IQS550BLQNR_技术文档

IQ Switch^®

ProxSense^®Series

Contents

1

2

Overview............................................................................................................................................................ 7

Packaging and Pin-out........................................................................................................................................ 8

2.1

IQS550 - QFN48 ................................................................................................................................................. 8

IQS572 - QFN28 ............................................................................................................................................... 10

IQS525 - QFN28 ............................................................................................................................................... 12

2.2

2.3

3

ProxSense^®Module ...........................................................................................................................................14

3.1

Channel Definition........................................................................................................................................... 14

Alternate Low-Power Channel (ALP) .............................................................................................................. 14

Count Value..................................................................................................................................................... 14

3.2

3.3

3.3.1 Trackpad Count Values ............................................................................................................................... 14

3.3.2 ALP Count Values ........................................................................................................................................ 14

3.3.3 Max Count................................................................................................................................................... 15

3.3.4 Delta Value.................................................................................................................................................. 15

3.4

Reference Value............................................................................................................................................... 15

3.4.1 Reference Update Time .............................................................................................................................. 15

3.4.2 ALP Long-Term Average.............................................................................................................................. 15

3.4.3 Reseed......................................................................................................................................................... 15

3.5

Channel Outputs.............................................................................................................................................. 15

3.5.1 Proximity..................................................................................................................................................... 15

3.5.2 Touch .......................................................................................................................................................... 16

3.5.3 Snap ............................................................................................................................................................ 16

3.5.4 Output Debounce ....................................................................................................................................... 16

3.5.5 Maximum Touch ......................................................................................................................................... 16

3.6

Auto Tuning (ATI) ............................................................................................................................................ 17

3.6.1 ATI C Multiplier ........................................................................................................................................... 17

3.6.2 ATI Compensation & Auto ATI .................................................................................................................... 17

3.7

Automatic Re-ATI ............................................................................................................................................ 17

3.7.1 Description.................................................................................................................................................. 17

3.7.2 Conditions for Re-ATI to activate................................................................................................................ 17

3.7.3 ATI Error...................................................................................................................................................... 18

3.7.4 Design requirements................................................................................................................................... 18

3.8

Sensing Hardware Settings.............................................................................................................................. 18

4

5

Sensing Modes ..................................................................................................................................................19

4.1

Report Rate ..................................................................................................................................................... 19

4.1.1 Previous Cycle Time .................................................................................................................................... 20

4.2

4.3

Mode Timeout................................................................................................................................................. 20

Manual Control ............................................................................................................................................... 20

Trackpad ...........................................................................................................................................................20

5.1 Configuration................................................................................................................................................... 20

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5.1.1 Size Selection .............................................................................................................................................. 20

5.1.2 Individual Channel Disabling....................................................................................................................... 20

5.1.3 Rx / Tx Mapping .......................................................................................................................................... 20

5.1.4 Rx / Tx Selections ........................................................................................................................................ 21

5.2

Trackpad Outputs............................................................................................................................................ 21

5.2.1 Number of Fingers ...................................................................................................................................... 21

5.2.2 Relative XY .................................................................................................................................................. 21

5.2.3 Absolute XY................................................................................................................................................. 21

5.2.4 Touch Strength............................................................................................................................................ 21

5.2.5 Area............................................................................................................................................................. 21

5.2.6 Tracking / Identification.............................................................................................................................. 21

5.3

Max Number of Multi-touches ........................................................................................................................ 21

XY Resolution................................................................................................................................................... 21

Palm Rejection................................................................................................................................................. 21

Stationary Touch ............................................................................................................................................. 22

Multi-touch Finger Split................................................................................................................................... 22

XY Output Flip & Switch................................................................................................................................... 22

XY Position Filtering......................................................................................................................................... 22

5.4

5.5

5.6

5.7

5.8

5.9

5.9.1 MAV Filter ................................................................................................................................................... 22

5.9.2 IIR Filter....................................................................................................................................................... 22

6

Gestures............................................................................................................................................................23

6.1

Single Tap ........................................................................................................................................................ 23

Press and Hold................................................................................................................................................. 23

Swipe (X-, X+, Y-, Y+)........................................................................................................................................ 24

2 Finger Tap..................................................................................................................................................... 24

Scroll................................................................................................................................................................ 24

Zoom................................................................................................................................................................ 25

Switching Between Gestures ........................................................................................................................... 25

6.2

6.3

6.4

6.5

6.6

6.7

7

Additional Features...........................................................................................................................................25

7.1

Non-volatile Defaults....................................................................................................................................... 25

Automated Start-up ........................................................................................................................................ 25

Suspend ........................................................................................................................................................... 26

7.2

7.3

7.3.1 I²C Wake...................................................................................................................................................... 26

7.3.2 Switch Input Pin Wake ................................................................................................................................ 26

7.4

Reset................................................................................................................................................................ 26

7.4.1 Reset Indication .......................................................................................................................................... 26

7.4.2 Software Reset............................................................................................................................................ 26

7.4.3 Hardware Reset .......................................................................................................................................... 26

7.5

Watchdog Timer (WDT)................................................................................................................................... 26

RF Immunity .................................................................................................................................................... 26

Additional Non-Trackpad Channels................................................................................................................ 26

Bootloader....................................................................................................................................................... 26

7.6

7.7

7.8

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7.8.1 Bootloader Status ....................................................................................................................................... 26

7.9

Version Information ........................................................................................................................................ 27

7.9.1 Product Number ......................................................................................................................................... 27

7.9.2 Project Number........................................................................................................................................... 27

7.9.3 Major and Minor Versions .......................................................................................................................... 27

7.10

7.11

Unique ID......................................................................................................................................................... 27

Switch Input..................................................................................................................................................... 27

8

I²C .....................................................................................................................................................................27

8.1

Data Ready (RDY) ............................................................................................................................................ 27

Slave Address................................................................................................................................................... 27

16-bit Addressing ............................................................................................................................................ 27

I²C Read ........................................................................................................................................................... 27

8.2

8.3

8.4

8.4.1 Default Read Address.................................................................................................................................. 28

8.5

I²C Write .......................................................................................................................................................... 28

I²C Timeout...................................................................................................................................................... 28

End of Communication Session / Window...................................................................................................... 28

Event Mode Communication ........................................................................................................................... 28

8.6

8.7

8.8

8.8.1 Events.......................................................................................................................................................... 28

8.8.2 Force Communication................................................................................................................................. 28

8.9

8.10

8.10.1

8.10.2

Memory Map Registers ................................................................................................................................... 29

Memory Map Bit / Register Definitions........................................................................................................... 36

Gesture Events 0..................................................................................................................................... 37

Gesture Events 1..................................................................................................................................... 37

System Info 0 .......................................................................................................................................... 38

System Info 1 .......................................................................................................................................... 39

Individual Channel Status / Config Bit Definitions.................................................................................. 39

Count / Delta / Reference Data .............................................................................................................. 40

System Control 0 .................................................................................................................................... 41

System Control 1 .................................................................................................................................... 42

System Config 0 ...................................................................................................................................... 42

8.10.3

8.10.4

8.10.5

8.10.6

8.10.7

8.10.8

8.10.9

8.10.10 System Config 1 ...................................................................................................................................... 43

8.10.11 Alternate Channel Setup ........................................................................................................................ 44

8.10.12 ALP Rx select........................................................................................................................................... 45

8.10.13 ALP Tx select........................................................................................................................................... 45

8.10.14 RxToTx .................................................................................................................................................... 45

8.10.15 Hardware Settings A............................................................................................................................... 46

8.10.16 Hardware Settings B ............................................................................................................................... 46

8.10.17 Hardware Settings C ............................................................................................................................... 47

8.10.18 Hardware Settings D............................................................................................................................... 47

8.10.19 XY Config 0.............................................................................................................................................. 48

8.10.20 Single Finger Gestures ............................................................................................................................ 48

8.10.21 Multi-finger Gestures ............................................................................................................................. 49

9

Circuit Diagram .................................................................................................................................................50

10 Electrical Characteristics....................................................................................................................................55

10.1 Absolute Maximum Ratings ............................................................................................................................ 55

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10.2

10.2.1

10.2.2

Operating Conditions ...................................................................................................................................... 56

General Operating Conditions................................................................................................................ 56

Power-up / Power-down Operating Conditions..................................................................................... 56

Supply Current Characteristic................................................................................................................. 57

ProxSense^®Current Consumption .......................................................................................................... 57

Expected Total Current Consumption Scenarios .................................................................................... 57

I/O Port Pin Characteristics .................................................................................................................... 59

Output Driving Current........................................................................................................................... 60

NRST Pin ................................................................................................................................................. 60

I²C Characteristics................................................................................................................................... 61

10.2.3

10.2.4

10.2.5

10.2.6

10.2.7

10.2.8

10.2.9

10.2.10 Package Moisture Sensitivity.................................................................................................................. 63

10.2.11 Electrostatic Discharge (ESD).................................................................................................................. 63

10.2.12 Thermal Characteristics.......................................................................................................................... 63

10.2.13 ProxSense Electrical Characteristics ....................................................................................................... 64

11 Mechanical Dimensions ....................................................................................................................................65

11.1

11.2

11.3

11.4

IQS550 QFN(7x7)-48 Mechanical Dimensions................................................................................................. 65

IQS550 Landing Pad Layout............................................................................................................................. 66

IQS572/IQS525 QFN(4x4)-28 Mechanical Dimensions.................................................................................... 67

IQS572/IQS525 Landing Pad Layout................................................................................................................ 68

12 Packaging Information ......................................................................................................................................69

12.1 Tape Specification ........................................................................................................................................... 69

12.1.1

12.1.2

12.2

12.2.1

12.2.2

IQS550 Tape Description ........................................................................................................................ 70

IQS572 and IQS525 Tape Description..................................................................................................... 70

Reel Specification ............................................................................................................................................ 71

Dry Packing ............................................................................................................................................. 72

Baking ..................................................................................................................................................... 72

12.3

12.4

Handling of the IQS5xx.................................................................................................................................... 73

Reflow for IQS5xx ............................................................................................................................................ 74

13 Device Marking .................................................................................................................................................75

13.1

13.2

IQS550 Marking............................................................................................................................................... 75

IQS572/IQS525 Marking.................................................................................................................................. 76

14 Ordering Information ........................................................................................................................................76

14.1

14.2

14.3

IQS550 Ordering.............................................................................................................................................. 76

IQS572 Ordering.............................................................................................................................................. 77

IQS525 Ordering.............................................................................................................................................. 77

Changes:....................................................................................................................................................................... 78

Release v1.00 ........................................................................................................................................................... 78

Release v1.01 ........................................................................................................................................................... 78

Release v2.00 ........................................................................................................................................................... 78

15 Contact Information..........................................................................................................................................79

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List of Abbreviations

ALP

Alternate Low Power

ATI

Automatic Tuning Implementation

Electromagnetic Interference

Electrostatic Discharge

Ground

EMI

ESD

GND

GUI

IC

Graphical User Interface

Integrated Circuit

ICI

Internal Capacitor Implementation

Infinite Impulse Response

Low Power

IIR

LP

LTA

MAV

ND

Long Term Average

Moving Average

Noise Detect

THR

TP

Threshold

Trackpad

WDT

Watchdog Timer

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1 Overview

The IQS550 / IQS572 / IQS525 are capacitive sensing controllers designed for multi-touch

applications using projected capacitance touch panels. The device offers high sensitivity

proximity wake-up and contact detection (touch) through a selectable number of sensor lines

(Rxs and Txs).

The device has an internal voltage regulator and Internal Capacitor Implementation (ICI) to

reduce external components. Advanced on-chip signal processing capabilities provide stable

high performance with high sensitivity.

A trackpad consists of an array of sensors that are scanned at regular intervals. The controller

uses the principle of projected capacitance charge transfer on the trackpad. When a

conductive object such as a human finger approaches the sense plate it will decrease the

detected capacitance. Thresholds are applied to the sensor data to identify areas that exhibit

proximity and touch deviation. The contours of the touch areas are then translated to

Cartesian position coordinates that are continuously monitored to identify gestures. A user

has access to all of the data layers – the raw sensor data, the sensor proximity/touch status

data, the XY coordinates as well as the gesture outputs.

Multiple filters are implemented to detect and suppress noise, track slow varying

environmental conditions and avoid effects of possible drift. The Auto Tuning (ATI) allows for

the adaptation to a wide range of touch screens without using external components.

An innovative addition, known as a snap*, is also available on each channel. This adds

another channel output, additional to the proximity and touch.

The trackpad application firmware on the IQS5xx is very flexible in design, and can incorporate

standard touch sensors, trackpad / touchscreen areas (giving XY output data) and

conventional snap-dome type buttons, all providing numerous outputs such as proximity,

touch, snap, touch strength, area and actual finger position all in one solution.

The IQS550, IQS572 and IQS525 devices ship with the bootloader only, since the designer

must program custom IQS5xx-B000 firmware during production testing. The custom firmware

is the IQS5xx-B000 trackpad firmware together with customer specific hardware settings

exported by the GUI program.

This datasheet applies to the following IQS550 version:

Product Number 40 / Project Number 15 / Version Number 2

This datasheet applies to the following IQS572 version:

Product Number 58 / Project Number 15 / Version Number 2

This datasheet applies to the following IQS525 version:

Product Number 52 / Project Number 15 / Version Number 2

*patented

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2 Packaging and Pin-out

2.1 IQS550 - QFN48

The IQS550 is available in a QFN(7x7)-48

package.

Tx14 1

PGM 2

SW_IN 3

N/C 4

36 Tx3

35 Tx2

34 Tx1

33 Tx0

SDA 5

32 Rx9B

31 Rx9A

30 Rx8B

29 Rx8A

28 Rx7B

27 Rx7A

26 Rx6B

25 Rx6A

SCL 6

VDDHI 7

VSS 8

VREG 9

NRST 10

RDY 11

N/C 12

Figure 2.1 QFN Top View

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Table 2.1

Name

Tx14

QFN48 Pin-out

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

Name

Rx6A

Rx6B

Rx7A

Rx7B

Rx8A

Rx8B

Rx9A

Rx9B

Tx0

Description

1

Description

Transmitter electrode

Programming Pin

Receiver electrode

Note1

2

PGM

Receiver electrode

Note1

Wake-up from suspend

and switch input

3

SW_IN

Receiver electrode

4

5

6

7

8

n/c

SDA

~

Note1

I²C Data

Receiver electrode

SCL

I²C Clock

Note1

VDDHI

VSS

Supply Voltage

Ground Reference

Transmitter electrode

I/O Ground Reference

I/O Supply Voltage

Tx1

Internal Regulator

Voltage

9

VREG

Tx2

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

NRST

RDY

Reset (active LOW)

Tx3

I²C RDY

~

VSSIO

VDDIO

Tx4

n/c

Rx0A

Rx0B

Rx1A

Rx1B

Rx2A

Rx2B

Rx3A

Rx3B

Rx4A

Rx4B

Rx5A

Rx5B

Receiver electrode

Transmitter electrode

Note1

Tx5

Receiver electrode

Tx6

Note1

Tx7

Receiver electrode

Tx8

Note1

Tx9

Receiver electrode

Tx10

Tx11

Tx12

Tx13

Note1

Receiver electrode

Note1

Note1: Any of these can be configured through I²C as the

Receiver electrode

ProxSense^®electrode.

