IQS3161QNMOQ_技术文档

IQ Switch^®

ProxSense^®Series

5.2.2 Cx Sensors Requiring Shield....................... 12

5.2.3 Cx Sensors Used For Prox........................... 12

5.2.4 Cx Sensors plus I/O’s.................................. 13

5.2.5 Unused Cx’s................................................ 13

Contents

IQS316 Datasheet...........................................................1

6

Communication ....................................................13

1

2

Overview................................................................3

Packaging and Pin-out............................................4

6.1

Communication Selection............................... 13

Watchdog Timeout and MCLR ....................... 13

SPI................................................................... 13

6.2

6.3

2.1

2.2

QFN32............................................................... 4

ICTRL................................................................. 5

6.3.1 SPI read ...................................................... 14

6.3.2 SPI write..................................................... 14

6.3.3 SPI Communications Window Terminate

Command................................................................ 15

3

ProxSense^®Module ................................................5

3.1

3.2

Charge Transfer Concepts ................................ 5

Charging Modes ............................................... 6

6.4

I²C ................................................................... 15

6.4.1 Control byte and Device Address............... 15

6.4.2 I²C read....................................................... 15

6.4.3 I²C write ..................................................... 15

6.4.4 I²C Communications Window Terminate

Command................................................................ 16

3.2.1 Prox Mode Charging .................................... 6

3.2.2 Touch Mode Charging.................................. 6

3.2.3 Interaction Between Prox and Touch Mode 7

3.2.4 Low Power Charging .................................... 7

3.3

Prox Module Setup ........................................... 8

3.3.1 Report rate................................................... 8

3.3.2 Transfer Frequency ...................................... 8

3.3.3 Count Value.................................................. 8

3.3.4 Prox Mode Channel Filters........................... 8

3.3.5 Environmental Drift ..................................... 8

3.3.6 LTA Filter ...................................................... 8

3.3.7 Filter Halt ..................................................... 8

3.3.8 Touch Sensitivity (Touch Mode channels

6.5

Circuit diagrams (all features)........................ 16

7

Electrical specifications.........................................18

7.1

Absolute maximum specifications.................. 18

Operating conditions (Measured at 25°C)...... 18

Moisture Sensitivity Level............................... 18

Recommended storage environment for IC’s . 19

Timing characteristics (Measured at 25°C) .... 20

7.2

7.3

7.4

7.5

only)

9

3.3.9 Proximity Sensitivity (Prox and Touch Mode

channels)................................................................... 9

3.3.10

8

9

Mechanical Dimensions........................................21

Antenna Tuning Implementation ............ 9

8.1

IQS316 Mechanical Dimensions ..................... 21

4

Additional Features..............................................10

8.1.2 QFR package differences to QNR package. 22

4.1

RF Immunity ................................................... 10

4.1.1 Design Guidelines....................................... 10

4.1.2 RF detection............................................... 10

8.2

IQS316 Landing Pad Layout............................ 23

Datasheet and Part-number Information .............24

4.2

Active Shield ................................................... 10

Proximity Output (POUT)................................ 11

Zero Cross Synchronising................................ 11

Device Sleep.................................................... 11

Communication Bypass .................................. 11

General Purpose I/O’s .................................... 12

9.1

Ordering Information ..................................... 24

Package Marking............................................ 24

Tape and Reel................................................. 25

Revision History.............................................. 27

4.3

4.4

4.5

4.6

4.7

9.2

9.3

9.5

Appendix A.

Contact Information.............................28

5

Application Design ...............................................12

5.1

Physical Layout............................................... 12

5.2

Cx Selection .................................................... 12

5.2.1 Cx Sensor Close to Noise Source................ 12

IQS316 Datasheet

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IQ Switch^®

ProxSense^®Series

each sensor (key) can be viewed as the

positive plate of capacitor and the

1 Overview

a

The IQS316 is a multi-key capacitive sensing

controller designed for touch applications

requiring up to 16 touch inputs. The device

has proximity (PROX) detection integrated

with the existing 16 touch sense electrode,

providing a total of 4 additional PROX channel

outputs.

environment as the negative plate (virtual

ground reference). When a conductive object

such as a human finger approaches the

sensor, it will increase the detected

capacitance.

Advanced signal processing is implemented to

suppress and detect noise, track slow varying

environmental conditions, and avoid effects of

The electrodes used for PROX are selectable,

to allow keys in noisy/unreliable areas to not

influence the PROX stability and sensitivity.

possible drift.

The Antenna Tuning

Implementation (ATI) allows for adapting to a

wide range of application environments,

without requiring external components.

All 20 device channels (16 touch, 4 proximity)

can be individually configured. It can be

selected that 4, or 8 of the channels are setup

to be used as general purpose I/O‟s.

Functions such as simple LED control can be

implemented with these I/O‟s.

The device provides active driven shields to

protect the integrity of sensor line signals if

required. The device has a high immunity to

RF interference. For severe conditions, the

RF detection pin allows for noise detection

when connected to a suitable RF antenna,

providing suppression of noise on the

influenced data.

The device has an internal voltage regulator

and Internal Capacitor Implementation (ICI) to

reduce

Advanced

external

on-chip

components

signal

required.

processing

The IQS316 provides SPI and I²C

capabilities and a dedicated PROX charging

mode yields a stable capacitive controller with

high sensitivity.

communication

options.

A

typical

implementation of a 16 key touch panel is

shown in Figure 1.1.

With the charge transfer method implemented,

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Figure 1.1 Typical implementation

2 Packaging and Pin-out

The IQS316 is available in a QFN32

package.

2.1 QFN32

MOSI-I2CAO 1

SOMI-SDA 2

RDY 3

24 CxA3

23 CxA2

22 CxA1

21 CxA0

20 CxB3

19 CxB2

18 CxB1

17 CxB0

The pin-out for the IQS316 in the QFN32

package is illustrated below in Figure 2.1.

SCK-SCL 4

/SS-IRDY 5

POUT

SPI_ENABLE 7

/MCLR 8

Figure 2.1 QFN32 Top View

IQS316 Datasheet

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IQ Switch^®

ProxSense^®Series

In Table 2.2

communication pins are given.

a

description of all

Table 2.1

Name

QFN32 top view

Description

1

Table 2.2

Communication pins

MOSI-I2CA0 Refer to Table 2.2

2

SOMI-SDA

RDY

Refer to Table 2.2

Proximity output

SPI

I²C

3

Name Description

4

SCK-SCL

/SS-IRDY

POUT

MOSI Master Out

Slave In

SOMI Slave

Master In

I2CA0 Sub-Address

0

5

6

Out SDA

Data

7

SPI_ENABLE Comms Selection

/SS

SCK

RDY

Slave Select

Serial Clock

SPI Ready

IRDY I²C Ready

8

/MCLR

VDDHI

RFIN

Master Clear

Supply Voltage

RF Noise Input

Ground Reference

Current Reference

ZC Input

SCL

Not used

Clock

9

10

11

12

13

14

15

16

VSS

Pins are used as defined in the standard

communications protocols, except for the

additional RDY pin in SPI mode and the

IRDY pin in I²C mode. The ready is an

indication to the master that data transfer is

ready to be initiated (that the communication

window is available).

