LRMAM2512-R01JT5 [ETC]

Low Resistance Metal Alloy Resistor; 低电阻金属合金电阻


型号：	LRMAM2512-R01JT5
厂家：	ETC
描述：	Low Resistance Metal Alloy Resistor 低电阻金属合金电阻
文件：	总3页 (文件大小：389K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Low Resistance

Metal Alloy Resistor

LRMA Series

Resistance range 1 to 100mΩ

High temperature operation to 170°C

Low thermal EMF version

High power version

Current sensing for power electronics

RoHS compliant & halogen free

Electrical Data

LRMA Version

Size

T (Standard)

2512

≤R01: 2, >R01: 1

≤R01: 10, >R01: 5

1 to 50

P (Power)

2512

3 to 100

Power rating @70°C

Overload rating (5s)

Resistance range

mΩ

1, 1.5, 2, 3, 4, 5, 7, 8, 9, 10,

11, 12, 15, 18, 20, 25, 30, 33, 40, 50

1, 5

3, 5, 10, 11, 15,

20, 25, 30, 40, 50, 80, 100

Standard values ¹

mΩ

Resistance tolerance

TCR (25 to 125°C)

Ambient temperature

Insulation resistance

Element alloy

ppm/°C

°C

>R01: ±75

>R001 & ≤R01: ±100,

R001: ±275

-55 to 170

>100

Cu-Ni or Mn-Cu

Black

MΩ

Coating

LRMA Version

Size

M (Low thermal EMF)

2512

N (Inverse)

1206

0815

Power rating @70°C

≤R02: 2, >R02: 1

≤R02: 10, >R02: 5

5 to 40

1 ²

Overload rating (5s)

Resistance range

mΩ

5 to 30

1 to 30

1, 6, 8, 10,

15, 20, 25, 30

Standard values ¹

mΩ

5, 10, 15, 20, 25, 30

5, 10, 20, 30, 40

Resistance tolerance

TCR (25 to 125°C)

Ambient temperature

Insulation resistance

Element alloy

ppm/°C

1, 5

≤R01: ±100

-55 to 170°C

>100

>R01: ±75,

±100

MΩ

Mn-Cu

Cu-Ni

Black

Coating

Black

Green

Notes: 1. Non-standard values may be available for high volume requirements. 2. Requires 300mm²copper pad & trace area

Physical Data (All dimensions in mm and nominal weight in g)

Size

1206

3.2 ±0.2

1.6 ±0.2

0.5 ±0.3

0.6 ±0.2

18.3

2.1 ±0.25

6.4 ±0.2

3.75 ±0.3

3.2 ±0.2

0.5 ±0.2

2.0 ±0.2

0.7 ±0.2

14.1

0815

2512

≤R002

0.65 ±0.25

57 to 63

2512

0.9 ±0.2

>R002

General Note

TT electronics reserves the right to make changes in product speciﬁcation without notice or liability.

All information is subject to TT electronics’ own data and is considered accurate at time of going to print.

www.bitechnologies.com www.irctt.com www.welwyn-tt.com

09. 11

Low Resistance

Metal Alloy Resistor

LRMA Series

Construction

Coating (UL94-V0)

Copper electrode with

nickel then tin plating

Low TCR

resistance alloy plate

Marking

The components are marked with ohmic value, e.g. “R002” = 2mΩ, “R010” = 10 mΩ.

Solvent Resistance

The component is resistant to all normal industrial cleaning solvents suitable for printed circuits.

Performance Data

Maximum (%)

Typical (%)

Load at rated power (cyclic load, 1000 hours at 70C)

Short term overload (5 x rated power for 5s)

Humidity (1000 hours, 85°C, 85%RH)

Temperature cycle (-40 to +125°C, 1000 cycles, 15 minute dwell)

Resistance to solder heat (260°C ±5°C for 20s ±1s)

Solderability (245°C ±5°C for 2s ±0.5s)

±R

0.3

0.15

0.3

0.5

>95% coverage

Dry heat (1000 hours at 170C)

±R

0.5

0.3

0.15

0.3

Low temperature storage (1000 hours at -55°C)

Substrate bending (board 1.6mm, fulcrum spacing 90mm, deflection 2mm)

Insulation resistance (1 minute @ 100Vdc)

>100M

Thermal Performance & Mounting

Temperature Derating

Typical Temperature Rise

120

100%

80%

60%

40%

20%

Hot spot

100

Joint

20%

40%

60%

80%

100%

-30

120

170

Proportion of Pr

Ambient Temperature (°C)

The temperature rise shown is highly

dependent on mounting conditions.

Reference conditions assume 20

copper with thermal vias to multiple

layers.

The self-heating in the current tracks

should be kept negligible, or allowed

for by temperature derating.

Reference Pad Dimensions (mm)

Size

1206

1.8

7.9

4.0

1.9

1.5

3.1

2.1

1.4

0.9

1.3

4.1

0815

2512 ≤R002

2512 >R002

Current

Sense

General Note

TT electronics reserves the right to make changes in product speciﬁcation without notice or liability.

All information is subject to TT electronics’ own data and is considered accurate at time of going to print.

www.bitechnologies.com www.irctt.com www.welwyn-tt.com

09. 11

Low Resistance

Metal Alloy Resistor

LRMA Series

Packaging

Bottom Tape

ΦA

ΦC ΦB

Paper Tape

Size Tape

P₁

P₂

P₀

ΦD₀

ΦA

ΦB ΦC

2.0

3.6

8.0

3.5 1.75 4.0

2.0

4.0

1.5

0.84

11.5

1206 Paper

178 ±0.2 60 ±1 13 ±1 9 ±1

178 ±0.2 60 ±1 13 ±1 13 ±1

±0.15

±0.2

±0.05

±0.1

±0.05

±0.1

+0.1/-0

±0.1

±1

2.6

±0.2

4.5

±0.2

5.5 1.75 4.0

2.0

±0.2

4.0

±0.1

1.55

±0.05

1.1

±0.1

15.4

±2

0815 Emboss

2512 Emboss

±0.1

+-0.1

3.6

±0.2

6.9

±0.2

5.5 1.75 4.0

2.0

±0.05

4.0

±0.05

1.5

+0.1/-0

0.85

±0.15

15.4

±2

±0.05

±0.1

Storage

Conditions: 5°C to 35°C and 40% to 75%RH

Shelf life: 2 years from manufacture

Processing

LRMA series resistors are suitable for both wave and IR reflow soldering. The recommended reflow profile for Pb-

free SAC305 alloy (Sn 96.5%, Ag 3%, Cu 0.5%) soldering is as follows:

Pre-heat: 60s to 120s at 150°C to 180°C

Soldering: 20s to 40s at ≥230°C

Peak: 5s at 250°C to 255°C

Ordering Procedure

Example: LRMA low thermal EMF version in 2512 size and at 10 milliohms and 1% tolerance packed in tape.

L R M A M 2 5 1 2 – R 0 1 F T 4

Type

Version

Size

Value (use IEC62 code)

Tolerance (use IEC62 code)

Packing

1206

0815, 2512

5000/reel

4000/reel

Tape

Standard

General Note

TT electronics reserves the right to make changes in product speciﬁcation without notice or liability.

All information is subject to TT electronics’ own data and is considered accurate at time of going to print.

www.bitechnologies.com www.irctt.com www.welwyn-tt.com

09. 11

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