HFCT-5005 [ETC]
Evaluation Kit for SFF LC for SONET/ATM OC-48 or Gigabit Ethernet or Dual Spec Applications ; 评估板SFF LC的SONET / ATM OC- 48或千兆位以太网或双规格的应用\n
| 型号： | HFCT-5005 |
| 厂家： | 
ETC |
| 描述： | Evaluation Kit for SFF LC for SONET/ATM OC-48 or Gigabit Ethernet or Dual Spec Applications
|
| 文件： | 总17页 (文件大小：274K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Agilent HFCT-5914ATL Single Mode Laser
Transceivers for Gigabit Ethernet and
iSCSI Applications at 1.25 Gb/s
Data Sheet
Features
•
10 km Links with 9/125 µm single
mode fiber (SMF)
• 550 m Links in 62.5/125 µm multi
mode fiber (MMF)
• Compliant to IEEE 802.3, 2000
Edition
Description
•
Compliant to Small Form Factor
MSA specifications
The HFCT-5914ATL transceiver
is a high performance, cost
effective module for serial
optical data communications
applications operating at 1.25
Gb/s. This module is designed
for single mode fiber and
operates at a nominal
wavelength of 1310 nm. It
incorporates high performance,
reliable, long wavelength optical
devices and proven circuit
technology to give long life and
consistent service.
The transceiver is supplied in
the industry standard 2 x 10 DIP
style package with the LC fiber
connector interface and is
footprint compatible with SFF
Multi Source Agreement (MSA).
•
2 x 10 package style with LC
receptacle
•
•
Single +3.3 V power supply
Case operating temperature
range: -10°C to +85°C
Manufactured in an ISO9002
certified facility
Fully Class 1 CDRH/IEC 825
compliant
Wave solder and aqueous wash
process compatible
•
•
•
Applications
The transmitter section
•
Gigabit Ethernet 1000BASE-LX
incorporates a 1310 nm Fabry
Perot (FP) laser. The transmitter
has full IEC 825 and CDRH Class
1 eye safety.
•
High speed links for Gigabit
Ethernet
Switches
Routers
Hubs
•
•
•
The receiver section uses an
MOVPE grown planar SEDET
PIN photo detector for low dark
current and excellent
responsivity.
Functional Description
Receiver Section
Noise Immunity
Design
The receiver includes internal
circuit components to filter
power supply noise. However
under some conditions of EMI
and power supply noise,
external power supply filtering
may be necessary (see
Figure 1 also shows a filter
function which limits the
bandwidth of the pre-amplifier
output signal. The filter is
designed to bandlimit the pre-
amplifier output noise and thus
improve the receiver sensitivity.
The receiver section for the
HFCT-5914ATL contains an
InGaAs/InP photo detector and
a pre-amplifier mounted in an
optical subassembly. This optical
subassembly is coupled to a
post-amplifier/decision circuit
on a circuit board. The design of
the optical assembly is such that
it provides better than 12 dB
Optical Return Loss (ORL).
Application Section).
These components will reduce
the sensitivity of the receiver as
the signal bit rate is increased
above 1.25 Gb/s.
The Signal Detect Circuit
The signal detect circuit works
by sensing the peak level of the
received signal and comparing
this level to a reference. The SD
output is low voltage TTL.
The post-amplifier is ac coupled
to the pre-amplifier as
The device incorporates a
photodetector bias circuit. This
illustrated in Figure 1. The
coupling capacitors are capable
of passing the Gigabit Ethernet
test pattern at 1.25 Gb/s without
any significant distortion or
performance penalty. If a lower
signal rate, or a code which has
significantly more low frequency
content is used, sensitivity, jitter
and pulse distortion could be
degraded.
output must be connected to V
and can be monitored by
connecting through a series
resistor (see Application
Section).
CC
PHOTODETECTOR
BIAS
FILTER
DATA OUT
TRANS-
IMPEDANCE
PRE-
AMPLIFIER
PECL
OUTPUT
BUFFER
AMPLIFIER
DATA OUT
GND
TTL
OUTPUT
BUFFER
SIGNAL
DETECT
CIRCUIT
SD
Figure 1. Receiver Block Diagram
2
Functional Description
Transmitter Section
Design
A schematic diagram for the
transmitter is shown in Figure 2.
The HFCT-5914ATL uses an FP
laser designed to be complaint
with IEC 825 eye safety
requirements under any single
fault condition and CDRH under
normal operating conditions.
The optical output is controlled
by a custom IC that detects the
laser output via the monitor
photodiode. This IC provides
both dc and ac current drive to
the laser to ensure correct
modulation, eye diagram and
extinction ratio over
temperature, supply voltage and
operating life.
The transmitter also include
monitor circuitry for both the
laser diode bias current and
laser diode optical power.
