HN58X2402SI/HN58X2404SI [ETC]

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HN58X2402SI/HN58X2404SI
型号: HN58X2402SI/HN58X2404SI
厂家: ETC    ETC
描述:

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HN58X2402SI/HN58X2404SI  
Two-wire serial interface  
2k EEPROM (256-word × 8-bit)  
4k EEPROM (512-word × 8-bit)  
ADE-203-1105 (Z)  
Preliminary  
Rev. 0.0  
Sep. 3, 1999  
Description  
HN58X24xxSI series are two-wire serial interface EEPROM (Electrically Erasable and Programmable  
ROM). They realize high speed, low power consumption and a high level of reliability by employing  
advanced MNOS memory technology and CMOS process and low voltage circuitry technology. They also  
have a 8-byte page programming function to make their write operation faster.  
Note: Hitachi’s serial EEPROM are authorized for using consumer applications such as cellular phone,  
camcorders, audio equipment. Therefore, please contact Hitachi’s sales office before using  
industrial applications such as automotive systems, embedded controllers, and meters.  
Features  
Single supply: 1.8 V to 5.5 V  
Two-wire serial interface (I2CTM serial bus*1)  
Clock frequency: 400 kHz  
Power dissipation:  
Standby: 3 µA (max)  
Active (Read): 1 mA (max)  
Active (Write): 3 mA (max)  
Automatic page write: 8-byte/page  
Write cycle time: 10 ms (2.7 V to 5.5 V)/15ms (1.8 V to 2.7 V)  
Endurance: 105 Cycles (Page write mode)  
Data retention: 10 Years  
Preliminary: The specification of this device are subject to change without notice. Please contact your  
nearest Hitachi’s Sales Dept. regarding specification.  
HN58X2402SI/HN58X2404SI  
Small size packages: TSSOP 8-pin and SOP 8-pin  
Shipping tape and reel  
TSSOP 8-pin: 3,000 IC/reel  
SOP 8-pin: 2,500 IC/reel  
Note: 1. I2C is a trademark of Philips Corporation.  
Ordering Information  
Type No.  
Internal organization Operating voltage Frequency  
Package  
HN58X2402SFPI 2k bit (256 × 8-bit)  
1.8 V to 5.5 V  
400 kHz  
150 mil 8-pin plastic SOP  
(FP-8DB)  
HN58X2404SFPI 4k bit (512 × 8-bit)  
HN58X2402STI  
2k bit (256 × 8-bit)  
1.8 V to 5.5 V  
400 kHz  
8-pin plastic TSSOP  
(TTP-8DA)  
HN58X2404STI  
4k bit (512 × 8-bit)  
Pin Arrangement  
8-pin TSSOP  
8-pin SOP  
1
A0  
A1  
8
VCC  
WP  
2
3
4
7
6
5
A2  
SCL  
SDA  
VSS  
(Top view)  
Pin Description  
Pin name  
A0 to A2  
SCL  
Function  
Device address  
Serial clock input  
Serial data input/output  
Write protect  
SDA  
WP  
VCC  
Power supply  
Ground  
VSS  
2
HN58X2402SI/HN58X2404SI  
Block Diagram  
High voltage generator  
Memory array  
VCC  
VSS  
WP  
A0, A1, A2  
SCL  
Control  
logic  
Y-serect & Sense amp.  
Serial-parallel converter  
SDA  
Absolute Maximum Ratings  
Parameter  
Symbol  
VCC  
Value  
Unit  
V
Supply voltage relative to VSS  
Input voltage relative to VSS  
Operating temperature range*1  
Storage temperature range  
–0.6 to +7.0  
–0.5*2 to +7.0*3  
–40 to +85  
Vin  
V
Topr  
Tstg  
˚C  
˚C  
–65 to +125  
Notes: 1. Including electrical characteristics and data retention.  
2. Vin (min): –3.0 V for pulse width 50 ns.  
3. Should not exceed VCC + 1.0 V.  
DC Operating Conditions  
Parameter  
Symbol  
VCC  
Min  
Typ  
0
Max  
Unit  
V
Supply voltage  
1.8  
5.5  
VSS  
0
0
V
Input high voltage  
Input low voltage  
VIH  
VCC × 0.7  
–0.3*1  
–40  
VCC + 1.0  
VCC × 0.3  
85  
V
VIL  
V
Operating temperature  
Topr  
˚C  
Note: 1. VIL (min): –1.0 V for pulse width 50 ns.  
