HX318C9SRK2-16 [ETC]
DDR3-1866 CL9 240-Pin DIMM Kit;
| 型号： | HX318C9SRK2-16 |
| 厂家： | 
ETC |
| 描述： | DDR3-1866 CL9 240-Pin DIMM Kit 双倍数据速率 |
| 文件： | 总2页 (文件大小：591K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HX318C9SRK4/32
32GB (8GB 1G x 64-Bit x 4 pcs.)
DDR3-1866 CL9 240-Pin DIMM Kit
SPECIFICATIONS
CL(IDD)
11 cycles
Row Cycle Time (tRCmin)
48.125ns(min.)
260ns(min.)
Refresh to Active/Refresh
Command Time (tRFCmin)
Row Active Time (tRASmin)
Maximum Operating Power
UL Rating
35ns(min.)
TBD W*
94 V - 0
0o C to +85o C
-55o C to +100o C
Operating Temperature
Storage Temperature
*Power will vary depending on the SDRAM used.
DESCRIPTION
FEATURES
HyperX HX318C9SRK4/32 is a kit of four 1G x 64-bit (8GB)
DDR3-1866 CL9 SDRAM (Synchronous DRAM) 2Rx8, memory
module, based on sixteen 512M x 8-bit FBGA components per
module. Each module kit supports Intel® XMP (Extreme
Memory Profiles). Total kit capacity is 32GB. Each module
has been tested to run at DDR3-1866 at a low latency timing of
9-10-11 at 1.5V. The SPDs are programmed to JEDEC
standard latency DDR3-1600 timing of 11-11-11 at 1.5V.
Each 240-pin DIMM uses gold contact fingers. The
JEDEC standard electrical and mechanical specifications
are as follows:
• JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
• VDDQ = 1.5V (1.425V ~ 1.575V)
• 800MHz fCK for 1600Mb/sec/pin
• 8 independent internal banks
• Programmable CAS latency: 11, 10, 9, 8, 7, 6
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• 8-bit pre-fetch
• Burst Length: 8 (interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write (either on the fly using A12 or
MRS)
XMP TIMING PARAMETERS
• JEDEC: DDR3-1600 CL11-11-11 @1.5V
• XMP Profile #1: DDR3-1866 CL9-10-11 @1.5V
• XMP Profile #2: DDR3-1600 CL9-9-9 @1.5V
• Bi-directional Differential Data Strobe
• Internal (self) calibration: Internal self calibration through ZQ
pin (RZQ: 240 ohm ± 1%)
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95°Cº
• Asynchronous Reset
• Height 1.311” (33.30mm), w/heatsink, double sided component
Continued >>
kingston.com/hyperx
Document No. 4807131-001.B00 04/22/15 Page 1
continued
HyperX
MODULE WITH HEAT SPREADER
133.35 mm
7.9 mm
MODULE DIMENSIONS
FOR MORE INFORMATION, GO TO WWW.KINGSTON.COM/HYPERX
All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at the
published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers faster than
the published speed. Overclocking or modifying your system timing may result in damage to computer components.
kingston.com/hyperx
Document No. 4807131-001.B00
Page 2
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