HD74HC623RP [ETC]
BUS TRANSCEIVER|SINGLE|8-BIT|HC-CMOS|SOP|20PIN|PLASTIC ; 总线收发器|单| 8位| HC -CMOS |专科| 20PIN |塑料\n
| 型号： | HD74HC623RP |
| 厂家： | 
ETC |
| 描述： | BUS TRANSCEIVER|SINGLE|8-BIT|HC-CMOS|SOP|20PIN|PLASTIC
|
| 文件： | 总10页 (文件大小：60K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HD74HC620/HD74HC623
Octal Bus Transceivers (with inverted 3-state outputs)
Octal Bus Transceivers (with 3-state outputs)
Description
This octal bus transceiver is designed for asynchronous two-way communication between data buses. The
control fuction implementation allows for maximum flexibility in timing.
This device allows data transmission from the A bus to the B bus or from the B bus to the A bus depending
upon the logic levels at the enable inputs (GBA and GAB).
The enable inputs can be used to disable the device so that the buses are effectively isolated.
The dual-enable configuration gives these devices the capability to store data by simultaneous enabling of
GBA and GAB. Each output reinforces its input in this transceiver configuration. Thus, when both control
inputs are enabled and all other data sources to the two sets of bus lines are at high impedance, both sets of
bus lines (16 in all) will remain at their last states. The 8-bit codes appearing on the two sets of buses will
be identical for the HD74HC623 or coplementary for the HD74HC620.
Features
•
•
•
•
•
High Speed Operation: tpd (Bus to Bus) = 12 ns typ (CL = 50 pF)
High Output Current: Fanout of 15 LSTTL Loads
Wide Operating Voltage: VCC = 2 to 6 V
Low Input Current: 1 µA max
Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C)
Function Table
Enable Inputs
Operation
GBA
GAB
HD74HC620
HD74HC623
L
L
B data to A bus
A data to B bus
Isolation
B data to A bus
A data to B bus
Isolation
H
H
L
H
L
H
B data to A bus, A data to B bus
B data to A bus, A data to B bus
HD74HC620/HD74HC623
Pin Arrangement
1
2
3
4
5
6
7
8
9
20
VCC
Enable GAB
19 Enable GBA
A1
A2
A3
A4
A5
A6
A7
A8
18
17
16
15
14
13
12
11
B1
B2
B3
B4
B5
B6
B7
B8
GND 10
(Top view)
Absolute Maximum Ratings
Item
Symbol
VCC
Rating
Unit
V
Supply voltage range
Input voltage
–0.5 to +7.0
–0.5 to VCC + 0.5
–0.5 to VCC + 0.5
±35
VIN
V
Output voltage
VOUT
IOUT
ICC, IGND
IIK
V
Output current
mA
mA
mA
mA
mW
°C
DC current drain per VCC GND
DC input diode current
DC output diode current
Power Dissipation per package
Storage temperature
±75
±20
IOK
±20
PT
500
Tstg
–65 to +150
2
HD74HC620/HD74HC623
Block Diagram
HD74HC620
GBA
GAB
VCC
A1
B1
VCC
A2
A3
A4
A5
A6
A7
A8
B2
B3
B4
B5
B6
B7
B8
3
HD74HC620/HD74HC623
HD74HC623
GBA
GAB
VCC
A1
B1
VCC
A2
A3
A4
A5
A6
A7
A8
B2
B3
B4
B5
B6
B7
B8
4
HD74HC620/HD74HC623
DC Characteristics
Ta = –40 to
Ta = 25°C
+85°C
Item
Symbol VCC (V) Min Typ Max Min Max Unit Test Conditions
Input voltage
VIH
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
4.5
6.0
2.0
4.5
6.0
4.5
6.0
6.0
1.5
—
—
—
—
0.5
1.5
3.15
4.2
—
—
V
V
V
3.15 —
—
4.2
—
—
—
—
—
—
—
—
VIL
0.5
1.35
1.8
—
1.35 —
1.8
—
—
—
—
—
—
Output voltage
VOH
1.9 2.0
4.4 4.5
