L9824 [ETC]
;型号: | L9824 |
厂家: | ETC |
描述: | 驱动器 接口集成电路 光电二极管 CD |
文件: | 总11页 (文件大小:232K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
L9824
OCTAL PARALLEL LOW SIDE DRIVER
ADVANCE DATA
.
OPERATING DC SUPPLY VOLTAGE RANGE
5V TO 25V
SUPPLY OVERVOLTAGE PULSEUP TO 40V
VERY LOW STANDBY QUIESCENT CUR-
RENT 100µA
EIGHTBITPARALLELSTRUCTURE WITHME-
MORY FEATURE
BIDIRECTIONAL INPUTS-OUTPUTS
µC COMPATIBLEINPUTLEVELSWITHTHRE-
SHOLD HYSTERESIS
INTERNAL 4.5V REFERENCE DEFINING THE
OUTPUT HIGH LEVELS
EIGHT HIGH CURRENT OUTPUTS FOR DC
CURRENTS UP TO 350mA WITH ON RESI-
STANCE LESS THAN 3Ω (typ. 1,5Ω)
OUTPUT SHORT CIRCUIT PROTECTION
WITH TIME DELAY CHARACTERISTICS FOR
DRIVING LAMPS
MULTIPOWER BCD TECHNOLOGY
.
.
.
.
.
DIP20
SO20
.
.
ORDERING NUMBERS : L9824 (DIP20)
L9824D (SO20)
DESCRIPTION
The L9824 is an octal parallel input power interface
circuit in the Multipower BCD technology with bidi-
rectional inputs and outputs and the output status
monitoring.
.
.
THERMAL OVERLOAD PROTECTION
BLOCK DIAGRAM
February 1995
1/11
This is advanced information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
L9824
PIN CONNECTION (top view)
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
40
Unit
VS
VOUT
dVOUT/dt
IOUT DC
IOUT P (*)
IS
Supply Voltage
V
Output Voltage
Int. Clamped to Vs
100
Output Voltage Transient
DC Output Current
V/µs
mA
A
±350
Peak Output Current (T/tp ≥ 100, tp = 4ms)
DC Current at VS
±2
– 1.5
A
VD IN
VEN
Input Voltage
– 0.3 to 7 (**)
– 0.3 to 7 (**)
– 0.3 to 7 (**)
– 40 to 150
– 65 to 150
V
Enable Input Voltage
V
VTR
Transfer Input Voltage
V
Tj
Operating Junction Temperature
Storage Temperature
°C
°C
Tstg
Pmax
Power Dissipation (Tamb = 80°C)
DIP20
SO20
875
420
mW
mW
(*) Schaffner pulses type 1 and 2
(**) For VS < 6.7V the device can be supplied through the internal ESD diodes from inputs to VS.
THERMAL DATA
Symbol
Rth j-amb Thermal Resistance Junction-ambient
Tj Maximum Junction Temperature
Parameter
DIP20
80°C/W
150°C/W
SO20
Max.
165°C/W
150°C/W
MAX
2/11
L9824
ELECTRICAL CHARACTERISTICS (5V ≤ VS ≤ 25V (40V @ t < 400ms), – 40°C ≤ Tj ≤ 125°C unless oth-
erwise specified)
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
V
VDINL
VDINH
Input Voltage LOW
Input Voltage HIGH
VE = L, VTR = L
0
1.0
(input-mode) 1)
VE = L, VTR = H
(output-mode)
3.0
7.0
V
1)
VDOUTL
VDOUTH
Output Voltage LOW
Output Voltage HIGH
VE = L, VTR = H
(output-mode)
0.4
5.0
V
V
1)
4.0
IDIN
Input Current
VE = L, VTR = L
(input-mode) 1)
– 10
10
µA
VENL
VENH
VTRL
VTRH
IEN.TR
VEHY
VTHY
ROUT
Enable Voltage LOW
0
1.0
7.0
1.0
7.0
1
V
V
Enable Voltage HIGH
3.0
0
Transfer Voltage LOW
V
Transfer Voltage HIGH
3.0
– 1
200
200
V
Enable, Transfer Input Current
Enable Threshold Hysteresis
Transfer Threshold Hysteresis
0 < VE.TR < 5V
µA
mV
mV
Output Resistance
ROUT-characteristic
See fig. 2
Out = L
0 < IOUT ≤ 350mA
VS ≥ 8V
VS = 6.5V
VS = 5.0V
1.5
0.5
3.0
25
1
Ω
Ω
KΩ
ISC
Output Short Current
IOUTSC-characteristic (See fig. 3) TSCL = 20ms
8V ≤ VS = Vout ≤ 25V
0.36
1.2
A
VOUT
Output Voltage
Out = H
IOUT = 0.35A (DC)
IOUT = 1A (pulsed)
VS + 0.5
VS + 2.0
VS + 2
VS + 4
V
V
ΣIOUTL1
Output Leakage Current per
Channel
Out = H, – 40 ≤ Tj ≤ 85°C
VOUT = 16V
100
µA
COUT
Output Capacitance
Out = H,
VOUT = 5V
60
30
90
60
120
90
pF
pF
V
OUT = 15V
IQ
Quiescent Current
5V ≤ VS ≤ 16V; IDOUT = 0
– 40 ≤ Tj ≤ 85°C
VE = H, VTR = H
VTR = L
STANDBY MODE
TRANSFER-, HOLD MODE
READ MODE
100
200
400
µA
µA
µA
VE = L, VTR = H
IQ
Quiescent Current
VS = 25V
VS = 40V @ t ≤ 400ms
2
35
mA
mA
20
40
ISCOP
Additional Short Circuit
Operating Current Per Channel
VEN = L, VDIN = L
VTR = L, IOUT = ISC
IO +500
3.5
µA
V
VOM
SCL (2)
Output Monitor Threshold
2.5
20
T
Duration of Low Short Current
Limiting
IOUT = ISCL
60
ms
Note : 1. VD... arebidirectional datainputs or outputs depending on the VE, VTR status.