3
HN58X2402SI/HN58X2404SI  
DC Characteristics (Ta = –40 to +85˚C, VCC = 1.8 V to 5.5 V)  
Parameter  
Symbol Min  
Typ  
Max  
2.0  
2.0  
3.0  
1.0  
3.0  
0.4  
Unit  
µA  
µA  
µA  
mA  
mA  
V
Test conditions  
Input leakage current  
Output leakage current  
Standby VCC current  
Read VCC current  
Write VCC current  
Output low voltage  
ILI  
VCC = 5.5 V, Vin = 0 to 5.5 V  
VCC = 5.5 V, Vout = 0 to 5.5 V  
Vin = VSS or VCC  
ILO  
ISB  
1.0  
ICC1  
ICC2  
VOL2  
VCC = 5.5 V, Read at 400 kHz  
VCC = 5.5 V, Write at 400 kHz  
VCC = 4.5 to 5.5 V, IOL = 1.6 mA  
V
V
CC = 2.7 to 4.5 V, IOL = 0.8 mA  
CC = 1.8 to 2.7 V, IOL = 0.4 mA  
VOL1  
0.2  
V
VCC = 1.8 to 2.7 V, IOL = 0.2 mA  
Capacitance (Ta = 25˚C, f = 1 MHz)  
Test  
Parameter  
Input capacitance (A0 to A2, SCL, WP) Cin*1  
Output capacitance (SDA)  
CI/O*1  
Symbol Min  
Typ  
Max  
6.0  
Unit  
pF  
conditions  
Vin = 0 V  
6.0  
pF  
Vout = 0 V  
Note: 1. This parameter is sampled and not 100% tested.  
4
HN58X2402SI/HN58X2404SI  
AC Characteristics (Ta = –40 to +85˚C, VCC = 1.8 to 5.5 V)  
Test Conditions  
Input pules levels:  
VIL = 0.2 × VCC  
VIH = 0.8 × VCC  
Input rise and fall time: 20 ns  
Input and output timing reference levels: 0.5 × VCC  
Output load: TTL Gate + 100 pF  
Parameter  
Symbol Min  
Typ  
Max  
400  
Unit  
kHz  
ns  
Notes  
Clock frequency  
Clock pulse width low  
Clock pulse width high  
Noise suppression time  
Access time  
fSCL  
tLOW  
tHIGH  
tI  
1200  
600  
ns  
50  
ns  
1
tAA  
100  
1200  
600  
600  
0
900  
ns  
Bus free time for next mode  
Start hold time  
tBUF  
tHD.STA  
tSU.STA  
tHD.DAT  
tSU.DAT  
tR  
ns  
ns  
Start setup time  
ns  
Data in hold time  
Data in setup time  
Input rise time  
ns  
100  
ns  
300  
300  
ns  
1
1
Input fall time  
tF  
ns  
Stop setup time  
tSU.STO  
tDH  
600  
50  
ns  
Data out hold time  
ns  
Write cycle time  
VCC = 2.7 V to 5.5 V  
VCC = 1.8 V to 2.7 V  
tWC  
10  
ms  
ms  
2
2
tWC  
15  
Notes: 1. This parameter is sampled and not 100% tested.  
2. tWC is the time from a stop condition to the end of internally controlled write cycle.  
5
HN58X2402SI/HN58X2404SI  
Timing Waveforms  
Bus Timing  
1/fSCL  
tLOW  
tR  
tF  
tHIGH  
SCL  
tSU.STA  
tHD.DAT  
tSU.DAT  
tHD.STA  
tSU.STO  
SDA  
(in)  
tBUF  
tAA  
tDH  
SDA  
(out)  
Write Cycle Timing  
Stop condition  
Start condition  
SCL  
D0 in  
SDA  
tWC  
(Internally controlled)  
Write data  
(Address (n))  
ACK  
6
HN58X2402SI/HN58X2404SI  
Pin Function  
Serial Clock (SCL)  
The SCL pin is used to control serial input/output data timing. The SCL input is used to positive edge  
clock data into EEPROM device and negative edge clock data out of each device. Maximum clock rate is  
400 kHz.  