Note1

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2.2 IQS572 - QFN28

The IQS572 is available in a QFN(4x4)-28

package. The production version is shown

below.

n/c 1

SDA 2

21 TX3

20 TX2

SCL 3

19 TX1

VDDHI 4

VSS 5

18 TX0

17 RX7 / TX9

16 RX6 / TX10

15 RX5 / TX11

VREG 6

NRST 7

Figure 2.2 IQS572 QFN Top View

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Table 2.2

Name

IQS572 QFN28 Pin-out

15

16

17

18

19

20

21

22

23

24

25

26

27

Rx5

Rx6

Rx7

Tx0

Tx1

Tx2

Tx3

Tx4

Tx5

Tx6

Tx7

Tx8

PGM

Receiver electrode

Transmitter electrode

Programming Pin

1

Description

~

n/c

SDA

2

I²C Data

3

SCL

I²C Clock

4

VDDHI

VSS

Supply Voltage

Ground Reference

5

Internal Regulator

Voltage

6

VREG

7

NRST

RDY

n/c

Reset (active LOW)

I²C RDY

8

9

~

10

11

12

13

14

Rx0

Rx1

Rx2

Rx3

Rx4

Receiver electrode

Wake-up from suspend

and switch input

28

SW_IN

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2.3 IQS525 - QFN28

The IQS525 is available in a QFN(4x4)-28

package. The production version is shown

below.

n/c 1

SDA 2

21 PD3

20 PD2

SCL 3

19 TX0

VDDHI 4

VSS 5

18 TX1

17 RX7 / TX2

16 RX6 / TX3

15 RX5 / TX4

VREG 6

NRST 7

Figure 2.3 IQS525 QFN Top View

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Table 2.3

Name

n/c

QFN28 Pin-out

Rx5 /

TX4

Receiver / Transmitter

electrode

15

16

17

1

Description

~

Rx6 /

TX3

Receiver / Transmitter

electrode

2

SDA

I²C Data

Rx7 /

TX2

Receiver / Transmitter

electrode

3

SCL

I²C Clock

18

19

20

21

22

23

24

25

26

27

Tx1

Tx0

Transmitter electrode

General purpose I/O

Programming Pin

4

VDDHI

VSS

Supply Voltage

Ground Reference

5

PD2

PD3

PD4

PD5

PD6

PD7

PB0

PGM

Internal Regulator

Voltage

6

VREG

7

NRST

RDY

n/c

Reset (active LOW)

I²C RDY

8

9

~

10

11

12

13

14

Rx0

Rx1

Rx2

Rx3

Rx4

Receiver electrode

Wake-up from suspend

and switch input

28

SW_IN

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 Sensing

method

(CHARGE_TYPE):

3 ProxSense^®Module

projected capacitive or self capacitive.

The IQS5xx contains a ProxSense^®module

that uses patented technology to measure and

process the capacitive sensor data. The

trackpad sensors are scanned one Tx

transmitter at a time, until all have completed,

with all enabled Rxs charging in each Tx time

slot. The channel outputs (proximity, touch

and snap) are the primary outputs from the

sensors. These are processed further to

provide secondary trackpad outputs that

include finger position, finger size as well as

on-chip gesture recognition.

 Sensors: which Rxs (RX_GROUP / ALP Rx

select) / Txs (ALP Tx select) are active

during conversions.

 Reverse sensing: If enabled, negative

deviations can also trigger proximity

detection (PROX_REVERSE).

 Count value filtering: gives reliable

proximity detection in noisy environments.

 Single channel: since the alternate channel

is processed as only a single channel,

much less processing is done, allowing for

lower overall power consumption.

The additional snap state is a unique sensor

output that utilises capacitive technology to

sense the depression of a metal dome snap

button onto the customized sensor area. This

gives an additional output above the traditional

proximity and touch channel outputs.

Since all Rxs return a count measurement, it

means that the ALP channel can be a

combination of numerous measurements. To

reduce processing time (and this decrease

current consumption) the measurements are

added together, and processed as a single

„channel‟.

For more information on capacitive sensing

and charge transfers, please refer to the

Azoteq Application Note AZD004.

3.3 Count Value

For more information regarding design

guidelines refer to the Application Note

AZD068.

The capacitive sensing measurement returns

a count value for each channel. Count values

are inversely proportional to capacitance, and

all outputs are derived from this them.

3.1 Channel Definition

A channel for a projected capacitive sensor

consists of a Tx electrode that is in close

proximity to an Rx electrode.

3.3.1 Trackpad Count Values

The individual trackpad channel count values

(Count values) are unfiltered.

On a trackpad sensor (typically a diamond

shape pattern), each intersection of an Rx and

Tx row/column forms a capacitive sensing

element which is referred to as a channel.

Each channel has an associated count value,

reference value, proximity, touch and snap (if

enabled) status. The maximum number of Tx

and Rx electrodes on the IQS550 device is

15x10, thus giving 150 channels in total.

3.3.2 ALP Count Values

The combined count value (ALP count value)

used for this channel is a summation of the

individual count values (ALP individual count

values) from each active Rx.

A count value filter is implemented on this

channel to give stable proximity output for

system wake-up from a low-power mode. It is

recommended to leave this count filter

enabled (ALP_COUNT_FILTER).

3.2 Alternate Low-Power

Channel (ALP)

The amount of filtering can be modified (ALP

count beta) if required. This beta is used as

follows to determine the damping factor of the

filter:

If lower power consumption is required (ALP),

LP1 and LP2 can be configured to utilise a

single custom channel sensor, instead of

sensing the trackpad channels. This channel

has a lot of setup flexibility:

Count damping factor = Beta / 256

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If the beta is small, the filtering is stronger,

3.4.2 ALP Long-Term Average

and if the beta is larger, the filtering is weaker.

The ALP channel does not have a snapshot

reference value as used on the trackpad, but

utilises a filtered long-term average value

3.3.3 Max Count

Each channel is limited to having a count

value smaller than the configurable limit (Max

count limit). If the ATI setting or hardware

causes measured count values higher than

this, the conversion will be stopped, and a

value of „0‟ will be read for that relevant count

value. Note that a „0‟ is also returned for a

disabled channel.

(ALP LTA value).

The LTA tracks the

environment closely for accurate comparisons

to the measured count value, to allow for small

proximity deviations to be sensed. The speed

of LTA tracking can be adjusted with the ALP

LTA beta. There is an ALP1 and ALP2, which

are implemented in LP1 and LP2 respectively.

This is to allow different settings for different

report rates, so that the LTA tracking rate can

remain the same.

3.3.4 Delta Value

The delta values (Delta values) are simply:

Delta = Count - Reference

3.4.3 Reseed

Since the Reference (or LTA for ALP channel)

is critical for the device to operate correctly,

there could be known events or situations

3.4 Reference Value

User interaction is detected by comparing

count values to reference values. The count

which would call for a manual reseed.

A

reseed takes the latest measured counts, and

seeds the reference/LTA with this value,

therefore updating the value to the latest

environment. A reseed command can be

given by setting the corresponding bit

(RESEED or ALP_RESEED).

value

of

a

sensor

represents

the

instantaneous capacitance of the sensor. The

reference value of a sensor is the count value

of the sensor that is slowly updated to track

changes in the environment, and is not

updated during user interaction.

The reference value is a two-cycle averaged

of the count value, stored during a time of no

user activity, and thus is a non-affected

reference. The trackpad reference values are

only updated from LP1 and LP2 mode when

modes are managed automatically. Thus, if

the system is controlled manually, the

reference must also be managed and updated

manually by the host.

3.5 Channel Outputs

For the trackpad channels, user interaction

typically causes the count values to increase.

The amount of deviation relative to the

reference can be used to determine the output

state of the channel, dependent on the

sensitivities configured.

For a snap actuation, the count values

decrease, and a negative deviation cause a

snap output.

3.4.1 Reference Update Time

The reference value is updated or refreshed

If the measured count value exceeds the

selected threshold value for consecutive

cycles, equal in number to the selectable

debounce parameter, the output becomes set.

according

to

a

configurable

interval

(Reference update time), in seconds.

To ensure that the reference value is not

updated during user interaction, it only

executes from the LP1 and LP2 states, where

no user interaction is assumed.

3.5.1 Proximity

This output (Prox status) is set when a

channels‟ count value deviates from the

reference value by more than the selected

threshold (Prox threshold).

Setting the Reference update time to „0‟ will

disable the updating of the reference values.

The proximity threshold is the smallest

difference between the count value and the

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reference value that would result in a proximity pattern. The design must be configured so

output. Small threshold values are thus more that a snap on the metal dome will result in a

sensitive than large threshold values.

channels‟ count value falling well below the

reference for that channel.

Note: For the trackpad channels (projected

capacitive) the samples will increase with user

interaction, thus the actual threshold is the reference

value PLUS the threshold parameter.

However, if an ALP channel is implemented in self

capacitive mode, the samples will decrease during

user interaction, thus the actual threshold is the

reference value MINUS the threshold parameter.

If required, the function must be enabled

(Snap enabled channels) for each channel on

which snap is designed. Only channels with

snap must be marked as such, since channels

are handled differently if they are snap

channels, compared to non-snap channels.

3.5.2 Touch

One global snap threshold (Snap threshold) is

implemented as a delta value BELOW the

reference. When a snap is performed, a

sensor saturation effect causes the deviation

to be negative.

This output (Touch status) is set when a

channels‟ count value increases by more than

the selected threshold.

The touch threshold for a specific channel is

calculated as follows:

Because it is only necessary to read the

individual snap registers if a state change has

occurred, a status bit (SNAP_TOGGLE) is

added to indicate this. This is only set when

there is a change of status of any snap

channel.

Threshold = Reference x (1 + Multiplier / 128)

A smaller fraction will thus be a more sensitive

threshold.

A trackpad will have optimal XY data if all of

the channels in the trackpad exhibit similar

deltas under similar user inputs. In such a

case all of the channels will have identical

thresholds. In practise, sensor design and

hardware restrictions could cause deltas

which are not constant over the entire

trackpad. It could then be required to select

individual multiplier values. These (Individual

touch multiplier adjustment) are signed 8-bit

values and indicate how much the unsigned 8-

bit global value (Global touch multiplier) must

be adjusted. The threshold used for a specific

channel (set and clear) is as follows:

A reseed is executed if a snap is sensed for

longer than the Snap timeout time (in

seconds). A setting of 0 will never reseed.

The timeout is reset if any snap is set or

cleared.

3.5.4 Output Debounce

All the channel outputs (proximity, touch and

snap) are debounced according to the

selectable debounce values (Prox debounce /

Touch snap debounce). Note that a debounce

value of 1 means that two samples satisfying

the condition must be met consecutively

before the output is activated. The default

touch debounce is set to 0 / no debouncing.

This is due to the fact that with a 15x10

sensor, debouncing adds too much delay, and

fast movements on the touch panel cannot be

debounced fast enough to provide reliable XY

output data.

Multiplier = Global + Individual adjust

A hysteresis can also be implemented

because there are different touch multiplier

parameters for setting a touch and clearing a

touch. This hysteresis allows the channels to

not flicker in and out of touch with noise.

3.5.5 Maximum Touch

3.5.3 Snap

An additional output is provided (Max Touch),

and indicates the column and row of the

channel with the largest touch deviation. This

is usually only utilised when implementing

discrete buttons, to reject any adjacent keys if

they are located in close proximity to each

When adding a metal snap-dome overlay to

the trackpad pattern, an additional snap output

(Snap status) is available. The device is able

to distinguish between a normal „touch‟ on the

overlay and an actual button „snap‟, which

depresses the metal dome onto the Rx/Tx

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other. If the Rxs and Txs are switched The ATI routine will run for the channels of the

(SWITCH_XY_AXIS), the columns are the Txs, current mode, for example, if the system is

and the rows are the Rxs. If no touches are currently sensing the alternate low-power

seen, then this will output 0xFF.

channel, the auto ATI will apply to it, similarly

the algorithm will configure the trackpad

channels if they are currently active.

3.6 Auto Tuning (ATI)

The ATI is a sophisticated technology

implemented in the new ProxSense^®devices

to allow optimal performance of the devices

for a wide range of sensing electrode

capacitances, without modification to external

components. The ATI settings allow tuning of

two parameters, ATI C Multiplier and ATI

Compensation, to adjust the sample value for

an attached sensing electrode.

The ALP channel has individual compensation

values (ALP ATI compensation) for each

enabled Rx.

The ALP ATI target value applies to each of

the individual count values configured for the

ALP channel.

Note: This routine will only execute after the

communication window is terminated, and the

I²C communication will only resume again

once the ATI routine has completed.

For detailed information regarding the on-chip

ATI technology, please refer to AZD027 and

AZD061.

3.7 Automatic Re-ATI

The main advantage of the ATI is to balance

out small variations between trackpad

hardware and IQS5xx variation, to give similar

performance across devices.

3.7.1 Description

When enabled (REATI or ALP_REATI) the ATI

algorithm will be repeated if certain conditions

are met. One of the most important features

of the Re-ATI is that it allows easy and fast

3.6.1 ATI C Multiplier

All trackpad channels can be adjusted globally recovery from an incorrect ATI, such as when

by modifying the global parameter (Global ATI performing ATI during user interaction with the

C).

sensor. This could cause the wrong ATI

Compensation to be configured, since the

user affects the capacitance of the sensor. A

Re-ATI would correct this.

Although it is recommended to keep the same

ATI C value for all trackpad channels, if

different values are required (possibly for

different trackpads), individual adjustments When a Re-ATI is performed on the IQS5xx, a

can be made. The ATI C value for each status bit will set momentarily to indicate that

channel can be adjusted using 8-bit signed this has occurred (REATI_OCCURRED

/

values (ATI C individual adjust) as follows:

ALP_REATI_OCCURRED).

3.7.2 Conditions for Re-ATI to activate

1. Reference drift

ATI C = Global + Individual Adjust

The ALP channel has its own global ATI C

parameter (ALP ATI C).

A Re-ATI is performed when the reference of

a channel drifts outside of the acceptable

range around the ATI Target.

3.6.2 ATI Compensation & Auto ATI

The ATI Compensation value for each channel

(ATI compensation) is set by means of an

automated ATI procedure. The algorithm is

executed after the AUTO_ATI bit is set. The

ATI Compensation values are chosen so that

each count value is close to the selected

target value (ATI target / ALP ATI target).

The boundaries where Re-ATI occurs for the

trackpad channels and for the ALP channels

are independently set via the drift threshold

value (Reference drift limit / ALP LTA drift

limit). The Re-ATI boundaries are calculated

from the delta value as follows:

Re-ATI Boundary = ATI target ± Drift limit

The AUTO_ATI bit clears automatically on chip

when the algorithm has completed.

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For example, assume that the ATI target is

 Count is already outside the Re-ATI range

configured to 800 and that the reference drift

value is set to 50. If Re-ATI is enabled, the

ATI algorithm will be repeated under the

following conditions:

upon completion of the ATI algorithm.

If any of these conditions are met, the

corresponding error flag will be set

(ATI_ERROR / ALP_ATI_ERROR). The flag

status is only updated again when a new ATI

algorithm is performed.

Reference > 850 or

Reference < 750

Re-ATI will not be repeated immediately if

an ATI Error occurs. A configurable time

(Re-ATI retry time) will pass where the Re-ATI

is momentarily suppressed. This is to prevent

the Re-ATI repeating indefinitely. An ATI error

should however not occur under normal

circumstances.

The ATI algorithm executes in a short time, so

goes unnoticed by the user.

2. Very large count values

The configurable Max count limit is used to

sense for unexpectedly large count values. A

Re-ATI is triggered if the max count limit is

exceeded for 15 consecutive cycles.

3.7.4 Design requirements

This limit is configured to be a value higher

than the maximum count possible through

user interaction, plus worst case noise on the

count value, plus headroom. The monitoring

of this assists in correcting for a Re-ATI which

occurred during a snap press. If this does

occur, after removing the snap, the counts are

typically very high. If this was not monitored a

stuck touch could occur.

The Re-ATI can be very useful when ATI

parameters are selected for which successful

Re-ATI operation can be expected. With the

conditions for Re-ATI mentioned above, it is

clear that when the designer sets the ATI

parameters, it is beneficial to select the ATI C

and ATI Target so that the resulting ATI

Compensation values are near the centre of

the range. This ensures that with changing

sensitivity, the ATI Compensation has the

ability to increase/decrease in value without it

easily becoming 0 or 255. In general, ATI

Compensation values between 100 and 150

are desirable as they provide ample room for

adjustment. Note that the range is dependent

on the sensitivity requirements, and on the

capacitance of the sensor.

