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HPND-4028 [ETC]

Beam Lead PIN Diodes for Phased Arrays and Switches (71K in pdf) ; 梁式引线PIN二极管的相控阵和交换机（PDF格式71K ）
HPND-4028
型号： HPND-4028
厂家： ETC    ETC
描述：

Beam Lead PIN Diodes for Phased Arrays and Switches (71K in pdf)
梁式引线PIN二极管的相控阵和交换机（PDF格式71K ）

二极管 开关 测试 光电二极管 CD
文件： 总7页 (文件大小：71K)
中文：  中文翻译
下载：  下载PDF数据表文档文件
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Beam Lead PIN Diodes for  
Phased Arrays and Switches  
Technical Data  
HPND-4018  
HPND-4028  
HPND-4038  
690 (27)  
650 (26)  
Features  
• Low Capacitance  
0.025 pF Maximum at 1 MHz  
330 (13)  
260 (10)  
Guaranteed Min./Max.  
220 (9)  
180 (7)  
180 (7)  
160 (6)  
• Fast Switching  
2.0nsec  
• Low Resistance at Low Bias  
1.5 Ω at IF = 10 mA (Typical)  
110 (4.5)  
90 (3.5)  
280 (11)  
240 (9)  
• Rugged Construction  
Typical 10 Gram Lead Pull  
• Silicon Nitride Passivation  
12 (0.47)  
8 (0.32)  
Description  
TheHPND-4018,4028,and4038  
beam lead PIN diodes are  
designed for low capacitance, low  
resistance, and fast switching at  
60 (2.4)  
40 (1.6)  
DIMENSIONS IN µM (1/1000 INCH)  
microwave frequencies. These  
characteristics are achieved at  
low bias levels for minimal power  
consumption. Advanced process-  
ing techniques ensure uniform  
and consistent electrical perfor-  
mance, allowing guaranteed  
capacitance windows. This  
translates to improved perfor-  
mance in phased array  
Outline 83  
Maximum Ratings  
Operating Temperature ................................................ -65°Cto+150°C  
Storage Temperature .................................................... -65°Cto+200°C  
Power Dissipation at T  
= 25°C ........................................... 250mW  
CASE  
(Deratelinearlytozeroat150°C.)  
Minimum Lead Strength............................... 4 grams pull on either lead  
perMIL-S-19500,LTPD=20  
applications.  
Applications  
array radar. The low capacitance  
makes them ideal for circuits  
requiring high isolation in the  
series configuration. These  
devices have been fully charac-  
terized and S-parameters have  
been provided.  
These beam lead PIN diodes are  
designed for use in stripline,  
coplanar waveguide, or micro-  
strip circuits. Applications  
include phase shifting and  
switching. The guaranteed  
capacitance windows ensure  
uniform performance in phased  
Rugged construction and strong  
beams ensure high assembly  
yields while nitride passivation  
and polyimide coating ensure  
reliability. Standard Hi-Rel  
programs are available for all  
three devices.  
2-86  
5965-8878E  
Electrical Specifications at TA = 25°C  
Break-  
Series  
down  
Reverse Forward  
Carrier  
Reverse  
Series  
Resistance  
RS (Ω)  
Capacitance Resistance  
Voltage Current  
VBR (V) IR (nA)  
Voltage  
VF (V)  
Lifetime Recovery  
Part  
(pF)  
RS (Ω)  
τ (ns)  
trr (ns)  
Number  
HPND-  
Min. Max. Typ.  
Max.  
4.6  
Min.  
60  
Max.  
100  
Max.  
1.1  
Typ.  
26  
Typ.  
2.0*  
2.6  
Typ.  