3/11
L9824
ELECTRICAL CHARACTERISTICS (continued)
Symbol
Parameter
Test Conditions
See fig. 1
Min.
Typ.
Max.
10
10
100
40
10
10
4
Unit
ms
µs
tn ON
ON-delay Time (5)
RL = 1KΩ
tn OFF (3) OFF-delay Time (5)
ts ON ON-delay Time (6)
ts OFF (3) OFF-delay Time (6)
tD ON Data ON - Delay Time (7)
tD OFF (3) Data OFF - Delay Time (7)
20
20
2
µs
µs
µs
2
µs
t
ON-tOFF
tf
Delay Time Difference
Filter Time (8)
Except STANDBY MODE
µs
0.7
2
4
µs
Notes : 2. If the output current exceeds the high short current threshold ISC an internal timer is started. If after the time period of TTSC the current
limiting is still active the overload condition is recognized and this output is switchedoff. To restart the output the TRANSFER MODE
has to be chosen and the corresponding input voltage VDIN must become HIGH to reset the internal overload latch.
3. Becausethe output capacitance is the drain-source capacitance of the power switch the risetime of the outputs depends of the used
supply voltage VS, the load resistor RL and the output capacitance COUT and can be calculated with the following equation :
Td = τ In 10 (reaching 90% of VS) τ = RL x COUT x K (4) K = 1.5
This additional delay time Td must be added to tOFF
4. Because the drain source capacitance of the output transistor is voltage dependent, it is necessary to multiply COUT (specified at the
maximum VOUT) with a correction factor K to obtain the average output capacitance COUT
.
.
5. Delay time between all modes except STANDBYMODE.
6. Delay time between STANDBY MODE and any other mode and vice versa.
7. Data delay time when TRANSFER MODE is chosen.
8. Explanation see page 6.
.
Critical mode variations occur when both mode
MODE CHANGE DIAGRAM
inputs change their state simultaneously. This is
representedby the diagonal arrows in the mode
changediagram.
.
To avoid thata filter is implementedin the TM si-
gnal path. A suitable filter time tf is chosen to be
well beyondthe mode comparator delays.
FILTERING TIMING
4/11
L9824
.
As a consequenceof the filter functionthe follo-
wing features are given respectively has to be
considered (refer to timing above):
For a delay between RM and HM up to td < tmin
the parasitic TM will be supressed.
.
.
ThereforethechangefromTMtoanyothermode
causes an additional delay tf that is the internal
filter time.
The parasiticSMtime istoo shorttoinfluencethe
outputs and is hence negligible.
.
.
To obtain the transfer function surely both mode
inputs be ”Low” for at least tTM fmax.
t
TRUTH TABLE FOR THE CONTROL INPUTS
Enable VE
Transfer VTR
Mode Symbol
Function Mode
L
L
H
L
RM
TM
HM
SM
READ MODE (output monitoring)
TRANSFER MODE (input data transferred to output)
HOLD MODE (output corresponds to the data latch)
STANDBY MODE (all outputs open)
H
H
L
H
Figure 1 : Timing Diagram with Function Modes.
Figure 2 : Maximum ROUT - Characteristics.
Figure 3 : Typical Short Current
Characteristics.
I
I
SC
8)
TH
R
DSON
Region
I
SCL
9)
RON
T
SC
T
t(ms)
0
D95AT168
40
ITH: Exceeding the threshold activates the current limitation
circuit and timer.
T
RON: Must be longer than 20ms because for shorter times even
currents higher than ITH do not trigger the current limitation.
5/11
L9824
Figure 4 : Test Circuit.