ICTRL

ZC

SHLD_B

SHLD_A

VREG

Shield

Internal

Voltage

Regulator

17

18

19

20

21

22

23

24

25

CxB0

CxB1

CxB2

CxB3

CxA0

CxA1

CxA2

CxA3

Cx Sensor Line

/ Cx Sensor Line / I/O

2.2 ICTRL

A reference resistor of 39k MUST be placed

from the ICTRL I/O to ground, as shown in

Figure 1.1. It is very important that the track

to the resistor must be as short as possible,

with the other side having a good connection

to ground.

®

CxB4

GPIO_0

3 ProxSense Module

The device contains a ProxSense^®module

that uses patented technology to provide

detection of PROX/TOUCH on the numerous

sensing lines. The ProxSense™ module is a

combination of hardware and software,

based on the principles of charge transfer. A

set of measurements are taken and used for

calculating the touch controller outputs.

26

27

28

29

30

31

32

CxB5/

GPIO_1

Cx Sensor Line / I/O

/ Cx Sensor Line / I/O

CxB6

GPIO_4

CxB7

GPIO_5

CxA4

GPIO_2

3.1 Charge Transfer Concepts

CxA5

GPIO_3

Capacitance measurements are taken with a

charge transfer process that is periodically

initiated. The measuring process is referred

to as a charge transfer cycle and consists of

the following:

CxA6

GPIO_6

CxA7

GPIO_7

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processing performed to improve stability and



Discharging of an internal sampling

capacitor (Cs) and the sense

electrode (Cx) on a channel.

sensitivity, for optimum PROX operation. The

sensor lines connected to these channels are

also selectable. By default, only CH0 and CH1

are active in Prox Mode Charging, with CxA0 –

CxA3 connected to CH0 and CxB0 – CxB3

connected to CH1. This means that CxA0,

CxA1, CxA2 and CxA3 form a combined sense

plate for CH0.

Charging of Cx‟s connected to the

channel and then a series of charge

transfers from the Cx‟s to the

associated

internal

sampling

capacitor (Cs), until the trip voltage is

reached.

It is possible to connect between 2 and 16 of

the Cx sensor lines to the PROX channels.

The number of charge transfers required to

reach the trip voltage on a channel is

referred to as the count value.

Group 0

CH0

Group 0

CH0

Group 0

CH0

The device continuously repeats charge

transfers on the sense electrode connected

to the Cx Pin.

(CxA0-CxA3)

For each channel a Long Term Average

(LTA) is calculated (12 bit unsigned integer

values). The count value (12 bit unsigned

integer values) are processed and compared

to the LTA to detect TOUCH and PROX.

CH1

(CxB0-CxB3)

CH1

CH2

CH3

CH2

(CxA4-CxA7)

CH2

CH3

For more information regarding capacitive

sensing, refer to the application note

“AZD004 Azoteq Capacitive Sensing”.

CH3

(CxB4-CxB7)

3.2 Charging Modes

Figure 3.1 Prox Mode Charging

3.2.2 Touch Mode Charging

The IQS316 has 16 sensor lines (Cx). The

device has four internal sampling capacitors,

with the touch channels charging in 4

timeslots, equating to the 16 channels. Each

active sensor line is connected to a channel

to determine touch button actuations. For

PROX channels, a selection of the 16 touch

sensor lines are combined to provide up to 4

dedicated PROX channels. For example,

CxB0, CxB1, CxB2 and CxB3 are connected

together, and charge as one PROX channel,

namely CH1.

In Touch Mode, all active touch channels are

sampled. If all 16 channels are enabled

(default), charge transfers occur in 4 groups,

namely Group1, 2, 3 and 4. In Touch Mode,

this cycle is continually repeated. Figure 3.2

shows how the channels are connected to

the respective sensor lines. The channel

number is written, and below in brackets the

respective sensor line is shown.

example: CH12 is the touch button output of

sensor line CxA2.

For

In the IQS316, charge transfers are

implemented in two charging „Modes‟,

namely Prox Mode, and Touch Mode.

The touch channels are optimised for touch

response time, and less signal processing is

performed compared to the Prox Mode

channels.

3.2.1 Prox Mode Charging

In Prox Mode, CH0 to CH3 are repeatedly

charged. Collectively, they are referred to as

the Group 0 charge transfers.

These channels are optimised for PROX

sensing by having specific digital signal

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ProxSense^®Series

Group 1

CH4

Group 2

CH8

Group 3

CH12

Group 4



In Prox Mode, charging takes place

until any proximity has been detected

on CH0 to CH3, then the charging

changes to Touch Mode.

CH16

(CxA3)

(CxA0)

(CxA1)

(CxA2)

CH5

CH9

CH13

CH17



In Prox Mode, every T_modethe IC will

force Touch Mode charging for one

cycle, so that the Touch Channels

(CH4-CH19) can update their

(CxB0)

(CxB1)

(CxB2)

(CxB3)

CH6

(CxA4)

CH10

(CxA5)

CH14

(CxA6)

CH18

(CxA7)

averaging filters.

CH7

(CxB4)

CH11

(CxB5)

CH15

(CxB6)

CH19

(CxB7)



In Touch Mode, if no touch is pressed

or released for T_mode, the system will

return to Prox Mode charging.

While touches are made or released,

the system will remain in Touch Mode

Figure 3.2 Touch Mode Charging



3.2.3 Interaction Between Prox and

Touch Mode

Interaction between Prox and Touch Mode

Charging occurs automatically as follows:

0

1

2

3

4

0

1

2

3

4

1

2

3

4

1 2 3 4 1 2 3 4 0 0 0 0 0 0 0 0

Prox Mode

Touch

Mode

Prox Mode

Touch Mode

Prox Mode

A

Update

Figure 3.3 Charging Mode Interaction

The interaction between charging modes is

easily understood by means of the following

example, refer to Figure 3.3.

In an ideal situation, the concept is

implemented to operate as follows:

In steady-state (no user interaction), the

For the first stage, the charging is in Prox Mode,

with Group 0 charging repeatedly. A timeout

(T_MODE) occurs, and a brief Touch Mode update

is performed, after which Prox Mode charging is

resumed.

device operates in the Prox Mode charging.

