LZ1-00R400-0000 [ETC]
EMITTER IR 850NM 1.2A SMD;
| 型号： | LZ1-00R400-0000 |
| 厂家： | 
ETC |
| 描述： | EMITTER IR 850NM 1.2A SMD |
| 文件： | 总17页 (文件大小：747K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
High Luminous Efficacy
850nm Infrared LED Emitter
LZ1-00R400
Key Features
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High Efficacy 850nm 1.9W Infrared LED
Ultra-small foot print – 4.4mm x 4.4mm
Surface mount ceramic package with integrated glass lens
Very low Thermal Resistance (10.5°C/W)
Very high Radiant Flux density
Autoclave complaint (JEDEC JESD22-A102-C)
JEDEC Level 1 for Moisture Sensitivity Level
Lead (Pb) free and RoHS compliant
Reflow solderable (up to 6 cycles)
Emitter available on Standard or Miniature MCPCB (optional)
Typical Applications
.
.
Inspection
Security lighting
Description
The LZ1-00R400 850nm Infrared LED emitter generates 720mW nominal output at 1.9W power dissipation in an
extremely small package. With a 4.4mm x 4.4mm ultra-small footprint, this package provides exceptional radiant
flux density. The patent-pending design has unparalleled thermal and optical performance. The high quality
materials used in the package are chosen to optimize light output and minimize stresses which results in
monumental reliability and lumen maintenance. The robust product design thrives in outdoor applications with
high ambient temperatures and high humidity.
COPYRIGHT © 2015 LED ENGIN. ALL RIGHTS RESERVED.
LZ1-00R400 (3.1 - 02/06/15)
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Part number options
Base part number
Part number
Description
LZ1-00R400-xxxx
LZ1-10R400-xxxx
LZ1-30R400-xxxx
LZ1 emitter
LZ1 emitter on Standard Star MCPCB
LZ1 emitter on Miniature round MCPCB
Bin kit option codes
R4, Infrared (850nm)
Min
Kit number
flux
Color Bin Range
Description
suffix
Bin
full distribution flux; full distribution
wavelength
0000
J
F08 – F08
Notes:
1.
Default bin kit option is -0000
COPYRIGHT © 2015 LED ENGIN. ALL RIGHTS RESERVED.
LZ1-00R400 (3.1-02/06/14)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Radiant Flux Bins
Table 1:
Minimum
Radiant Flux (Φ)
@ IF = 1000mA[1,2]
(mW)
Maximum
Radiant Flux (Φ)
@ IF = 1000mA[1,2]
(mW)
Bin
Code
J
512
640
800
640
800
K
L
1000
Notes for Table 1:
1.
2.
Radiant flux performance guaranteed within published operating conditions. LED Engin maintains a tolerance of ± 10% on flux measurements.
Future products will have even higher levels of radiant flux performance. Contact LED Engin Sales for updated information.
Peak Wavelength Bin
Table 2:
Minimum
Maximum
Peak Wavelength (λP)
@ IF = 1000mA[1]
(nm)
Peak Wavelength (λP)
@ IF = 1000mA[1]
(nm)
Bin Code
F08
835
875
Notes for Table 3:
1.
LED Engin maintains a tolerance of ± 2.0nm on peak wavelength measurements.
Forward Voltage Bin
Table 3:
Minimum
Forward Voltage (VF)
@ IF = 1000mA [1]
(V)
Maximum
Forward Voltage (VF)
@ IF = 1000mA [1]
(V)
Bin Code
0
1.7
2.7
Notes for Table 3:
1.
LED Engin maintains a tolerance of ± 0.04V for forward voltage measurements.
COPYRIGHT © 2015 LED ENGIN. ALL RIGHTS RESERVED.
LZ1-00R400 (3.1-02/06/14)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Absolute Maximum Ratings
Table 4:
Parameter
Symbol
Value
Unit
mA
mA
DC Forward Current at Tjmax=100°C[1]
DC Forward Current at Tjmax=125°C[1]
Peak Pulsed Forward Current[2]
Reverse Voltage
IF
IF
1200
1000
IFP
VR
Tstg
TJ
2000
mA
V
See Note 3
-40 ~ +125
125
Storage Temperature
°C
°C
°C
Junction Temperature
Soldering Temperature[4]
Tsol
260
Allowable Reflow Cycles
6
121°C at 2 ATM,
100% RH for 168 hours
Autoclave Conditions[5]
> 8,000 V HBM
Class 3B JESD22-A114-D
ESD Sensitivity[6]
Notes for Table 4:
1.