Serial Input/Output data (SDA)  
The SDA pin is bidirectional for serial data transfer. The SDA pin needs to be pulled up by resistor as that  
pin is open-drain driven structure. Use proper resistor value for your system by considering VOL, IOL and  
the SDA pin capacitance. Except for a start condition and a stop condition which will be discussed later,  
the SDA transition needs to be completed during SCL low period.  
Data Validity (SDA data change timing waveform)  
SCL  
SDA  
Data  
Data  
change  
change  
Note:  
High-to-low and low-to-high change of SDA should be done during SCL low periods.  
7
HN58X2402SI/HN58X2404SI  
Device Address (A0, A1, A2)  
Eight devices can be wired for one common data bus line as maximum. Device address pins are used to  
distinguish each device and device address pins should be connected to VCC or VSS. When device address  
code provided from SDA pin matches corresponding hard-wired device address pins A0 to A2, that one  
device can be activated. As for 4k EEPROM, some device address pins don't need to be fixed since device  
address code provided from the SDA pin is used as memory address signal.  
Pin Connections for A0 to A2  
Pin connection  
Max connect  
Memory size number  
A2  
A1  
A0  
Notes  
2k bit  
4k bit  
8
4
VCC/VSS*1 VCC/VSS VCC/VSS  
VCC/VSS VCC/VSS ×*2  
Use A0 for memory address a8  
Notes: 1. “VCC/VSS” means that device address pin should be connected to VCC or VSS.  
2. × = Don’t care (Open is also approval.)  
Write Protect (WP)  
When the Write Protect pin (WP) is high, the write protection feature is enabled and operates as shown in  
the following table. When the WP is low, write operation for all memory arrays are allowed. The read  
operation is always activated irrespective of the WP pin status. WP should be fixed high or low during  
operations since WP does not provide a latch function.  
Write Protect Area  
Write protect area  
WP pin status  
2k bit  
4k bit  
VIH  
VIL  
Entire (2k bit)  
Upper 1/2 (2k bit)  
Normal read/write operation  
8
HN58X2402SI/HN58X2404SI  
Functional Description  
Start Condition  
A high-to-low transition of the SDA with the SCL high is needed in order to start read, write operation.  
(See start condition and stop condition)  
Stop Condition  
A low-to-high transition of the SDA with the SCL high is a stop condition. The stand-by operation starts  
after a read sequence by a stop condition. In the case of write operation, a stop condition terminates the  
write data inputs and place the device in a internally-timed write cycle to the memories. After the  
internally-timed write cycle which is specified as tWC, the device enters a standby mode. (See write cycle  
timing)  
Start Condition and Stop Condition  
SCL  
SDA  
(in)  
Start condition  
Stop condition  
9
HN58X2402SI/HN58X2404SI  
Acknowledge  
All addresses and data words are serially transmitted to and from in 8-bit words. The receiver sends a zero  
to acknowledge that it has received each word. This happens during ninth clock cycle. The transmitter  
keeps bus open to receive acknowledgment from the receiver at the ninth clock. In the write operation,  
EEPROM sends a zero to acknowledge after receiving every 8-bit words. In the read operation, EEPROM  
sends a zero to acknowledge after receiving the device address word. After sending read data, the  
EEPROM waits acknowledgment by keeping bus open. If the EEPROM receives zero as an acknowledge,  
it sends read data of next address. If the EEPROM receives acknowledgment "1" (no acknowledgment) and  
a following stop condition, it stops the read operation and enters a stand-by mode. If the EEPROM  
receives neither acknowledgment "0" nor a stop condition, the EEPROM keeps bus open without sending  
read data.  