FP
LASER
PHOTODIODE
(rear facet monitor)
DATA
LASER
MODULATOR
DATA
PECL
INPUT
LASER BIAS
DRIVER
BMON(+)
BMON(-)
LASER BIAS
CONTROL
PMON(+)
PMON(-)
Figure 2. Simplified Transmitter Schematic
3
Package
The receiver electrical
Each electrical subassembly PCB
carries the signal pins that exit
from the bottom of the
transceiver.
The overall package concept for
the device consists of the
following basic elements; two
optical subassemblies, two
electrical subassemblies and the
housing as illustrated in the
block diagram in Figure 3.
subassembly includes an
internal shield for the electrical
and optical subassembly to
ensure high immunity to
external EMI fields.
The solder posts are fastened
into the molding of the device.
This design provides the
The optical subassemblies are
each attached to their respective mechanical strength required to
The package outline drawing
and pin out are shown in
Figures 4 and 5. The details of
this package outline and pin out
are compliant with the multi-
source definition of the 2 x 10
DIP.
transmit or receive electrical
subassemblies. These two units
are then placed within the outer
housing of the transceiver. The
outer housing of the transceiver
is molded with nonconductive
plastic to provide mechanical
strength. The housing is then
encased with a metal EMI
protective shield. The case is
signal ground and we
withstand the additional
stresses on the transceiver
resulting from the insertion
force of fiber cable mating.
Although the solder posts are
not connected electrically to the
transceiver, it is recommended
that they are connected to the
chassis ground.
The electrical subassemblies
consist of high volume
multilayer printed circuit boards
on which the IC and various
surface-mounted passive circuit
elements are attached.
recommend soldering the four
ground tabs to host card signal
ground.
RX SUPPLY
*
PHOTO DETECTOR
BIAS
DATA OUT
DATA OUT
PIN PHOTODIODE
PREAMPLIFIER
SUBASSEMBLY
QUANTIZER IC
RX GROUND
SIGNAL
DETECT
LC
TX GROUND
RECEPTACLE
DATA IN
DATA IN
LASER BIAS
MONITORING
LASER
OPTICAL
SUBASSEMBLY
Tx DISABLE
LASER DRIVER
AND CONTROL
CIRCUIT
B
B
MON(+)
MON(-)
LASER DIODE
OUTPUT POWER
MONITORING
P
P
MON(+)
MON(-)
TX SUPPLY
CASE
* NOSE CLIP PROVIDES CONNECTION TO CHASSIS GROUND FOR IMPROVED EMI PERFORMANCE.
Figure 3. Block Diagram
4
+ 0
- 0.2
+0
13.59
0.535
13.59
(0.535)
MAX
15.0 0.2
(0.591 0.008)
(
)
-0.008
TOP VIEW
48.2
(1.898)
6.25
(0.246)
9.8
10.8 0.2
9.6 0.2
(0.386)
(0.425 0.008)(0.378 0.008)
MAX
4.06
(0.16)
MIN
3.81
(0.15)
MIN
0.25
(0.01)
1
Ø 1.07
10.16
(0.4)
1
(0.039)
(0.042)
20 x 0.5
(0.02)
(0.039)
19.5 0.3
(0.768 0.012)
1.78
(0.07)
BACK VIEW
FRONT VIEW
SIDE VIEW
20 x 0.25 (PIN THICKNESS)
(0.01)
NOTE: END OF PINS
CHAMFERED
BOTTOM VIEW
Tcase REFERENCE
POINT
DIMENSIONS IN MILLIMETERS (INCHES)
DIMENSIONS SHOWN ARE NOMINAL. ALL DIMENSIONS MEET THE MAXIMUM PACKAGE OUTLINE DRAWING IN THE SFF MSA.
Figure 4. HFCT-5914ATL Package Outline Drawing
5
Connection Diagram
RX
TX
Mounting Studs/
Solder Posts
Package
Grounding Tabs
o
o
PHOTO DETECTOR BIAS
RECEIVER SIGNAL GROUND
RECEIVER SIGNAL GROUND
NOT CONNECTED
1
2
3
4
5
6
7
8
9
20
19
18
17
16
15
14
13
12
11
LASER DIODE OPTICAL POWER MONITOR - POSITIVE END
LASER DIODE OPTICAL POWER MONITOR - NEGATIVE END
LASER DIODE BIAS CURRENT MONITOR - POSITIVE END
LASER DIODE BIAS CURRENT MONITOR - NEGATIVE END
TRANSMITTER SIGNAL GROUND
TRANSMITTER DATA IN BAR
TRANSMITTER DATA IN
TRANSMITTER DISABLE
TRANSMITTER SIGNAL GROUND
o
o
o
o
o
o
o
o
o
o
o
o
o
o
o
o
o
o
Top
View
NOT CONNECTED
RECEIVER SIGNAL GROUND
RECEIVER POWER SUPPLY
SIGNAL DETECT
RECEIVER DATA OUTPUT BAR
RECEIVER DATA OUTPUT
10
TRANSMITTER POWER SUPPLY
Figure 5. Pin Out Diagram (Top View)
Pin Descriptions:
Pin 1 Photo Detector Bias, VpdR:
This pin enables monitoring of
photo detector bias current. The
pin should either be connected
directly to V RX, or to V RX
through a resistor (max 200 W)
for monitoring photo detector
bias current.
