HX316C9SRK2-16 [ETC]

DDR3-1600 CL9 240-Pin DIMM Kit;


型号：	HX316C9SRK2-16
厂家：	ETC
描述：	DDR3-1600 CL9 240-Pin DIMM Kit 双倍数据速率
文件：	总2页 (文件大小：591K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

HX316C9SRK4/32

32GB (8GB 1G x 64-Bit x 4 pcs.)

DDR3-1600 CL9 240-Pin DIMM Kit

SPECIFICATIONS

CL(IDD)

11 cycles

Row Cycle Time (tRCmin)

48.125ns(min.)

260ns(min.)

Refresh to Active/Refresh

Command Time (tRFCmin)

Row Active Time (tRASmin)

Maximum Operating Power

UL Rating

35ns(min.)

TBD W*

94 V - 0

0^oC to +85^oC

-55^oC to +100^oC

Operating Temperature

Storage Temperature

*Power will vary depending on the SDRAM used.

DESCRIPTION

FEATURES

HyperX HX316C9SRK4/32 is a kit of four 1G x 64-bit (8GB)

DDR3-1600 CL9 SDRAM (Synchronous DRAM) 2Rx8, memory

module, based on sixteen 512M x 8-bit FBGA components per

module. Each module kit supports Intel® XMP (Extreme

Memory Profiles). Total kit capacity is 32GB. Each module

has been tested to run at DDR3-1600 at a low latency timing of

9-9-9 at 1.5V. The SPDs are programmed to JEDEC

standard latency DDR3-1600 timing of 11-11-11 at 1.5V.

Each 240-pin DIMM uses gold contact fingers. The

JEDEC standard electrical and mechanical specifications

are as follows:

• JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply

• VDDQ = 1.5V (1.425V ~ 1.575V)

• 800MHz fCK for 1600Mb/sec/pin

• 8 independent internal banks

• Programmable CAS latency: 11, 10, 9, 8, 7, 6

• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock

• 8-bit pre-fetch

• Burst Length: 8 (interleave without any limit, sequential with

starting address “000” only), 4 with tCCD = 4 which does not

allow seamless read or write (either on the fly using A12 or

MRS)

XMP TIMING PARAMETERS

• JEDEC: DDR3-1600 CL11-11-11 @1.5V

• XMP Profile #1: DDR3-1600 CL9-9-9 @1.5V

• Bi-directional Differential Data Strobe

• Internal (self) calibration: Internal self calibration through ZQ

pin (RZQ: 240 ohm ± 1%)

• On Die Termination using ODT pin

• Average Refresh Period 7.8us at lower than TCASE 85°C,

3.9us at 85°C < TCASE < 95°Cº

• Asynchronous Reset

• Height 1.311” (33.30mm), w/heatsink, double sided component

Continued >>

kingston.com/hyperx

Document No. 4807130-001.B00 04/22/15 Page 1

continued

HyperX

MODULE WITH HEAT SPREADER

133.35 mm

7.9 mm

MODULE DIMENSIONS

FOR MORE INFORMATION, GO TO WWW.KINGSTON.COM/HYPERX

All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at the

published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers faster than

the published speed. Overclocking or modifying your system timing may result in damage to computer components.

kingston.com/hyperx

Document No. 4807130-001.B00

Page 2

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