Acknowledge Timing Waveform  
1
2
8
9
SCL  
SDA IN  
Acknowledge  
out  
SDA OUT  
10  
HN58X2402SI/HN58X2404SI  
Device Addressing  
The EEPROM device requires an 8-bit device address word following a start condition to enable the chip  
for a read or a write operation. The device address word consists of 4-bit device code, 3-bit device address  
code and 1-bit read/write(R/W) code. The most significant 4-bit of the device address word are used to  
distinguish device type and this EEPROM uses “1010” fixed code. The device address word is followed by  
the 3-bit device address code in the order of A2, A1, A0. The device address code selects one device out of  
all devices which are connected to the bus. This means that the device is selected if the inputted 3-bit  
device address code is equal to the corresponding hard-wired A2-A0 pin status. As for the 4kbit  
EEPROMs, some bits of their device address code may be used as the memory address bits. For example,  
A0 is used as a8 of memory address for the 4kbit. The eighth bit of the device address word is the  
read/write(R/W) bit. A write operation is initiated if this bit is low and a read operation is initiated if this bit  
is high. Upon a compare of the device address word, the EEPROM enters the read or write operation after  
outputting the zero as an acknowledge. The EEPROM turns to a stand-by state if the device code is not  
“1010” or device address code doesn’t coincide with status of the correspond hard-wired device address  
pins A0 to A2.  
Device Address Word  
Device address word (8-bit)  
Device code (fixed)  
Device address code*1  
R/W code*2  
R/W  
2k  
4k  
1
1
0
0
1
1
0
0
A2  
A2  
A1  
A1  
A0  
a8  
R/W  
Notes: 1. A2 to A0 are device address and a8 are memory address.  
2. R/W=“1” is read and R/W = “0” is write.  
11  
HN58X2402SI/HN58X2404SI  
Write Operations  
Byte Write:  
A write operation requires an 8-bit device address word with R/W = “0”. Then the EEPROM sends  
acknowledgment "0" at the ninth clock cycle. After these, EEPROMs receive 8-bit memory address word.  
Upon receipt of this memory address, the EEPROM outputs acknowledgment "0" and receives a following  
8-bit write data. After receipt of write data, the EEPROM outputs acknowledgment "0". If the EEPROM  
receives a stop condition, the EEPROM enters an internally-timed write cycle and terminates receipt of  
SCL, SDA inputs until completion of the write cycle. The EEPROM returns to a standby mode after  
completion of the write cycle.  
Byte Write Operation  
Device  
Memory  
address  
address (n)  
Write data (n)  
2k, 4k  
Start  
1 0 1 0  
W
ACK  
R/W  
ACK  
ACK  
Stop  
Page Write:  
The EEPROM is capable of the page write operation which allows any number of bytes up to 8 bytes to be  
written in a single write cycle. The page write is the same sequence as the byte write except for inputting  
the more write data. The page write is initiated by a start condition, device address word, memory  
address(n) and write data(Dn) with every ninth bit acknowledgment. The EEPROM enters the page write  
operation if the EEPROM receives more write data(Dn+1) instead of receiving a stop condition. The a0 to  
a2 address bits are automatically incremented upon receiving write data(Dn+1). The EEPROM can  
continue to receive write data up to 8 bytes. If the a0 to a2 address bits reaches the last address of the page,  
the a0 to a2 address bits will roll over to the first address of the same page and previous write data will be  
overwritten. Upon receiving a stop condition, the EEPROM stops receiving write data and enters  
internally-timed write cycle.  
Page Write Operation  
Device  
Memory  
address  
address (n)  
Write data (n)  
Write data (n+m)  
2k, 4k  
Start  
W
1 0 1 0  
Stop  
ACK  
ACK  
R/W  
ACK  
ACK  
12  
HN58X2402SI/HN58X2404SI  
Acknowledge Polling:  
Acknowledge polling feature is used to show if the EEPROM is in a internally-timed write cycle or not.  
This features is initiated by the stop condition after inputting write data. This requires the 8-bit device  
address word following the start condition during a internally-timed write cycle. Acknowledge polling will  
operate R/W code = “0”. Acknowledgment “1” (no acknowledgment) shows the EEPROM is in a  
internally-timed write cycle and acknowledgment “0” shows that the internally-timed write cycle has  
completed. See Write Cycle Polling using ACK.  