Pin 9 Receiver Data Out Bar RD-:
PECL logic family. Output
internally biased and ac
coupled.
Pin 17 Laser Diode Bias Current
Monitor - Negative End B
The laser diode bias current is
accessible by measuring the
voltage developed across pins 17
and 18. Dividing the voltage by
10 Ohms (internal) will yield the
value of the laser bias current.
–
MON
CC
CC
Pin 10 Receiver Data Out RD+:
PECL logic family. Output
internally biased and ac
coupled.
Pins 2, 3, 6 Receiver Signal Ground
Pin 18 Laser Diode Bias Current
Pin 11 Transmitter Power Supply
V
RX:
Monitor - Positive End B
+
EE
MON
V
TX:
CC
Directly connect these pins to
the receiver ground plane.
See pin 17 description.
Provide +3.3 V dc via the
recommended dc transmitter
power supply filter circuit.
Locate the power supply filter
circuit as close as possible to the
Pin 19 Laser Diode Optical Power
Pins 4, 5 DO NOT CONNECT
Monitor - Negative End P
–
MON
The back facet diode monitor
current is accessible by measuring
the voltage developed across
pins 19 and 20. The voltage
across a 200 Ohm resistor
between pins 19 and 20 will be
proportional to the photo
current.
Pin 7 Receiver Power Supply V RX:
CC
Provide +3.3 V dc via the
V
TX pin.
CC
recommended dc receiver power
supply filter circuit. Locate the
power supply filter circuit as
Pins 12, 16 Transmitter Signal
Ground V TX:
EE
Directly connect these pins to
the transmitter signal ground
plane.
close as possible to the V RX
CC
pin. Note: the filter circuit
should not cause V to drop
CC
below minimum specification.
Pin 20 Laser Diode Optical Power
Pin 13 Transmitter Disable T
:
DIS
Monitor - Positive End P
+
MON
Optional feature, connect this
pin to +3.3 V TTL logic high “1”
to disable module. To enable
module connect to TTL logic low
“0”.
Pin 8 Signal Detect SD:
Normal optical input levels to
the receiver result in a logic “1”
output.
See pin 19 description.
Mounting Studs/Solder Posts
The two mounting studs are
provided for transceiver
mechanical attachment to the
circuit board. It is
recommended that the holes in
the circuit board be connected to
chassis ground.
Low optical input levels to the
receiver result in a logic “0”
output.
Pin 14 Transmitter Data In TD+:
PECL logic family.
Internal terminations are
provided (Terminations, ac
coupling).
This Signal Detect output can be
used to drive a LVTTL input on
an upstream circuit, such as
Signal Detect input or Loss of
Signal-bar.
6
Package Grounding Tabs
Connect four package grounding
tabs to signal ground.
Pin 15 Transmitter Data In Bar TD-:
Internal terminations are
provided (Terminations, ac
coupling).
Application Information
link. The OPB is allocated for the Refer to Section 38.11.4 for
The Applications Engineering
Group at Agilent is available to
assist you with technical
understanding and design trade-
offs associated with these
transceivers. You can contact
them through your Agilent sales
representative.
fiber-optic cable length and the
corresponding link penalties.
For proper link performance, all
penalties that affect the link
performance must be accounted
for within the link optical power
budget.
specification of offset-launch
mode-conditioning patch cord
required for MMF operation of
HFCT-5914ATL.
10km Link Support
As well as complying with the
LX 5 km standard, the HFCT-
The Gigabit Ethernet IEEE 802.3 5914ATL specification provides
The following information is
provided to answer some of the
most common questions about
the use of the parts.
standard identifies, and has
modeled, the contributions of
these OPB penalties to establish
the link length requirements for
62.5/125 µm and 50/125 µm
multimode fiber usage. In
addition, single mode fiber with
standard 1310 nm Fabry-Perot
lasers have been modeled and
specified. Refer to the IEEE
802.3 standard and its
additional margin allowing for a
10 km Gigabit Ethernet link on a
single mode fiber. This is
accomplished by limiting the
spectral width and center
wavelength range of the
transmitter while increasing the
output optical power and
improving sensitivity. All other
LX cable plant recommendations
should be followed.