The IQS316 will then sense

a

user

approaching by means of the optimised PROX

sensing, and will flip the charging to Touch

Mode.

Now touch button interaction is

constantly monitored. Once touch interaction

has subsided, Prox Mode is resumed. This

provides stable and sensitive proximity

detection, as well as rapid touch response.

At point marked „A‟, a proximity event occurs,

which forces the system into Touch Mode, and

charging of Group 1 to 4 is now repeated.

Touch Mode is continued until a T_modeperiod of

no touch interaction is monitored, upon which

the device returns to the Prox Mode charging, as

shown in the last stage of the figure.

3.2.4 Low Power Charging

Low current consumption charging modes are

available. These only apply to the Prox Mode

charging, since when in Touch Mode,

interaction with the device is assumed, and

then slow response is not acceptable. In low

The master can override the automatic

interaction between Prox- and Touch Mode,

by forcing the IQS316 into either mode by

means of specific commands.

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ProxSense^®Series

power, charging takes place less often, and sensitivity. The Touch Mode channels (CH4 –

naturally this decreases the response time for CH19) are usually considerably lower (200 –

a proximity event, this does however allow the 500), because the same sensitivity as required

device to sleep for long periods between for PROX is not usually required for touch.

conversions, decrease the power consumption

3.3.4 Prox Mode Channel Filters

considerably.

The Prox Mode channel filter provides a major

improvement on the proximity performance of

3.3 Prox Module Setup

the device. The filter is implemented on CH0

– CH3, and is default ON at start-up. It is

recommended to keep this filter enabled.

To improve the filters effectiveness with

rejecting AC mains noise, the charge transfers

are synchronised to a base frequency (roughly

9ms, to accommodate both 50Hz and 60Hz).

Numerous factors (charge transfer frequency,

high counts, long communication time, more

than two active Prox Mode channels etc)

could cause this timing to be extended, which

would simply reduce the effectiveness of the

filter. Refer to Table 7.5.

3.3.1 Report rate

The report rate of the device depends on the

charge transfer frequency and the LTA of the

channels.

The length of communications

performed by the master device will also have

an effect on the report rate of the IQS316. A

typical value is shown in the characteristic

data in Table 7.5.

3.3.2 Transfer Frequency

The frequency of the transfers can be selected

by the main oscillator (Main_OSC) and main

oscillator divider (CxDIV) settings. Conversion

frequencies are given in Table 3.1 with the

Main_Osc fixed at 8MHz. An optimal transfer

frequency must be selected for a specific

application by choosing the optimal CxDIV

setting.

3.3.5 Environmental Drift

The Long Term Average (LTA) can be seen

as the baseline or reference value. The LTA

is calculated to continuously adapt to any

environmental drift.

Table 3.1

Charge transfer

frequency

3.3.6 LTA Filter

The LTA filter is calculated from the count

value of each channel. The LTA filter allows

the device to adapt to environmental (slow

moving) drift. Touch and PROX information is

calculated by comparing the count value with

this LTA reference value.

CxDIV

Conversion

Frequency

000

001

010

011

100

4MHz

2MHz

For an illustration of the working of the LTA

filter (and filter halt), refer to application note

“AZD024 Graphical Representation of the IIR

Filter”.

1MHz (default)

0.5MHz

3.3.7 Filter Halt

0.25MHz

To ensure that the LTA filters do not adapt

during a PROX or TOUCH, a filter halt

scheme is implemented on the device. The

designer can choose between four options as

given in Table 3.2.

101-111

0.125MHz

3.3.3 Count Value

As a rough guideline, the Prox Mode channels

(CH0 – CH3) are usually set to higher count

values (800 – 1500), to optimise PROX

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ProxSense^®Series

count value to drop. A touch threshold of 1/32

will be the most sensitive setting and 10/16

will result in the least sensitive.

Table 3.2

Filter

Filter halt options

T_HALT

Table 3.3

Touch Thresholds

During PROX or TOUCH,

filter halts for ~20s, then

reseeds

Short

Setting LOW Range

HIGH Range

00

01

1/32 (default)

4/16

During PROX or TOUCH,

Filter halts for ~40s, then

reseeds

Long

(default)

1/16

6/16

8/16

10

11

2/16

3/16

Never

Filter NEVER halts

10/16

Always

Filter is HALTED, always

Four values exist for each channel. Two

ranges of settings can be selected, but the

range is a global setting and applies to all

channels; whereby each channel can then

individually be setup to a value within the

selected range.

With the Short and Long option, the filter

operates as follows:

The LTA filter will freeze on a touch or

proximity for T_HALTseconds. After T_HALT, if

prox/touch condition still exists, the system will

assume a stuck condition, and the LTA will

reseed to the count value. In applications

where long user interaction is expected, the

„Long Halt‟ option is recommended.

3.3.9 Proximity Sensitivity (Prox and

Touch Mode channels)

The proximity sensitivity of each individual

channel is a user defined threshold calculated

as a delta value below the LTA. A PROX

status is detected when the count value drops

below the selected delta relative to the LTA.

The T_HALTtimer is reset every time a touch is

made or released.

For the „Never Halt‟ setting, the filter will

immediately begin to adapt, without ever

freezing the filter.

recommended.

This setting is not

Table 3.4

Prox Thresholds

Setting LOW Range

HIGH Range

8 (default)

The „Always Halt‟ setting can be used to

enable a master device to implement a

custom filter halt scheme. The master device

can monitor the LTA and count values to

determine when a stuck condition has

occurred. This setting is useful since the

master device can decide when the touch key

is in a „stuck‟ condition, and a „Reseed‟

command could be initiated from the master to

rectify this.

00

01

2

3

16

20

30

10

11

4

6

Again four values exist for each channel, and

again a global secondary range can be

selected, changing the 4 available settings for

all channels to a new set of 4 possibilities.

On the IQS316, all channels can be

individually reseeded if need be, otherwise a

global reseed is available.

3.3.10 Antenna Tuning Implementation

The ATI is

a

sophisticated technology

implemented in the new ProxSense^®series

devices. It allows optimal performance of the

devices for a wide range of sensing electrode

capacitances, without modification or addition

of external components. The ATI allows the

tuning of two parameters, an ATI Multiplier

3.3.8 Touch Sensitivity (Touch Mode

channels only)

The touch sensitivity of each individual

channel is a user defined threshold, calculated

as a ratio of the count value to the LTA. Note

that a user touching the sensor will cause the

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and an ATI Compensation, to adjust the count

value for an attached sensing electrode.