Write Cycle Polling using ACK  
Send  
write command  
Send  
stop condition  
to initiate write cycle  
Send  
start condition  
Send  
device address word  
with R/W = 0  
No  
No  
ACK  
returned  
Yes  
Next operation is  
addressing the memory  
Yes  
Send  
Send  
Send  
memory address  
start condition  
stop condition  
Send  
stop condition  
Proceed random address  
read operation  
Proceed write operation  
13  
HN58X2402SI/HN58X2404SI  
Read Operation  
There are three read operations: current address read, random read, and sequential read. Read operations are  
initiated the same way as write operations with the exception of R/W = “1”.  
Current Address Read:  
The internal address counter maintains the last address accessed during the last read or write operation,  
with incremented by one. Current address read accesses the address kept by the internal address counter.  
After receiving a start condition and the device address word(R/W is “1”), the EEPROM outputs the 8-bit  
current address data from the most significant bit following acknowledgment “0” If the EEPROM receives  
acknowledgment “1” (no acknowledgment) and a following stop condition, the EEPROM stops the read  
operation and is turned to a standby state. In case the EEPROM have accessed the last address of the last  
page at previous read operation, the current address will roll over and returns to zero address. In case the  
EEPROM have accessed the last address of the page at previous write operation, the current address will  
roll over within page addressing and returns to the first address in the same page. The current address is  
valid while power is on. The current address after power on will be indefinite. The random read operation  
described below is necessary to define the memory address.  
Current Address Read Operation  
Device  
address  
Read data (n+1)  
ACK No ACK  
2k, 4k  
Start  
Note: 1. Don‘t care bit for 4k.  
1 0 1 0  
R
Stop  
R/W  
14  
HN58X2402SI/HN58X2404SI  
Random Read:  
This is a read operation with defined read address. A random read requires a dummy write to set read  
address. The EEPROM receives a start condition, device address word(R/W=0) and memory address  
sequentially. The EEPROM outputs acknowledgment “0” after receiving memory address then enters a  
current address read with receiving a start condition. The EEPROM outputs the read data of the address  
which was defined in the dummy write operation. After receiving acknowledgment “1”(no  
acknowledgment) and a following stop condition, the EEPROM stops the random read operation and  
returns to a standby state.  
Random Read Operation  
Device  
Memory  
Device  
address  
address (n)  
address  
Read data (n)  
ACK No ACK  
@@@  
# # #  
2k, 4k  
Start  
W
R
1 0 1 0  
1 0 1 0  
Start  
ACK  
R/W  
Stop  
R/W  
ACK  
Dummy write  
Currect address read  
Note: 1. 2nd device address code (#) should be same as 1st (@).  
Sequential Read:  
Sequential reads are initiated by either a current address read or a random read. If the EEPROM receives  
acknowledgment “0” after 8-bit read data, the read address is incremented and the next 8-bit read data are  
coming out. This operation can be continued as long as the EEPROM receives acknowledgment “0”. The  
address will roll over and returns address zero if it reaches the last address of the last page. The sequential  
read can be continued after roll over. The sequential read is terminated if the EEPROM receives  
acknowledgment “1” (no acknowledgment) and a following stop condition.  
Sequential Read Operation  
Device  
address  
Read data (n) Read data (n+1) Read data (n+2) Read data (n+m)  
2k, 4k  
Start  
R
1 0 1 0  
ACK  
ACK  
R/W  
ACK  
ACK  
No ACK  
Stop  
15  
HN58X2402SI/HN58X2404SI  
Notes  
Data protection at VCC On/Off  
When VCC is turned on or off, noise on the SCL and SDA inputs generated by external circuits (CPU, etc)  
may act as a trigger and turn the EEPROM to unintentional program mode. To prevent this unintentional  
programming, this EEPROM have a power on reset function. Be careful of the notices described below in  
order for the power on reset function to operate correctly.  
SCL and SDA should be fixed to VCC or VSS during VCC on/off. Low to high or high to low transition  
during VCC on/off may cause the trigger for the unintentional programming.  
VCC should be turned off after the EEPROM is placed in a standby state.  
VCC should be turned on from the ground level(VSS) in order for the EEPROM not to enter the  
unintentional programming mode.  
VCC turn on speed should be longer than 10 us.  
Write/Erase Endurance and Data retention Time  
The endurance is 105 cycles in case of page programming and 104 cycles in case of byte programming (1%  
cumulative failure rate). The data retention time is more than 10 years when a device is page-programmed  
less than 104 cycles.  