2:
3.
4.
5.
6.
Maximum DC forward current is determined by the overall thermal resistance and ambient temperature. Follow the curves in Figure 10 for current derating.
Pulse forward current conditions: Pulse Width ≤ 10msec and Duty Cycle ≤ 10%.
LEDs are not designed to be reverse biased.
Solder conditions per JEDEC 020D. See Reflow Soldering Profile Figure 3.
Autoclave Conditions per JEDEC JESD22-A102-C.
LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZ1-00R400 in an electrostatic protected area (EPA).
An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1.
Optical Characteristics @ TC = 25°C
Table 5:
Parameter
Symbol
Typical
Unit
Radiant Flux (@ IF = 700mA)
Radiant Flux (@ IF = 1000mA)
Peak Wavelength
Φ
Φ
515
720
850
90
mW
mW
λP
nm
Viewing Angle[1]
2Θ1/2
Θ0.9V
Degrees
Degrees
Total Included Angle[2]
130
Notes for Table 5:
1.
Viewing Angle is the off axis angle from emitter centerline where the radiant power is ½ of the peak value.
2.
Total Included Angle is the total angle that includes 90% of the total radiant flux.
Electrical Characteristics @ TC = 25°C
Table 6:
Parameter
Symbol
Typical
Unit
Forward Voltage (@ IF = 1000mA)
Forward Voltage (@ IF = 1200mA)
VF
VF
1.9
2.0
V
V
Temperature Coefficient
of Forward Voltage
ΔVF/ΔTJ
RΘJ-C
-2.0
mV/°C
°C/W
Thermal Resistance
(Junction to Case)
10.5
COPYRIGHT © 2015 LED ENGIN. ALL RIGHTS RESERVED.
LZ1-00R400 (3.1-02/06/14)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
IPC/JEDEC Moisture Sensitivity Level
Table 7 - IPC/JEDEC J-STD-20 MSL Classification:
Soak Requirements
Floor Life
Conditions
Standard
Conditions
Accelerated
Level
1
Time
Time (hrs)
Time (hrs)
Conditions
≤ 30°C/
60% RH
168
+5/-0
85°C/
60% RH
1 Year
n/a
n/a
Notes for Table 7:
1.
The standard soak time is the sum of the default value of 24 hours for the semiconductor manufacturer’s exposure time (MET) between bake and bag
and the floor life of maximum time allowed out of the bag at the end user of distributor’s facility.
Average Radiant Flux Maintenance Projections
Lumen maintenance generally describes the ability of a lamp to retain its output over time. The useful lifetime for
solid state lighting devices (Power LEDs) is also defined as Radiant Flux Maintenance, with the percentage of the
original light output remaining at a defined time period.
Based on long-term WHTOL testing, LED Engin projects that the LZ Series will deliver, on average, 70% Radiant Flux
Maintenance at 65,000 hours of operation at a forward current of 1000 mA. This projection is based on constant
current operation with junction temperature maintained at or below 110°C.
COPYRIGHT © 2015 LED ENGIN. ALL RIGHTS RESERVED.
LZ1-00R400 (3.1-02/06/14)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Mechanical Dimensions (mm)
Pin Out
Function
Pad
1
Cathode
Anode
2
3
Anode
4
5[2]
Cathode
Thermal
1
2
5
4
3
Figure 1: Package outline drawing.
Notes for Figure 1:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
2.
Thermal contact, Pad 5, is electrically connected to the Anode, Pads 2 and 3. Do not electrically connect any electrical pads to the thermal contact, Pad 5.
LED Engin recommends mounting the LZ1-00R400 to a MCPCB that provides insulation between all electrical pads and the thermal contact, Pad 5. LED Engin
offers LZ1-10R400 and LZ1-30R400 MCPCB options which provide both electrical and thermal contact insulation with low thermal resistance. Please refer to
Application Note MCPCB Options 1 and 3, or contact a LED Engin sales representative for more information.