ATI allows the designer to optimise a specific

design by adjusting the sensitivity and stability

of each channel through the adjustment of the

MOSI-I2CAO

SOMI-SDA

RDY

1

2

3

4

5

24 CxA3

23 CxA2

22 CxA1

21 CxA0

20 CxB3

19 CxB2

18 CxB1

17 CxB0

ATI parameters.

Please refer to Azoteq

Application Note AZD027 for more information

regarding ATI.

SCK-SCL

/SS-IRDY

POUT

The IQS316 has an automated ATI function.

This allows the designer to specify a count

target value for either the Prox- or Touch

Mode channels, and then when activated, the

system will increment the relevant ATI

Compensation settings until the channels

reach the target value.

Note that the ATI algorithm (and the ATI Busy

indication) bit will only take effect once the

communication window where the AutoATI is

requested has been ended.

SPI_ENABLE

7

8

/MCLR

GND

Figure 4.1 Ground plane routing

4.1.2 RF detection

In cases of extreme RF interference, the on-

chip RF detection is suggested.

By

connecting a suitable antenna to the RF pin, it

allows the device to detect RF noise and notify

the master of possible corrupt data. A 50Ω

pull-down resistor should be placed on RFIN.

Note that the value of the resistor should

match the impedance of the antenna.

4 Additional Features

4.1 RF Immunity

The IQS316 has immunity to high power RF

noise.

In this section general design

guidelines will be given to improve noise

immunity and the noise detection functionality

is explained.

Noise affected samples are not allowed to

influence the LTA filter, and also do not

contribute to PROX or TOUCH detection.

4.1.1 Design Guidelines

If this function is not implemented in design, it

is recommended to disable the noise detection

in the firmware.

To improve the RF immunity, extra decoupling

capacitors are suggested on V_REGand V_DDHI

.

Place a 100pF in parallel with the 1uF ceramic

on V_REGand V_DDHI. All decoupling capacitors

should be placed as close as possible to the

V_DDHIand V_REGdevice pins.

4.2 Active Shield

The IQS316 has two active driven shield

outputs, shielding the sensor lines from false

touches and proximities, and countering the

effect of parasitic ground sources. Using

internal driven shields in applications where

the environment requires shielding lowers the

cost of the final solution by avoiding the

necessity of external shield components.

PCB ground planes also improve noise

immunity. Care must be taken to not pour

these planes near the tracks/pins of the

sensing lines, see Figure 4.1. Ground/voltage

planes close to the sensing channels have a

negative effect on the sensitivity of the

sensors. Note, if I/O‟s are used instead of the

sensor lines, the ground pour can also go

under these pins.

Manual control of the shield is provided by the

IQS316 (allowing CxA0/CxB0 to CxA6/CxB6

to be shielded). Additionally, an automatic

shield implementation can be selected,

allowing automatic setup of the shield each

cycle. The channels that are set by the

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ProxSense^®Series

automatic selection are highlighted in the

table.

4.3 Proximity Output (POUT)

All the individual PROX status for each

channel is available through the device

memory map, but an additional POUT I/O has

been added. This I/O is active HIGH when

any of the PROX channels (CH0 – CH3)

sense a PROX. This could, for example, be

used to control the backlighting of an

application.

Table 4.1

Automatic Shield

Setting Channels

Group

SHLD_A

CxA0

SHLD_B

CxB0

0

1

2

3

4

CxA0

CxB0

CxA1

CxB1

4.4 Zero Cross Synchronising

CxA2

CxB2

CxA3

CxB3

When an application is operated in a noisy AC

environment, it could be required to

synchronise the charging to the AC. This

reduces the noise influence on the count

value. This is not normally required since the

Prox Mode filters should remove this AC

component, but is available if needed.

The active driven shields follow the waveforms

of the sensor lines. A screenshot of two pairs

of shield and sensor lines are illustrated in

Figure 4.2. It can be seen that generally 2

different channels have very similar signals,

and it has been found that the shield of a

specific channel can be effectively used to

shield the other channels in the same timeslot

(Group).

If unused, it is best to connect directly to GND.

4.5 Device Sleep

The IQS316 can be placed in low power

SLEEP mode. This however is a totally

inactive state, and no channel sensing is

performed.

This could be used if an

application does not require the keys to be

sensed, or if custom low power mode is

implemented. All the device settings and data

is retained after waking from the sleep.

4.6 Communication Bypass

The IQS316 can be set up to bypass the

communication window. This could be useful

if a master does not want to be interrupted

during every charging cycle of the IQS316.

The communication will be resumed (Ready

will indicate available data) if the IQS316

senses a proximity. The master can also

initiate communication if required (only in SPI).

Therefore the master sends a command to

bypass the communication. The IQS316 then

Figure 4.2 Active shields

Pull-up resistors are required on each shield

line as shown in Figure 6.9 and Figure 6.10.

A suggested value for the pull-up resistors are

2kΩ when using the controller at 3.3V, and

4.7kΩ when using the controller at 5V.

Smaller resistor values will increase the

driving ability of the shield, but will also

increase the current consumption.

continually

does

conversions

without

interaction with the master, until a proximity

occurs, which is most likely the first time that

the master will be interested in the IQS316

data.

For more information regarding shielding, refer

to

the

application

note

“AZD009

If the master wants to force the

communication to resume in SPI mode, then

Implementation of Driven Shield”.

IQS316 Datasheet

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the /SS must be pulled LOW to select the decisions are highlighted here, referring to

device. Then the master must still wait for the Figure 5.1 to illustrate the options. This is

RDY to go HIGH, then communication is mostly important when less than 16 keys are

resumed.

required, and the Cx‟s that are to be used in

the design are chosen.

After communication is resumed, both by the

master or the slave, then the bypass is

removed. Thus if required again, it must be

reconfigured.

Group 4

Group 0

Group 1

Group 2

Group 3

CH16

(CxA3)

CH0

(CxA0-CxA3)

CH4

(CxA0)

CH8

(CxA1)

CH12

(CxA2)

Row 0

Row 1

Row 2

CH17

(CxB3)

CH1

(CxB0-CxB3)

CH5

(CxB0)

CH9

(CxB1)

CH13

(CxB2)

4.7 General Purpose I/O’s

The IQS316 has 8 GPIO‟s available. It is

possible to use 0, 4 or 8 I/O‟s, leaving 16, 12

or 8 Cx channels respectively. These I/O‟s

can be controlled via the memory map. The

following considerations should be given when

using these I/O‟s:

CH2

(CxA4-CxA7)

CH6

(CxA4)

CH10

(CxA5)

CH14

(CxA6)

CH18

(CxA7)

CH19

(CxB7)

CH3

(CxB4-CxB7)

CH7

(CxB4)

CH11

(CxB5)

CH15

(CxB6)

Row 3

Figure 5.1 Cx Channel Selection

-

They provide only

indication (no current

a

logic level

sourcing

5.2.1 Cx Sensor Close to Noise Source

If the design is such that some channels will

be in close proximity to a noisy environment, it

is always good to group these channels

together in the same row, where rows are

illustrated in Figure 5.1. This is so that if

channels are affected by noise, they will

influence less of the Prox Mode channels

(noise could reduce the effectiveness of

capabilities), thus for example, if LED‟s

are to be switched, the I/O must

connect to the gate of a FET (thus only

capacitive loads).