3. Decreased count value

A considerable decrease in the count value of

a non-snap channel is abnormal, since user

interaction increases the count value.

Therefore if a decrease larger than the

configurable threshold (Minimum count Re-

ATI delta) is seen on such a channel, it is

closely monitored. If this is continuously seen

for 15 cycles, it will trigger a Re-ATI. If the

channel is a snap channel, this decrease is

allowed since snap does cause count values

to decrease.

3.8 Sensing Hardware Settings

Settings specific to the ProxSense^®Module

charge transfer characteristics can be

changed.

3.7.3 ATI Error

The charge transfer frequency (f_cc) can be

calculated as:

After the ATI algorithm is performed, a check

is done to see if there was any error with the

algorithm. An ATI error is reported if one of

the following is true for any channel after the

ATI has completed:

16.10⁶

푓

푐푐

=

[Hz]

ꢀ

7−퐶퐾_퐹푅퐸푄

(2

× (2 + 푈푃 + 푃퐴푆푆 + 퐼푁퐶_푃퐻퐴푆퐸)

where

푈푃 = 2^{(푈푃퐿퐸푁−2)}(if UPLEN > 4)

푈푃 = 푈푃퐿퐸푁 (if UPLEN ≤ 4)

 ATI Compensation <= ReATI lower

compensation limit

푃퐴푆푆 = 2^{(푃퐴푆푆퐿퐸푁 −2)}(if PASSLEN > 4)

푃퐴푆푆 = 푃퐴푆푆퐿퐸푁 (if PASSLEN ≤ 4)

 ATI Compensation >= ReATI upper

compensation limit

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Note: CK_FREQ, UPLEN and PASSLEN are the

4 Sensing Modes

numerical values of the settings.

For example, the default frequency is:

16.10⁶

The IQS5xx automatically switches between

different charging modes dependent on user

interaction and other aspects. This is to allow

for fast response, and also low power

consumption when applicable. The current

mode can be read from the device

(CHARGING_MODE).

푓 =

푐푐

= 1.77푀퐻푧

ꢀ

7−7

(2

× (2 + 4 + 3 + 0)

The other hardware parameters are not

discussed as they should only be adjusted

under guidance of Azoteq support engineers.

The modes are best illustrated by means of

the following state diagram.

Idle-Touch

Mode

Sensing:

Trackpad

Timeout

Action: reseed trackpad

No touch

Movement: reset timer

Touch or snap

Active

Mode

Idle

Mode

No Touch and no snap

Sensing:

Trackpad

Sensing:

Trackpad

These modes are always the

trackpad channels sensing. Prox,

touch and snap are processed.

e

t

a

d

p

u

e

c

n

e

r

e

f

e

R

l

a

n

o

i

LP1 and LP2:

These can be either the trackpad

(only prox processing is done) or an

alternative LP channel setup

(flexible)

s

a

c

O

LP2

LP1

Sensing:

Timeout

Trackpad or

customisable

ALP channel

Trackpad or

customisable

ALP channel

Figure 4.1 System Mode State Diagram

rate, and the other modes are configured

according to the power budget of the design,

and the expected response time.

4.1 Report Rate

The report rate for each mode can be adjusted

as required by the design. A faster report rate

will have a higher current consumption, but

will give faster response to user interaction.

Active mode typically has the fastest report

The report rate is configured by selecting the

cycle time (in milliseconds) for each mode:

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reference values by reseeding (RESEED) or

manually writing to the reference registers

(Reference values).



Report rate Active mode

Report rate Idle touch mode

Report rate Idle mode

Report rate LP1 mode

Report rate LP2 mode

5 Trackpad

5.1 Configuration

4.1.1 Previous Cycle Time

5.1.1 Size Selection

The achieved report rate can be read The total number of Rx and Tx channels used

(Previous cycle time) from the device each

for trackpad purposes must be configured

cycle; this is the previous cycles‟ length in (Total Rx / Total Tx). This gives a rectangular

milliseconds.

If the desired rate is not

area of channels, formed by rows and

columns of Rx and Tx sensors.

achievable, that is, if processing and sensing

takes longer than the specified time, a status

flag (RR_MISSED) indicates that the rate could

not be achieved.

5.1.2 Individual Channel Disabling

If the sensor is not a completed rectangle (this

could be due to board cut-outs or trackpad

shape), channels not implemented but falling

within the Total Rx / Total Tx rectangle, must

be individually disabled (Active channels).

4.2 Mode Timeout

The timeout values can be configured, and

once these times have elapsed, the system

will change to the next state according to the

state diagram.

5.1.3 Rx / Tx Mapping

The Rxs and Txs of the trackpad can be

assigned to the trackpad in any order to

simplify PCB layout and design. Rxs and Txs

can however not be interchanged (for example

you cannot use both Rxs and Txs for the

columns of the trackpad).

These times are adjusted by selecting a

desired value (in seconds), for the specific

timeout:



Timeout - Active mode

Timeout - Idle touch mode

Timeout - Idle mode

For both the mapping registers (Rx mapping /

Tx mapping) the first byte relates to the

mapping of the first row/column, the next byte

in the memory map is the next row/column,

and so on.

Timeout - LP1 mode

Note: the timeout for LP1 is set in multiples of

20s (thus a setting of ‘30’ translates to 600s,

or 10min).

Example: If a 5x5 trackpad was to be

designed with Rx/Tx mapping to columns and

rows as shown in Table 5.1, the Rx and Tx

mapping registers would need to be set as

follows:

A timeout value of 255 will result in a „never‟

timeout condition.

4.3 Manual Control

Rx Mapping = {3, 0, 8, 1, 2}

The default method allows the IQS5xx to

automatically switch between modes and

update reference values as shown in Figure

4.1. This requires no interaction from the

master to manage the IQS5xx.

Tx Mapping = {0, 1, 13, 12, 11}

Each value shown here is a byte in the

memory map. The rest of the mapping bytes

are „don‟t care‟ since they are not used.

The master can manage various states and

implement custom power modes when Manual

Control is enabled (MANUAL_CONTROL). The

master needs to control the mode

(MODE_SELECT), and also manage the

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Table 5.1

Mapping Example

5.2.3 Absolute XY

For all the multi-touch inputs, the absolute

finger position (Absolute X/Y), in the selected

resolution (Resolution X/Y) of the trackpad, is

available.

Column number

(mapped Rx)

Row

number

(mapped Tx)

0

1

2

3

4

(Rx3) (Rx0) (Rx8) (Rx1) (Rx2)

5.2.4 Touch Strength

This value (Touch strength) indicates the

strength of the touch by giving a sum of all the

deltas associated with the finger, and

therefore varies according to the sensitivity

setup of the sensors.

0 (Tx0)

1 (Tx1)

5x5

Trackpad

2 (Tx13)

3 (Tx12)

4 (Tx11)

5.2.5 Area

The number of channels associated with a

finger is provided here. This area is usually

equal to or smaller than the number of touch

channels under the finger.

5.1.4 Rx / Tx Selections

On the IQS525 and IQS572, some Rxs can be

configured to take on Tx functionality. The

preferred option is to keep them as Rxs, but if

more Txs are needed in the design, they can

be configured as such in the RxToTx register.

This allows for elongated trackpads or sliders

to be implemented on the two devices. The

corresponding Rx or Tx number is then used

in the mapping registers to configure the order

of the electrodes.

5.2.6 Tracking / Identification

The fingers are tracked from one cycle to the

next, and the same finger will be located in the

same position in the memory map. The

memory location thus identifies the finger.

5.3 Max Number of Multi-touches

The maximum number of allowed multi-

touches is configurable (Max multi-touches)

up to 5 points. If more than the selected value

is sensed, a flag is set (TOO_MANY_FINGERS)

and the XY data is cleared.

5.2 Trackpad Outputs

The channel count variation (deltas) and touch

status outputs are used to calculate finger

location data.

5.4 XY Resolution

The output resolution for the X and Y

coordinates are configurable (X/Y Resolution).

The on-chip algorithms use 256 points

5.2.1 Number of Fingers

This gives an indication of the number of

active finger inputs on the trackpad (Number

of fingers).

between each row and column.

The

resolution is defined as the total X and total Y

output range across the complete trackpad.

5.2.2 Relative XY

5.5 Palm Rejection

If there is only one finger active, a Relative X

and Relative Y value is available. This is a

signed 2‟s complement 16-bit value. It is a

delta of the change in X and Y, in the scale of

the selected output resolution.

A maximum finger size/area (Palm reject

threshold) can be set up to allow for palm

rejection or similar input suppression. This

feature can be enabled or disabled

(PALM_REJECT), and when a palm reject

condition is sensed, a status flag will indicate

this result (PALM_DETECT). All XY outputs

are also suppressed during palm detection.

Palm reject is latched on for the timeout period

Note: Gestures also use these registers to

indicate swipe, scroll and zoom parameters.

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(Palm reject timeout) to prevent erratic

behaviour before and after the palm is seen.

This timeout sets in increments of 32ms.

5.9 XY Position Filtering

Stable XY position data is available from the

IQS5xx due to two on-chip filters, namely the

Moving Average (MAV) filter, and the Infinite

Impulse Response (IIR) filter. The filters are

applied to the raw positional data in the

aforementioned order. It is recommended to

keep both of the filters enabled for optimal XY

data.

5.6 Stationary Touch

A stationary touch is defined as a point that

does not move outside of a certain boundary

within a specific time.

This movement

boundary or threshold can be configured

(Stationary touch movement threshold), and is

defined as a movement in either X or Y in the

configured resolution.

5.9.1 MAV Filter

If enabled (MAV_FILTER), raw XY points from

the last two cycles are averaged to give the

filter output.

The device will switch to Idle-Touch mode

when a stationary point is detected, where a

lower duty cycle can be implemented to save

power in applications where long touches are

expected.

5.9.2 IIR Filter

The IIR filter, if enabled (IIR_FILTER), can be

configured to select between a dynamic and a

static filter (IIR_SELECT).

If movement is detected, a status flag

(TP_MOVEMENT) is set.

The damping factor is calculated from the

selected Beta as follows:

5.7 Multi-touch Finger Split

The position algorithm looks at areas

(polygons) of touches, and calculates

positional data from this. Two fingers in close

proximity to each other could have areas

touching, which would merge them incorrectly

into a single point. A finger split algorithm is

implemented to separate these merged

polygons into multiple fingers. There is a

finger split aggression factor which can be

adjusted to determine how aggressive this

finger splitting must be implemented. A value

of „0‟ will not split polygons, and thus merge

any fingers with touch channels adjacent

(diagonally also) to each other.

Damping factor = Beta / 256

5.9.2.1 Dynamic Filter

Relative to the speed of movement of a co-

ordinate, the filter dynamically adjusts the

amount of filtering (damping factor) performed.

When fast movement is detected, and quick

response is required, less filtering is done.

Similarly when a co-ordinate is stationary or

moving at a slower speed, more filtering can

be applied.

The damping factor is adjusted depending on

the speed of movement. Three of these

parameters are adjustable to fine-tune the

dynamic filter if required (XY dynamic bottom

beta / XY dynamic lower speed / XY dynamic

upper speed).

5.8 XY Output Flip & Switch

By default, X positions are calculated from the

first column (usually Rx0) to the last column.

Y positions are by default calculated from the

first row (usually Tx0) to the last row. The X

and/or Y output can be flipped (FLIP_X /

FLIP_Y), to allow the [0, 0] co-ordinate to be

defined as desired. The X and Y axes can

also be switched (SWITCH_XY_AXIS) allowing

X to be the Txs, and Y to be along the Rxs.

The speed is defined as the distance (in the

selected resolution) travelled in one cycle

(pixels/cycle).

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All gestures are calculated relative to their

starting coordinates, i.e., the first coordinate at

which the touch was detected. Furthermore, if

at any time during a gesture, more than the

required number of touches is detected, the

gesture will be invalidated.

No filtering

Filter damping

factor (beta)

Lower Beta

(more filtering)

6.1 Single Tap

The single tap gesture requires that a touch is

made and released in the same location and

within a short period of time. Some small

amount of movement from the initial

coordinate must be allowed to compensate for

shift in the finger coordinate during the

release. This bound is defined in register Tap

distance, which specifies the maximum

deviation in pixels the touch is allowed to

move before a single tap gesture is no longer

valid.

Top Speed

Bottom Speed

Speed of

movement

Figure 5.1 Dynamic Filter Parameters

5.9.2.2 Static Filter

Co-ordinates filtered with

a

fixed but

configurable damping factor (XY static beta)

are obtained when using the static filter. It is

recommended that the dynamic filter is used

due to the advantages of a dynamically

changing damping value.

Similarly, the Tap time register defines the

maximum duration in ms that will result in a

valid gesture. That is, the touch should be

released before the time period in Tap time is

reached.

6 Gestures

The IQS5xx has an on-chip gesture

recognition feature. The list of recognisable

gestures includes:

A valid single tap gesture will be reported

(SINGLE_TAP) in the same processing cycle

as the touch release was detected, and will be

cleared on the next cycle. No movement will

be reported in the relative XY registers

(Relative X and Relative Y) during this

gesture.

 1 finger gestures (GESTURE_EVENTS_0):

o A single tap

o A press and hold

o Swipe X+

Since the gesture reports after the finger is

removed, the location of the tap gesture is

placed in the Absolute X/Y registers of finger 1

at this time. With Number of fingers set to 0,

this will not look like an active finger, and is

just a repetition of the location of the tap that

has occurred for the main controller to utilise.

o Swipe X-

o Swipe Y+

o Swipe Y-

 2 finger gestures (GESTURE_EVENTS_1):

o 2 simultaneous taps

o Scroll

6.2 Press and Hold

The same register that defines the bounds for

the single tap gesture (Tap distance) is used

for the press and hold gesture. If the touch

deviates more than the specified distance, the

gesture is no longer valid.

o Zoom

Each single finger gesture can individually be

enabled and disabled by setting or clearing

the corresponding bits in the register

SINGLE_FINGER_GESTURES. The multi finger

gestures can be enabled and disabled via the

register MULTI_FINGER_GESTURES.

However, if the touch remains within the given

bound for longer that the period in ms, defined

as the sum of the register values in Tap time

and Hold time, a press and hold gesture will

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be reported (PRESS_AND_HOLD).

The [pixels] and Swipe consecutive time [ms].

gesture will continue to be reported until the Once the initial swipe gesture conditions are

touch is released or if a second touch is met as defined above, the parameters of

registered.

Swipe initial distance [pixels] and Swipe initial

time [ms] will be replaced with these. Also,

the gesture engine will reset its properties,

thus evaluating the current touch‟s movement

as if its initial coordinate was at the point at

which the previous swipe gesture was

recognised and as if it first occurred at that

point in time.

No data will be reported in Relative X and

Relative Y before the defined maximum hold

period is reached, however, the relative data

will be reported thereafter. This allows for

features such as drag-n-drop.

6.3 Swipe (X-, X+, Y-, Y+)

The consecutive events allow for the

continuous stream of swipe events for a single

action by the user. However, once the initial

conditions are satisfied, the direction of the

swipe gesture is fixed. For example, if a

swipe X+ gesture is recognised by the engine,

the consecutive swipe gestures will also be of

type X+. And the 3^rdcondition will only be

evaluated against the X axis.

All four swipe gestures work in the same

manner, and are only differentiated in their

direction. The direction is defined with respect

to the origin (0, 0) of the trackpad, typically at

Rx0, Tx0 (Channel 0). If the touch is moving

away from the origin, it is considered a

positive swipe (+) and if it is moving towards

the origin, it is a negative swipe (-). Whether

the swipe is of the type X or Y is defined by

which axis the touch is moving approximately

parallel to.

In the case that only a single event is desired,

the settings in Swipe consecutive distance can

be set to its maximum value and Swipe

consecutive time set to zero. This would

make it impossible to meet these conditions

on a standard trackpad.