Recommended Solder Pad Layout (mm)
Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad
Note for Figure 2a:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
COPYRIGHT © 2015 LED ENGIN. ALL RIGHTS RESERVED.
LZ1-00R400 (3.1-02/06/14)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Recommended Solder Mask Layout (mm)
Figure 2b: Recommended solder mask opening for anode, cathode, and thermal pad
Note for Figure 2b:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
Recommended 8mil Stencil Apertures Layout (mm)
Figure 2c: Recommended 8mil stencil apertures layout for anode, cathode, and thermal pad
Note for Figure 2c:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
COPYRIGHT © 2015 LED ENGIN. ALL RIGHTS RESERVED.
LZ1-00R400 (3.1-02/06/14)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Reflow Soldering Profile
Figure 3: Reflow soldering profile for lead free soldering.
Typical Radiation Pattern
100
90
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
Angular Displacement (Degrees)
Figure 4: Typical representative spatial radiation pattern.
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Typical Relative Spectral Power Distribution
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
600
650
700
750
800
850
900
Wavelenght(nm)
Figure 5: Relative spectral power vs. wavelength @ TC = 25°C.
Typical Normalized Radiant Flux over Current
140%
120%
100%
80%
60%
40%
20%
0%
0
200
400
600
800
1000
1200
IF - Forward Current (mA)
Figure 6: Typical normalized radiant flux vs. forward current @ TC = 25°C.
COPYRIGHT © 2015 LED ENGIN. ALL RIGHTS RESERVED.
LZ1-00R400 (3.1-02/06/14)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Typical Normalized Radiant Flux over Temperature
1.2
1
0.8
0.6
0.4
0.2
0
0
20
40
60
80
100
Case Temperature (°C)
Figure 7: Typical normalized radiant flux vs. case temperature.
Typical Peak Wavelength Shift over Current
3.00
2.00
1.00
0.00
-1.00
-2.00
-3.00
0
200
400
600
800
1000
1200
IF - Forward Current (mA)
Figure 8: Typical peak wavelength shift vs. forward current @ Tc = 25°C
COPYRIGHT © 2015 LED ENGIN. ALL RIGHTS RESERVED.
LZ1-00R400 (3.1-02/06/14)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Typical Peak Wavelength Shift over Temperature
16
14
12
10
8
6
4
2
0
0
20
40
60
80
100
Case Temperature (°C)
Figure 9: Typical peak wavelength shift vs. case temperature.
Typical Forward Current Characteristics
1400
1200
1000
800
600
400
200
0
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
VF - Forward Voltage (V)
Figure 10: Typical forward current vs. forward voltage @ TC = 25°C
COPYRIGHT © 2015 LED ENGIN. ALL RIGHTS RESERVED.
LZ1-00R400 (3.1-02/06/14)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Current De-rating
Figure 11: Maximum forward current vs. ambient temperature based on TJ(MAX) = 125°C.
Notes for Figure 11:
1.
2.
RΘJ-C [Junction to Case Thermal Resistance] for the LZ1-00R400 is typically 10.5°C/W.
RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance].
COPYRIGHT © 2015 LED ENGIN. ALL RIGHTS RESERVED.
LZ1-00R400 (3.1-02/06/14)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Emitter Tape and Reel Specifications (mm)
Figure 12: Emitter carrier tape specifications (mm).
Figure 12: Emitter reel specifications (mm).
Notes for Figure 13:
1.
Reel quantity minimum: 200 emitters. Reel quantity maximum: 2500 emitters.
COPYRIGHT © 2015 LED ENGIN. ALL RIGHTS RESERVED.
LZ1-00R400 (3.1-02/06/14)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
LZ1 MCPCB Family
Emitter + MCPCB
Thermal Resistance
(oC/W)
Diameter
Typical Vf Typical If
Part number Type of MCPCB
(mm)
(V)
(mA)
LZ1-1xxxxx
LZ1-3xxxxx
1-channel Star
1-channel Mini
19.9
11.5
10.5 + 1.5 = 12.0
10.5 + 2.0 = 12.5
2.3
2.3
1000
1000
Mechanical Mounting of MCPCB
.
MCPCB bending should be avoided as it will cause mechanical stress on the emitter, which could lead to
substrate cracking and subsequently LED dies cracking.
.