Optical Power Budget and
Link Penalties
The worst-case Optical Power
Budget (OPB) in dB for a fiber-
optic link is determined by the
difference between the
minimum transmitter output
optical power (dBm avg) and the
lowest receiver sensitivity (dBm
avg). This OPB provides the
necessary optical signal range to
establish a working fiber-optic
supplemental documents that
develop the model, empirical
results and specifications.
Z = 50
Z = 50
W
W
VCC (+3.3 V)
TDIS (LVTTL)
130
W
BMON
-
TD-
BMON
+
NOTE A
130
W
PMON
PMON
-
TD+
+
20 19 18 17 16 15 14 13 12 11
VCC (+3.3 V)
1 µH
TX
10 µF
10 µF
C2
C1
C3
VCC (+3.3 V)
RX
1 µH
RD+
RD-
10 µF
1
2
3
4
5
6
7
8
9
10
Z = 50
W
W
VCCRX (+3.3 V)
200
100
W
NOTE B
W
Z = 50
10 nF
NOTE C
SD
LVTTL
Note: C1 = C2 = C3 = 10 nF or 100 nF
TD+, TD- INPUTS ARE INTERNALLY TERMINATED AND AC COUPLED.
RD+, RD- OUTPUTS ARE INTERNALLY BIASED AND AC COUPLED.
Note A: CIRCUIT ASSUMES OPEN EMITTER OUTPUT.
Note B: CIRCUIT ASSUMES HIGH IMPENDANCE INTERNAL BIAS @ VCC - 1.3 V.
Note C: THE BIAS RESISTOR FOR VpdR SHOULD NOT EXCEED 200
W.
Figure 6. Recommended Interface Circuit
7
Electrical and Mechanical Interface
Recommended Circuit
Figure 6 shows the
recommended interface for
deploying the Agilent
transceivers in a +3.3 V system.
The HFCT-5914ATL has a
stages. The Data and Data-bar
outputs of the post-amplifier are
internally biased and ac-coupled
to their respective output pins
(Pins 9, 10).
transmit disable function which
is a single-ended +3.3 V TTL
input which is dc-coupled to Pin
13. In addition the devices offer
the designer the option of
monitoring the laser diode bias
current and the laser diode
optical power. The voltage
measured between Pins 17 and
18 is proportional to the bias
current through an internal 10 Ω
resistor. Similarly the optical
power rear facet monitor circuit
provides a photo current which
is proportional to the voltage
measured between Pins 19 and
20, this voltage is measured
across an internal 200 Ω
Signal Detect is a single-ended,
+3.3 V TTL compatible output
signal that is dc-coupled to pin 8
of the module. Signal Detect
should not be ac-coupled
externally to the follow-on
circuits because of its infrequent
state changes.
Data Line Interconnections
Agilent’s HFCT-5914ATL fiber-
optic transceivers are designed
to couple to +3.3 V PECL signals.
The transmitter driver circuit
regulates the output optical
power. The regulated light
output will maintain a constant
output optical power provided
the data pattern is balanced in
duty cycle. If the data duty cycle
has long, continuous state times
(low or high data duty cycle),
then the output optical power
The designer also has the option
of monitoring the PIN photo
detector bias current. Figure 6
shows a resistor network, which
could be used to do this. Note
that the photo detector bias
current pin must be connected
resistor.
will gradually change its average The receiver section is internally
to V . Agilent also recommends
CC
output optical power level to its
preset value.
ac-coupled between the pre-
amplifier and the post-amplifier
that a decoupling capacitor is
used on this pin.
8.89
3.56
(0.14)
(0.35)
2 x Ø 2.29 MAX. 2 x Ø 1.4 0.1
2 x Ø 1.4 0.1
(0.055 0.004)
7.11
(0.28)
(0.09)
(0.055 0.004)
4 x Ø 1.4 0.1
(0.055 0.004)
10.16
(0.4)
13.34
(0.525)
7.59
(0.299)
9.59
(0.378)
2
(0.079)
9 x 1.78
(0.07)
2
3
3
2 x Ø 2.29
(0.09)
(0.079)
(0.118)
(0.118)
4.57
(0.18)
20 x Ø 0.81 0.1
(0.032 0.004)
6
16
3.08
(0.236)
(0.63)
(0.121)
DIMENSIONS IN MILLIMETERS (INCHES)
NOTES:
1. THIS FIGURE DESCRIBES THE RECOMMENDED CIRCUIT BOARD LAYOUT FOR THE SFF TRANSCEIVER.
2. THE HATCHED AREAS ARE KEEP-OUT AREAS RESERVED FOR HOUSING STANDOFFS. NO METAL TRACES OR
GROUND CONNECTION IN KEEP-OUT AREAS.