A swipe gesture event is only reported when a

moving touch meets all three of the following

conditions:

1. A minimum distance is travelled from its

initial coordinates, as defined in pixels by

the value in register Swipe initial distance.

6.4 2 Finger Tap

The simultaneous tap gesture simply requires

two tap gestures to occur simultaneously. For

this reason the gesture uses the same

parameters (Tap distance and Tap time) as

that of the tap gesture. It is also confined to

the same conditions for the output to be

reported (2_FINGER_TAP).

2. The distance in (1) is covered within the

time specified in Swipe initial time (in ms).

3. The angle of the swipe gesture, as

determined by its starting coordinate and

the coordinate at which conditions (1) and

(2) were first met, does not exceed the

threshold in Swipe angle with regards to at

least 1 of the axes. The value in register

Swipe angle is calculated as 64 tan 휃,

where 휃 is the desired angle (in degrees).

6.5 Scroll

A

scroll gesture is identified by two

simultaneous and parallel moving touches. A

scroll gesture will be reported (SCROLL) once

the average distance travelled by the two

touches in pixels exceeds the value stored in

register Scroll initial distance. Thereafter, a

scroll gesture will continuously be reported

until one of the touches is released or if a

zoom gesture is validated.

The respective swipe gesture will be reported

for 1 cycle (SWIPE_X-, X+, Y- Y+) when all of

these conditions are met.

The relative

distance travelled will be reported in registers

Relative X and Relative Y throughout.

It is also possible to generate consecutive

swipe gesture events during the same swipe

gesture by defining the swipe gesture settings

in registers Swipe consecutive distance

Similar to the swipe gestures, the scroll

gestures are also bounded by a given angle to

the axis (Scroll angle). The value in this

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can be made and validated. However, for the

register is calculated as 64 tan 휃, where 휃 is

the desired angle (in degrees). This condition

is only enforced during the initial validation

stage of the scroll gesture.

scroll and zoom gestures, it is possible to

alternate between the gestures and their

directions without releasing any touches.

A

switch between multi-touch gestures

The direction of the scroll gesture is defined

by the reported relative X (horizontal scroll)

and Y (vertical scroll) data. For instance, a

positive relative X value will correspond with

includes

 Alternating between scroll axes

the direction of a swipe X+ gesture. Unlike  Alternating between zoom in and out

the swipe gestures, a scroll gesture may

 Going from a scroll to a zoom gesture

alternate between a positive and negative

direction without requiring the validation of the

initial conditions. However, switching between

the axes will require the validation.

 Going from a zoom to a scroll gesture

 Releasing any one of the two touches

 Having more than 2 touches on the

At any given stage during a scroll gesture,

only the axis applicable to the gesture will

have a non-zero value in its relative data

register. For example, a scroll parallel to the

X-axis will have a non-zero Relative X value

and a zero Relative Y value. This value

relates to the movement of the scroll gesture.

trackpad at any given moment.

A release of 1 of the touches will require a

new touch be generated before any multi-

touch gesture can be validated. The multi-

touch gestures require 2, and only 2, touches

at all time during the gesture.

6.6 Zoom

7 Additional Features

Zoom gestures require two touches moving

toward (zoom out) or away (zoom in) from 7.1 Non-volatile Defaults

each other. Similar to the scroll and swipe

The designer can use the supplied GUI to

gestures, the zoom requires that an initial

distance threshold in the register Zoom initial

distance [pixels] is exceeded before a zoom

gesture is reported (ZOOM). Thereafter, the

register Zoom Consecutive Distance defines

the distance threshold for each zoom event

that follows the initial event. The direction/axis

along which the two touches move is not

relevant.

easily configure the optimal settings for

different setups. The design specific firmware

is then exported by the GUI, and programmed

onto the IQS5xx. These parameters are used

as the default values after start-up, without

requiring any setup from the master.

Two registers (Export file version number) are

available so that the designer can label and

identify the exported HEX file with the

Switching from a zoom in to a zoom out

gesture, or vice versa, requires that the initial

conditions be met in the opposite direction

corresponding settings.

This allows the

master to verify if the device firmware has the

intended configuration as required.

before the switch can occur.

Alternating

between a zoom and a scroll gesture requires

the same.

7.2 Automated Start-up

The IQS5xx is programmed with the trackpad

application firmware, bundled with settings

specifically configured for the current

hardware as described in Section 7.1. After

power-up the IQS5xx will automatically use

the settings and configure the device

accordingly.

The size of each zoom event will be reported

in Relative X, where the negative sign

indicates a zoom out gesture and a positive

sign a zoom in gesture.

6.7 Switching Between Gestures

For all single finger gestures it is necessary to

release all touches before any new gesture

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7.3 Suspend

7.5 Watchdog Timer (WDT)

The IQS5xx can be placed into a suspended A watchdog timer is implemented to prevent

state (SUSPEND). No processing is any stuck conditions which could occur from

performed, minimal power is consumed ESD events or similar scenarios. The

watchdog timeout is set to about 500ms. The

(<1uA), and the device retains existing data.

watchdog can be disabled (WDT), however,

this needs to be programmed into the non-

volatile defaults, since this only takes effect

after a reset.

An automatic reseed of the trackpad is

triggered after the IQS5xx is woken from

suspend, since it cannot be guaranteed that

the reference values are still relevant.

7.3.1 I²C Wake

7.6 RF Immunity

The IQS5xx has immunity to high power RF

noise. To improve the RF immunity, extra

decoupling capacitors are suggested on V_REG

The device can be woken from suspend by

addressing it on the I²C bus. It will respond

with a not-acknowledge (NACK) on the first

addressing attempt and with an acknowledge

(ACK) on the second addressing attempt,

providing that there was at least a time

difference of ~150us between the two

addressing attempts. The suspend bit must

then be disabled in that communication

session to resume operations.

and V_DDHI

.

Place a 100pF in parallel with the 1uF ceramic

on V_REG. Place a 1uF ceramic on V_DDHI. All

decoupling capacitors should be placed as

close as possible to the V_DDHIand V_REGpads.

PCB ground planes also improve noise

immunity.

7.3.2 Switch Input Pin Wake

7.7 Additional Non-Trackpad

Channels

The SW_IN input pin can be used to wake the

device from suspend (when enabled). The

input can be connected to an alternate long-

range proximity sensing IC (such as IQS211),

or a mechanical switch/button for example.

For more details on the input see Section

7.11.

Unused projected capacitance channels can

be used to design additional buttons or sliders.

Note that the channels will still provide XY

data output, which can be ignored (or utilised)

by the master.

7.4 Reset

7.8 Bootloader

7.4.1 Reset Indication

A bootloader is included to allow easy

application firmware upgrading via the I²C

bus, without the need to access the PGM and

NRST pins for reprogramming.

After a reset, the SHOW_RESET bit will be set

by the system to indicate the reset event

occurred. This bit will clear when the master

sets the ACK_RESET, if it becomes set again,

the master will know a reset has occurred, and

can react appropriately.

For more information, refer to the

documentation “IQS5xx I2C Bootloader v2.x

Technical User Guide.pdf”.

7.8.1 Bootloader Status

7.4.2 Software Reset

The IQS5xx can be reset by means of an I²C

command (RESET).

The bootloader status register can be used to

confirm the availability/presence of the

bootloader (Bootloader status).

7.4.3 Hardware Reset

The NRST pin (active low) can be used to

reset the IQS5xx. For more details see

Section 10.2.6.

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A change in the state of the SW_IN can also

Table 7.1

Register value

0xA5

Bootloader Status

Status

trigger an event, see Section 8.8.1. This input

can be used as an additional switch or

proximity sensor, and has the ability to wake

the IQS5xx from the extreme (<1uA) low

power suspend state.

Bootloader is available

No bootloader

0xEE

8 I²C

*Note the bootloader is available on the standard

IQS5xx-B000 firmware; this could possibly be

unavailable on custom firmware versions.

The IQS5xx communicates via the standard

I²C communication protocol.

7.9 Version Information

Clock stretching can occur, thus monitoring

the availability of the SCL is required, as per

standard I²C protocol.

7.9.1 Product Number

The different IQS5xx devices can be identified

by their relevant product numbers.

8.1 Data Ready (RDY)

Table 7.2

Product Number

Device

An additional RDY I/O indicates (active HIGH)

when the communication window is available

with new data for optimal response. Polling

can however be used, but is not

recommended. RDY should be connected to

an interrupt-on-change input for easier

implementation and optimal response time.

Product Number

(decimal)

40

IQS550

IQS572

IQS525

58

8.2 Slave Address

52

The default 7-bit device address is „1110100‟.

The device address can be modified during

programming. The full address byte will thus

be 0xE9 (read) or 0xE8 (write).

7.9.2 Project Number

The project number for the generic B000

project is 15 (decimal) for all devices.

8.3 16-bit Addressing

The I²C employs a 16-bit address to access all

individual registers in the memory map.

8.4 I²C Read

7.9.3 Major and Minor Versions

These will vary as the B000 is updated, this

datasheet relates to the version as indicated

at the bottom of the Overview Section 1.

7.10Unique ID

The master can read from the device at the

current address if the address is already set

up, or when reading from the default address.

A 12-byte unique ID can be read from memory

map address 0xF000 – 0xF00B. This number

gives each individual IC a unique identifier.

Current Address Read

Control Byte

Start

S

Data n

Data n+1

Stop

S

7.11Switch Input

ACK

NACK

The SW_IN (switch input) pin, when enabled

(SW_INPUT), will display the state of the input

pin to the master controller (SWITCH_STATE).

This state is updated before each I²C session.

Figure 8.1 Current Address Read

The master can perform a random read by

specifying the address.

A WRITE is

performed to set up the address, and a

repeated start is used to initiate the READ

section.

The input can be configured as active LOW or

active HIGH (SW_INPUT_SELECT). For active

LOW, an internal pull-up resistor (typical value

of 40kΩ) is connected to the SW_IN pin.

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Address [7..0]

Address [15..8]

ADR - high

Control Byte

Start

S

the communication window, RDY will go low

and the IQS5xx will continue with a new

sensing and processing cycle.

Adr + WRITE ACK

ACK

ADR - low

^ACK. . .

Control Byte

Start

S

Data n

Stop

P

Adr + READ ACK

NACK

. . .

8.8 Event Mode Communication

The device can be set up to bypass the

communication window when no activity is

Figure 8.2 Random Read

sensed (EVENT_MODE).

This is usually

8.4.1 Default Read Address

enabled since the master does not want to be

interrupted unnecessarily during every cycle if

no activity occurred. The communication will

resume (RDY will indicate available data) if an

enabled event occurs. It is recommended that

the RDY be placed on an interrupt-on-pin-

change input on the master.

When a new communication window begins,

the configurable default read address is used

if a current address read is performed (no

address is specified). If an application will

always read from a specific register, the

IQS5xx can be configured to point to the

required register, negating the need to specify

the address at each new communication

window, allowing for faster data reading.

8.8.1 Events

Numerous events can be individually enabled

to trigger communication, they are:

8.5 I²C Write

 Trackpad events (TP_EVENT): event

triggered if there is a change in X/Y value,

or if a finger is added or removed from the

trackpad

The master uses a Data Write to write settings

to the device. A 16-bit data address is always

required, followed by the relevant data bytes

to write to the device.

 Proximity events (PROX_EVENT): event

only triggers if a channel has a change in a

proximity state

Start Control Byte

Address [15..8]

Address [7..0]

Data n

Data n+1

Stop

S

Adr + WRITE ACK

ADR - high

ACK

ADR - low

ACK

P

 Touch events (TOUCH_EVENT): event only

triggers if a channel has a change in a

touch state

Figure 8.3 Data Write

8.6 I²C Timeout

 Snap (SNAP_EVENT): event only triggers if

If the communication window is not serviced

within the I²C timeout period (in milliseconds),

the session is ended (RDY goes LOW), and

processing continues as normal. This allows

the system to continue and keep reference

values up to date even if the master is not

responsive.

a channel has a change in a snap state

 Re-ATI (REATI_EVENT): one cycle is given

to

indicate

the

Re-ATI

occurred

(REATI_OCCURRED).

 Proximity on ALP (ALP_PROX_EVENT):

event given on state change

8.7 End of Communication

Session / Window

 Switch input (SW_INPUT_EVENT): event

triggers if there is a change in the input pin

state.

Unlike the previous A000 implementation, an

I²C

STOP

will

not

terminate

the

The proximity/touch/snap events are therefore

mostly aimed at channels that are used for

traditional buttons, where you want to know

only when a status is changed.

communication window. When all required

I²C transactions have been completed, the

communication session must be terminated

manually. This is achieved by sending the

End Communication Window command, by

writing a single byte (any data) to the address

0xEEEE, followed by a STOP. This will end

8.8.2 Force Communication

The master can initiate communication with

the IQS5xx, even while RDY is LOW. The

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IQS5xx will clock stretch until an appropriate before retrying), and the IQS5xx will be ready

time to complete the I²C transaction. The and ACK the transaction.

master firmware will not be affected (as long

Figure 8.4 shows a forced communication

as clock stretching is correctly handled).

transaction. Communication starts with RDY

For optimal program flow, it is suggested that = LOW. The IQS5xx is in a low power state

RDY is used to sync on new data from the on the first request, and a NACK is sent. After

IQS5xx.

The forced method is only the second request the IQS5xx responds with

recommended if the master must perform I²C an ACK. The IQS5xx clock stretches until an

and Event Mode is active.

appropriate time to communicate (to prevent

interference with the capacitive

measurements). When appropriate, the clock

is released and the transaction completes as

normal. RDY is not set during a forced

communication transaction.

NOTE: If the IQS5xx is in a low-power state

when the master forces the communication,

the first addressing will respond with a NACK.

The master must repeat the addressing (wait

a minimum of 150us after the I²C STOP

Figure 8.4 Forced communication

the shading in the „R‟ (read) and/or „W‟ (write)

columns.

8.9 Memory Map Registers

The registers available in the memory map,

via I²C, are provided in this section. The

memory map starts with a READ-ONLY

section, followed by a READ/WRITE section.

The read/write permissions are indicated by

Certain registers in the memory map have

defaults loaded from non-volatile memory,

which can be configured during programming;

these are highlighted also in the „E²‟ column.