To avoid MCPCB bending:
o
o
Special attention needs to be paid to the flatness of the heat sink surface and the torque on the screws.
Care must be taken when securing the board to the heat sink. This can be done by tightening three M3
screws (or #4-40) in steps and not all the way through at once. Using fewer than three screws will
increase the likelihood of board bending.
o
o
It is recommended to always use plastics washers in combinations with the three screws.
If non-taped holes are used with self-tapping screws, it is advised to back out the screws slightly after
tightening (with controlled torque) and then re-tighten the screws again.
Thermal interface material
.
.
.
To properly transfer heat from LED emitter to heat sink, a thermally conductive material is required when
mounting the MCPCB on to the heat sink.
There are several varieties of such material: thermal paste, thermal pads, phase change materials and thermal
epoxies. An example of such material is Electrolube EHTC.
It is critical to verify the material’s thermal resistance to be sufficient for the selected emitter and its operating
conditions.
Wire soldering
.
To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125-150oC.
Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is
recommended to use a solder iron of more than 60W.
.
It is advised to use lead-free, no-clean solder. For example: SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn:
24-7068-7601)
COPYRIGHT © 2015 LED ENGIN. ALL RIGHTS RESERVED.
LZ1-00R400 (3.1-02/06/14)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
LZ1-1xxxxx
1 channel, Standard Star MCPCB (1x1) Dimensions (mm)
Notes:
Unless otherwise noted, the tolerance = ± 0.2 mm.
Slots in MCPCB are for M3 or #4-40 mounting screws.
LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.
LED Engin recommends using thermal interface material when attaching the MCPCB to a heat sink.
The thermal resistance of the MCPCB is: RΘC-B 1.5°C/W
Components used
MCPCB:
HT04503
(Bergquist)
(Diodes, Inc., for 1 LED die)
(Vishay Semiconductors, for 1 LED die)
ESD/TVS Diode: BZT52C5V1LP-7
VBUS05L1-DD1
Pad layout
MCPCB
Pad
Ch.
String/die Function
1,2,3
4,5,6
Cathode -
Anode +
1
1/A
COPYRIGHT © 2015 LED ENGIN. ALL RIGHTS RESERVED.
LZ1-00R400 (3.1-02/06/14)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
LZ1-3xxxxx
1 channel, Mini Round MCPCB (1x1) Dimensions (mm)
Notes:
Unless otherwise noted, the tolerance = ± 0.20 mm.
LED Engin recommends using thermal interface material when attaching the MCPCB to a heat sink.
The thermal resistance of the MCPCB is: RΘC-B 2.0°C/W
Components used
MCPCB:
HT04503
(Bergquist)
(Diodes, Inc., for 1 LED die)
(Vishay Semiconductors, for 1 LED die)
ESD/TVS Diode: BZT52C5V1LP-7
VBUS05L1-DD1
Pad layout
MCPCB
Pad
Ch.
String/die Function
1
2
Anode +
Cathode -
1
1/A
COPYRIGHT © 2015 LED ENGIN. ALL RIGHTS RESERVED.
LZ1-00R400 (3.1-02/06/14)
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LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Company Information
LED Engin, Inc., based in California’s Silicon Valley, specializes in ultra-bright, ultra compact solid state lighting
solutions allowing lighting designers & engineers the freedom to create uncompromised yet energy efficient
lighting experiences. The LuxiGen™ Platform — an emitter and lens combination or integrated module solution,
delivers superior flexibility in light output, ranging from 3W to 90W, a wide spectrum of available colors, including
whites, multi-color and UV, and the ability to deliver upwards of 5,000 high quality lumens to a target. The small
size combined with powerful output allows for a previously unobtainable freedom of design wherever high-flux
density, directional light is required. LED Engin’s packaging technologies lead the industry with products that
feature lowest thermal resistance, highest flux density and consummate reliability, enabling compact and efficient
solid state lighting solutions.
LED Engin is committed to providing products that conserve natural resources and reduce greenhouse emissions.
LED Engin reserves the right to make changes to improve performance without notice.
Please contact sales@ledengin.com or (408) 922-7200 for more information.
COPYRIGHT © 2015 LED ENGIN. ALL RIGHTS RESERVED.
LZ1-00R400 (3.1-02/06/14)
17
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
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