3. 2 x 10 TRANSCEIVER MODULE REQUIRES 26 PCB HOLES (20 I/O PINS, 2 SOLDER POSTS AND 4 PACKAGE
GROUNDING TABS).
PACKAGE GROUNDING TABS SHOULD BE CONNECTED TO SIGNAL GROUND.
4. THE MOUNTING STUDS SHOULD BE SOLDERED TO CHASSIS GROUND FOR MECHANICAL INTEGRITY AND TO
ENSURE FOOTPRINT COMPATIBILITY WITH OTHER SFF TRANSCEIVERS.
5. HOLES FOR HOUSING LEADS MUST BE TIED TO SIGNAL GROUND.
Figure 7. Recommended Board Layout Hole Pattern
8
Power Supply Filtering and Ground
Planes
It is important to exercise care
in circuit board layout to
achieve optimum performance
from these transceivers. Figure 6
shows the power supply circuit
which complies with the Small
Form Factor Multisource
Agreement. It is further
15.24
(0.6)
10.16 0.1
(0.4 0.004)
TOP OF PCB
B
B
DETAIL A
recommended that a continuous
ground plane be provided in the
circuit board directly under the
transceiver to provide a low
inductance ground for signal
return current. This
1
(0.039)
15.24
(0.6)
A
SOLDER POSTS
recommendation is in keeping
with good high frequency board
layout practices.
14.22 0.1
(0.56 0.004)
Package footprint and front panel
considerations
15.75 MAX. 15.0 MIN.
(0.62 MAX. 0.59 MIN.)
SECTION B - B
The Agilent transceivers comply
with the circuit board “Common
Transceiver Footprint” hole
pattern defined in the current
multisource agreement which
defined the 2 x 10 package style.
This drawing is reproduced in
Figure 7 with the addition of
ANSI Y14.5M compliant
dimensioning to be used as a
guide in the mechanical layout
of your circuit board. Figure 8
shows the front panel
DIMENSIONS IN MILLIMETERS (INCHES)
1. FIGURE DESCRIBES THE RECOMMENDED FRONT PANEL OPENING FOR A LC OR SG SFF TRANSCEIVER.
2. SFF TRANSCEIVER PLACED AT 15.24 mm (0.6) MIN. SPACING.
Figure 8. Recommended Panel Mounting
state between the minimum
receiver input optical power and
-30 dBm avg. input optical
dependent on physical design
and features which help improve
EMI suppression. Agilent
encourages using standard RF
suppression practices and
avoiding poorly EMI-sealed
enclosures.
power indicating a definite
optical fault (e.g. unplugged
connector for the receiver or
transmitter, broken fiber, or
failed far-end transmitter or data
source). The Signal Detect does
not detect receiver data error or
error-rate. Data errors can be
determined by signal processing
offered by upstream PHY ICs.
dimensions associated with such
a layout.
Agilent’s Gbe LC transceivers
have nose shields which provide
a convenient chassis connection
to the nose of the transceiver.
This nose shield improves
system EMI performance by
effectively closing off the LC
aperture.
Eye Safety Circuit
For an optical transmitter
device to be eye-safe in the event
of a single fault failure, the
transmit-ter must either
maintain eye-safe operation or
be disabled.
Electromagnetic Interference (EMI)
One of a circuit board designer’s
foremost concerns is the control
of electromagnetic emissions
from electronic equipment.
Success in controlling generated
Electromagnetic Interference
(EMI) enables the designer to
pass a governmental agency’s
EMI regulatory standard and
more importantly, it reduces the
possibility of interference to
neighboring equipment. Agilent
has designed the HFCT-5914ATL
to provide good EMI
Localized shielding is also
improved by tying the four metal
housing package grounding tabs
to signal ground on the PCB.
Though not obvious by
inspection, the nose shield and
metal housing are electrically
separated for customers who do
not wish to directly tie chassis
and signal grounds together.
Figure 8 shows the
The HFCT-5914ATL is
intrinsically eye safe and does
not require shut down circuitry.
Signal Detect
The Signal Detect circuit
provides a de-asserted output
signal when the optical link is
broken (or when the remote
transmitter is OFF). The Signal
Detect threshold is set to
transition from a high to low
9
recommended positioning of the
transceivers with respect to the
PCB and faceplate.
performance. The EMI
performance of a chassis is
Package and Handling Instructions
Flammability
Recommended Solder fluxes
Solder fluxes used with the
HFCT-5914ATL should be
water-soluble, organic fluxes.
Recommended solder fluxes
include Lonco 3355-11 from
London Chemical West, Inc. of
Burbank, CA, and 100 Flux from
Alpha-Metals of Jersey City, NJ.