2.5  
4018  
4028  
4038  
0.015 0.025  
0.025 0.045  
0.045 0.065  
4.0  
2.3  
1.5  
3.0  
60  
100  
1.1  
36  
2.0  
2.0  
60  
100  
1.1  
45  
2.4  
1.0  
Test  
Conditions  
VR =30V  
f=1MHz  
IF =10mA  
f=100MHz  
VR =VBR VR =50V IF =20mA IF =10mA *IF =10mA  
IF =50mA  
f=100MHz  
Measure  
IR = 6 mA  
IF=5mA  
VR =10V  
IR≤ 10mA  
90%recovery  
Typical Parameters  
40  
35  
30  
25  
20  
15  
10  
40  
35  
30  
25  
20  
15  
10  
5
–30V  
0V  
–30V  
0V  
5
0
0
0.75  
0.60  
0.45  
0.30  
1.0  
0.75  
0.50  
1 mA  
5 mA  
10 mA  
1 mA  
5 mA  
10 mA  
0.25  
0
0.15  
0
1
10 18 20  
1
10 18 20  
FREQUENCY (GHz)  
FREQUENCY (GHz)  
Figure 1. Typical Isolation and  
Insertion Loss, HPND-4018.  
Figure 2. Typical Isolation and  
Insertion Loss, HPND-4028.  
30  
26  
22  
18  
0.12  
0.10  
0.08  
0.06  
14  
10  
–30V  
6
HPND-4038  
0V  
2
0.5  
0.4  
0.3  
0.2  
0.04  
0.02  
HPND-4028  
HPND-4018  
1 mA  
5 mA  
10 mA  
0.1  
0
100  
0
1
10 20  
0
10  
20  
30  
FREQUENCY (GHz)  
REVERSE VOLTAGE (V)  
Figure 3. Typical Isolation and  
Insertion Loss, HPND-4038.  
Figure 4. Typical Capacitance vs.  
Reverse Voltage ( at 1 MHz) .  
2-87  
Typical Parameters (cont.)  
12  
12  
10  
8
10  
8
6
6
4
4
2
V
= 10V  
= 20V  
n
V
= 5V  
n
2
0
V
= 10V  
V = 15V  
n
n
V
n
0
0
4
8
12  
16  
20  
0
5
10  
15  
FORWARD CURRENT (mA)  
FORWARD CURRENT (mA)  
Figure 5. Typical Reverse Recovery  
Time vs. Forward Current ( Series  
Configuration) . HPND-4018.  
Figure 6. Typical Reverse Recovery  
Time vs. Forward Current ( Series  
Configuration) . HPND-4028, HPND-  
4038.  
100  
10  
1000  
HPND-4018  
100  
1
HPND-4028  
10  
0.1  
HPND-4038  
1.0  
0.01  
0.001  
0.1  
0
0.2  
0.4  
0.8  
1.0  
0.01  
0.10  
1.0  
10  
100  
0.6  
FORWARD VOLTAGE (V)  
I
– FORWARD BIAS CURRENT (mA)  
F
Figure 7. Typical Forward  
Characteristics.  
Figure 8. Typical RF Resistance vs.  
Forward Bias Current ( at 100 MHz) .  
2-88  
Typical S-Parameters (in series configuration) at ZO = 50 Ω, 25°C  
HPND-4018  
IF = 1 mA  
IF = 5 mA  
dB  
IF = 10 mA  
S21/S12  
Mag. Ang.  
Freq.  
S11/S22  
S21/S12  
Mag.  
S11/S22  
Mag. Ang.  
S21/S12  
Mag.  
S11/S22  
(MHz)  
Mag.  
Ang.  
dB  
Ang.  
Ang.  
Mag.  
Ang.  