5.9 6.0
4.18 —
5.68 —
1.9
4.4
5.9
4.13
5.63
—
Vin = VIH or VIL IOH = –20 µA
—
—
—
IOH = –6 mA
IOH = –7.8 mA
—
VOL
—
—
—
—
—
—
0.0 0.1
0.0 0.1
0.0 0.1
0.1
0.1
0.1
0.33
0.33
V
Vin = VIH or VIL IOL = 20 µA
—
—
—
—
—
0.26 —
0.26 —
IOL = 6 mA
IOL = 7.8 mA
Off-state output
current
IOZ
Iin
±0.5 —
±5.0 µA
Vin = VIH or VIL,
Vout = VCC or GND
Input current
6.0
6.0
—
—
—
—
±0.1 —
±1.0 µA
Vin = VCC or GND
Quiescent supply ICC
current
4.0
—
40
µA
Vin = VCC or GND, Iout = 0 µA
5
HD74HC620/HD74HC623
AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns)
Ta = –40 to
+85°C
Ta = 25°C
Symbol VCC (V) Min Typ Max Min Max Unit Test Conditions
Item
Propagation delay tPLH
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
100 —
125 ns
time
tPHL
12 20
—
—
25
—
—
17
21
Output enable
time
tZH
tZL
150 —
190 ns
12 30
—
—
38
—
—
26
33
Output disable
time
tHZ
tLZ
150 —
190 ns
16 30
—
—
—
—
—
—
38
33
—
—
4
26
60
12
10
10
Output rise/fall
time
tTLH
tTHL
75
15
13
10
ns
—
5
Input capacitance Cin
pF
6
Unit: mm
24.50
25.40 Max
20
11
10
1
1.30
0.89
7.62
1.27 Max
+ 0.11
– 0.05
0.25
2.54 ± 0.25
0.48 ± 0.10
0° – 15°
Hitachi Code
JEDEC
EIAJ
DP-20N
—
Conforms
Weight (reference value) 1.26 g
Unit: mm
12.6
13 Max
11
10
20
1
+ 0.20
7.80
– 0.30
0.80 Max
1.15
0° – 8°
1.27
0.70 ± 0.20
*0.42 ± 0.08
0.40 ± 0.06
0.15
0.12 M
Hitachi Code
JEDEC
FP-20DA
—
EIAJ
Conforms
*Dimension including the plating thickness
Base material dimension
Weight (reference value) 0.31 g
Unit: mm
12.8
13.2 Max
11
10
20
1
+ 0.25
– 0.40
10.40
0.935 Max
1.45
0° – 8°
+ 0.57
– 0.30
1.27
0.70
*0.42 ± 0.08
0.40 ± 0.06
0.15
M
0.12
Hitachi Code
JEDEC
EIAJ
FP-20DB
Conforms
—
*Dimension including the plating thickness
Base material dimension
Weight (reference value) 0.52 g
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URL
NorthAmerica
Europe
: http:semiconductor.hitachi.com/
: http://www.hitachi-eu.com/hel/ecg
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Asia (Taiwan)
: http://www.has.hitachi.com.sg/grp3/sicd/index.htm
: http://www.hitachi.com.tw/E/Product/SICD_Frame.htm
Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm
Japan
: http://www.hitachi.co.jp/Sicd/indx.htm
For further information write to:
Hitachi Semiconductor
(America) Inc.
Hitachi Europe GmbH
Hitachi Asia (Hong Kong) Ltd.
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7/F., North Tower, World Finance Centre,
Harbour City, Canton Road, Tsim Sha Tsui,
Kowloon, Hong Kong
Tel: <852> (2) 735 9218
Fax: <852> (2) 730 0281
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Tel: 535-2100
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Germany
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Tel: <886> (2) 2718-3666
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Telex: 40815 HITEC HX
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Berkshire SL6 8YA, United Kingdom
Tel: <44> (1628) 585000
Fax: <44> (1628) 778322
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
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