Recommended Cleaning/Degreasing
Chemicals
Alcohols: methyl, isopropyl,
isobutyl.
Aliphatics: hexane, heptane
Other: naphtha.
The HFCT-5914ATL transceiver
housing consists of high
strength, heat resistant and UL
94 V-0 flame retardant plastic
and metal packaging.
Do not use partially halogenated
hydrocarbons such as 1,1.1
trichloroethane, ketones such as
MEK, acetone, chloroform, ethyl
acetate, methylene dichloride,
phenol, methylene chloride, or
N-methylpyrolldone. Also,
Agilent does not recommend the
use of cleaners that use
halogenated hydrocarbons
because of their potential
Recommended Solder and Wash
Process
The HFCT-5914ATL are
compatible with industry-
standard wave solder processes.
Process plug
This transceiver is supplied with
a process plug for protection of
the optical port within the LC
connector receptacle. This
process plug prevents
environmental harm.
contamination during wave
solder and aqueous rinse as well
as during handling, shipping and
storage. It is made of a high-
temperature, molded sealing
material that can withstand
+85°C and a rinse pressure of
110 lbs per square inch.
LC SFF Cleaning Recommendations
In the event of contamination of
the optical ports, the
recommended cleaning process
is the use of forced nitrogen. If
contamination is thought to have
remained, the optical ports can
be cleaned using a NTT
international Cletop stick type
(diam. 1.25mm) and HFE7100
cleaning fluid.
10
Regulatory Compliance
Electromagnetic Interference (EMI)
Eye Safety
The Regulatory Compliance for
transceiver performance is
shown in Table 1. The overall
Most equipment designs utilizing These laser-based transceivers
these high-speed transceivers
from Agilent will be required to
are classified as AEL Class I
(U.S. 21 CFR(J) and AEL Class 1
per IEC 60825-1. They are eye
safe when used within the data
sheet limits per CDRH. They are
equipment design will determine meet FCC regulations in the
the certification level. The
transceiver performance is
offered as a figure of merit to
assist the designer in
considering their use in
equipment designs.
United States, CENELEC
EN55022 (CISPR 22) in Europe
and VCCI in Japan. Refer to EMI also eye safe under normal
section (page 9) for more details. operating conditions and under
all reasonably foreseeable single
Immunity
fault conditions per IEC60825-1.
Transceivers will be subject to
Agilent has tested the
Electrostatic Discharge (ESD)
The device has been tested to
comply with MIL-STD-883E
(Method 3015). It is important to
use normal ESD handling
precautions for ESD sensitive
devices. These precautions
include using grounded wrist
straps, work benches, and floor
mats in ESD controlled areas.
radio-frequency electromagnetic
transceiver design for
fields following the IEC 61000-4-3
compliance with the
requirements listed below.
test method.
These tests were conducted
under normal operating
conditions and under single
fault conditions where
applicable. TUV Rheinland has
granted certification to these
transceivers for laser eye safety
and use in IEC60825-2
applications. Their performance
enables the transceivers to be
used without concern for eye
safety up to 3.6 V transmitter
Table 1: Regulatory Compliance - Targeted Specification
V
CC
.
Feature
Test Method
Performance
Electrostatic Discharge
(ESD) to the
MIL-STD-883
Method 3015
Class 2 (>2 kV).
Electrical Pins
Electrostatic Discharge
(ESD) to the LC
Receptacle
Variation of IEC 61000-4-2
Tested to 8 kV contact discharge.
Electromagnetic
Interference (EMI)
FCC Class B
CENELEC EN55022 Class B
(CISPR 22A)
Margins are dependent on customer board and chassis
designs.
VCCI Class I
Immunity
Variation of IEC 61000-4-3
Typically show no measurable effect from a
10 V/m field swept from 27 to 1000 MHz applied to the
transceiver without a chassis enclosure.
Laser Eye Safety
and Equipment Type
Testing
FDA CDRH
21-CFR 1040
Class 1
Accession Number:
HFCT-5914ATL ) 9521220 - 53
IEC 60825-1
Amendment 2
2001 - 01
License Number: 933/510206/01
UL File Number: E173874
Component
Recognition
Underwriters Laboratories and
Canadian Standards Association
Joint Component Recognition
for Information Technology
Equipment Including Electrical
Business Equipment.
11
CAUTION:
There are no user serviceable
parts nor any maintenance
required for the HFCT-5914ATL.
All adjustments are made at the
factory before shipment to our
customers. Tampering with or
modifying the performance of
the parts will result in voided
product warranty. It may also
result in improper operation of
the circuitry, and possible
overstress of the laser source.
Device degradation or product
failure may result.