dB  
1000  
2000  
0.086  
0.085  
0.085  
0.088  
0.090  
0.093  
0.096  
0.100  
0.103  
0.106  
0.109  
0.114  
0.117  
0.121  
0.125  
0.129  
0.134  
0.140  
-1  
5
-0.76  
-0.76  
-0.76  
-0.74  
-0.76  
-0.76  
-0.76  
-0.76  
-0.76  
-0.76  
-0.74  
-0.76  
-0.76  
-0.78  
-0.80  
-0.80  
-0.80  
-0.84  
0.917  
0.917  
0.918  
0.919  
0.918  
0.918  
0.918  
0.918  
0.918  
0.918  
0.919  
0.918  
0.917  
0.916  
0.913  
0.914  
0.914  
0.909  
-1  
-2  
0.046  
0.047  
0.051  
0.056  
0.060  
0.066  
0.071  
0.076  
0.081  
0.086  
0.090  
0.096  
0.100  
0.105  
0.111  
0.116  
0.122  
0.130  
8
-0.38  
-0.40  
-0.40  
-0.40  
-0.40  
-0.40  
-0.40  
-0.40  
-0.40  
-0.40  
-0.40  
-0.40  
-0.40  
-0.42  
-0.42  
-0.42  
-0.44  
-0.46  
0.958  
0.957  
0.957  
0.957  
0.956  
0.956  
0.957  
0.955  
0.955  
0.955  
0.956  
0.956  
0.956  
0.953  
0.953  
0.953  
0.952  
0.950  
-1  
-2  
0.037  
0.040  
0.043  
0.049  
0055  
11  
23  
32  
38  
43  
46  
48  
50  
51  
51  
52  
52  
52  
53  
53  
53  
53  
53  
-0.30 0.967  
-0.32 0.965  
-0.32 0.966  
-0.32 0.966  
-0.32 0.965  
-0.32 0.965  
-0.32 0.965  
-0.32 0.965  
-0.32 0.965  
-0.32 0.964  
-0.32 0.965  
-0.32 0.965  
-0.32 0.965  
-0.34 0.962  
-0.34 0.963  
-0.34 0.962  
-0.36 0.961  
-0.36 0.960  
-1  
-2  
17  
25  
31  
36  
39  
42  
43  
45  
46  
47  
46  
47  
48  
48  
49  
48  
49  
3000  
10  
14  
18  
20  
22  
24  
26  
27  
28  
28  
29  
30  
30  
31  
31  
32  
-4  
-4  
-4  
4000  
-5  
-5  
-5  
5000  
-6  
-6  
-6  
6000  
-7  
-7  
0.061  
0.066  
0.072  
0.078  
0.083  
0.087  
0.093  
0.097  
0.103  
0.109  
0.114  
0.120  
0.129  
-7  
7000  
-8  
-8  
-8  
8000  
-10  
-11  
-12  
-13  
-14  
-16  
-17  
-18  
-19  
-21  
-22  
-10  
-11  
-12  
-13  
-14  
-16  
-17  
-18  
-19  
-21  
-22  
-10  
-11  
-12  
-13  
-15  
-16  
-17  
-18  
-19  
-21  
-22  
9000  
10000  
11000  
12000  
13000  
14000  
15000  
16000  
17000  
18000  
HPND-4018  
VR = 0 V  
dB  
VR = 10 V  
VR = 30 V  
Freq.  
(MHz)  
S11/S22  
S21/S12  
Mag.  
S11/S22  
Mag. Ang.  
S21/S12  
Mag.  
S11/S22  
Mag.  
S21/S12  
Mag. Ang.  
Mag.  
Ang.  
Ang.  
dB  
Ang.  
Ang.  
dB  
1000  
2000  
0.995  
0.990  
0.983  
0.975  
0.967  
0.959  
0.950  
0.942  
0.933  
0.924  
0.915  
0.904  
0.896  
0.886  
0.876  
0.870  
0.865  
0.859  
-3  
-33.16  
-27.54  
-24.30  
-22.28  
-20.74  
-19.50  
-18.42  
-17.60  
-16.84  
-16.32  
-15.56  
-15.00  
-14.66  
-14.04  
-13.86  
-13.44  
-13.36  
-13.44  
0.022  
0.042  
0.061  
0.077  
0.092  
0.106  
0.120  
0.132  
0.144  
0.153  
0.167  
0.178  
0.185  
0.199  
0.203  
0.213  
0.215  
0.213  
84  
76  
71  
68  
64  
62  
59  
57  
54  
52  
49  
48  
45  
43  
41  
37  
35  
32  
0.999  
0.998  
0.996  
0.993  
0.991  
0.987  
0.982  
0.979  
0.972  
0.966  
0.959  
0.951  
0.944  
0.936  
0.925  
0.920  
