HX426C15FBK4-16 [ETC]
DDR4-2666 CL15 288-Pin DIMM;
| 型号： | HX426C15FBK4-16 |
| 厂家： | 
ETC |
| 描述： | DDR4-2666 CL15 288-Pin DIMM 双倍数据速率 |
| 文件： | 总2页 (文件大小：356K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HX426C15FBK2/8
8GB (4GB 512M x 64-Bit x 2 pcs.)
DDR4-2666 CL15 288-Pin DIMM
SPECIFICATIONS
CL(IDD)
15 cycles
Row Cycle Time (tRCmin)
45ns(min.)
260ns(min.)
Refresh to Active/Refresh
Command Time (tRFCmin)
Row Active Time (tRASmin)
Maximum Operating Power
UL Rating
26.25ns(min.)
TBD W*
94 V - 0
0o C to +85o C
-55o C to +100o C
Operating Temperature
Storage Temperature
*Power will vary depending on the SDRAM used.
DESCRIPTION
FEATURES
• Power Supply: VDD = 1.2V Typical
HyperX HX426C15FBK2/8 is a kit of two 512M x 64-bit (4GB)
DDR4-2666 CL15 SDRAM (Synchronous DRAM) 1Rx8, memory
module, based on eight 512M x 8-bit FBGA components per
module. Each module kit supports Intel® Extreme Memory
Profiles (Intel® XMP) 2.0. Total kit capacity is 8GB. Each
module has been tested to run at DDR4-2666 at a low latency timing
of 15-17-17 at 1.2V. Additional timing parameters are shown in
the Plug-N-Play (PnP) Timing Parameters section below.
The JEDEC standard electrical and mechanical specifications
are as follows:
• VDDQ = 1.2V Typical
• VPP - 2.5V Typical
• VDDSPD = 2.2V to 3.6V
• Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
• Low-power auto self refresh (LPASR)
• Data bus inversion (DBI) for data bus
• On-die VREFDQ generation and calibration
• Single-rank
• On-board I2 serial presence-detect (SPD) EEPROM
• 16 internal banks; 4 groups of 4 banks each
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
Note: The PnP feature offers a range of speed and timing options to support
the widest variety of processors and chipsets. Your maximum speed will
be determined by your BIOS.
• Selectable BC4 or BL8 on-the-fly (OTF)
• Fly-by topology
JEDEC/XMP TIMING PARAMETERS
• Terminated control command and address bus
• Height 1.340” (34.04mm), w/heatsink
• JEDEC/PnP: DDR4-2666 CL15-17-17 @1.2V
DDR4-2400 CL14-16-16 @1.2V
DDR4-2133 CL12-14-14 @1.2V
•XMP Profile #1: DDR4-2666 CL15-17-17 @1.2V
Continued >>
kingston.com/hyperx
Document No. 4807354-001.A00 07/20/15 Page 1
continued
HyperX
MODULE WITH HEAT SPREADER
7.08 mm
133.35 mm
MODULE DIMENSIONS
133.35
129.55
2.10±0.15
3.00
Detail A
28.90
Detail B
Detail D
Detail E
Detail C
Pin 105 Pin 117
Pin 35
Pin 47
Pin 1
3.35
64.60
56.10
22.95
FOR MORE INFORMATION, GO TO WWW.KINGSTON.COM/HYPERX
All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at the
published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers faster than
the published speed. Overclocking or modifying your system timing may result in damage to computer components.
kingston.com/hyperx
Document No. 4807354-001.A00
Page 2
相关型号：
©2020 ICPDF网 联系我们和版权申明