.

Taipei Branch Office

3F, Hung Kuo Building. No.167,

Tun-Hwa North Road, Taipei (105)

Tel: <886> (2) 2718-3666

Fax: <886> (2) 2718-8180

Telex: 40815 HITEC HX

Hitachi Europe Ltd.

Electronic Components Group.

Whitebrook Park

Lower Cookham Road

Maidenhead

Berkshire SL6 8YA, United Kingdom

Tel: <44> (1628) 585000

Fax: <44> (1628) 778322

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