-

Updating the TRIS of the I/O‟s is only

done after the termination of the

communication window.

proximity sensing).

These Prox Mode

The state of a GPIO can only be

read/written during a communication

window, since it is controlled via the

memory map.

channel(s) can then be set up with an

insensitive PROX threshold, or can be

disabled.

5.2.2 Cx Sensors Requiring Shield

-

The I/O‟s switch to Vreg voltage.

If the design requires the use of shields, it can

be useful to select the Cx‟s according to those

used by the automatic shield function (Section

4.2). The Cx‟s used by this are circled in

Figure 5.1.

5 Application Design

5.1 Physical Layout

For more information regarding the layout of

the buttons / electrode, please refer to the

application note “AZD008 Design Guidelines

for Touch Pads.” Information such as button

size and shape, overlay type and thickness,

sensor line routing, and ground effects on

sensing are highlighted.

5.2.3 Cx Sensors Used For Prox

If specific channels are required to provide

good

proximity sensing,

then it

is

recommended to also keep these in the same

row, preferably row0 and row1 as circled

(since these are part of CH0 and CH1 which

are default active). If you require independent

proximity information, then these channels

must be chosen to be in different rows (since

all channels in the same row charge together

to give a collective PROX result).

5.2 Cx Selection

A few points need to be considered when

designing a multi-key application. Factors

such as noise, shielding and proximity

requirements need to be evaluated. A few key

IQS316 Datasheet

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@ 8Mhz) to be serviced. If the device is not

5.2.4 Cx Sensors plus I/O’s

serviced within this time, a reset will occur.

The watchdog is disabled by default and can

be enabled in the Memory Map. It is advised

to disable the watchdog timer during the

development phase.

If the I/O‟s are to be used, the Cx‟s must be

selected appropriately. If 8 I/O‟s are used,

then the 8 Cx‟s available are again those

circled in the figure, the remaining are then

converted to I/O‟s. If 12 Cx‟s are required with

4 I/O‟s, then the I/O‟s used will be either:

The watchdog is also not crucial, since a

MCLR pin is available for the master to reset

the IQS316. The MCLR has an internal pull-

up resistor. To reset, pull the MCLR LOW

(active LOW).

CxA4, CxA5, CxB4 and CxB5 or

CxA6, CxA7, CxB6 and CxB7.

The remaining 12 will thus be the sensor lines.

5.2.5 Unused Cx’s

It is important to disable unused Cx‟s, since

this increases the response time of the device,

as shown in Table 7.5.

6 Communication

The IQS316 can communicate in SPI or I²C

using the respective standard communication

protocols. Both communication protocols are

implemented with similar interaction with the

memory map. For both of the communication

protocols, the respective Ready I/O will be set

when data is available.

Figure 6.1

Communication start-up

time

It can be seen in Figure 6.1 that it takes

roughly 16ms for communication to start after

the MCLR pin has been released. The IC

does an initial conversion, while performing

device initialisation and calculations, after

which the communication window is available.

A general I²C and SPI Memory Map is defined

so that all ProxSense^®devices can use a

standard framework. The complete Memory

Map is defined in the “AZD032 IQS316

Communication Interface” document. This

document is a design guideline covering all

the specific device details, device information,

and settings.

6.3 SPI

SPI uses a memory mapped structure when

sending or retrieving data to/from the IC. The

device must be selected by pulling the /SS

low.

In I²C and SPI mode a WRITE = 00 and a

READ = 01.

At the beginning of a communication window,

the pointer will be set to a default value. This

value can be overwritten to change the default

pointer position. Note that the clock polarity is

idle high, and the data is sampled at the

second edge of the clock pin (rising edge).

6.1 Communication Selection

The IQS316 uses I²C communication by

default. To enable SPI communication, the

SPI enable pin must be pulled HIGH at start-

up, which will configure the device to SPI

mode. The SPI_ENABLE input pin can be

connected to V_DDHIor a pull-up resistor smaller

than 39kΩ can be used.

6.2 Watchdog Timeout and MCLR

When data is available, and Ready is set, the

device will allow a full watchdog period (16ms

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/SS

RDY

SCK

data read from the IC will be from that specific

address, as long as that address is a valid

Read Address from the memory map. This

speeds up the reading of sporadic addresses,

by allowing addresses to be specified „on the

fly‟. When an illegal address is specified in a

read operation, the device will return a „27‟

decimal, the IQS316 product number.

MOSI

SOMI

bit7

7

bit6

bit5

bit3

bit2

bit1

bit0

0

Figure 6.2 SPI timing illustration

6.3.1 SPI read

An example of the read process is illustrated

in Figure 6.3.

The SPI read is performed by sending the

„Read‟ bit in the control byte during the first

data time-slot. The pointer will increment and

step through the relevant memory mapped

blocks, as long as the value sent in to the

device is „FE‟. If an „FF‟ is sent, the SPI read

cycle is terminated. If any value other than a

„FE‟ or an „FF‟ is received, that value will be

loaded into the address pointer, and the next

Header

Data @

Adr 13

Data @

pointer

Data @

pointer+1

Data @

Adr 12

FF

SOMI

MOSI

MCU

Stop

FF

Control

FE

12

FE

R

01

Overwrite Pointer with

address ‘12’

Figure 6.3 SPI Read

Header

00

01

00

01

00

FF

SOMI

MOSI

MCU

Stop

FF

Control

Address

n

Data n

Address

n+1

Data n+1

W

00

Figure 6.4 SPI Write

An example of the SPI write process is given

in Figure 6.4. If an „FF‟ is sent as an address,

the Write cycle is terminated. The value „FF‟

is sent in the Read and Write cycle to

terminate the respective cycles, but will not

terminate the communication window.