FUNCTIONAL DESCRIPTIONS
OUTPUT BLOCK
This device wasdeveloped specially forautomotive
applications to drive different loads like relais,
lamps, databusesor actuatorswith verylow current
consumption.
TRANSFER FROM DATA INPUT TO POWER
OUTPUT.
The DATA pins are used bidirectionally. The main
path is the non inverting transfer of a digital signal
fromthe DATApin tothepoweroutput(TRANSFER
MODE). The data pass the input latch that works
alsoasa memoryin theHOLD MODE. Theyremain
stored until the TRANSFER MODE is selected to
write in new data.
The L9824 contains eight identical channels each
with a separate DATA input/output and the power
output. In each channel the memory function, the
outputshort circuit function and the diagnostic fun-
ction is realized.
This meansthatinallothermodesthememory con-
tent will not be changedexcept the output short cir-
cuit protection was activemore than the checktime
of 42.5ms.In this case in allmodes the storage flip-
flop will be set to hold the output for protectioninto
the Off-state. By activating the READ MODE in this
position it is possible to detectshort-circuit load.
The common part determines the function modes
throughENABLE and TRANSFER inputs whereas
thereferencepartbiasesallcurrentsourcesandge-
nerates the threshold voltages and the stabilized
supply voltage for the whole CMOS-logic.
A special thermal protection, ESD-protected in-
puts/DATApins and a particular outputshort circuit
characteristic prevent a damage or the destruction
of the device.
To switch on the output again, the external control
processorhas toselectthe TRANSFERMODE and
to changethe inputsignalatthecorrespondingdata
terminaltoHIGHtoset thestorageflip-flopandthen
to write in LOW. An additionalreading of this chan-
nel output (selecting the READ MODE after the
mentionedchecktime)showswhetherthe short-cir-
cuit is still present.
Referring to the block diagram it can be seen that
each channel works independent and contains all
necessary functions described in the following
points.
6/11
L9824
TRANSFER FROM POWER OUTPUT TO DATA
OUTPUT.
frombothinputcomparatorswhichdeterminethelo-
gic threshold and hysteresis drive the mode logic
that distributesthe right data to all output blocks.
The opposite signal path (READING MODE) from
theoutput to the DATAterminals is used for thedia-
gnosticfunctionto monitor the outputstatus.Output
voltages greater than 3.5V lead to ”HIGH” state at
the DATA terminals. The HIGH level is typical 4.5V
and internally stabilized. For ”LOW” level the satu-
ration voltage of N-Channel MOS transistor is rele-
vant.
TRANSFER, HOLD and READ MODE are explai-
ned before. The remaining STANDBY MODE swit-
ches the clock oscillator and all outputs off and
reducethequiescentcurrentbelow100µA. Thisme-
ans that only the both mode comparators and the
bandgapregulatorare active. The input data stored
beforewill be not changed.
SHORT-CIRCUIT PROTECTION.
OSCILLATOR PART.
For the use oflamps a particular short-current char-
acteristicis implementedanditis drawn infig. 3. Be-
cause of the low resistance of lamps during the
ON-phasethe current limit is fortypical 2.5ms about
the double as for the second current limiting phase.
Detecting a short circuit condition means that the
channeloutputremains low in any condition for the
check time TCH = TTSCH + TSCL independentof the
status of the inputs.
The clock oscillator contains an on-chip capacitor
andrequiresthereforeno externalcomponents.The
oscillation frequency is approximately in the range
of 50kHz. This oscillator signal is devidedby a 7 bit-
counter which createsthe two frequenciesfor the ti-
ming of all short current control circuits in each
output block.
VOLTAGE REFERENCE.
Thesetimeperiodsaregeneratedfrom twofrequen-
cies 400Hz/6.4kHzcoming from the common oscil-
lator part. If the current limiting is active after the
check period an overload is recognized and the re-
garding channel is switched off and the DATA flip-
flop is also reset as explainedearlier.
Themainreferencecellis abandgapcontrolledvery
lowdrop voltageregulator.Allthresholdvoltagesfor
the input comparators, the diagnostic comparators
andthethermal overloadcomparatorsaswell asthe
referencevoltage for the CMOS supply buffers are
derived from one resistor devider.
Inorder to savesupplycurrentaspecialshort-circuit
protection is used that needs no quiescent current
during the ON-state as long as no overload is pre-
sent at the output. Because of this special circuit
configuration the output current must exceed a gi-
venthresholdto activatethecurrent regulationloop.
Becauseofthelow currentcapabilityofthe regulator
two buffers are used to supply the CMOS logic for
every four channels. These voltage followers work
like a current multiplier at a very low quiescentcur-
rent.Aclamping circuit preventsthattheCMOS bre-
akdownvoltage will be reached.