Connection of the devices to a
non-approved optical source,
operating above the
recommended absolute
maximum conditions or
operating the HFCT-5914ATL in
a manner inconsistent with its
design and function may result
in hazardous radiation exposure
and may be considered an act of
modifying or manufacturing a
laser product. The person(s)
performing such an act is
required by law to re-certify and
re-identify the laser product
under the provisions of U.S. 21
CFR (Subchapter J).
12
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause catastrophic damage to the device. Limits apply to each parameter in
isolation, all other parameters having values within the recommended operating conditions. It should not be assumed that limiting
values of more than one parameter can be applied to the product at the same time. Exposure to the absolute maximum ratings for
extended periods can adversely affect device reliability.
Parameter
Symbol
Min
Typ
Max
Unit
Notes
Storage Temperature
(non-operating)
TS
-40
+85
°C
Relative Humidity
RH
85
%
Supply Voltage
Input Voltage on any Pin
VCC
VI
-0.5
-0.5
3.6
VCC
V
V
1
Typical Operating Conditions
Parameter
Symbol
TC
Min
-10
3.1
Typ
+25
3.3
Max
+85
3.5
Unit
°C
Notes
Case Operating Temperature
Supply Voltage
VCC
V
Power Supply Noise Rejection
Data Output Load
PSNR
RDL
100
mVP-P
W
2
50
Transmit Disable Input Voltage - Low
Transmit Disable Input Voltage - High
Transmit Disable Assert Time
Transmit Disable Deassert Time
TDIS
0.6
V
TDIS
2.2
V
Tassert
TDEASSERT
10
µs
ms
3
4
1.0
Process Compatibility
Parameter
Symbol
Min
Typ
Max
Unit
Notes
Wave Soldering and Aqueous Wash
TSOLD/tSOLD
+260/10 °C/sec.
5
Notes:
1. The transceiver is class 1 eye safe up to V = 3.6 V.
CC
2. Tested with a sinusoidal signal in the frequency range from 10 Hz to 1 MHz on the V supply with the recommended power supply filter in place.
CC
Typically less than a 1 dB change in sensitivity is experienced.
3. Time delay from Transmit Disable Assertion to laser shutdown.
4. Time delay from Transmit Disable Deassertion to laser startup.
5. Aqueous wash pressure <110 psi.
13
Transmitter Electrical Characteristics
T = -10°C to +85°C, V = 3.1 V to 3.5 V)
C
CC
Parameter
Symbol
ICCT
Min
Typ
52
Max
120
420
930
Unit
mA
Notes
Supply Current
Transmitter Power Dissipation
PDIST
172
mW
mV
Data Input Voltage Swing (single-ended)
VIH - VIL
250
Transmitter Differential
Data Input Current - Low
IIL
-350
µA
Transmitter Differential
Data Input Current - High
IIH
350
700
200
µA
mV
mV
Laser Diode Bias Monitor Voltage
Power Monitor Voltage
1, 2
1, 2
10
Receiver Electrical Characteristics
T = -10°C to +85°C, V = 3.1 V to 3.5 V)
C
CC
Parameter
Symbol
ICCRX
Min
Typ
103
340
Max
140
490
930
0.40
0.40
0.6
Unit
mA
mW
mV
ns
Notes
Supply Current
Receiver Power Dissipation
PDISS
Data Output Voltage Swing (single-ended) VOH - VOL
575
3
4
4
5
5
Data Output Rise Time
tr
Data Output Fall Time
tf
ns
Signal Detect Output Voltage - Low
Signal Detect Output Voltage - High
Signal Detect Assert Time (OFF to ON)
VOL
VOH
ASMAX
V
2.0
V
100
100
µs
Signal Detect Deassert Time (ON to OFF) ANSMAX
µs
Notes:
1. Measured at T +25°C.
C =
2. The laser bias monitor current and laser diode optical power are calculated as ratios of the corresponding voltages to their current sensing
resistors, 10 W and 200 W (under modulation).