6.3.2 SPI write

Similar to the read, while receiving the

„header‟ byte, a WRITE must be selected in

the control byte. The address to which to

write to always precedes the data (address,

data, address, data…)

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6.3.3 SPI

Communications

Window 6.4.2 I²C read

Terminate Command

With the R/W bit SET in the control byte, a

read is initiated. Data will be read from the

address specified by the internal address

pointer (Figure 6.6). This pointer will be

automatically incremented to read through the

Once the master received all required data

from the device, and has written any required

settings to the device, the communication

must be ended, so that the IC can perform

another charge transfer. To achieve this, a

value of „FE‟ must be written in the Address

time slot of a WRITE cycle.

memory map data blocks.

If a random

address is to be read, a Random Read must

be performed. The process for a Random

Read is as follows: write to the pointer (Word

Address in Figure 6.7), initiate a repeated-

Start, read from the address.

6.4 I²C

The IQS316 can communicate on an I²C

compatible bus structure. Note that 4.7kΩ

pull-up resistors should be placed on SDA and

SCL.

Current Address Read

Control Byte

Start

S

Data n

Data n+1

Stop

S

ACK

NACK

6.4.1 Control byte and Device Address

Figure 6.6 I²C Current Address Read

The Control byte indicates the 7-bit device

address and the Read/Write indicator bit. The

structure of the control byte is shown in Figure

6.5.

Random Read

Control Byte

Start

S

Word Address(n)

ACK

Start

Data n

Stop

S

ACK

S

ACK

NACK

7 bit address

Figure 6.7 I²C Random Read

6.4.3 I²C write

MSB

LSB

R/W

I2CA1 I2CA0

1

0

1

With the R/W bit cleared in the control byte, a

write is initiated. An I²C write is performed by

sending the address, followed by the data.

Unlike the SPI write, the Address is only sent

once, followed by data bytes. A block of data

can be written by sending the address

followed by multiple blocks of data. The

internal address pointer is incremented

automatically for each consecutive write, if the

pointer increments to an address which

doesn‟t exist in the memory map, no write will

take place.

Note that the pointer doesn‟t automatically

jump from the end of the LT average block to

the settings block.

An example of the write process is given in

Figure 6.8.

I2C Group

Sub-addresses

Figure 6.5 I²C control byte

The I²C device has a 7 bit Slave Address in

the control byte as shown in Figure 6.5. To

confirm the address, the software compares

the received address with the device address.

Sub-address 0 of the device address is a

static variable read from state of the I2CA0 pin

at start-up. The default value of Sub-address

1 (I2CA1) is „0‟, please contact your local

Azoteq distributor for devices with I2CA1 set

to „1‟.

The two sub-addresses allow 4 IQS316 slave

devices to be used on the same I²C bus, as

well as to prevent address conflict.

DATA WRITE

Start Control Byte

S

Word Address(n)

Data n

Data n+1

Stop

S

The fixed device address is „11101‟ followed

by the 2 sub-address bits, giving a default 7-

bit address of „1110100‟.

ACK

Figure 6.8 I²C write

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6.4.4 I²C

Terminate Command

Communications

Circuit diagrams of implementations using

Window

additional features are shown in Figure 6.9

and Figure 6.10. Additional 100pF decoupling

capacitors are placed on VDDHI and VREG to

increase the noise immunity of the controller.

In Figure 6.9 the controller is configured to

communicate in SPI mode and in Figure 6.10

the controller is configured to communicate in

I2C mode.

To terminate the communication window in

I²C, a STOP is given.

When sending

numerous Read and Write commands in one

communication cycle, a „Repeated Start‟

command must be used to stack them

together (since a STOP will jump out of the

communication window, which is not desired).

6.5 Circuit diagrams (all features)

IQS316

VDDHI

VREG

SPI_ENABLE

(Optional)

C4

100pF

C1

1uF

C2

100pF

C3

1uF

CXA0

CXA1

CXB1

CXA5

CXB5

CXA2

CXB2

CXA6

CXB6

CXA3

CXB3

CXA7

CXB7

CXA[7:0]

CXB[7:0]

GND

CXB0

CXA4

CXB4

MOSI

VDDHI VDDHI

SOMI

RDY

SCK

R2

R3

Shield (Optional)

/SS

SPI Interface

to Master Controller

SHLD_A

SHLD_B

MCLR

C5

10nF

(RF Optional)

RF antenna

GND

RF

ZC

ZC_IN

(Zero-Cross Optional)

VSS

ICTRL

39k

R1

GND

R4

GND

Figure 6.9 Circuit diagram for SPI implementation

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IQS316

VDDHI

SPI_ENABLE

VREG

(Optional)

CXA0

CXA1

CXB1

CXA5

CXB5

CXA2

CXB2

CXA6

CXB6

CXA3

CXB3

CXA7

CXB7

C1

1uF

C2

100pF

C3

1uF

C4

100pF

VDDHI VDDHI

CXA[7:0]

CXB[7:0]

(Standard I2C pull-ups)

CXB0

CXA4

CXB4

GND

R1

R2

VDDHI VDDHI

SDA

SCL

R4

R5

Shield (Optional)

IRDY

I2CA0

SHLD_A

SHLD_B

I2C Interface

to Master Controller

GND

MCLR

C5

10nF

(RF Optional)

RF antenna

GND

RF

ZC

ZC_IN

VSS

(Zero-Cross Optional)

ICTRL

39k

R3

GND

R6

GND

Figure 6.10 Circuit diagram for I²C implementation

VDDHI

BACKLIGHTING LED

IQS316

VDDHI

VREG

SPI_ENABLE

R

GPIO (7:0)

4

3

D

Q1

GPIO_0

1

G

S

(Optional)

C4

100pF

C1

1uF

C2

100pF

C3

1uF

GND

VDDHI VDDHI

MOSI

SOMI

RDY

SCK

R2

R3

Shield (Optional)

SHLD_A

SHLD_B

/SS

SPI Interface

to Master Controller

CXA0

CXB0

CXA1

CXB1

CXA2

CXA3

CXB3

CXA[3:0]

CXB[3:0]

MCLR

C5

10nF

CXB2

(RF Optional)

RF antenna

GND

RF

ZC

ZC_IN

(Zero-Cross Optional)

VSS

ICTRL

39k

R1

GND

R4

GND

Figure 6.11 Circuit Diagram for 8 GPIO implementation

IQS316 Datasheet

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7 Electrical specifications

7.1 Absolute maximum specifications

Operating temperature

-40°C to 85°C

Supply Voltage (V_DDHI-V_SS)

Max pin voltage for ESD=V_DDHI

Maximum pin voltage for ESD=V_REG

Min pin voltage

5.5V

V_DDHI+ 0.5V

V_REG+ 0.5V

V_SS- 0.5V

100V/s

Min power on slope

ESD protection (Human Body Model)

Latch-up current

3kV

100mA

7.2 Operating conditions (Measured at 25°C)

Table 7.1

Electrical operating conditions

Description

Conditions

Parameter

V_REG

V_DDHI

I_NP

Min Typ Max Unit

Internal regulator output

Supply voltage

2.85V<V_DDHI<5.5V

2.3

2.85

2.4

2.5

5.5

680

V

Normal operating current

Low power operating current (LP1)

Low power operating current (LP2)

Low power operating current (LP3)

Current in SLEEP mode

Main Oscillator (8MHz setting)

2. 85V<V_DDHI<5.5V

V_DDHI=3.3V+4shields

2. 85V<V_DDHI<5.5V

640

4

µA

mA

µA

I_NP

I_LP1

I_LP2

I_LP3

I_SL

Fosc

100

60

45

20

8

25

7.36

8.64 MHz

Please Note: LP1, LP2 and LP3 are dependent on a variety of settings and thus a MIN/MAX

value cannot sensibly be given.