0.913  
0.907  
-2  
-4  
-6  
-8  
-39.18 0.011  
-32.78 0.023  
-29.12 0.035  
-26.76 0.046  
93  
85  
83  
81  
78  
76  
73  
71  
68  
67  
63  
62  
59  
55  
53  
48  
45  
41  
1.000  
0.998  
0.997  
0.995  
0.992  
0.988  
0.985  
0.982  
0.975  
0.969  
0.960  
0.953  
0.946  
0.940  
0.929  
0.924  
0.917  
0.911  
-2  
-4  
-6  
-8  
-39.18 0.011  
-33.16 0.022  
-29.64 0.033  
-27.14 0.044  
93  
87  
84  
82  
79  
77  
74  
72  
69  
68  
64  
63  
60  
56  
54  
49  
46  
42  
-5  
3000  
-7  
4000  
-10  
-12  
-14  
-16  
-18  
-21  
-23  
-25  
-27  
-29  
-31  
-33  
-35  
-36  
-38  
5000  
-10 -24.90 0.057  
-12 -23.24 0.069  
-14 -21.84 0.081  
-16 -20.74 0.092  
-18 -19.84 0.102  
-20 -19.10 0.111  
-23 -18.14 0.124  
-25 -17.40 0.135  
-27 -16.96 0.142  
-29 -16.20 0.155  
-31 -15.92 0.160  
-33 -15.46 0.169  
-34 -15.36 0.171  
-36 -15.50 0.168  
-10 -25.36 0.054  
-12 -23.76 0.065  
-14 -22.28 0.077  
-16 -21.22 0.087  
-18 -20.28 0.097  
-20 -19.50 0.106  
-22 -18.58 0.118  
-24 -17.80 0.129  
-26 -17.34 0.136  
-29 -16.60 0.148  
-31 -16.26 0.154  
-32 -15.82 0.162  
-34 -15.76 0.163  
-36 -15.92 0.160  
6000  
7000  
8000  
9000  
10000  
11000  
12000  
13000  
14000  
15000  
16000  
17000  
18000  
2-89  
Typical S-Parameters (cont.)  
HPND-4028  
IF = 1 mA  
IF = 5 mA  
dB  
IF = 10 mA  
S21/S12  
Mag. Ang.  
Freq.  
S11/S22  
S21/S12  
Mag.  
S11/S22  
S21/S12  
Mag.  
S11/S22  
(MHz)  
Mag.  
Ang.  
dB  
Ang.  
Mag.  
Ang.  
Ang.  
Mag.  
Ang.  
dB  
1000  
2000  
0.046  
0.048  
0.052  
0.058  
0.063  
0.069  
0.075  
0.081  
0.087  
0.092  
0.097  
0.103  
0.107  
0.112  
0.119  
0.123  
0.129  
0.139  
7
-0.38  
-0.40  
-0.40  
-0.40  
-0.40  
-0.40  
-0.40  
-0.40  
-0.40  
-0.40  
-0.40  
-0.40  
-0.40  
-0.42  
-0.42  
-0.44  
-0.44  
-0.46  
0.958  
0.956  
0.957  
0.957  
0.956  
0.956  
0.956  
0.955  
0.956  
0.956  
0.956  
0.956  
0.957  
0.954  
0.953  
0.952  
0.952  
0.950  
-1  
-2  
0.031  
0.036  
0.041  
0.049  
0.057  
0.064  
0.070  
0.077  
0.084  
0.089  
0.095  
0.101  
0.106  
0.110  
0.117  
0.122  
0.130  
0.139  
17  
33  
43  
49  
54  
57  
60  
60  
61  
61  
61  
60  
59  
59  
58  
57  
56  
55  
-0.24  
-0.26  
-0.26  
-0.26  
-0.26  
-0.26  
-0.26  
-0.28  
-0.28  
-0.28  
-0.26  
-0.26  
-0.26  
-0.30  
-0.28  
-0.28  
-0.30  
-0.32  
0.973  
0.971  
0.972  
0.971  
0.971  
0.971  
0.971  
0.970  
0.970  
0.970  
0.971  
0.971  
0.971  
0.968  
0.969  
0.969  
0.967  
0.965  
-1  
-2  
0.027  
0.033  
0.040  
0.047  
0.055  
0.063  
0.070  
0.076  
0.083  
0.089  
0.095  
0.101  
0.105  
0.111  
0.117  
0.123  
0.129  
0.140  
19  
37  
47  
53  
58  
60  
62  
63  
63  
63  
63  
62  
62  
61  
60  
60  
57  
56  
-0.20  
-0.22  
-0.22  
-0.22  
-0.22  
-0.24  
-0.22  
-0.24  
-0.24  
-0.24  
-0.22  
-0.22  
-0.22  
-0.24  
-0.26  
-0.26  
-0.26  