3. These outputs are compatible with 10 k, 10 kH, and 100 k ECL and PECL inputs.
4. These are 20 - 80% values.
5. SD is LVTTL compatible.
14
Transmitter Optical Characteristics
T = -10°C to +85°C, V = 3.1 V to 3.5 V)
C
CC
Parameter
Symbol
Min
Typ
Max
Unit
Notes
Output Optical Power 9 µm SMF
62.5 µm MMF
50 µm MMF
Optical Extinction Ratio
POUT
-9.5
-11.5
-11.5
9
-3
-3
-3
dBm
1
ER
dB
Center Wavelength
Cl
1278
1343
nm
nm
ns
8, Fig 10
Spectral Width - RMS
1.4
2.8
8, Fig 10
Optical Rise/Fall Time
TRISE/FALL
RIN12
TJ
0.26
2, 3, Fig 9
Random Intensity Noise
-120
dB/Hz
ps
3
4
Contributed Total Jitter added at TP2
Coupled Power Ratio 62.5 µm MMF
Coupled Power Ratio 50 µm MMF
227
CPR
28<CPR<40
12<CPR<20
CPR
Receiver Optical Characteristics
T = -10°C to +85°C, V = 3.1 V to 3.5 V
C
CC
Parameter
Symbol
PIN MAX
PIN MIN
Min
Typ
Max
Unit
Reference
Receiver Overload
Receiver Sensitivity
-3
dBm avg
dBm avg
dBm avg
ps
-20
5
Stressed Receiver Sensitivity
-14.4
6
Stressed Receiver Eye Opening at TP4
201
4, 7
Receiver Electrical 3 dB Upper Cutoff
Frequency
Operating Center Wavelength
1500
1570
MHz
lC
1270
12
nm
Return Loss
dB
Signal Detect - Asserted
Signal Detect - Deasserted
Signal Detect - Hysteresis
PA
-20
dBm avg
dBm avg
dB
PD
-30
1.5
PA - PD
Notes:
1. The maximum Optical Output Power complies with IEEE 802.3 specification, and is class 1 laser eye safe.
2. These are unfiltered 20 - 80% values.
3. An eye diagram (Figure 9) specifies laser transmitter pulse response characteristics. The characteristics include rise time, fall time, pulse
undershoot, and ringing, all of which are controlled to prevent excessive degradation of the receiver sensitivity. The referenced Gigabit Ethernet
eye diagram using the required filter specifies these parameters. The output optical wavefomr complies with the requirements of the eye mask
discussed in section 38.6.5 and Fig 38-2 of IEEE 802.3.
4. TP refers to the compliance point specified in 802.3, section 38.2.1.
5. The receiver sensitivity is measured using a worst case extinction ratio penalty while sampling at the center of the eye.
7
For a 2 -1 PRBS the receiver will provide output data with better than or equal to 1E-12 BER.
6. The stressed receiver sensitivity is measured using the conformance test signal defined in 802.3, section 38.6.11. The conformance test signal is
conditioned by applying deterministic jitter and intersymbol interference.
7. The stressed receiver jitter is measured using the conformance test signal defined in 802.3, section 38.6.11 and set to an average optical power
0.5dB greater than the specified stressed receiver sensitivity.
8
In order to meet the 10 km link power budget the transmitter can trade off spectral width and center wavelength as shown in Figure 10.
15
NORMALIZED TIME (UNIT INTERVAL)
0.625
0
0.22
0.375
0.78
1.0
1.30
130
100
80
1.00
0.80
0.50
50
20
0
0.20
0.0
-20
-0.20
0
37.5
62.5
78
100
22
NORMALIZED TIME (% OF UNIT INTERVAL)
Figure 9. Gigabit Ethernet Transmitter eye mask diagram
5
4.5
4
3.5
3
2.5
2
1.5
Minimum Launched Power -9.5 dBm
1
0.5
0
1270
1280
1290
1300
1310
1320
1330
1340
1350
1360
Wavelength (nm)
Figure 10. Maximum spectral width trade off curve derived from Gigabit Ethernet link model
16
Design Support Materials
Agilent has created a reference
design with HDMP-1687 PHY IC
in order to demonstate full
functionality and
interoperability. Such design
information and results can be
made available to the designer
as a technical aid. Please contact
your Agilent representative for
further information if required.
Ordering Information
1310 nm FP Laser (Case Temperature range -10°C to +85°C)
HFCT-5914ATL
Related Products
Other single mode Gigabit Ethernet transceivers in this product range are:-
HFCT-5911ATL
2x5 pin, 10 km
Class 1 Laser Product: This product conforms to the
applicable requirements of 21 CFR 1040 at the date of
manufacture
Date of Manufacture:
Agilent Technologies Inc., No 1 Yishun Ave 7, Singapore
Handling Precautions
1. The HFCT-5914ATL can be damaged by current surges or overvoltage.
Power supply transient precautions should be taken.
2. Normal handling precautions for electrostatic sensitive devices
should be taken.
www.agilent.com/
semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(408)654-8675
Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (+65) 6271 2451
India, Australia, New Zealand: (+65) 6271 2394
Japan: (+81 3) 3335-8152(Domestic/International), or
0120-61-1280(DomesticOnly)
Korea: (+65) 6271 2194
Malaysia, Singapore: (+65) 6271 2054
Taiwan: (+65) 6271 2654
Data subject to change.
Copyright © 2002 Agilent Technologies, Inc.
Obsoletes:5988-7984EN
October 9, 2002
5988-8138EN
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