Noise Suppression Time  
This EEPROM have a noise suppression function at SCL and SDA inputs, that cut noise of width less than  
50 ns. Be careful not to allow noise of width more than 50 ns.  
16  
HN58X2402SI/HN58X2404SI  
Package Dimensions  
HN58X2402SFPI/HN58X2404SFPI (FP-8DB)  
Unit: mm  
4.89  
5.15 Max  
5
8
1
4
6.02 ± 0.18  
0.69 Max  
1.06  
0° – 8°  
+ 0.289  
1.27  
0.60  
– 0.194  
+0.063  
*0.42  
–0.064  
0.40 ± 0.06  
0.10  
M
0.25  
Hitachi Code  
JEDEC  
EIAJ  
FP-8DB  
*Dimension including the plating thickness  
Base material dimension  
Weight (reference value) 0.08 g  
17  
HN58X2402SI/HN58X2404SI  
HN58X2402STI/HN58X2404STI (TTP-8DA)  
Unit: mm  
3.00  
3.30 Max  
8
5
1
4
0.65  
1.00  
+0.08  
–0.07  
*0.22  
0.13 M  
0.20 ± 0.06  
6.40 ± 0.20  
0.805 Max  
0.10  
0° – 8°  
0.50 ± 0.10  
Hitachi Code  
JEDEC  
TTP-8DA  
EIAJ  
0.034 g  
*Dimension including the plating thickness  
Base material dimension  
Mass (reference value)  
18  
HN58X2402SI/HN58X2404SI  
Cautions  
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,  
copyright, trademark, or other intellectual property rights for information contained in this document.  
Hitachi bears no responsibility for problems that may arise with third party’s rights, including  
intellectual property rights, in connection with use of the information contained in this document.  
2. Products and product specifications may be subject to change without notice. Confirm that you have  
received the latest product standards or specifications before final design, purchase or use.  
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,  
contact Hitachi’s sales office before using the product in an application that demands especially high  
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk  
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,  
traffic, safety equipment or medical equipment for life support.  
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly  
for maximum rating, operating supply voltage range, heat radiation characteristics, installation  
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used  
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable  
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-  
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other  
consequential damage due to operation of the Hitachi product.  
5. This product is not designed to be radiation resistant.  
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without  
written approval from Hitachi.  
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor  
products.  
Hitachi, Ltd.  
Semiconductor & Integrated Circuits.  
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Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109  
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Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm  
Japan  
: http://www.hitachi.co.jp/Sicd/indx.htm  
For further information write to:  
Hitachi Semiconductor  
(America) Inc.  
Hitachi Europe GmbH  
Hitachi Asia (Hong Kong) Ltd.  
Group III (Electronic Components)  
7/F., North Tower, World Finance Centre,  
Harbour City, Canton Road, Tsim Sha Tsui,  
Kowloon, Hong Kong  
Tel: <852> (2) 735 9218  
Fax: <852> (2) 730 0281  
Hitachi Asia Pte. Ltd.  
16 Collyer Quay #20-00  
Hitachi Tower  
Singapore 049318  
Tel: 535-2100  
Electronic components Group  
Dornacher Straße 3  
D-85622 Feldkirchen, Munich  
Germany  
Tel: <49> (89) 9 9180-0  
Fax: <49> (89) 9 29 30 00  
179 East Tasman Drive,  
San Jose,CA 95134  
Tel: <1> (408) 433-1990  
Fax: <1>(408) 433-0223  
Fax: 535-1533  
Hitachi Asia Ltd.  
Taipei Branch Office  
3F, Hung Kuo Building. No.167,  
Tun-Hwa North Road, Taipei (105)  
Tel: <886> (2) 2718-3666  
Fax: <886> (2) 2718-8180  
Telex: 40815 HITEC HX  
Hitachi Europe Ltd.  
Electronic Components Group.  
Whitebrook Park  
Lower Cookham Road  
Maidenhead  
Berkshire SL6 8YA, United Kingdom  
Tel: <44> (1628) 585000  
Fax: <44> (1628) 778322  
Copyright © Hitachi, Ltd., 1998. All rights reserved. Printed in Japan.  
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