-0.28  
0.978  
0.975  
0.975  
0.975  
0.975  
0.974  
0.975  
0.974  
0.974  
0.974  
0.975  
0.975  
0.975  
0.973  
0.972  
0.972  
0.971  
0.970  
-1  
-2  
20  
29  
36  
42  
46  
48  
50  
51  
52  
53  
52  
51  
51  
51  
51  
49  
48  
3000  
-4  
-4  
-4  
4000  
-5  
-5  
-5  
5000  
-6  
-6  
-6  
6000  
-7  
-7  
-7  
7000  
-8  
-8  
-8  
8000  
-9  
-9  
-9  
9000  
-11  
-12  
-13  
-14  
-15  
-17  
-18  
-19  
-20  
-22  
-11  
-12  
-13  
-14  
-15  
-17  
-18  
-19  
-20  
-21  
-11  
-12  
-13  
-14  
-15  
-17  
-18  
-19  
-20  
-22  
10000  
11000  
12000  
13000  
14000  
15000  
16000  
17000  
18000  
HPND-4028  
VR = 0 V  
dB  
VR = 10 V  
dB  
VR = 30 V  
dB Mag. Ang.  
Freq.  
(MHz)  
S11/S22  
Mag. Ang.  
S21/S12  
Mag.  
S11/S22  
Mag. Ang.  
S21/S12  
Mag. Ang.  
S11/S22  
S21/S12  
Ang.  
Mag.  
Ang.  
1000  
2000  
0.997  
0.988  
0.974  
0.958  
0.940  
0.921  
0.898  
0.879  
0.857  
0.836  
0.816  
0.795  
0.778  
0.761  
0.744  
0.733  
0.720  
0.709  
-4  
-27.54  
-21.74  
-18.36  
-16.10  
-14.48  
-13.20  
-12.16  
-11.36  
-10.64  
-10.12  
-9.54  
0.042  
0.082  
0.121  
0.157  
0.189  
0.219  
0.247  
0.271  
0.294  
0.312  
0.334  
0.351  
0.361  
0.379  
0.383  
0.397  
0.401  
0.399  
86  
79  
74  
69  
64  
70  
56  
52  
48  
46  
42  
40  
37  
33  
31  
28  
26  
24  
0.999  
0.997  
0.994  
0.991  
0.986  
0.979  
0.972  
0.965  
0.954  
0.942  
0.931  
0.917  
0.904  
0.892  
0.876  
0.867  
0.855  
0.846  
-3  
-33.16  
-27.34  
-23.62  
-21.12  
-19.26  
-17.66  
-16.26  
-15.20  
-14.20  
-13.44  
-12.58  
-11.84  
-11.44  
-10.80  
-10.56  
-10.12  
-9.96  
0.022  
0.043  
0.066  
0.088  
0.109  
0.131  
0.054  
0.174  
0.195  
0.213  
0.235  
0.256  
0.268  
0.289  
0.297  
0.312  
0.318  
0.319  
91  
86  
83  
81  
78  
75  
72  
70  
67  
65  
61  
59  
56  
52  
50  
46  
44  
42  
1.000  
0.998  
0.996  
0.992  
0.987  
0.982  
0.976  
0.970  
0.960  
0.950  
0.937  
0.926  
0.913  
0.903  
0.888  
0.881  
0.869  
0.861  
-2  
-33.98 0.020 91  
-28.18 0.039 86  
-24.44 0.060 84  
-21.94 0.080 82  
-20.10 0.099 79  
-18.42 0.120 76  
-17.08 0.140 73  
-15.92 0.160 71  
-14.96 0.179 68  
-14.20 0.195 66  
-13.32 0.216 62  
-12.62 0.234 60  
-12.20 0.246 57  
-11.52 0.266 54  
-11.26 0.274 52  
-10.80 0.289 48  
-10.64 0.294 46  
-10.64 0.294 44  
-7  
-6  
-5  
3000  
-11  
-14  
-17  
-21  
-24  
-26  
-29  
-32  
-35  
-37  
-40  
-42  
-44  
-46  
-48  
-50  
-8  
-7  
4000  
-10  
-13  
-16  
-19  
-21  
-24  
-27  
-30  
-33  
-36  
-38  
-41  
-43  
-45  
-47  
-10  
-13  
-15  
-18  
-21  
-23  
-26  
-29  
-32  
-34  
-37  
-39  
-42  
-44  
-46  
5000  
6000  
7000  
8000  
9000  
10000  
11000  
12000  
13000  
14000  
15000  
16000  
17000  
18000  
-9.10  
-8.86  
-8.44  
-8.34  
-8.04  
-7.94  
-8.00  
-9.94  
2-90  
Typical S-Parameters (cont.)  