7.3 Moisture Sensitivity Level

Moisture Sensitivity Level (MSL) relates to the packaging and handling precautions for some

semiconductors. The MSL is an electronic standard for the time period in which a moisture

sensitive device is allowed to be exposed to ambient room conditions (approximately

30°C/60%RH) before reflow must occur.

Table 7.2

MSL

Package

Level (duration

QFN5x5-32

QFR5x5-32

MSL 3 (168 hours)

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7.4 Recommended storage environment for IC’s

This storage environment assumes that the IC‟s are packed properly inside a humidity barrier

bag

Table 7.3

Min Typ Max Unit Notes

-55 25 150 °C

IC Storage

Parameter Description

T_STG

Storage

Recommended storage temperature is 25

°C ± 25 °C. Extended duration storage at

temperatures above 85 °C degrades

reliability as well as reduces data

retention performance

Temperature

T_j

Junction

150 °C

Temperature

Supplementary notes according to Jedec recommendations:



Optimal Storage Temperature Range: 5 °C to 30 °C

Humidity: between 40 to 70% RH

Air should be clean

Avoid harmful gasses and dust

Avoid outdoor exposure or storage in areas subject to rain or water spraying

Avoid storage in areas subject to corrosive gas or dust. Products shall not be stored in

areas exposed to direct sunlight



Avoid rapid changes of temperature

Avoid condensation

Mechanical stress such as vibration and impact shall be avoided

The products shall not be placed directly on the floor

The products shall be stored on a plane area. They should not be turned upside down.

They should not be placed against the wall

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7.5 Timing characteristics (Measured at 25°C)

Table 7.4

Timing characteristics

Description

Symbol

Min

Typical Max Unit

SPI clock frequency

F_SCK

0.4

0.8

MHz

I²C clock frequency

F_SCL

F_CX

0.1

1

MHz

Charge transfer oscillator (setting =

osc/8)

0.92

1.08

Filter Halt Short

t_FHS

20

s

Filter Halt Long

Mode timer

t_FHL

40

4

s

T_MODE

Table 7.5

IQS316 Data Report Rate²

Number of

Total

Total Groups

Charging Mode

Channels

per Group

Typical

Unit

Charging

Prox Mode

Touch Mode

1

4

3

2

1

4

3

110 ^Note1

41

Hz

2

1

16

Touch Mode

3

2

1

4

3

2

1

12

8

4

3

2

54

82

161

192

238

250

Hz

1

Note 1:

In Prox Mode, the target charging frequency can decrease if certain situations

exist. For example if lengthy communication is done, the frequency will decrease, of if the

charge transfer is long (slower prox oscillator divider, or very high count values).

Note 2:

Measurements in Table 7.5 where obtained with the following settings:

-

Prox Mode count values = ±1000

Touch Mode count values = ±500

4 bytes read per cycle (XY info, Prox, Touch and Group).

IQS316 Datasheet

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8 Mechanical Dimensions

8.1 IQS316 Mechanical Dimensions

W

P

F

B

Tt

Wt

C2

C1

A

H

T

Figure 8.1 IQS316 Package. Drawings not too scale - illustration only.

Table 8.1

Packaging Dimensions.

QNR QFR

MIN

DESCRIPTION

MAX

5.10

0.05

Unit

mm

A

B

4.90

0

4.90

5.10

0.05

4.90

0

C1

C2

F

0.203TYP

0.600TYP

0.85 0.95

0.5TYP

0.3 0.5

0.203TYP

0.3

0.4

H

0.85

0.95

P

0.5TYP

T

0.3

0.5

T_t

3.3 TYP

0.25TYP

3.3 TYP

3.55

3.75

W

W_t

0.25TYP

3.55

3.75

IQS316 Datasheet

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8.1.2 QFR package differences to QNR package

The overall physical size of the part (l x w x h) and pitch of the pins did not change.

The mechanical dimensions of the saddle (T_t& W_t) and length of the pins (F) have changed

from the old part (IQS316-0-QNR) to the new part (IQS316-0-QFR). The new dimensions are

given below:

IQS316-

0-QNR

0-QFR

Figure 8.2 Changes in Package. Only affected dimensions are shown. Drawing for

illustration only, not too scale.

IQS316 Datasheet

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8.2 IQS316 Landing Pad Layout

X2

Y1

32

31

30

29

28

27

26

25

X1

1

2

3

24

23

22

21

20

19

18

17

4

5

6

7

8

C2

Y2

33

16

9

10

11

12

13

14

15

C1

Figure 8.3 IQS316 Footprint. Illustration not to scale.

*NOTE: Pad 33 must be connected to GND.

Table 8.2

Dimensions from Figure 8.3

QFN

Dimension

4.90

QFR

Dimension

4.85

DESCRIPTION

Unit

mm

C1

C2

X1

X2

Y1

Y2

4.90

4.85

0.30

0.25

3.25

3.65

0.90

0.8

3.25

3.65

IQS316 Datasheet

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9 Datasheet and Part-number Information

9.1 Ordering Information

IQS316 z pp b

IC NAME

BULK PACKAGING

PACKAGE TYPE

IC CONFIGURATION

PACKAGE TYPE

z

=

0 : I²C Sub-address 1 = 0

1 : I²C Sub-address 1 = 1

QN

QF

=

QFN32

QFR32

BULK PACKAGING QFN5x5-32

R

=

Reel (3000 pcs/reel)