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Table 8.1

Bit5 Bit4

Direct-Addressable Memory Map

E²

Address

Bit7

Bit6

Bit3

Bit2

Bit1

Bit0

Details

(See 7.9)

(See 7.8.1)

R W

0x0000 -

0x0001

Product number (2 bytes)

Project number (2 bytes)

0x0002 -

0x0003

0x0004

0x0005

0x0006

Major version

Minor version

Bootloader status

0x0007 -

0x000A

Open (4 bytes)

0x000B

0x000C

Max touch column

Previous cycle time [ms]

Max touch row

PRESS

(See 3.5.5)

(See 4.1.1)

SWIPE SWIPE SWIPE SWIPE

SINGLE

_TAP

Gesture

Events 0

0x000D

0x000E

_AND_

HOLD

-

_Y-

_Y+

_X+

_X-

2_

FINGER_

TAP

Gesture

Events 1

SCROLL

-

ZOOM

ALP_

ATI_

ERROR

REATI_

OCCUR

RED

System Info

0

SHOW_ REATI_

RESET OCCUR

RED

ATI_

ERROR

0x000F

CHARGING_MODE

TP_

MOVE-

MENT

TOO_

MANY_

FINGERS

System Info

1

SWITCH

_STATE

SNAP_

TOGGLE

RR_

MISSED

PALM_

DETECT

0x0010

0x0011

-

Number of fingers

(See 5.2.1)

0x0012 -

0x0013

Relative X [pixels] (2 bytes)

Relative Y [pixels] (2 bytes)

(See 5.2.2)

0x0014 -

0x0015

0x0016 -

0x0017

Absolute X position [pixels] (2 bytes)

Absolute Y position [pixels] (2 bytes)

Touch strength (2 bytes)

(See 5.2.3)

(See 5.2.4)

0x0018 -

0x0019

0x001A -

0x001B

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IQ Switch^®

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E²

Address

Bit7

Bit6

Bit5

Bit4

Bit3

Bit2

Bit1

Bit0

Details

R W

0x001C

Touch area / size

Repeat:

(See 5.2.5)

0x001D

:

Absolute X

Absolute Y

Touch strength

Touch area / size

0x0038

For fingers 2 - 5

0x0039 -

0x0058

Prox status (32 bytes)

0x0059 -

0x0076

Touch status (30 bytes)

Snap status (30 bytes)

Count values (300 bytes)

Delta values (300 bytes)

(See 8.10.5)

0x0077 -

0x0094

0x0095 -

0x01C0

(See 8.10.6)

(See 3.3.2)

0x01C1 -

0x02EC

0x02ED -

0x02EE

ALP count value (2 bytes)

ALP individual count values (20 bytes)

Reference values (300 bytes)

ALP LTA (2 bytes)

0x02EF -

0x0302

0x0303 -

0x042E

(See 8.10.6)

(See 3.4.2)

0x042F -

0x0430

ACK_

RESET

AUTO_

ATI

System

Control 0

ALP_

RESEED

0x0431

0x0432

-

MODE_SELECT

System

Control 1

SUSPEND

-

RESET

0x0433 -

0x0434

Open (2 bytes)

0x0435 -

0x043E

ALP ATI compensation (10 bytes)

ATI compensation (150 bytes)

(See 3.6.2)

0x043F -

0x04D4

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IQ Switch^®

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E²

Address

Bit7

Bit6

Bit5

Bit4

Bit3

Bit2

Bit1

Bit0

Details

R W

0x04D5 -

0x56A

ATI C individual adjust (150)

(See 3.6.1)

0x056B

0x056C

-

Global ATI C

ALP ATI C

0x056D -

0x056E

ATI target (2 bytes)

(See 3.6.2)

0x056F -

0x0570

ALP ATI target (2 bytes)

0x0571

0x0572

0x0573

0x0574

Reference drift limit

ALP LTA drift limit

(See 3.7.2)

(See 3.7.3)

Re-ATI lower compensation limit

Re-ATI upper compensation limit

(See 3.3.3

and 3.7.2)

0x0575 -

0x0576

Max count limit (2 bytes)

Re-ATI retry time [s]

Open (2 bytes)

0x0577

(See 3.7.3)

0x0578 -

0x0579

0x057A -

0x057B

Report rate [ms] – Active mode (2 bytes)

Report rate [ms] – Idle touch mode (2 bytes)

Report rate [ms] – Idle mode (2 bytes)

Report rate [ms] – LP1 mode (2 bytes)

Report rate [ms] – LP2 mode (2 bytes)

0x057C -

0x057D

0x057E -

0x057F

(See 4.1)

0x0580 -

0x0581

0x0582 -

0x0583

0x0584

0x0585

0x0586

0x0587

Timeout [s] – Active mode

Timeout [s] – Idle touch mode

Timeout [s] – Idle mode

(See 4.2)

Timeout [x 20s] – LP1 mode

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IQ Switch^®

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E²

Address

0x0588

0x0589

0x058A

Bit7

Bit6

Bit5

Bit4

Bit3

Bit2

Bit1

Bit0

Details

(See 3.4.1)

(See 3.5.3)

(See 8.6)

R W

Reference update time [s]

Snap timeout [s]

I²C timeout [ms]

0x058B -

0x058D

Open (3 bytes)

SW_

INPUT_

EVENT

SW_

INPUT_

SELECT

ALP_

REATI

SW_

INPUT

System

Config 0

MANUAL_

CONTROL

SETUP_

COMPLETE

0x058E

0x058F

WDT

REATI

ALP_

PROX_

EVENT

SNAP_

EVENT

TP_

EVENT

System

Config 1

PROX_

EVENT

REATI_

EVENT

TOUCH_

EVENT

EVENT_

MODE

GESTURE

_EVENT

0x0590 –

0x0591

Open (2 bytes)

0x0592 -

0x0593

Snap threshold (2 bytes)

(See 3.5.3)

(See 3.5.1)

0x0594

0x0595

0x0596

0x0597

Prox threshold - trackpad

Prox threshold - ALP channel

Global touch multiplier - set

Global touch multiplier - clear

(See 3.5.2)

(See 3.7.2)

0x0598 -

0x062D

Individual touch multiplier adjustments (150 bytes)

Minimum count Re-ATI delta

0x062E

0x062F -

0x0631

Open (3 bytes)

ALP_

COUNT

_FILTER

Filter

Settings 0

IIR_

SELECT

MAV_

FILTER

IIR_

FILTER

0x0632

-

0x0633

0x0634

0x0635

0x0636

0x0637

XY static beta

ALP count beta

ALP1 LTA beta

ALP2 LTA beta

(See 5.9.2.2)

(See 3.3.2)

(See 3.4.2)

XY dynamic filter – bottom beta

(See 5.9.2.1)

IQS5xx-B000 Trackpad Datasheet

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IQ Switch^®

ProxSense^®Series

E²

Address

Bit7

Bit6

Bit5

Bit4

Bit3

Bit2

Bit1

Bit0

Details

R W

0x0638

XY dynamic filter– lower speed

0x0639 –

0x063A

XY dynamic filter– upper speed (2 bytes)

0x063B –

0x063C

Open (2 bytes)

0x063D

0x063E

Total Rx

Total Tx

(See 5.1.1)

(See 5.1.3)

0x063F -

0x0648

Rx mapping (10 bytes)

0x0649 -

0x0657

Tx mapping (15 bytes)

ALP Channel

Setup 0

RX_

GROUP

CHARGE

_TYPE

PROX_

REVERSE

0x0658

0x0659

0x065A

0x065B

0x065C

ALP

-

ALP_

RX9

ALP_

RX8

-

ALP Rx

Select

ALP_

RX7

ALP_

RX6

ALP_

RX5

ALP_

RX4

ALP_

RX3

ALP_

RX2

ALP_

RX1

ALP_

RX0

ALP_

TX14

ALP_

TX13

ALP_

TX12

ALP_

TX11

ALP_

TX10

ALP_

TX9

ALP_

TX8

-

ALP Tx

Select

ALP_

TX7

ALP_

TX6

ALP_

TX5

ALP_

TX4

ALP_

TX3

ALP_

TX2

ALP_

TX1

ALP_

TX0

Rx7/Tx2

Rx7/Tx9

Rx6/Tx3

Rx6/Tx10

Rx5/Tx4

Rx5/Tx11

Rx4/Tx5

Rx4/Tx12

Rx3/Tx6

Rx3/Tx13

Rx2/Tx7

Rx2/Tx14

Rx1/Tx8

-

Rx0/Tx9

-

0x065D

RxToTx

0x065E

0x065F

Open

Hardware

Settings A

RX_

FLOAT

-

ND

-

0

ANA_

DEAD_

TIME

INCR_

PHASE

Hardware

Settings B1

0x0660

CK_FREQ

-

Hardware

Settings B2

(ALP)

ANA_

DEAD_

TIME

INCR_

PHASE

0x0661

0x0662

-

CK_FREQ

-

Hardware

Settings C1

STAB_ TIME

OPAMP_BIAS

VTRIP

IQS5xx-B000 Trackpad Datasheet

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IQ Switch^®

ProxSense^®Series

E²

Address

Bit7

Bit6

Bit5

Bit4

Bit3

Bit2

Bit1

Bit0

Details

R W

Hardware

Settings C2

(ALP)

0x0663

STAB_ TIME

OPAMP_BIAS

UPLEN

VTRIP

Hardware

Settings D1

0x0664

0x0665

-

PASSLEN

Hardware

Settings D2

(ALP)

UPLEN

0x0666 -

0x0668

Open (3 bytes)

SWITCH

_XY_

AXIS

PALM_

REJECT

0x0669

-

FLIP_Y FLIP_X XY Config 0

0x066A

0x066B

0x066C

0x066D

Max multi-touches

(See 5.3)

(See 5.7)

Finger split aggression factor

Palm reject threshold

(See 5.5)

(See 5.4)

Palm reject timeout [x 32ms]

0x066E -

0x066F

X Resolution [pixels] (2 bytes)

Y Resolution [pixels] (2 bytes)

0x0670 -

0x00671

0x0672

Stationary touch movement threshold [pixels]

Open (2 bytes)

(See 5.6)

0x0673 -

0x0674

0x0675 -

0x0676

Default read address (2 bytes)

(See 8.4.1)

(See 7.1)

0x0677 -

0x0678

Export file version number (2 bytes)

Prox

debounce

0x0679

0x067A

PROX_DB_SET

PROX_DB_CLEAR

SNAP_DB_

SET

TOUCH_DB_

SET

SNAP_DB_

CLEAR

TOUCH_DB_

CLEAR

Touch snap

debounce

0x067B -

0x0698

Active channels (30 bytes)

(See 8.10.5)

IQS5xx-B000 Trackpad Datasheet

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November 2016

IQ Switch^®

ProxSense^®Series

E²

Address

Bit7

Bit6

Bit5

Bit4

Bit3

Bit2

Bit1

Bit0

Details

R W

0x0699 -

0x06B6

Snap enabled channels (30 bytes)

TAP_

AND_

HOLD

SWIPE SWIPE SWIPE SWIPE

SINGLE Single Finger

0x06B7

0x06B8

-

_TAP

_Y-

-

_Y+

-

_X+

-

_Y-

Gestures

2_

FINGER_

TAP

Multi Finger

Gestures

SCROLL

ZOOM

0x06B9 -

0x06BA

Tap time [ms] (2 bytes)

(see 6.1 and

6.4)

0x06BB -

0x06BC

Tap distance [pixels] (2 bytes)

Hold time [ms] (2 bytes)

0x06BD -

0x06BE

(see 6.2)

0x06BF -

0x06C0

Swipe initial time [ms] (2 bytes)

Swipe initial distance [pixels] (2 bytes)

Swipe consecutive time [ms] (2 bytes)

0x06C1 -

0x06C2

0x06C3 -

0x06C4

(see 6.3)

0x06C5 -

0x06C6

Swipe consecutive distance [pixels] (2 bytes)

Swipe angle [64tan(deg)]

0x06C7

0x06C8 -

0x06C9

Scroll initial distance [pixels] (2 bytes)

Scroll angle [64tan(deg)]

(see 6.5)

(see 6.6)

0x06CA

0x06CB -

0x06CC

Zoom initial distance [pixels] (2 bytes)

0x06CD -

0x06CE

Zoom consecutive distance [pixels] (2 bytes)

Open (1 byte)

0x06CF

8.10 Memory Map Bit / Register Definitions

The bit definitions for the registers in the memory map are explained in this section. Also

certain parameters that have a multiple number of bytes (registers) are also explained here.

IQS5xx-B000 Trackpad Datasheet

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November 2016

IQ Switch^®

ProxSense^®Series

8.10.1 Gesture Events 0

Gesture Events 0

Bit

7

-

6

-

5

4

3

2

1

0

Name

PRESS_

AND_

HOLD

SWIPE_

Y-

SWIPE_

Y+

SWIPE_

X+

SWIPE_

X-

SINGLE_

TAP

Bit 7-6:

Unused

Bit 5:

Bit 4:

Bit 3:

Bit 2:

Bit 1:

Bit 0:

SWIPE_Y-: Swipe in negative Y direction status

0 = No gesture

1 = Swipe in negative Y-direction occurred

SWIPE_Y+: Swipe in positive Y direction status

0 = No gesture

1 = Swipe in positive Y-direction occurred

SWIPE_X+: Swipe in positive X direction status

0 = No gesture

1 = Swipe in positive X-direction occurred

SWIPE_X-: Swipe in negative X direction status

0 = No gesture

1 = Swipe in negative X direction occurred

PRESS_AND_HOLD: Press and hold gesture status

0 = No gesture

1 = Press and hold occurred

SINGLE_TAP: Single tap gesture status

0 = No gesture

1 = Single tap occurred

8.10.2 Gesture Events 1

Gesture Events 1

Bit

7

-

6

-

5

-

4

-

3

-

2

1

0

Name

2_

ZOOM

SCROLL FINGER_

TAP

Bit 7-3:

Bit 2:

Unused

ZOOM: Zoom gesture status

0 = No gesture

IQS5xx-B000 Trackpad Datasheet

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IQ Switch^®

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1 = Zoom gesture occurred

Bit 1:

Bit 0:

SCROLL: Scroll status

0 = No gesture

1 = Scroll gesture occurred

2_FINGER_TAP: Two finger tap gesture status

0 = No gesture

1 = Two finger tap occurred

8.10.3 System Info 0

System Info 0

Bit

Name

7

6

5

4

3

2

1

0

ALP_

REATI_

OCCURR

ED

ALP_

ATI_

ERROR

REATI_

OCCURR

ED

SHOW_

RESET

ATI_

ERROR

CHARGING_MODE

Bit 7:

SHOW_RESET: Indicates a reset

0 = Reset indication has been cleared by host, writing to „Ack Reset‟ bit

1 = Reset has occurred, and indication has not yet been cleared by host

ALP_REATI_OCCURRED: Alternate Low Power channel Re-ATI status

0 = No Re-ATI

Bit 6:

Bit 5:

Bit 4:

Bit 3:

1 = Re-ATI has just completed on the alternate LP channel

ALP_ATI_ERROR: Alternate Low Power channel ATI error status

0 = Most recent ATI process was successful

1 = Most recent ATI process had errors

REATI_OCCURRED: Trackpad Re-ATI status

0 = No Re-ATI

1 = Re-ATI has just completed on the trackpad

ATI_ERROR: Error condition seen on latest ATI procedure

0 = Most recent ATI process was successful

1 = Most recent ATI process had errors

CHARGING_MODE: Indicates current mode

000 = Active mode

Bit 2-0:

001 = Idle-Touch mode

010 = Idle mode

011 = LP1 mode

100 = LP2 mode

IQS5xx-B000 Trackpad Datasheet

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8.10.4 System Info 1

System Info 1

Bit

Name

7

-

6

5

4

3

2

1

0

TOO_

MANY_

FINGERS

TP_

MOVE-

MENT

SWITCH

_STATE TOGGLE MISSED

SNAP_

RR_

PALM_

DETECT

-

Bit 7-6:

Unused

Bit 5:

Bit 4:

Bit 3:

Bit 2:

Bit 1:

Bit 0:

SWITCH_STATE: Status of input pin SW_IN

0 = SW_IN is LOW

1 = SW_IN is HIGH

SNAP_TOGGLE: Change in any snap channel status

0 = No change in any channels‟ snap status

1 = At least one channel has had a change in snap status

RR_MISSED: Report rate status

0 = Report rate has been achieved

1 = Report rate was not achieved

TOO_MANY_FINGERS: Total finger status

0 = Number of fingers are within the max selected value

1 = Number of fingers are more than the max selected

PALM_DETECT: Palm detect status

0 = No palm reject detected

1 = Palm reject has been detected

TP_MOVEMENT: Activity or movement on trackpad status

0 = No finger or no movement of fingers on trackpad

1 = Movement of finger(s) seen on trackpad

8.10.5 Individual Channel Status / Config Bit Definitions

For all status outputs or configuration parameters where one bit relates to one channel, the

structure is defined as shown in the tables below. Each row has a 16-bit value where the

status/config of each bit corresponds to the status/config of the corresponding column.

IQS5xx-B000 Trackpad Datasheet

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IQ Switch^®

ProxSense^®Series

Table 8.2

Status Bytes

Data

Address

X

Status/Config [Row0] – High Byte

Status/Config [Row0] – Low Byte

Status/Config [Row1] – High Byte

Status/Config [Row1] – Low Byte

:

X+1

X+2

X+3

X+28

X+29

Status/Config [Row14] – High Byte

Status/Config [Row14] – Low Byte

*Note that the proximity status bits have two extra bytes appended to the end to include the

proximity status bit of the ALP channel. Its status is located at Bit0.