HPND-4038  
IF = 1 mA  
IF = 5 mA  
dB  
IF = 10 mA  
S21/S12  
Mag. Ang.  
Freq.  
S11/S22  
S21/S12  
Mag.  
S11/S22  
S21/S12  
Mag.  
S11/S22  
(MHz)  
Mag.  
Ang.  
dB  
Ang.  
Mag.  
Ang.  
Ang.  
Mag.  
Ang.  
dB  
1000  
2000  
0.028  
0.032  
0.037  
0.045  
0.052  
0.060  
0.067  
0.073  
0.081  
0.087  
0.092  
0.099  
0.104  
0.110  
0.118  
0.123  
0.132  
0.141  
15  
34  
47  
55  
61  
65  
67  
69  
70  
71  
71  
70  
70  
69  
67  
66  
64  
62  
-0.22  
-0.24  
-0.22  
-0.22  
-0.24  
-0.24  
-0.24  
-0.24  
-0.24  
-0.24  
-0.22  
-0.24  
-0.22  
-0.26  
-0.24  
-0.24  
-0.26  
-0.26  
0.976  
0.974  
0.975  
0.975  
0.974  
0.974  
0.974  
0.974  
0.973  
0.974  
0.975  
0.974  
0.975  
0.972  
0.973  
0.973  
0.972  
0.972  
-1  
-2  
0.019  
0.026  
0.034  
0.042  
0.051  
0.059  
0.067  
0.074  
0.081  
0.088  
0.094  
0.100  
0.106  
0.112  
0.119  
0.125  
0.133  
0.143  
28  
50  
61  
67  
72  
74  
76  
76  
77  
77  
77  
76  
75  
74  
72  
71  
68  
66  
-0.12  
-0.16  
-0.14  
-0.14  
-0.16  
-0.16  
-0.16  
-0.16  
-0.16  
-0.16  
-0.16  
-0.16  
-0.14  
-0.16  
-0.16  
-0.16  
-0.16  
-0.18  
0.987  
0.984  
0.985  
0.985  
0.984  
0.984  
0.984  
0.983  
0.984  
0.982  
0.984  
0.984  
0.985  
0.982  
0.983  
0.982  
0.982  
0.980  
-1  
-2  
0.017  
0.024  
0.033  
0.042  
0.051  
0.059  
0.067  
0.073  
0.081  
0.089  
0.094  
0.101  
0.107  
0.113  
0.120  
0.126  
0.133  
0.143  
35  
56  
66  
70  
75  
77  
78  
78  
78  
79  
79  
77  
76  
75  
73  
72  
69  
67  
-0.10 0.989  
-0.14 0.986  
-0.12 0.988  
-0.12 0.987  
-0.14 0.986  
-0.14 0.986  
-0.12 0.987  
-0.14 0.986  
-0.14 0.986  
-0.14 0.986  
-0.14 0.986  
-0.14 0.986  
-0.12 0.987  
-0.16 0.984  
-0.14 0.985  
-0.16 0.984  
-0.16 0.984  
-0.16 0.983  
-1  
-2  
3000  
-3  
-3  
-4  
4000  
-5  
-5  
-5  
5000  
-6  
-6  
-6  
6000  
-7  
-7  
-7  
7000  
-8  
-8  
-8  
8000  
-9  
-9  
-9  
9000  
-10  
-11  
-12  
-14  
-15  
-16  
-17  
-18  
-19  
-20  
-10  
-11  
-12  
-14  
-15  
-16  
-17  
-18  
-19  
-20  
-10  
-11  
-12  
-14  
-15  
-16  
-17  
-18  
-19  
-20  
10000  
11000  
12000  
13000  
14000  
15000  
16000  
17000  
18000  
HPND-4038  
VR = 0 V  
dB  
VR = 10 V  
dB  
VR = 30 V  
Freq.  