This current threshold ITH is determined by the ON-
resistance RDSON of the outputDMOS and the mi-
nimum operatingsupplyvoltageVSmin of thelimiting
circuit and can be easily calculatedin the following
way :
CURRENT REFERENCE + POWER–ON RESET.
The twotemperaturecompensatedcurrent linesare
generated directly from the bandgap voltage and
are switched off by the mode logic to save supply
current. Athirdunswitchedcurrentlinebiasesthein-
put comparators and CMOS buffers.
ITH = VSmin/RDSON = 4V/1.5Ω = 2.7A (typical value
at Tj = 25°C)
During supply voltage rise, power-on reset circuit
providesa definedstatusofall latchesin the CMOS
logic. From a supplyvoltage of about 4V on it ena-
bles the wholelogic and thedevice canwork. Below
4Valllatchesareset toholdtheoutputsintotheOFF
state.
When the outputis shortedfor instanceto VS ama-
ximum peakcurrentwill occurforashortdurationup
to the limiting circuit is switched on and the settling
time is over. Under worst case conditions (Tj = –
40°C), VS = 16V, where RDSON is lowest) the peak
current can reach 7A with a duration of 1µs at Vout
= 15V and 4A with a duration of 20µs at Vout = 5V.
PROTECTION CIRCUITS
ESD–PROTECTION.
COMMON PARTS
MODE CONTROL.
By the”TRANSFER” and ”ENABLE” input, working
modes can be selected as shown in the truthtable
intheupperpart offig. 1. The controlsignalscoming
Bothinputcomparators(ENABLE,TRANSFER)are
ESD protectedandinclude zenerdiodes thatclamp
the gatesof the internal MOSFETs to minimal 15V.
Seconddiodes clamp theseinputs to VS if the sup-
ply voltage is lower than 0.6V below the zener volt-
age.
7/11
L9824
The eight ”DATA” terminals hasthe same ESD pro-
tectionstructure as the comparator inputs.
At a chip temperatureof about 160°C the device is
switched OFF. This stateis similar to the STANDBY
MODE. Afterthe temperatureremains underappro-
ximately 135°C the element is switched ON. Ther-
malshut-downdoesnotinfluenceanylogicbecause
it switches only the gates of all outputDMOS-tran-
sistors directly to ground.
SHORT CURRENT LIMITING.
The detailed function explanation is given in a for-
mer section where the output block is described.
Generallyitcan besupplementarysaidthatthis kind
of protection determines the limits within the safe
operatingarea of the used DMOS structure.
APPLICATION HINTS
The big chiparea and the heatcapacityof silicon al-
lowforshort durationspeakcurrentsuptofive times
the maximum DC current that occur under certain
conditions as expoundedabove.
– Precausions by external components must be
provided to avoid damage of the device (it‘s in
any case not allowed to exceed the maximum
ratings given on page 2).
THERMAL SHUTDOWN.
Because of the symmetry and the big size of chip
twothermaloverloadprotectioncircuits wereplaced
on each side ofthe chip where the outputstructures
are concentrated to ensure minimum thermal gra-
dients to the thermal sensors.
– For open load detection it is recommended to
use external components to fix the desired
status (depending on the temperature the in-
ternal open load status can vary from ”H” to
”L” caused by leakage currents)
Figure 5: Application Diagram
8/11
L9824
DIP20 PACKAGE MECHANICAL DATA
mm
inch
TYP.
DIM.
MIN.
0.254
1.39
TYP.
MAX.
MIN.
0.010
0.055
MAX.
a1
B
b
1.65
0.065
1.000
0.45
0.25
0.018
0.010
b1
D
E
e
25.4
8.5
2.54
0.335
0.100
0.900
e3
F
22.86
7.1
0.280
0.155
I
3.93
L
3.3
0.130
Z
1.34
0.053
9/11
L9824
SO20 PACKAGE MECHANICAL DATA
mm
inch
TYP.
DIM.
MIN.
TYP.
MAX.
2.65
0.3
MIN.
MAX.
0.104
0.012
0.096
0.019
0.013
A
a1
a2
b
0.1
0.004
2.45
0.49
0.32
0.35
0.23
0.014
0.009
b1
C
0.5
0.020
c1
D
45 (typ.)
12.6
10
13.0
0.496
0.394
0.512
0.419
E
10.65
e
1.27
0.050
0.450
e3
F
11.43
7.4
0.5
7.6
0.291
0.020
0.299
0.050
0.030
L
1.27
0.75
M
S
8 (max.)
10/11
L9824
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for
the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its
use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifica-
tions mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information pre-
viously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or
systems without express written approval of SGS-THOMSON Microelectronics.
1994 SGS-THOMSON Microelectronics - All Rights Reserved
SGS-THOMSON Microelectronics GROUP OF COMPANIES
Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore-
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11/11
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