MOQ =

1 reel. Mass production orders shipped as full reels

9.2 Package Marking

IQS316 x i z PWWYY

IC NAME

REVISION

DATE CODE

IC CONFIGURATION

TEMPERATURE RANGE

REVISION

X

i

=

IC Revision Number

TEMPERATURE RANGE

IC CONFIGURATION

-40°C to 85°C (Industrial)

z

=

I²C Sub-address 1 = 0

I²C Sub-address 1 = 1

DATE CODE

P

WW

=

Package House

Week

IQS316 Datasheet

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IQ Switch^®

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YY

=

Year

9.3 Tape and Reel

Figure 9.1 Tape Dimensions Figure

Table 9.1

Tape Dimensions Table

LABEL

A0

Dimensions (mm)

5.3 ± 0.10

LABEL

P0

Dimensions (mm)

4.0 ± 0.10

B0

5.3 ± 0.10

P1

8.0 ± 0.10

D0

D1

E

1.5 ± 0.10

P2

2.0 ± 0.05

1.5 ± 0.25

10xP0

T

40.0 ± 0.2

1.75 ± 0.10

5.5 ± 0.05

0.3 ± 0.05

F

W

12.0 ± 0.30

K0

1.1 ± 0.10

IQS316 Datasheet

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Figure 9.2 Reel Dimension Figure

Table 9.2

Reel Dimension Table

Tape Size

Combination

Part Number

T12-13/04-A1

12

13/04-04-1

13/04-08-1

A(+0.25/-4.0) N(±2.0) W1(+2/-0)

330 100 12.4

W2(Max)

W3(Min/Max) Sw

11.9/15.4 6.0

18.4

IQS316 Datasheet

Revision 1.03

Page 26 of 28

November 2015

IQ Switch^®

ProxSense^®Series

9.5 Revision History

Revision

Number

V0.03

History



Added Section 2.2

Updated Figure 2.1 (new qfn package)

Update Section 8.1.

V0.04

V0.05



Fixed Section

9.1

bulk

packaging

description and removed tube option

Added Section 9.3 (tape and reel details)

Updated 7.1 (ESD Model)

Updated patents



Fixed text Section 3.2



Terminology updated

Updated to Section 4.6

Updated to Section 2.2

Updated Section 4.4

Connected ZC to ground in Figure 1.1

Added ground tab information to Section

8.1.2



Updated Figure 2.1

Updated Section 4.1.2

Added MSL details Section 7.3

Added footer first page

Updated Table 3.3 and Table 3.4 to show

selection bits

V1.00



Updated Section 3.3.10

Updated Table 7.4

Updated contacts section

V1.01

V1.02

V1.03



Add QFR32 package descriptions



Updated contacts section



Updated current consumption values in

Table 7.1

Added storage temperature Section 7.4

IQS316 Datasheet

Revision 1.03

Page 27 of 28

November 2015

IQ Switch^®

ProxSense^®Series

Appendix A. Contact Information

USA

Asia

South Africa

Physical

Address

Rm2125, Glittery City

Shennan Rd

Futian District

Shenzhen, 518033

China

109 Main Street

Paarl

7646

6507 Jester Blvd

Bldg 5, suite 510G

Austin

TX 78750

USA

South Africa

Postal

Address

Rm2125, Glittery City

Shennan Rd

Futian District

Shenzhen, 518033

China

PO Box 3534

Paarl

7620

6507 Jester Blvd

Bldg 5, suite 510G

Austin

TX 78750

USA

South Africa

Tel

+1 512 538 1995

+1 512 672 8442

info@azoteq.com

+86 755 8303 5294

ext 808

+27 21 863 0033

+27 21 863 1512

info@azoteq.com

Fax

Email

linayu@azoteq.com.cn

Please visit www.azoteq.com for a list of distributors and worldwide representation.

The following patents relate to the device or usage of the device: US 6,249,089 B1; US 6,621,225 B2; US 6,650,066 B2;

US 6,952,084 B2; US 6,984,900 B1; US 7,084,526 B2; US 7,084,531 B2; US 7,265,494 B2; US 7,291,940 B2; US 7,329,970 B2;

US 7,336,037 B2; US 7,443,101 B2; US 7,466,040 B2 ; US 7,498,749 B2; US 7,528,508 B2; US 7,755,219 B2; US 7,772,781

B2; US 7,781,980 B2; US 7,915,765 B2; US 7,994,726 B2; US 8,035,623 B2; US RE43,606 E; US 8,288,952 B2; US 8,395,395

B2; US 8,531,120 B2; US 8,659,306 B2; US 8,823,273 B2; EP 1 120 018 B2; EP 1 206 168 B1; EP 1 308 913 B1; EP 1 530 178

A1; EP 2 351 220 B1; EP 2 559 164 B1; CN 1330853; CN 1783573; AUS 761094; HK 104 1401

IQ Switch^®, SwipeSwitch™, ProxSense^®, LightSense™, AirButton^TM, ProxFusion™, Crystal Driver™ and the

logo are trademarks of Azoteq.

The information in this Datasheet is believed to be accurate at the time of publication. Azoteq uses reasonable effort to maintain the information up-to-date and accurate, but does not warrant

the accuracy, completeness or reliability of the information contained herein. All content and information are provided on an “as is” basis only, without any representations or warranties, express

or implied, of any kind, including representations about the suitability of these products or information for any purpose. Azoteq disclaims all warranties and conditions with regard to these

products and information, including but not limited to all implied warranties and conditions of merchantability, fitness for a particular purpose, title and non-infringement of any third party

intellectual property rights. Azoteq assumes no liability for any damages or injury arising from any use of the information or the product or caused by, without limitation, failure of performance,

error, omission, interruption, defect, delay in operation or transmission, even if Azoteq has been advised of the possibility of such damages. The applications mentioned herein are used solely

for the purpose of illustration and Azoteq makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for

application that may present a risk to human life due to malfunction or otherwise. Azoteq products are not authorized for use as critical components in life support devices or systems. No

licenses to patents are granted, implicitly, express or implied, by estoppel or otherwise, under any intellectual property rights. In the event that any of the abovementioned limitations or

exclusions does not apply, it is agreed that Azoteq‟s total liability for all losses, damages and causes of action (in contract, tort (including without limitation, negligence) or otherwise) will not

exceed the amount already paid by the customer for the products. Azoteq reserves the right to alter its products, to make corrections, deletions, modifications, enhancements, improvements

and other changes to the content and information, its products, programs and services at any time or to move or discontinue any contents, products, programs or services without prior

notification. For the most up-to-date information and binding Terms and Conditions please refer to www.azoteq.com.

www.azoteq.com/ip

info@azoteq.com

IQS316 Datasheet

Revision 1.03

Page 28 of 28

November 2015


型号：	IQS3161QNMOQ
厂家：	ETC
描述：	16 Touch Keys with distributed Proximity Sensing
文件：	总28页 (文件大小：1817K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

IQS3161QNMOQ [ETC]

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