(MHz)  
S11/S22  
S21/S12  
Mag.  
S11/S22  
S21/S12  
Mag. Ang.  
S11/S22  
Mag. Ang.  
S21/S12  
Mag. Ang.  
Mag.  
Ang.  
Ang.  
Mag.  
Ang.  
dB  
1000  
2000  
0.993  
0.976  
0.953  
0.923  
0.890  
0.857  
0.822  
0.790  
0.757  
0.727  
0.697  
0.668  
0.643  
0.620  
0.599  
0.584  
0.570  
0.556  
-5  
-23.10  
-17.28  
-14.04  
-11.88  
-10.36  
-9.20  
-8.28  
-7.58  
-7.00  
-6.54  
-6.10  
-5.74  
-5.56  
-5.22  
-5.16  
-4.90  
-4.80  
-4.84  
0.070  
0.137  
0.199  
0.255  
0.304  
0.347  
0.386  
0.418  
0.447  
0.471  
0.496  
0.517  
0.528  
0.549  
0.553  
0.569  
0.576  
0.574  
83  
76  
70  
64  
58  
53  
49  
45  
41  
38  
34  
32  
29  
26  
24  
21  
19  
17  
0.998  
0.995  
0.990  
0.982  
0.973  
0.962  
0.947  
0.933  
0.915  
0.897  
0.877  
0.854  
0.834  
0.813  
0.793  
0.778  
0.762  
0.747  
-3  
-7  
-28.88 0.036  
-22.86 0.072  
89  
84  
81  
78  
74  
71  
68  
65  
61  
58  
54  
52  
49  
45  
43  
39  
37  
35  
0.999  
0.996  
0.992  
0.986  
0.977  
0.968  
0.956  
0.945  
0.928  
0.912  
0.892  
0.874  
0.854  
0.839  
0.818  
0.805  
0.790  
0.776  
-3  
-6  
-9  
-29.90 0.032  
-23.76 0.065  
-20.18 0.098  
90  
85  
82  
79  
75  
73  
69  
66  
63  
61  
57  
54  
51  
48  
45  
42  
40  
37  
-10  
-15  
-19  
-23  
-27  
-31  
-34  
-38  
-41  
-44  
-46  
-49  
-51  
-53  
-55  
-57  
-59  
3000  
-10 -19.26 0.109  
-13 -16.78 0.145  
-16 -14.90 0.180  
-20 -13.40 0.214  
-23 -12.08 0.249  
-27 -11.06 0.280  
-30 -10.12 0.312  
-34  
-37  
-41  
-44  
-47  
-50  
-53  
-55  
-58  
4000  
-12 -17.74 0.130  
-15 -15.88 0.161  
-19 -14.30 0.193  
-22 -12.96 0.225  
-25 -11.92 0.254  
-29 -10.94 0.284  
-32 -10.22 0.309  
-35  
-38  
-42  
-45  
-48  
-50  
-53  
-55  
5000  
6000  
7000  
8000  
9000  
10000  
11000  
12000  
13000  
14000  
15000  
16000  
17000  
18000  
-9.40  
-8.62  
-8.00  
-7.60  
-7.04  
-6.82  
-6.42  
-6.22  
-6.18  
0.339  
0.371  
0.399  
0.417  
0.445  
0.457  
0.478  
0.489  
0.491  
-9.44  
-8.76  
-8.34  
-7.76  
-7.50  
-7.10  
-6.88  
-6.86  
0.338  
0.365  
0.383  
0.410  
0.422  
0.442  
0.453  
0.454  
2-91  
away from the substrate during  
the bonding process due to the  
deformation of the beam by the  
bonding tool. This effect is  
beneficial as it provides stress  
relief for the diode during thermal  
cycling of the substrate. The  
coefficient of expansion of some  
substrate materials, specifically  
soft substrates, is such that some  
bugging is essential if the circuit is  
to be operated over wide tempera-  
ture extremes.  