Table 8.3

High byte

Status/Config Bit Definitions

Low byte

-

Col9

Col8

Col7

Col6

Col5

Col4

Col3

Col2

Col1

Col0

Bit15

Bit14

Bit13

Bit12

Bit11

Bit10

Bit9

Bit8

Bit7

Bit6

Bit5

Bit4

Bit3

Bit2

Bit1

Bit0

Row Z

*Note that if the XY axes are switched, these registers do NOT switch. This means that the

bits will always link to Rxs, and the registers will always link to Txs.

For the example above the parameter shown in the grey box in the table above is associated

with the Z^thTx and the 6^thRx.

The bit definitions for these parameters are shown in the table below.

Table 8.4

Channel Status/Config Bit Definitions

Bit = 0 Bit = 1

Parameter

Prox status

Channel does not have a proximity

Channel does not have a touch

Channel does not have a snap

Channel disabled

Channel does have a prox

Channel does have a touch

Channel does have a snap

Channel enabled

Touch status

Snap status

Active channels

Snap enabled channels

Snap feature disabled on channel

Snap feature enabled on channel

8.10.6 Count / Delta / Reference Data

For the count, delta and reference values (2 bytes per channel), the structure is defined as

shown in the table below.

IQS5xx-B000 Trackpad Datasheet

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IQ Switch^®

ProxSense^®Series

Table 8.5

Count / Delta / Reference Value Bytes

Byte

Data

Description

number

X

Count/Delta/Reference value[0][0] – High Byte

Count/Delta/Reference value[0][0] – Low Byte

Count/Delta/Reference value[0][1] – High Byte

Count/Delta/Reference value[0][1] – Low Byte

Count, delta or reference @

first Tx, and first Rx (thus top

left)

X+1

X+2

X+3

Count, delta or reference @

first Tx, and 2nd Rx

:

X+298

X+299

Count/Delta/Reference value[14][9] – High Byte

Count/Delta/Reference value[14][9] – Low Byte

Count, delta or reference @

last Tx, and last Rx (thus

bottom right)

8.10.7 System Control 0

System Control 0

Bit

7

6

-

5

4

3

2

1

0

Name

ACK_

RESET

AUTO_

ATI

ALP_

RESEED

MODE_SELECT

Bit 7:

ACK_RESET: Acknowledge a reset

0 = nothing

1 = Acknowledge the reset by clearing SHOW_RESET bit

Bit 6:

Bit 5:

unused

AUTO_ATI: Run ATI algorithm

0 = nothing

1 = Run ATI algorithm (affected channels depending on current mode)

ALP_RESEED: Reseed alternate low power channel

0 = nothing

Bit 4:

1 = reseed the LTA of the alternate LP channel

RESEED: Reseed trackpad channels

0 = nothing

Bit 3:

1 = Reseed reference values of trackpad

MODE_SELECT: Select mode (only applies in Manual Mode)

000 = Active mode

Bit 2-0:

IQS5xx-B000 Trackpad Datasheet

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IQ Switch^®

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001 = Idle-Touch mode

010 = Idle mode

011 = LP1 mode

100 = LP2 mode

8.10.8 System Control 1

System Control 1

Bit

7

-

6

-

5

-

4

-

3

-

2

-

1

0

SUSPEND

Name

RESET

Bit 7-2:

Unused

Bit 1:

RESET: Reset the IQS5xx

0 = nothing

1 = Reset the device after the communication window terminates

SUSPEND: Suspend IQS5xx

Bit 0:

0 = nothing

1 = Place IQS5xx into suspend after the communication window terminates

8.10.9 System Config 0

System Config 0

Bit

7

6

5

4

3

2

1

0

Name

SW_

INPUT_

EVENT

SW_

INPUT_

SELECT

MANUAL_

CONTROL

ALP_

REATI

SW_

INPUT

SETUP_

COMPLETE

WDT

REATI

Bit 7:

MANUAL_CONTROL: Override automatic mode switching

0 = Modes are automatically controlled by IQS5xx

1 = Manual control of modes are handled by host

SETUP_COMPLETE: Device parameters are set up

0 = IQS5xx will remain in I²C setup window (no processing yet)

1 = Setup is complete, run auto-start procedure

WDT: Watchdog timer enable/disable

Bit 6:

Bit 5:

Bit 4:

0 = Watchdog is disabled (only disables after a reset)

1 = Watchdog is enabled

SW_INPUT_EVENT: Enable switch state change triggering event

0 = Toggle of SW_IN does not trigger an event

1 = Toggle of SW_IN triggers an event

IQS5xx-B000 Trackpad Datasheet

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IQ Switch^®

ProxSense^®Series

Bit 3:

ALP_REATI: Enable/Disable automatic Re-ATI on alternate LP channel

0 = Re-ATI is disabled for alternate LP channel

1 = Re-ATI is enabled for alternate LP channel

REATI: Enable/Disable automatic Re-ATI on trackpad

0 = Re-ATI is disabled for alternate trackpad channels

1 = Re-ATI is enabled for alternate trackpad channels

SW_INPUT_SELECT: Select I/O polarity

0 = SW_IN is active LOW

Bit 2:

Bit 1:

1 = SW_IN is active HIGH

Bit 0:

SW_INPUT: Enable/disable the input switch function on pin SW_IN

0 = Input disabled

1 = Input enabled

8.10.10

System Config 1

Bit

Name

7

6

5

4

3

2

1

0

ALP_

PROX_

EVENT

PROX_

EVENT

TOUCH_

EVENT

SNAP_

EVENT

REATI_

EVENT

TP_

EVENT

GESTURE EVENT_

_EVENT

MODE

Bit 7:

PROX_EVENT: Enable proximity triggering event

0 = Toggle of proximity status does not trigger an event

1 = Toggle of proximity status triggers an event

TOUCH_EVENT: Enable touch triggering event

0 = Toggle of touch status does not trigger an event

1 = Toggle of touch status triggers an event

Bit 6:

Bit 5:

Bit 4:

Bit 3:

Bit 2:

SNAP_EVENT: Enable snap triggering event

0 = Toggle of snap status does not trigger an event

1 = Toggle of snap status triggers an event

ALP_PROX_EVENT: Enable alternate LP channel proximity triggering event

0 = Toggle of alternate channel proximity status does not trigger an event

1 = Toggle of alternate channel proximity status triggers an event

REATI_EVENT: Enable Re-ATI generating an event

0 = Re-ATI occurring does not trigger an event

1 = Re-ATI occurring triggers an event

TP_EVENT: Enable trackpad events

0 = Trackpad actions will not trigger event

IQS5xx-B000 Trackpad Datasheet

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IQ Switch^®

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1 = Trackpad actions trigger event

Bit 1:

Bit 0:

GESTURE_EVENT: Enable gesture events

0 = Gestures will not trigger event

1 = Gestures will trigger event

EVENT_MODE: Enable event mode communication

0 = I²C is presented each cycle

1 = I²C is only initiated when an enabled event occurs

Filter Settings 0

Bit

Name

7

-

6

-

5

-

4

3

2

1

0

ALP_

COUNT_

FILTER

IIR_

SELECT

MAV_

FILTER

IIR_

FILTER

-

Bit 7-4:

Unused

Bit 3:

ALP_COUNT_FILTER: Enable alternate LP channel count filtering

0 = Alternate LP channel counts are unfiltered

1 = Alternate LP channel counts are filtered

Bit 2:

IIR_SELECT: Select the IIR filtering method for the XY data points

0 = Damping factor for IIR filter is dynamically adjusted relative to XY movement

1 = Damping factor for IIR filter is fixed

MAV_FILTER: Enable moving averaging filter

0 = XY MAV filter disabled

Bit 1:

1 = XY MAV filter enabled

Bit 0:

IIR_FILTER: Enable IIR filter

0 = XY IIR filter disabled

1 = XY IIR filter enabled

8.10.11

Alternate Channel Setup

ALP Channel Setup 0

Bit

7

6

5

4

3

-

2

-

1

-

0

-

Name CHARGE

_TYPE

RX_

GROUP

PROX_

REVERSE

ALP

Bit 7:

CHARGE_TYPE: Charge type selection

0 = Projected capacitive charging

1 = Self capacitive charging

Bit 6:

RX_GROUP: Select Rx group

IQS5xx-B000 Trackpad Datasheet

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IQ Switch^®

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0 = Rx group A

1 = Rx group B

Bit 5:

PROX_REVERSE: Enable reverse proximity sensing

0 = Allow proximity to only trigger in conventional direction (positive for

projected, negative for self capacitive)

1 = Proximity detects change in counts in both directions

ALP: Enable alternate low power channel

0 = LP1 and LP2 use trackpad channels

1 = LP1 and LP2 use alternate channel configuration

Unused

Bit 4:

Bit 3-0:

8.10.12

ALP Rx select

Bit Z:

ALP_RxZ: Select Rx for alternate low power channel

0 = RxZ is not part of ALP channel

1 = RxZ is part of ALP channel

8.10.13

ALP Tx select

Bit Z:

ALP_TxZ: Select Tx for alternate low power channel

0 = TxZ is not part of ALP channel

1 = TxZ is part of ALP channel

RxToTx

8.10.14

RxToTx⁽¹⁾

Bit

7

6

5

4

3

2

1

Rx1/Tx8

0

Rx0/Tx9

0

IQS525

IQS572

Rx7/Tx2

Rx6/Tx3

Rx5/Tx4

Rx4/Tx5

Rx3/Tx6

Rx2/Tx7

Rx7/Tx9 Rx6/Tx10 Rx5/Tx11 Rx4/Tx12 Rx3/Tx13 Rx2/Tx14

Bit 7-0:

Rx/Tx: Change an Rx electrode to a Tx electrode

0 = Activate indicated Rx

1 = Activate indicated Tx

1: This register is only available on the IQS572 and IQS525 firmware

IQS5xx-B000 Trackpad Datasheet

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IQ Switch^®

ProxSense^®Series

8.10.15

Hardware Settings A

Bit

Name

7

-

6

-

5

4

-

3

-

2

1

0

RX_

FLOAT

ND

Bit 7-6:

Unused

Bit 5:

ND: Enable hardware noise detection

0 = noise detect disabled

1 = noise detect enabled

Unused

Bit 4-3:

Bit 2:

RX_FLOAT: Select Rx status when inactive

0 = Rx is grounded when inactive

1 = Rx is floating when inactive

Internal use, set to 0

Bit 1-0

8.10.16

Hardware Settings B

Bit

Name

7

-

6

5

4

3

-

2

-

1

0

ANA_

DEAD_

TIME

INCR_

PHASE

CK_FREQ

Bit 7:

Unused

Bit 6-4:

CK_FREQ: Configure Prox module clock source

000 = 125kHz

001 = 250kHz

010 = 500kHz

011 = 1MHz

100 = 2MHz

101 = 4MHz

110 = 8MHz

111 = 16MHz

Unused

Bit 3-2:

Bit 1:

ANA_DEAD_TIME: Analog dead time between up and pass phase

0 = Analog dead time disabled (dead time is half a prox clock cycle)

IQS5xx-B000 Trackpad Datasheet

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IQ Switch^®

ProxSense^®Series

1 = Analog dead time enabled (dead time is ~10ns, and UP increased by one

cycle)

Bit 0:

INCR_PHASE: Increase the phase length of UP and PASS

0 = Phase (UP / PASS) not incremented

1 = Phase (UP / PASS) increased by one half of a prox clock cycle

Hardware Settings C

8.10.17

Hardware Settings C

Bit

Name

Bit 7-6:

7

6

5

4

3

2

1

0

STAB_ TIME

OPAMP_BIAS

VTRIP

STAB_TIME: Stabilisation time after module power-on before conversion starts

00 = 1.7ms

01 = 500us

10 = 120us

11 = no not use

Bit 6-4:

OPAMP_BIAS: Opamp bias strength

00 = 2.5uA

01 = 5uA

10 = 7.5uA

11 = 10uA

Bit 3-0:

VTRIP: Charge transfer trip voltage

Trip voltage = [0.5 + (VTRIP x 0.0267)] x Vreg

Hardware Settings D

8.10.18

Hardware Settings D

Bit

Name

Bit 7:

7

-

6

5

4

3

-

2

1

0

UPLEN

PASSLEN

Unused

Bit 6-4:

Bit 3:

UPLEN: Length of UP phase

Unused

Bit 2-0:

PASSLEN: Length of PASS phase

IQS5xx-B000 Trackpad Datasheet

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IQ Switch^®

ProxSense^®Series

8.10.19

XY Config 0

Bit

Name

7

-

6

-

5

-

4

-

3

2

1

0

SWITCH

_XY_

AXIS

PALM_

REJECT

FLIP_Y

FLIP_X

Bit 7-4:

Unused

Bit 3:

PALM_REJECT: Enable palm reject sensing and suppression

0 = Large fingers (palms) are allowed

1 = Large fingers (palms) will block XY outputs.

SWITCH_XY_AXIS: Switch X and Y outputs

Bit 2:

0 = Columns Rx0-Rx9 gives change in X, rows Tx0-Tx14 gives change in Y

1 = Columns Tx0-Tx14 gives change in X, rows Rx0-Rx9 gives change in Y

FLIP_Y: Flip Y output values

Bit 1:

0 = Keep default Y values

1 = Invert Y output values

Bit 0:

FLIP_X: Flip X output values

0 = Keep default X values

1 = Invert X output values

8.10.20

Single Finger Gestures

Bit

Name

7

-

6

-

5

4

3

2

1

0

PRESS_

AND_

HOLD

SWIPE_

Y-

SWIPE_

Y+

SWIPE_

X+

SWIPE_

Y-

SINGLE_

TAP

Bit 7-6:

Unused

Bit 5:

Bit 4:

Bit 3:

SWIPE_Y-: Swipe in negative Y direction

0 = Gesture disabled

1 = Gesture enabled

SWIPE_Y+: Swipe in positive Y direction

0 = Gesture disabled

1 = Gesture enabled

SWIPE_X+: Swipe in positive X direction

0 = Gesture disabled

IQS5xx-B000 Trackpad Datasheet

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IQ Switch^®

ProxSense^®Series

1 = Gesture enabled

Bit 2:

SWIPE_X-: Swipe in negative X direction

0 = Gesture disabled

1 = Gesture enabled

Bit 1:

PRESS_AND_HOLD: Press and hold gesture

0 = Gesture disabled

1 = Gesture enabled

Bit 0:

SINGLE_TAP: Single tap gesture

0 = Gesture disabled

1 = Gesture enabled

8.10.21

Multi-finger Gestures

Bit

Name

7

-

6

-

5

-

4

-

3

-

2

1

0

2F_

TAP

ZOOM

SCROLL

Bit 7-3:

Unused

Bit 2:

Bit 1:

Bit 0:

ZOOM: Zoom gestures

0 = Gestures disabled

1 = Gestures enabled

SCROLL: Scroll gestures

0 = Gestures disabled

1 = Gestures enabled

2F_TAP: Two finger tap gesture

0 = Gesture disabled

1 = Gesture enabled

IQS5xx-B000 Trackpad Datasheet

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November 2016

IQ Switch^®

ProxSense^®Series

9 Circuit Diagram

Supply

Voltage

Tx14

PGM

SW_IN

N/C

1

2

3

4

5

6

7

8

9

36 Tx3

35 Tx2

34 Tx1

Transmitters

and

receivers

to

33 Tx0

SDA

32 Rx9B

31 Rx9A

30 Rx8B

29 Rx8A

28 Rx7B

27 Rx7A

26 Rx6B

25 Rx6A

SCL

touchscreen

VDDHI

VSS

Digital

Interface

(i2c)

VREG

NRST 10

RDY 11

N/C 12

Figure 9.1 IQS550 Overview Diagram

IQS5xx-B000 Trackpad Datasheet

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IQ Switch^®

ProxSense^®Series

Supply

Voltage

N/C 1

21 TX3

SDA 2

SCL 3

20 TX2

19 TX1

Digital

Interface

(i2c)

VDDHI 4

VSS 5

18 TX0

Transmitters

and

receivers

to trackpad /

touchscreen

17 RX7 / TX9

16 RX6 / TX10

15 RX5 / TX11

VREG 6

NRST 7

Figure 9.2 IQS572 Overview Diagram

Supply

Voltage

N/C 1

SDA 2

21 PD3

20 PD2

SCL 3

19 TX0

Digital

Interface

(i2c)

VDDHI 4

VSS 5

18 TX1

Transmitters

and

receivers

to trackpad /

touchscreen

17 RX7 / TX2

16 RX6 / TX3

15 RX5 / TX4

VREG 6

NRST 7

Figure 9.3 IQS525 Overview Diagram

IQS5xx-B000 Trackpad Datasheet

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IQ Switch^®

ProxSense^®Series

Figure 9.4 IQS550 Application Circuit

IQS5xx-B000 Trackpad Datasheet

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November 2016

IQ Switch^®

ProxSense^®Series

Figure 9.5 IQS572 Application Circuit

IQS5xx-B000 Trackpad Datasheet

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November 2016

IQ Switch^®

ProxSense^®Series

Figure 9.6 IQS525 Application Circuit

IQS5xx-B000 Trackpad Datasheet

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10 Electrical Characteristics

10.1Absolute Maximum Ratings

Exceeding these maximum ratings may cause permanent damage to the device.