infrared heat lamp for 5–10  
minutes on clean filter paper.  
Freon degreaser, or its locally  
approved equivalent, may replace  
trichloroethane for light organic  
contamination.  
• Ultrasonic cleaning is not  
recommended.  
• Acid solvents should not be  
used.  
Bonding and Handling  
Procedures for Beam  
Lead Diodes  
1. Storage  
Under normal circumstances,  
storage of beam lead diodes in HP  
supplied waffle/gel packs is  
sufficient. In particularly dusty or  
chemically hazardous environ-  
ments, storage in an inert atmo-  
sphere desiccator is advised.  
4. Bonding  
Thermocompression: See  
Application Note 979 “The Han-  
dling and Bonding of Beam Lead  
Devices Made Easy”. This method  
is good for hard substrates only.  
2. Handling  
In order to avoid damage to beam  
lead devices, particular care must  
be exercised during inspection,  
testing, and assembly. Although  
the beam lead diode is designed to  
have exceptional lead strength, its  
small size and delicate nature  
requires that special handling  
techniques be observed so that  
the devices will not be mechani-  
cally or electrically damaged. A  
vacuum pickup is recommended  
for picking up beam lead devices,  
particularly larger ones, e.g.,  
quads. Care must be exercised to  
assure that the vacuum opening of  
the needle is sufficiently small to  
avoid passage of the device  
through the opening. A #27 tip is  
recommended for picking up  
single beam lead devices. A 20X  
magnification is needed for  
precise positioning of the tip on  
the device. Where a vacuum  
pickup is not used, a sharpened  
wooden Q-tip dipped in isopropyl  
alcohol is very commonly used to  
handle beam lead devices.  
Thick metal clad ground planes  
restrict the thermal expansion of  
the dielectric substrates in the X-Y  
axis. The expansion of the dielec-  
tric will then be mainly in the Z  
axis, which does not affect the  
beam lead device. An alternate  
solution to the problem of dielec-  
tric ground plane expansion is to  
heat the substrate to the maxi-  
mum required operating tempera-  
ture during the beam lead attach-  
ment. Thus, the substrate is at  
maximum expansion when the  
device is bonded. Subsequent  
cooling of the substrate will cause  
bugging, similar to bugging in  
thermocompression bonding or  
epoxy bonding. Other methods of  
bugging are preforming the leads  
during assembly or prestressing  
the substrate.  
Wobble: This method picks up  
the device, places it on the  
substrate and forms a thermo-  
compression bond all in one  
operation. This is described in the  
latest version of MIL-STD-883,  
Method 2017, and is intended for  
hard substrates only.  
Resistance Welding or  
Parallel-GAP Welding: To make  
welding on soft substrates easier,  
a low pressure welding head is  
recommended. Suitable equip-  
ment is available from HUGHES,  
Industrial Products Division in  
Carlsbad, CA.  
Epoxy: With solvent free, low  
resistivity epoxies (available from  
ABLESTIK and improvements in  
dispensing equipment, the quality  
of epoxy bonds is sufficient for  
many applications.  
3. Cleaning  
5. Lead Stress  
For organic contamination use a  
warm rinse of trichloroethane, or  
its locally approved equivalent,  
followed by a cold rinse in ac-  
etone and methanol. Dry under  
In the process of bonding a beam  
lead diode, a certain amount of  
“bugging” occurs. The term  
bugging refers to the chip lifting  
2-92  

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