Table 10.1 Voltage Characteristics

Symbol

Rating

Min

Max

Unit

V_DDHI

V_SS

-

External supply voltage

-0.3

4.0

Receiver channel pins (Rx0A...Rx9B)

V_SS–0.3

V_REG(-1.55)

4.0

Input voltage on transmit pins

(Tx0...Tx14))

PXS off

V

V_IN

PXS

on⁽¹⁾

V_REG(-1.55)

Input voltage on any pin⁽²⁾

V_SS–0.3

4.0

1. If the ProxSense^®peripheral is on, no injection must be performed on any pin having the transmit

function (Tx) as an alternate function, even if this alternate function is not specified

2. I_INJ(PIN)must never be exceeded. This is implicitly insured if V_INmaximum is respected. If V_IN

maximum cannot be respected, the injection current must be limited externally to the I_INJ(PIN)value. A

positive injection is induced by V_IN>V_DDHIwhile a negative is induced by V_IN<V_SS.

Table 10.2 Current Characteristics

Symbol

I_VDDHI

I_VSS

Rating

Max.

80

Unit

Total current into V_DDHIpower line (source)

Total current out of V_SSground line (sink)

Output current sunk by any other I/O and control pin

Output current source by any I/Os and control pin

Injected current on any pin⁽²⁾

80

25

I_IO

mA

-25

±5

(1)

I_INJ(PIN)

(1)

∑ I_INJ(PIN)

Total injected current (sum of all I/O and control pins)⁽²⁾

±25

1. I_INJ(PIN)must never be exceeded. This is implicitly insured if V_INmaximum is respected. If V_IN

maximum cannot be respected, the injection current must be limited externally to the _IINJ(PIN)value. A

positive injection is induced by V_IN>V_DDHIwhile a negative injection is induced by V_IN<V_SS. For true

open-drain pads, there is no positive injection current, and the corresponding V_INmaximum must

always be respected.

2. When several inputs are submitted to a current injection, the maximum ΣI_INJ(PIN)is the absolute sum

of the positive and negative injected currents (instantaneous values). These results are based on

characterization with ΣI_INJ(PIN)maximum current injection on four I/O port pins of the device.

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Table 10.3 Thermal Characteristics

Symbol

TSTG

TJ

Rating

Max.

-65 to +150

150

Unit

Storage temperature range

Maximum junction temperature

°C

10.2Operating Conditions

10.2.1 General Operating Conditions

Table 10.4 General Operating Conditions

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

1.65V ≤ V_DDHI

≤3.6V

16

(1)

f_MASTER

Master clock frequency

-

MHz

Standard operating

voltage

-

V_DDHI

-

1.65

-

3.6

625

85

V

mW

°C

Power dissipation at T_A

= 85°C

(2)

P_D

1.65V ≤ V_DDHI

≤3.6V

T_A

T_J

Temperature range

-40

Junction temperature

range

-40°C ≤ V_DDHI≤

105

°C

85°C

1. f_MASTER= f_CPU

2. To calculate P_Dmax(T_A) use the formula given in thermal characteristics P_Dmax=(T_Jmax−T_A)/θ_JAwith

T_Jmaxin this table and θ_JAin Table 10.15.

10.2.2 Power-up / Power-down Operating Conditions

Table 10.5 Operating Conditions at Power Up / Down

Symbol

t_VDDHI

t_TEMP

Parameter

Conditions

Min

20

Typ

Max

1300

-

Unit

µs/V

Ms

V

V_DDHIrise time rate

-

1

-

Reset release decay

Power on reset threshold

Power down reset threshold

V_DDHIrising

-

V_POR

1.44

1.30

1.65⁽¹⁾

1.60⁽²⁾

V_PDR

-

V

1. Tested in production

2. Data based on characterisation results, not tested in production.

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10.2.3 Supply Current Characteristic

Table 10.6 Current Consumption⁽¹⁾

Symbol

Parameter

Conditions

Typ

Max

Unit

I_DD(CORE)

Run current for processor core

16MHz master frequency

(T_A= -40 °C to 85 °C)

2.8

3.5

mA

I_{DD(LP STATE)}

Supply current in low-power

sleep state (which is added to

cycle time to obtain desired

report rate)

T_A= -40 °C to 25 °C

T_A= 85 °C

1

2

uA

1.4

3.2

I_DD(SUSPEND)

Supply current in suspend state

T_A= -40 °C to 25 °C

T_A= 85 °C

0.4

1

1.2

2.5

uA

1. Data based on characterisation results, unless otherwise specified.

10.2.4 ProxSense^®Current Consumption

The break-down of the consumption from the ProxSense peripheral is shown below.

Table 10.7 ProxSense^®Current Consumption⁽¹⁾

Symbol

ProxSense transmitter (Tx)

ProxSense receiver (Rx)

Typ

0.6

1.1

2.3

Unit

mA

I_DD(PXS)

1

4

10

1. Data based on characterisation results, unless otherwise specified.

10.2.5 Expected Total Current Consumption Scenarios

The specific parameters configured on varying designs have a great impact on the obtained

current consumption. Due to this, the following table is purely illustrative of the expected

consumption for similar configurations. The device configurations used below are examples of

practical setups expected in applications.

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Table 10.8 Total Current Consumption(1)

Current (Typ)

Report Rate

Symbol

Sensors

Unit

IQS550

3.75

2.52

1.9

IQS572

2.73

1.85

1.38

690

346

174

89

IQS525

1.46

0.99

0.74

370

185

96

Trackpad⁽²⁾

ALP⁽³⁾

10ms

15ms

mA

uA

20ms

40ms

975

483

243

121

67

80ms

160ms

320ms

640ms

80ms

48

55

26

48

ALP⁽³⁾

160ms

320ms

640ms

80ms

25

I_DD(Total)

ALP⁽³⁾

13

ALP⁽³⁾

7

ALP⁽⁴⁾

43

ALP⁽⁴⁾

160ms

320ms

640ms

80ms

22

ALP⁽⁴⁾

12

ALP⁽⁴⁾

7

ALP⁽⁵⁾

41

ALP⁽⁵⁾

160ms

320ms

640ms

21

ALP⁽⁵⁾

12

ALP⁽⁵⁾

6

1. Based on bench measurements, not characterised

2. Tested with maximum number of sensors active (IQS550 – 15x10 / IQS572 – 9x8 / IQS525 – 5x5);

ATI Target of 500 counts; Max number of multi-touches = 2 / default hardware (conversion) settings /

1 finger touch (8mm diameter) active / streaming 27 bytes (XY data and gestures) / I²C pull-ups of

4.7kΩ / V_DDHI= 3.3V

3. Tested with ALP channel configured in projected capacitive mode; ATI Target of 500; Alternating Txs

enabled, all Rxs enabled; Event-Mode enabled

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4. Tested with ALP channel configured in projected capacitive mode; ATI Target of 500; All Txs

enabled, single Rxs around trackpad enabled; Event-Mode enabled

5. Tested with ALP channel configured in self capacitive mode; ATI Target of 800; single Rx enabled;

Event-Mode enabled

10.2.6 I/O Port Pin Characteristics

General characteristics

Subject to general operating conditions for V_DDHIand T_Aunless otherwise specified. All

unused pins must be kept at a fixed voltage: using the output mode of the I/O for example or

an external pull-up or pull-down resistor.

Table 10.9 Standard I/O Static Characteristic ^{(1) (2)}

Symbol

V_IL

Parameter

Conditions

Standard I/Os

Min.

Typ.

Max.

Unit

Input low level voltage⁽³⁾

Input high level voltage⁽³⁾

V_SS-0.3

-

0.3V_DDHI

V

V_IH

0.7

V_DDHI

+0.3

V_hys

Schmitt trigger voltage

hysteresis⁽⁴⁾

Standard I/Os

-

200

-

1

mV

uA

I_Ikg

Input leakage current⁽⁵⁾

V_SS≤ V_IN≤ V_DDHI

Standard I/Os

-1

30

-

(6)

V_SS≤ V_in≤ V_REG

-

1

Rx, Tx I/Os

R_PU

Weak pull-up equivalent

resistor⁽⁷⁾

V_IN= V_SS

45

5

60

-

kΩ

(8)

C_IO

I/O pin capacitance

pF

1. V_DDHI= 3.0 V, T_A= -40 to 85°C unless otherwise specified.

2. Not applicable to Rx and Tx pins.

3. Data based on characterisation results, not tested in production.

4. Hysteresis voltage between Schmitt trigger switching levels. Based on characterization results, not

tested.

5. The maximum value may be exceeded if negative current is injected on adjacent pins.

6. V_INmust not exceed V_REGvalue if ProxSense^®is enabled, even on port B and D (Tx), V_REG= 1.55V.

7. R_PUpull-up equivalent resistor based on a resistive transistor (corresponding I_PUcurrent

characteristics)

8. Data guaranteed by design, not tested in production

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10.2.7 Output Driving Current

Subject to general operating conditions for V_DDHIand T_Aunless otherwise specified.

Table 10.10 Output Driving Current (high sink ports)

I/O type

Symbol

Parameter Conditions

Conditions

Min. Max. Unit

I_IO= +2mA,

V_DDHI= 1.8V

-

0.45

I_IO= +2mA,

V_DDHI= 3.0V

-

0.45

(1)

V_OL

Output low level voltage for an I/O pin

I_IO= +10mA,

V_DDHI= 3.0V

0.7

Standard

I_IO= -1mA,

V_DDHI

-

V_DDHI= 1.8V -0.45

V

Output high level voltage for an I/O

I_IO= -1mA,

V_DDHI= 3.0V -0.45

V_DDHI

-

(2)

V_OH

I_IO= -10mA,

V_DDHI= 3.0V

V_DDHI

-0.7

-

ProxSense

I/O

V_OL

V_OH

Output low level voltage for Tx and Rx

ProxSense I/Os

I_RX= TBD

I_TX= 1mA

-

TBD

Output high level voltage for Tx

ProxSense I/O

1.45

1.35

-

Output high level voltage for Rx

ProxSense I/O

I_{PXS_RX}

=

0.5mA

1. The I_IOcurrent sunk must always respect the absolute maximum rating and the sum of I_IO(I/O ports

and control pins) must not exceed I_VSS

2. The I_IOcurrent sourced must always respect the absolute maximum rating and the sum of I_IO(I/O

ports and control pins) must not exceed I_VDDHI

.

10.2.8 NRST Pin

The NRST pin input driver is CMOS. A permanent pull-up is present, thus an external

component is not needed if NRST is unconnected in the design.

Subject to general operating conditions for V_DDHIand T_Aunless otherwise specified.

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Table 10.11 NRST Pin Characteristics

Symbol

V_IL(NRST)

V_IH(NRST)

Parameter

Conditions

Min.

V_SS

1.4

-

Typ.

Max.

0.8

Unit

NRST Input low level voltage⁽¹⁾

NRST Input high level voltage⁽¹⁾

-

V

V_DDHI

0.8

-

V_OL(NRST)

NRST Output low level voltage

I_OL= 2mA

R_PU(NRST)

V_F(NRST)

t_OP(NRST)

V_NF(NRST)

NRST pull-up equivalent resistor⁽²⁾

NRST input filtered pulse⁽³⁾

NRST output pulse width

30

-

45

-

60

50

-

kΩ

20

300

-

ns

NRST input not filtered pulse⁽³⁾

-

1. Data based on characterization results, not tested in production.

2. The RPU pull-up equivalent resistor is based on a resistive transistor.

3. Data guaranteed by design, not tested in production.

The reset network shown in Figure 10.1 protects the device against parasitic resets. The user

must ensure that the level on the NRST pin can go below the V_ILmax. level specified in Table

10.11. Otherwise the reset is not taken into account internally.

Figure 10.1 Recommended NRST Pin Configuration

10.2.9 I²C Characteristics

Subject to general operating conditions for V_DDHI, f_MASTER, and T_Aunless otherwise specified.

The IQS5xx I²C interface meets the requirements of the Standard I²C communication protocol

described in the following table with the restrictions mentioned below.

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Table 10.12 I²C Characteristics

Standard I²C

(100kHz)

Fast I²C

(400kHz)

Symbol

Parameter

Unit

Min⁽¹⁾

4.7

4.0

250

0⁽²⁾

-

Max⁽¹⁾

Min⁽¹⁾

Max⁽¹⁾

t_w(SCLL)

t_w(SCLH)

t_su(SDA)

t_h(SDA)

t_r(SDA)

t_r(SCL)

t_f(SDA)

t_f(SCL)

SCL clock low time

SCL clock high time

SDA setup time

-

1.3

0.6

100

0

-

µs

ns

µs

pF

-

SDA data hold time

900⁽²⁾

300

-

SDA rise time

1000

300

-

SCL rise time

-

SDA fall time

-

SCL fall time

-

t_h(STA)

t_su(STA)

t_su(STO)

C_b

START condition hold time

Repeated START condition setup time

STOP condition setup time

Capacitive load for each bus line

4.0

4.7

4.0

-

0.6

-

400

1. Data based on protocol requirement, not tested in production

Figure 10.2 Typical Bus Application and Timing Diagram

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10.2.10

10.2.11

Package Moisture Sensitivity

Table 10.13 Moisture Sensitivity Level (MSL)

Parameter

IQS550

IQS572

IQS525

Package Moisture Sensitivity Level (MSL)

3

Electrostatic Discharge (ESD)

Electrostatic discharges (a positive then a negative pulse separated by 1 second) are applied

to the pins of each sample according to each pin combination. The sample size depends on

the number of supply pins in the device (3 parts*(n+1) supply pin). Two models can be

simulated: human body model and charge device model. This test conforms to the JESD22-

A114A/A115A standard.

Table 10.14 ESD Absolute Maximum Ratings

Symbol

Ratings

Conditions

Max Value

Unit

Electrostatic

discharge voltage

(human body model)

V_ESD(HBM)

2000⁽²⁾

T_A= +25 °C

V

Electrostatic

discharge voltage

(charge device

model)

V_ESD(CDM)

1000

1. Data based on characterisation results, not tested in production.

2. Device sustained up to 3000 V during ESD trials.

10.2.12

Thermal Characteristics

The maximum chip junction temperature (T_Jmax) must never exceed the values given in Table 10.4.

The maximum chip-junction temperature, T_Jmax, in degrees Celsius, may be calculated using the

following equation:

T_Jmax= T_Amax+ (P_Dmaxx θ_JA)

Where:

● T_Amaxis the maximum ambient temperature in °C

● θ_JAis the package junction-to-ambient thermal resistance in °C/W

● P_Dmaxis the sum of P_INTmaxand P_I/Omax(P_Dmax= P_INTmax+ P_I/Omax

● P_INTmaxis the product of I_DDand V_DDHI, expressed in watts. This is the maximum chip internal power.

P_I/Omaxrepresents the maximum power dissipation on output pins

)

●

where:

P_I/Omax= Σ (V_OL*I_OL) + Σ((V_DDHI−V_OH)*I_OH), taking into account the actual V_OL/I_OLand V_OH/I_OHof the I/Os at low

and high level in the application.

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Table 10.15 Thermal Characteristics⁽¹⁾

Symbol

Parameter

Value

Unit

Θ_JA

Thermal resistance junction ambient

32

°C/W

1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection environment.

10.2.13

ProxSense Electrical Characteristics

Table 10.16 Rx / Tx Characteristics

Symbol

Parameter

Conditions IQS550 IQS572 IQS525 Unit

C_RG

Rx capacitance to

ground

60

4

pF

kΩ

C_TG

C_M

Tx capacitance to

ground

60

40

Mutual capacitance

between Rx and Tx

16MHz

Prox Clock

2

R_rx

R_tx

Total Rx resistance

Total Tx resistance

4MHz Prox

Clock

20

2

16MHz

Prox Clock

4MHz Prox

Clock

20

Data based on characterisation results, not tested in production.

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11 Mechanical Dimensions

11.1IQS550 QFN(7x7)-48 Mechanical Dimensions

P

1

48

B

Tt

Z

W

Wt

A

Area „Z‟

H

1

Tp

48

r

Pin 1 corner

C 0.5 x 45°

T

Figure 11.1 QFN(7x7)-48 Package

Table 11.1 Dimensions from Figure 11.1

Dimension (mm)

Label

Min

Typical

0.500

0.400

0.250

5.600

5.500

Max

Min

Typical

0.550

7.00

Max

P

T

H

A / B

Tp

r

0.500

6.900

0.600

7.100

0.300

0.200

5.500

5.400

0.500

0.300

5.700

5.600

W

Tt

Wt

0.152

0.125

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11.2IQS550 Landing Pad Layout

H

48 47 46 45 44 43 42 41 40 39 38 37

1

2

36

35

34

33

32

31

30

29

28

27

26

25

X

3

W

4

5

6

Y1 Y2

7

8

9

49 (*Note1)

Y

g

10

11

12

13 14 15 16 17 18 19 20 21 22 23 24

P

X3

X1

X2

Figure 11.2 QFN(7x7)-48 Footprint

Table 11.2 Dimensions from Figure 11.2

Label

X

Dimension (mm)

Label

Y2

H

Dimension (mm)

5.60

6.20

7.30

5.80

5.60

6.20

7.30

0.55

0.30

0.20

0.50

X1

X2

X3

Y

W

g

P

Y1

*Note1: It is recommended to connect and solder this back-side pad to PCB ground.

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11.3IQS572/IQS525 QFN(4x4)-28 Mechanical Dimensions

Figure 11.3 QFN(4x4)-28 Package

Table 11.3 Dimensions from Figure 11.3

Dimension (mm)

Label

Min

0.5

Typical

0.55

0

Max

0.6

Min

0.3

Typical

0.4

Max

0.5

A

A1

D

L

L1

T

-0.05

3.9

0.05

4.1

0.25

0.35

0.152

0.25

0.5

0.45

4.0

D1

E

2.9

3.0

3.1

b

0.2

0.3

3.9

4.0

4.1

e

E1

2.9

3.0

3.1

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11.4IQS572/IQS525 Landing Pad Layout

Figure 11.4 QFN(4x4)-48 Footprint (dimensions in millimetres)

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12 Packaging Information

12.1Tape Specification

The IQS5xx products come packaged in a carrier tape on a reel. The carrier tape has a leader

and trailer section where no products are populated. A 400mm (min) section at the start of the

carrier tape is empty (leader part). The cover tape starts in this leader part and covers a

100mm (min) of carrier tape that has no products. From there the products are consecutively

populated in the carrier tape. The trailer of 160mm (min) has no products.

Figure 12.1 Representation of Leader and Trailer for the Carrier Tape

Table 12.1 Tape Dimensions

Measurement (mm)

Description

IQS550

IQS572

IQS525

12

Tape width

Part pitch

16

12

8

Sprocket hole diameter

Sprocket hole pitch

Cavity length

1.5

4

2

4

7.2

1.2

13

5.3

1.1

9.5

5.3

1.1

9.5

Cavity width

Cavity depth

Cover tape width

Please note: Cover tape does not cover the sprocket holes.

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12.1.1 IQS550 Tape Description

Azoteq logo

and name

IQS550 chip name

Pin 1 corner

indicator

Sprocket holes

Figure 12.2 IQS550 QFN48-7x7 Package in Carrier Tape Example

The IQS550 is packed in a carrier tape as shown above and placed on the reel. It fits in a long

carrier tape that is moulded specifically for this product and a removable see-through cover

tape is placed over. This cover can be peeled off and the product taken out of the tape with a

pick-and-place machine. The Pin 1 corner indicator is closest to a side facing the sprocket

holes in the carrier tape as illustrated.

12.1.2 IQS572 and IQS525 Tape Description

The IQS525 & IQS572 share the same tape and reel details, with an example of the IQS525

tape provided here.

Pin 1 corner

indicator

IQS525

chip name

Sprocket

holes

Figure 12.3 IQS525 QFN28-4x4 Package in Carrier Tape Example

Again the Pin 1 corner indicator is closest the side facing the sprocket holes in the carrier tape

as illustrated.

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12.2 Reel Specification

The reel is made from a high impact PS material. The physical dimensions are illustrated in

the table and figure below.

Figure 12.4 Reel Dimensions: Front and Side View

Table 12.2 Reel Dimensions

Value (in mm)

Dimension

IQS550

330 (max)

1.5 (min)

13 ±0.2

IQS572

330 (max)

1.5 (min)

IQS525

330 (max)

1.5 (min)

A

B

C

D

N

G

T

13 ±0.2

20.2 (min)

60

20.2 (min)

60

20.2 (min)

60

16.4 + 2/-0

22.4 (max)

12.4 + 2/-0mm

18.4mm (max)

12.4 + 2/-0mm

18.4mm (max)

Note: The reel could also have additional cut-outs not illustrated in the figure

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12.2.1 Dry Packing

The IQS5xx is specifically dry packed to protect them from moisture absorption while

shipping/storing which has a large effect on the quality and reliability of the IQS5xx after

soldering. To improve the quality and reliability of soldering joints, it is advised to bake the

IQS5xx before reflow soldering.

Below is a flow diagram which shows how Azoteq aims to minimise moisture absorption during

shipping and storage. On the right side is a flow diagram specific for the customer to consult

whether baking is needed.

Figure 12.5 Moisture Absorption Control Method / Guide

The flow diagram above informs the customer whether the baking process is needed. When

opening the dry pack consult the humidity indicator (gel) inside the pack. If it turned pink, the

product must be baked. If the gel is not pink, within the specified period there is no need for

baking, as long as the humidity and temperature conditions are met.

12.2.2 Baking

The IQS5xx is packed in a tape and reel and can thus not be baked. It must first be transferred

to a non-metal tube or tray, for example a glass tray. This is placed in an oven and baked

according to the IPC/JEDEC J-STD-033C MSL specification. A picture of this baking method

is shown below.

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ProxSense^®Series

Figure 12.6 IQS550 Baking Example

Take the IQS5xx out of the carrier tape and place on for example a glass sheet. Ensure all the

IQS5xx‟s are turned top side up and not lying on top of each other. Bake the product for 24

hours at 125 ⁰C. Remove from oven and let cool for about 1 hour before handling.

12.3Handling of the IQS5xx

When handling the IQS5xx product, ESD (Electrostatic discharge) must be avoided as far as

possible. Make sure all equipment and personnel are grounded to avoid static build-up.

Machines should be grounded and personnel should wear grounding straps.

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12.4Reflow for IQS5xx

When soldering the IQS5xx to a board, the correct temperature curve must be followed to

ensure good soldering joints and to avoid damaging the chip due to high temperatures.

Figure 12.7 Reflow Temperature Curve for the IQS5xx

The figure above shows the temperature profile to be used when soldering the IQS5xx onto a

board. This is according to the JEDEC (J-STD-020D.1) standard lead-free reflow profile.

Table 12.3 JEDEC Standard Lead-Free Reflow Profile

Symbol

Description

Average ramp-up rate

Temperature min

Temperature max

Preheat time

Value

3 ⁰C/second max

150 ⁰C

T_Smaxto T_P

T_Smin

T_Smax

t_s

200 ⁰C

60 – 120 seconds

217 ⁰C

T_L

Temperature

t_L

Time maintained above

temperature T_L

60 – 150 seconds

T_P

t_P

Peak/classification temperature

260 ⁰C

Time within 5 ⁰C of actual peak

temperature (T_P)

30 seconds

Ramp-down rate

6 ⁰C/second max

8 minutes max

t_25Cto t_P

Time: 25 ⁰C to peak temperature

All temperatures refer to topside of the package, measured on the body surface.

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ProxSense^®Series

13 Device Marking

13.1IQS550 Marking

A

B

C

D

E

F

G

H

I

=

IC Name

Assembly Plant

Internal use

Country of Origin

Assembly Year

Assembly Week

Dot – Pin1 reference

Internal use

J

Design Revision

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ProxSense^®Series

13.2IQS572/IQS525 Marking

A

B

D

C

E

F

G

H

A

B

C

D

E

F

=

IC Name

Assembly Plant

Internal use

Country of Origin

Assembly Date

G

H

Additional Information including Design Revision Code

Dot – Pin1 reference

14 Ordering Information

Order quantities will be subject to multiples of full reels. For large orders, Azoteq can provide

custom configured devices.

14.1 IQS550 Ordering

zz

IQS550

QN R

IC NAME

BULK PACKAGING

PACKAGE TYPE

CONFIGURATION CODE

IC NAME

IQS550

=

IQS550

CONFIGURATION CODE BL

Bootloader (ready for application firmware

programming, B000 firmware NOT pre-loaded)

PACKAGE TYPE

QN

R

=

QFN(7x7)-48

BULK PACKAGING

Reel (2500pcs/reel)

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14.2 IQS572 Ordering

zz

IQS572

QN R

IC NAME

BULK PACKAGING

PACKAGE TYPE

CONFIGURATION CODE

IC NAME

IQS572

=

IQS572

CONFIGURATION CODE BL

Bootloader (ready for application firmware

programming, B000 firmware NOT pre-loaded)

PACKAGE TYPE

QN

R

=

QFN(4x4)-28

BULK PACKAGING

Reel (3000pcs/reel)

14.3IQS525 Ordering

zz

IQS525

QN R

IC NAME

BULK PACKAGING

PACKAGE TYPE

CONFIGURATION CODE

IC NAME

IQS525

=

IQS525

CONFIGURATION CODE BL

Bootloader (ready for application firmware

programming, B000 firmware NOT pre-loaded)

PACKAGE TYPE

QN

R

=

QFN(4x4)-28

BULK PACKAGING

Reel (3000pcs/reel)

IQS5xx-B000 Trackpad Datasheet

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IQ Switch^®

ProxSense^®Series

Changes:

Release v1.00

 IQS5xx-B000 datasheet released

Release v1.01



Added ‘Minimum count Re-ATI delta„ to memory map, and updated Section 3.7.2.

Updated links (Sections 4.3 and 8.8.2)

Release v2.00



Updated wake pin functionality and changed terminology from wake to switch input:

Updated section 7.3.2 and 8.8.1, added SWITCH_STATE bit, added SW_INPUT_EVENT

bit, Added section 7.11



Added export file version: Updated Section 7.1 and memory map

Updated Note 2 in Table 10.8 (525 setup added and ATI target fixed)

Fixed heading of Table 2.3

Updated Figure 11.4

Updated RxToTx register to include IQS572 (memory map also updated), and updated

Section 5.1.4



Added Section 7.9 and 7.10

Updated Section 8.8.1 with updated trackpad event definition

Added tap location details to Section 6.1

Removed manual device setup description and startup flow diagram from Section 7.2

Updated overview diagrams and circuit diagrams (removed program interface on PGM and

NRST, and updated SW_IN pin)

IQS5xx-B000 Trackpad Datasheet

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15 Contact Information

USA

Asia

South Africa

Physical

Address

Rm2125, Glittery City

Shennan Rd

Futian District

Shenzhen, 518033

China

109 Main Street

Paarl

7646

6507 Jester Blvd

Bldg 5, suite 510G

Austin

TX 78750

USA

South Africa

Postal

Address

Rm2125, Glittery City

Shennan Rd

Futian District

Shenzhen, 518033

China

PO Box 3534

Paarl

7620

6507 Jester Blvd

Bldg 5, suite 510G

Austin

TX 78750

USA

South Africa

Tel

+1 512 538 1995

+1 512 672 8442

info@azoteq.com

+86 755 8303 5294

ext 808

+27 21 863 0033

+27 21 863 1512

info@azoteq.com

Fax

Email

info@azoteq.com

Please visit www.azoteq.com for a list of distributors and worldwide representation.

The following patents relate to the device or usage of the device: US 6,249,089; US 6,952,084; US 6,984,900; US

7,084,526; US 7,084,531; US 8,395,395; US 8,531,120; US 8,659,306; US 8,823,273; US 9,209,803; US 9,360,510; EP

2,351,220; EP 2,559,164; EP 2,656,189; HK 1,156,120; HK 1,157,080; SA 2001/2151; SA 2006/05363; SA 2014/01541; SA

2015/023634

IQ Switch^®, SwipeSwitch™, ProxSense^®, LightSense™, AirButton^TM, ProxFusion™, Crystal Driver™ and the

logo are trademarks of Azoteq.

The information in this Datasheet is believed to be accurate at the time of publication. Azoteq uses reasonable effort to maintain the information up-to-date and accurate, but does not warrant

the accuracy, completeness or reliability of the information contained herein. All content and information are provided on an “as is” basis only, without any representations or warranties, express

or implied, of any kind, including representations about the suitability of these products or information for any purpose. Values in the datasheet is subject to change without notice, please ensure

to always use the latest version of this document. Application specific operating conditions should be taken into account during design and verified before mass production. Azoteq disclaims all

warranties and conditions with regard to these products and information, including but not limited to all implied warranties and conditions of merchantability, fitness for a particular purpose, title

and non-infringement of any third party intellectual property rights. Azoteq assumes no liability for any damages or injury arising from any use of the information or the product or caused by,

without limitation, failure of performance, error, omission, interruption, defect, delay in operation or transmission, even if Azoteq has been advised of the possibility of such damages. The

applications mentioned herein are used solely for the purpose of illustration and Azoteq makes no warranty or representation that such applications will be suitable without further modification,

nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Azoteq products are not authorized for use as critical components in

life support devices or systems. No licenses to patents are granted, implicitly, express or implied, by estoppel or otherwise, under any intellectual property rights. In the event that any of the

abovementioned limitations or exclusions does not apply, it is agreed that Azoteq‟s total liability for all losses, damages and causes of action (in contract, tort (including without limitation,

negligence) or otherwise) will not exceed the amount already paid by the customer for the products. Azoteq reserves the right to alter its products, to make corrections, deletions, modifications,

enhancements, improvements and other changes to the content and information, its products, programs and services at any time or to move or discontinue any contents, products, programs or

services without prior notification. For the most up-to-date information and binding Terms and Conditions please refer to www.azoteq.com

www.azoteq.com/ip

info@azoteq.com

IQS5xx-B000 Trackpad Datasheet

Revision 2.0

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November 2016


型号：	IQS550BLQNR
厂家：	ETC
描述：	Proximity, touch and snap* on each channel
文件：	总79页 (文件大小：4625K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

IQS550BLQNR [ETC]

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